JP2009168471A - Semiconductor device test apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a signal input/output member of a semiconductor test apparatus from being damaged in high-temperature conditions. <P>SOLUTION: The test apparatus is provided with a test apparatus main unit 1 which has an upward U-shaped cross section and a signal input device 2 which is separate from the main unit 1 through a metallic pipe 18. The main unit 1 is provided with a pushpin holding member 6 on its each upright wall so as to bridge both walls. The holding member 6 is provided with pushpins 7, 9. On the bottom of the main unit 1, an insulating substrate 15 provided with a conductor transmission line 16 allowing a signal to be input to a semiconductor device under test 14. The signal input device 2 is provided with a coaxial cable connector 2a, and its central conductor 2b extends on the conductor transmission line 16. A signal input section of the semiconductor device under test 14 extends on the conductor transmission line 16, too. The pushpins 7, 9 are pressed downward by the extension force of springs 8, 10, and their pressing force achieves the connection between the central conductor 2b extending on the conductor transmission line 16 and an input terminal 14b. The output side has the same structure. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device testing apparatus that enables verification of reliability and the like in a high temperature state.

  A so-called burn-in test apparatus that applies a test signal of a predetermined frequency to a semiconductor element to be tested in a high temperature state and verifies the reliability of the test target semiconductor element from the change state of the test signal in the semiconductor element, such as the life, Widely used as a testing device for high-frequency semiconductor elements.

  As an example of this test apparatus, there is a test apparatus (hereinafter referred to as a first prior art) as shown in FIG. That is, FIG. 5 is a view in which a part of a test apparatus for a semiconductor device that becomes a high temperature state due to self-heating is opened and viewed from an oblique direction. In the drawing, a semiconductor device 42 to be tested is attached to a central portion of the bottom surface of the device body 41 having a U-shaped cross section using a screw hole of the attachment portion. A substrate 43 made of a heat-resistant insulating material is provided on a signal input end side and a signal output end side (not shown) of the semiconductor device 42, and a conductor line 44 is provided thereon. The center conductor (not shown) of the input coaxial connector 45 is soldered on one end of the conductor line 44, and the input terminal of the semiconductor device 42 is connected to the other end of the conductor at the tip 48a of the pressing device 48. By being pressed, an electrical connection is formed and a high-frequency signal can be input. Further, the output terminal side (not shown) of the semiconductor device 42 is also electrically connected by the presser device 49 and its tip 49a with the same configuration, and can output a high frequency signal. When a high-frequency signal is input to the semiconductor device 42, the device main body 41 enters a high temperature state due to self-heating based on the heat consumption of the semiconductor device. In this state, a high-frequency signal output is obtained via a coaxial cable (not shown) connected to the output coaxial connector 47, and the reliability of the semiconductor device under test is detected by detecting the change state of the high-frequency signal in the semiconductor device 42. Can be verified.

As another example of the test apparatus, there is an apparatus for holding and testing an IC (semiconductor integrated circuit) at a high temperature by an external heating device. That is, the device body is provided with a first support rod (socket support), the first support rod is provided with a second support rod (copper tube connector post), and the first support rod is provided with copper. The tube holding plate (s) are provided, and the second support rod is provided with a connector mounting plate (s). An invention in which an electrical connection is made between an IC socket for mounting an IC and a coaxial cable by passing a central conductor portion of a connector for a coaxial cable attached to a connector support plate in a copper tube held by the copper tube holding plate. (Hereinafter referred to as second prior art) is known (see Patent Document 1).
Japanese Patent Laid-Open No. 2003-240818

  In the case of the first prior art, the center conductors of the input coaxial connector 45 and the output coaxial connector 47 are fixed to the conductor 44 on the substrate 43 of the apparatus main body 41 by soldering. For this reason, when the device main body 41 becomes high temperature due to self-heating of the semiconductor device 42, the solder is melted, and the input coaxial connector 45 and the output coaxial connector 47 are directly affected by the high temperature. In recent years, semiconductor devices having a heat generation temperature of 250 ° C. to 350 ° C. have been developed. For this reason, damage to the input / output members of the semiconductor test equipment, such as melting of the solder, melting of the insulation material used in the coaxial connector, melting of the coating material of the coaxial cable connected to the coaxial connector, etc. As a result, there is a risk that the test cannot be performed stably in a normal state.

  In the case of the second prior art, the first support bar (socket support) and the second support bar (the post between copper tube connectors) of the extension have a predetermined length. For this reason, since the connector mounting plate is separated from the apparatus main body, there is no fear that the coaxial cable connector attached thereto is directly affected by the heating temperature. However, the test apparatus becomes larger as the connector mounting plate becomes farther from the apparatus main body. The connection from the center conductor part of the connector to the IC socket is composed of a copper tube and a center conductor of a coaxial cable passing through the inside of the copper tube. The copper tube is between the copper tube holding plate and the metal copper tube connector. It is connected to the jacket of the coaxial cable via the support column and the connector mounting plate. For this reason, impedance matching is lost in the connection between the coaxial cable connector and the IC socket, the transmission loss of the high-frequency signal is increased, and there is a risk that accurate reliability detection cannot be performed.

  The present invention has been made in view of such a situation, and its first object is to prevent signal input / output members of a semiconductor test apparatus from being damaged due to high temperature. This is to prevent impedance mismatch in connection between the transmission line and the input / output unit of the semiconductor device under test in a high temperature state. A third object is to enable a semiconductor device to be stably tested in a high temperature state.

According to a first aspect of the present invention, there is provided a test apparatus for a semiconductor device that is brought into a high temperature state by self-heating and / or external heating, a test apparatus main body in which a semiconductor device to be tested is installed, and a semiconductor device configured separately from the test apparatus main body A signal input / output device having a transmission line connection for energizing the device, and each end is a conductive cylinder that fits into the test device body and the signal input / output device, respectively, and forms an outer conductor of the transmission line. A test apparatus for a semiconductor device, comprising: a cylindrical body through which a central conductor of a transmission line passes through a cylinder.
According to a second aspect of the present invention, in the test apparatus for a semiconductor device according to the first aspect, the main body of the test apparatus presses a central conductor of a transmission line penetrating the cylindrical body on a conductor installed on an insulating substrate. And a second pressing means for pressing the input / output terminals of the semiconductor device under test.
A third aspect of the present invention is the semiconductor device test apparatus according to the first or second aspect, wherein the signal input / output device includes a cooling means.
According to a fourth aspect of the present invention, in the semiconductor device testing apparatus according to any one of the first to third aspects, the cylindrical body has an inner diameter that matches a connection impedance between the transmission line and the semiconductor device. This is a testing device.
According to a fifth aspect of the present invention, there is provided the semiconductor device test apparatus according to the fourth aspect, further comprising means for press-contacting the signal input / output device to a test device main body.

  According to the present invention, the signal input / output member of the semiconductor test apparatus is not damaged in a high temperature state, and impedance mismatch does not occur in the connection between the transmission line and the input / output unit of the semiconductor device under test. Thus, the semiconductor device can be tested stably.

Hereinafter, a semiconductor device testing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a partially open overhead view of a semiconductor test apparatus according to an embodiment of the present invention.
In FIG. 1, a semiconductor test apparatus 100 includes a test apparatus body 1 having an upward U-shaped cross section made of a metal such as a copper alloy, and a coaxial cable connector 2a for inputting a high-frequency signal to the semiconductor device to be tested. The signal input device 2, the signal output device 3 including the coaxial cable connector 3 a that outputs a high-frequency signal from the semiconductor device to be tested, and the signal input by the heat pipe 4 a to move the heat of the signal input device 2. A cooling device 4 connected to the device 2 and a cooling device (not shown) connected to the signal output device 3 by a heat pipe 5a to move the heat of the signal output device 3 are configured.

  The test apparatus main body 1 has a heating device (not shown) for heating the semiconductor device to be tested as necessary. The signal input device 2 and the signal output device 3 are connected to the test apparatus main body 1 by connecting pipes (pipes), which will be described later.

  A square frame-shaped push pin holding member 6 is installed on each rising wall of the test apparatus main body 1 having a U-shaped cross section upward so as to straddle both walls. A push pin 7 is provided so as to penetrate the lower frame from the upper frame of the push pin holding member 6. The push pin 7 includes a spring 8 that is urged so that it always moves downward. The push pin 7 is provided with a pin-like engagement member 7a in a direction perpendicular to the vertical movement direction, and extends along a groove 6a provided in the vertical direction of the upper frame of the push pin holding member 6. The push pin 7 can be moved in the vertical direction.

  Push pins 9, 11, 12 having the same structure as the push pin 7 are provided on the push pin holding member 6.

  The conductor line 15 and the insulating substrate 16 will be described in detail with reference to FIGS.

  FIG. 2 is a diagram showing a signal input device side portion in the AA cross section of the semiconductor test apparatus of FIG. Since the signal output device side portion has the same configuration as the signal input device side portion, the illustration is omitted.

  In FIG. 2, the user lifts the head of the push pin 7 against the downward biasing force of the spring 8 and engages the engagement member 7 a with the upper surface of the push pin holding member 6 in a state where the push member 7 is rotated 90 degrees. By doing so, the push pin 7 can be kept in the lifted state. The push pin 9 is also moved upward against the extension force of the spring 10, and the engaging member 9 a is engaged with the push pin holding member 6, so that the push pin 9 can be kept in the moved state. For this reason, there is a gap between the end portions of the push pins 7 and 9 and the conductor line 16.

  The test apparatus main body 1 and the signal input apparatus 2 are connected by fitting each end of a stainless steel pipe 18 to the test apparatus main body 1 and the signal input apparatus 2. At this time, the inner diameter of the pipe 18 is determined based on a known calculation method so that the impedance with the microstrip line is matched based on the diameter of the central conductor 2b of the coaxial cable connector 2a. The central conductor 2 b of the coaxial cable connector 2 a extends through the pipe 18 and onto the conductor line 16.

FIG. 3 is a top view of the BB cross section of FIG.
In FIG. 3, a semiconductor device 14 such as a field effect transistor (FET) to be tested is set at a substantially central portion of the bottom of the test apparatus main body 1. An insulating substrate 15 made of a heat-resistant resin having a conductor line 16 is installed between the rising wall on the signal input device 2 side of the test device main body 1 and the semiconductor device 14 at the bottom of the test device main body 1. As a result, a microstrip line is formed by the test apparatus main body 1, which functions as a ground conductor, the insulating substrate 15, and the conductor line 16.

  Although not shown in FIG. 3, a microstrip line is similarly formed between the rising wall on the signal output device 3 side of the test apparatus body 1 and the semiconductor device 6. The central conductor of the coaxial cable connector 3a and the output terminal of the semiconductor device 14 have the same configuration on the microstrip line.

  A heat pipe 4a is embedded in the signal input device 2, and the other end is attached to the cooling device 4 having a plurality of heat radiation fins. Similarly, a heat pipe 5 a (FIG. 1) is embedded in the signal output device 3, and the other end (not shown) is attached to a cooling device (not shown) of the same type as the cooling device 4.

  Further, the signal input device 2 is pressed against the test apparatus main body 1 side by screws 21 and 22. Although it cannot be confirmed by visual inspection, the surface of the pipe 18, the contact surface with the pipe 18 of the signal input device 2, and the contact surface with the pipe 18 of the test apparatus main body 1 are rugged. Will not be a perfect face-to-face contact, leading to impedance mismatch. Impedance mismatch can be eliminated by press-contacting the signal input device 2 with the screw 21 and the screw 22 to the test device main body 1 side and strengthening the contact.

  Now, when the semiconductor device 14 is arranged at the set position of the test apparatus main body 1 as a preparation for the test, the input terminal 14 b extends on the conductor line 16. Therefore, when the user disengages the engaging members 7a, 9a of the push pins 7, 9 from the push pin holding member 6 and moves the engaging members 7a, 9a along the grooves 6a, 6a, the push pins 7, 9 are engaged. Is lowered by the extension force of the springs 8 and 10 to press-contact the central conductor 2b and the conductor line 16 and the input terminal 14b and the conductor line 16 to form an electrical connection. Note that the push pin 7 may always be in a pressure contact state.

  The same electrical connection is configured by the push pins 11 and 12 which are not shown in FIGS.

FIG. 4 is a diagram showing an outline of the semiconductor test circuit.
In FIG. 4, when a test is performed, a test target semiconductor device (DUT) 14 that is mounted on the semiconductor test apparatus 100 and is electrically connected to the test target semiconductor device (DUT) 14 from a high frequency transmitter 31 through an attenuator (ATT) 32. A signal is input and output to the load device 33. At this time, the test apparatus body 1 of the semiconductor test apparatus becomes a high temperature state of about 250 ° C. to 350 ° C. due to self-heating of the semiconductor device and / or heating by the heating device, and in this state, the input signal p1 and the output signal p2 are compared to compare the semiconductor. The reliability of the device (DUT) 14 can be detected.

  As described above, the signal input device 2 and the signal output device 3 are configured separately from the test apparatus main body 1 by the stainless steel pipe 18, and the thermal insulation is maintained, so that the high temperature of the test apparatus main body 1 is maintained. Is not transmitted directly to the signal input device 2 and the signal output device 3. Therefore, the test apparatus body 1 can be heated while the signal input device 2 and the signal output device 3 are cooled to ensure the test temperature. Therefore, the coaxial cable connectors 2a and 3a are not damaged by heat. Moreover, since solder is not used for electrical connection, there is no need to worry about melting of the solder. In addition, since the connecting pipe 18 is configured to perfectly match the impedances of the coaxial cable connectors 2a and 3a and the conductor line 16, it is possible to stably detect the reliability of the semiconductor device and transmit high-frequency signals. Since loss can be suppressed, the reliability of the semiconductor device can be detected with high accuracy.

1 is a partially open overhead view of a semiconductor device testing apparatus according to an embodiment of the present invention; It is a figure which shows the signal input device side part among the AA cross sections of the testing apparatus of the semiconductor device of FIG. FIG. 3 is a top view of a BB cross section in FIG. 2. It is a figure which shows the outline of a semiconductor test circuit. It is a partial open bird's-eye view of the conventional semiconductor device testing apparatus.

Explanation of symbols

1 .... Test equipment body 2 .... Signal input device 2a ... Coaxial cable connector 3 .... Signal output device 3a ... Coaxial cable connector 4 .... Cooling device 4a ... Heat pipe 6 ..Push pin holding member, 6a ..groove, 7 ..Push pin, 7a ..engagement member, 8 ..spring, 14 ..Semiconductor device under test, 15 ..insulating substrate, 16 ..conductor line.

Claims (5)

In a semiconductor device testing device that becomes hot due to self-heating and / or external heating,
A test apparatus main body for installing a semiconductor device to be tested;
A signal input / output device having a transmission line connection portion configured to be separated from the test device body and energizing the semiconductor device;
A cylindrical body in which each end portion is a conductive cylindrical body that fits into the test apparatus main body and the signal input / output device, forms an outer conductor of the transmission line, and the central conductor of the transmission line passes through the cylinder;
An apparatus for testing a semiconductor device, comprising: In the semiconductor device testing apparatus according to claim 1,
The test apparatus body includes a first pressing means for pressing a central conductor of a transmission line penetrating the cylindrical body on a conductor installed on an insulating substrate, and a second for pressing an input / output terminal of a semiconductor device under test. An apparatus for testing a semiconductor device, comprising: a pressing means. The semiconductor device testing apparatus according to claim 1 or 2,
A test apparatus for a semiconductor device, wherein the signal input / output device comprises a cooling means. The semiconductor device test apparatus according to claim 1,
The test apparatus for a semiconductor device, wherein the cylindrical body has an inner diameter that matches a connection impedance between the transmission line and the semiconductor device.   5. The semiconductor device testing apparatus according to claim 4, further comprising means for press-contacting the signal input / output device to a test device body.

Images