JP2009177190A5 - - Google Patents

Download PDF

Info

Publication number
JP2009177190A5
JP2009177190A5 JP2009019862A JP2009019862A JP2009177190A5 JP 2009177190 A5 JP2009177190 A5 JP 2009177190A5 JP 2009019862 A JP2009019862 A JP 2009019862A JP 2009019862 A JP2009019862 A JP 2009019862A JP 2009177190 A5 JP2009177190 A5 JP 2009177190A5
Authority
JP
Japan
Prior art keywords
substrate
tray
support portion
gap
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009019862A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009177190A (ja
JP4969595B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009019862A priority Critical patent/JP4969595B2/ja
Priority claimed from JP2009019862A external-priority patent/JP4969595B2/ja
Publication of JP2009177190A publication Critical patent/JP2009177190A/ja
Publication of JP2009177190A5 publication Critical patent/JP2009177190A5/ja
Application granted granted Critical
Publication of JP4969595B2 publication Critical patent/JP4969595B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2009019862A 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法 Expired - Lifetime JP4969595B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009019862A JP4969595B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009019862A JP4969595B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005297378A Division JP4361045B2 (ja) 2005-10-12 2005-10-12 プラズマ処理装置及びプラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2009177190A JP2009177190A (ja) 2009-08-06
JP2009177190A5 true JP2009177190A5 (https=) 2009-09-17
JP4969595B2 JP4969595B2 (ja) 2012-07-04

Family

ID=41031885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009019862A Expired - Lifetime JP4969595B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置及びプラズマ処理方法

Country Status (1)

Country Link
JP (1) JP4969595B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011114677A1 (ja) * 2010-03-19 2011-09-22 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
WO2011148629A1 (ja) * 2010-05-27 2011-12-01 パナソニック株式会社 プラズマ処理装置
CN102939648B (zh) * 2010-06-01 2015-05-27 松下电器产业株式会社 等离子处理装置以及等离子处理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335616A (ja) * 1994-06-06 1995-12-22 Hitachi Ltd ウエハ処理装置
JP2001230234A (ja) * 2000-02-16 2001-08-24 Hitachi Ltd プラズマ処理装置及び方法
JP3960929B2 (ja) * 2003-02-25 2007-08-15 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP3950806B2 (ja) * 2003-03-05 2007-08-01 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
JP4640922B2 (ja) * 2003-09-05 2011-03-02 東京エレクトロン株式会社 プラズマ処理装置
JP4361045B2 (ja) * 2005-10-12 2009-11-11 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法

Similar Documents

Publication Publication Date Title
JP4786693B2 (ja) ウェハ接合装置およびウェハ接合方法
KR102549291B1 (ko) 정전 척의 제조 방법 및 정전 척
US8236109B2 (en) Component cleaning method and storage medium
JP4795899B2 (ja) 基板載置機構および基板受け渡し方法
CN103155117B (zh) 基板的等离子体处理方法
JP2007109770A5 (https=)
JP6649689B2 (ja) 減圧処理装置及びウエーハの保持方法
JP4847909B2 (ja) プラズマ処理方法及び装置
KR102332028B1 (ko) 기판 처리 방법 및 기판 처리 장치
TW201108349A (en) Method and apparatus for reduction of voltage potential spike during dechucking
TWI520260B (zh) Substrate adsorption method, substrate disconnection method and substrate processing device
JP2010232250A5 (ja) プラズマ処理装置及びプラズマ処理方法
JP2010040822A (ja) 静電吸着装置の除電処理方法、基板処理装置、及び記憶媒体
JP2015099839A (ja) 載置台に被吸着物を吸着する方法及び処理装置
WO2016167233A1 (ja) 基板保持機構、成膜装置、および基板の保持方法
JP2006270018A5 (https=)
JP2006270017A5 (https=)
JP2017120781A5 (https=)
JP2009177190A5 (https=)
TWI606547B (zh) Plasma processing chamber and its de-chucking device and method
US9734993B2 (en) Semiconductor manufacturing apparatus
KR20220008223A (ko) 기판 이탈 방법 및 플라즈마 처리 장치
JP2009147375A5 (https=)
JP2007242870A (ja) 基板処理装置、基板吸着方法及び記憶媒体
KR20110069490A (ko) 반도체 기판의 척킹/디척킹 방법, 이를 이용한 반도체 소자의 제조 장치 및 제조 방법