JP2009177011A5 - - Google Patents

Download PDF

Info

Publication number
JP2009177011A5
JP2009177011A5 JP2008015127A JP2008015127A JP2009177011A5 JP 2009177011 A5 JP2009177011 A5 JP 2009177011A5 JP 2008015127 A JP2008015127 A JP 2008015127A JP 2008015127 A JP2008015127 A JP 2008015127A JP 2009177011 A5 JP2009177011 A5 JP 2009177011A5
Authority
JP
Japan
Prior art keywords
conductive
member according
hole
conductive member
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008015127A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009177011A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008015127A priority Critical patent/JP2009177011A/ja
Priority claimed from JP2008015127A external-priority patent/JP2009177011A/ja
Publication of JP2009177011A publication Critical patent/JP2009177011A/ja
Publication of JP2009177011A5 publication Critical patent/JP2009177011A5/ja
Pending legal-status Critical Current

Links

JP2008015127A 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置 Pending JP2009177011A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008015127A JP2009177011A (ja) 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008015127A JP2009177011A (ja) 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置

Publications (2)

Publication Number Publication Date
JP2009177011A JP2009177011A (ja) 2009-08-06
JP2009177011A5 true JP2009177011A5 (enrdf_load_stackoverflow) 2010-12-16

Family

ID=41031788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008015127A Pending JP2009177011A (ja) 2008-01-25 2008-01-25 導電性部材ならびにそれを用いた部品および装置

Country Status (1)

Country Link
JP (1) JP2009177011A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077769A (ja) * 2011-09-30 2013-04-25 Nippon Zeon Co Ltd 回路基板
JP6076838B2 (ja) * 2013-05-31 2017-02-08 住友重機械イオンテクノロジー株式会社 絶縁構造及び絶縁方法
KR102019794B1 (ko) * 2017-06-29 2019-09-09 주식회사 디아이티 프로브 핀의 내구성 강화를 위한 스페이스 트랜스포머 및 그의 제조 방법
JP7075785B2 (ja) * 2018-03-08 2022-05-26 スタンレー電気株式会社 回路基板、電子回路装置、および、回路基板の製造方法
JP7259227B2 (ja) * 2018-08-03 2023-04-18 富士電機株式会社 溶解装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62100404A (ja) * 1985-10-28 1987-05-09 Kawasaki Steel Corp 高純度六方晶窒化硼素粉末の製造方法
JPH06140484A (ja) * 1992-10-28 1994-05-20 Nippon Telegr & Teleph Corp <Ntt> プローブカード
JP4066591B2 (ja) * 2000-06-09 2008-03-26 住友金属工業株式会社 プローブガイド
JP2005136266A (ja) * 2003-10-31 2005-05-26 Matsushita Electric Ind Co Ltd セラミック多層配線基板およびセラミック多層配線基板の製造方法ならびに半導体装置
US7180315B2 (en) * 2004-06-28 2007-02-20 Sv Probe, Ltd. Substrate with patterned conductive layer
JP4508859B2 (ja) * 2004-12-24 2010-07-21 新光電気工業株式会社 半導体基板の製造方法
JP2007324439A (ja) * 2006-06-02 2007-12-13 Mitsubishi Gas Chem Co Inc プリント配線板の製造方法

Similar Documents

Publication Publication Date Title
US9807885B2 (en) Wiring board with built-in electronic component and method for manufacturing the same
JP6116955B2 (ja) 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置
US8647979B2 (en) Buffer layer to enhance photo and/or laser sintering
KR101051551B1 (ko) 요철 패턴을 갖는 비아 패드를 포함하는 인쇄회로기판 및 그 제조방법
TW200746199A (en) Laminated electronic component and method for manufacturing the same
JP2009177011A5 (enrdf_load_stackoverflow)
WO2009023283A3 (en) Interconnection element with posts formed by plating
WO2009055550A3 (en) Apparatus and methods for thermal management of electronic devices
US9839132B2 (en) Component-embedded substrate
US9622340B2 (en) Flexible circuit board and method for manufacturing same
JP2000232269A (ja) プリント配線板およびプリント配線板の製造方法
JP2012164469A5 (enrdf_load_stackoverflow)
JP2013113849A (ja) コンタクトフィルム、コンタクトフィルムの製造方法、プローブユニット及びｌｃｄパネル検査装置
JP2012198189A5 (ja) 電子部品検査装置用配線基板およびその製造方法
TW201406229A (zh) 印刷電路板及應用其之製造方法
TWM472195U (zh) 半導體晶片的測試裝置
JP2012198194A5 (enrdf_load_stackoverflow)
TWI384911B (zh) 印刷配線板以及導電性配線層
TW201607384A (zh) 配線基板
CN105472884B (zh) 电路板及其制造方法
CN106358369B (zh) 电路板及其制作方法
JP2014090170A5 (enrdf_load_stackoverflow)
JP2009177011A (ja) 導電性部材ならびにそれを用いた部品および装置
JP2011054620A (ja) 多層配線基板の製造方法
JP2021174794A (ja) フレキシブルプリント配線板