JP2009177147A5 - - Google Patents
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- Publication number
- JP2009177147A5 JP2009177147A5 JP2008321935A JP2008321935A JP2009177147A5 JP 2009177147 A5 JP2009177147 A5 JP 2009177147A5 JP 2008321935 A JP2008321935 A JP 2008321935A JP 2008321935 A JP2008321935 A JP 2008321935A JP 2009177147 A5 JP2009177147 A5 JP 2009177147A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- single crystal
- film
- crystal semiconductor
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims 57
- 239000004065 semiconductor Substances 0.000 claims 46
- 239000000758 substrate Substances 0.000 claims 35
- 239000013078 crystal Substances 0.000 claims 30
- 238000004519 manufacturing process Methods 0.000 claims 11
- 239000012535 impurity Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 10
- 239000010410 layer Substances 0.000 claims 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims 5
- 150000002500 ions Chemical class 0.000 claims 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 5
- 230000015572 biosynthetic process Effects 0.000 claims 4
- 230000001678 irradiating effect Effects 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000007790 solid phase Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008321935A JP5459900B2 (ja) | 2007-12-25 | 2008-12-18 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007331656 | 2007-12-25 | ||
| JP2007331656 | 2007-12-25 | ||
| JP2008321935A JP5459900B2 (ja) | 2007-12-25 | 2008-12-18 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009177147A JP2009177147A (ja) | 2009-08-06 |
| JP2009177147A5 true JP2009177147A5 (enExample) | 2011-12-01 |
| JP5459900B2 JP5459900B2 (ja) | 2014-04-02 |
Family
ID=40789144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008321935A Expired - Fee Related JP5459900B2 (ja) | 2007-12-25 | 2008-12-18 | 半導体装置の作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7842584B2 (enExample) |
| JP (1) | JP5459900B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5486781B2 (ja) * | 2007-07-19 | 2014-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US20100221867A1 (en) * | 2009-05-06 | 2010-09-02 | International Business Machines Corporation | Low cost soi substrates for monolithic solar cells |
| JP5706670B2 (ja) | 2009-11-24 | 2015-04-22 | 株式会社半導体エネルギー研究所 | Ｓｏｉ基板の作製方法 |
| US8883612B2 (en) * | 2011-09-12 | 2014-11-11 | Infineon Technologies Austria Ag | Method for manufacturing a semiconductor device |
| JP2016134388A (ja) | 2015-01-15 | 2016-07-25 | 株式会社ジャパンディスプレイ | 表示装置 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03196567A (ja) * | 1989-08-30 | 1991-08-28 | Ricoh Co Ltd | 半導体基板とその製造方法 |
| JPH04116929A (ja) * | 1990-09-07 | 1992-04-17 | Seiko Epson Corp | 薄膜半導体装置の製法 |
| FR2681472B1 (fr) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
| TW222345B (en) | 1992-02-25 | 1994-04-11 | Semicondustor Energy Res Co Ltd | Semiconductor and its manufacturing method |
| US6709907B1 (en) | 1992-02-25 | 2004-03-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a thin film transistor |
| JP3200961B2 (ja) | 1992-05-15 | 2001-08-20 | ソニー株式会社 | 半導体装置の製造方法 |
| JPH07142738A (ja) | 1993-11-19 | 1995-06-02 | Fujitsu Ltd | 半導体装置の製造方法 |
| FR2738671B1 (fr) * | 1995-09-13 | 1997-10-10 | Commissariat Energie Atomique | Procede de fabrication de films minces a materiau semiconducteur |
| JP4103968B2 (ja) | 1996-09-18 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
| US6251754B1 (en) | 1997-05-09 | 2001-06-26 | Denso Corporation | Semiconductor substrate manufacturing method |
| US6388652B1 (en) | 1997-08-20 | 2002-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Electrooptical device |
| US6686623B2 (en) | 1997-11-18 | 2004-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile memory and electronic apparatus |
| JP2000012864A (ja) | 1998-06-22 | 2000-01-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP3358550B2 (ja) * | 1998-07-07 | 2002-12-24 | 信越半導体株式会社 | Ｓｏｉウエーハの製造方法ならびにこの方法で製造されるｓｏｉウエーハ |
| US6271101B1 (en) | 1998-07-29 | 2001-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Process for production of SOI substrate and process for production of semiconductor device |
| JP4476390B2 (ja) | 1998-09-04 | 2010-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6908797B2 (en) | 2002-07-09 | 2005-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
| US6949761B2 (en) * | 2003-10-14 | 2005-09-27 | International Business Machines Corporation | Structure for and method of fabricating a high-mobility field-effect transistor |
| FR2871172B1 (fr) * | 2004-06-03 | 2006-09-22 | Soitec Silicon On Insulator | Support d'epitaxie hybride et son procede de fabrication |
| US20060272574A1 (en) * | 2005-06-07 | 2006-12-07 | Advanced Micro Devices, Inc. | Methods for manufacturing integrated circuits |
| US7638372B2 (en) | 2005-06-22 | 2009-12-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101299604B1 (ko) | 2005-10-18 | 2013-08-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| JP5168788B2 (ja) * | 2006-01-23 | 2013-03-27 | 信越半導体株式会社 | Ｓｏｉウエーハの製造方法 |
| US7608521B2 (en) | 2006-05-31 | 2009-10-27 | Corning Incorporated | Producing SOI structure using high-purity ion shower |
| JP5486781B2 (ja) | 2007-07-19 | 2014-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7781308B2 (en) * | 2007-12-03 | 2010-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
-
2008
- 2008-12-18 JP JP2008321935A patent/JP5459900B2/ja not_active Expired - Fee Related
- 2008-12-19 US US12/339,413 patent/US7842584B2/en not_active Expired - Fee Related
-
2010
- 2010-11-09 US US12/942,156 patent/US8420504B2/en not_active Expired - Fee Related
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