JP2004139801A - Connecting interposer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting interposer where the lowering of a source voltage is not caused in a power source line, and electrical signals of correct high frequency can be transmitted in a signal line, in an inspection system. <P>SOLUTION: The connecting interposer for conductively connecting the corresponding electrodes to each other from both sides, which is interposed between two substrates having a plurality of electrodes, comprises a conductive support 11 having the same potential as the ground potential, where through holes 10 are formed and disposed, and a connector 12 inserted into the hole 10 and having connecting terminals 13 at both sides, and which is insulated from the support 11. By changing and adjusting at least any one parameter of the diameter R of the hole of the support 11, the diameter r of wire of the connector, or the dielectric constant ε of dielectrics either in the power source line or the signal line, the interposer is constituted so that the impedance of the connector is made to set with a low impedance in the power source line and made impedance matching in the signal line. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connection intermediary used for a jig for inspecting a circuit device such as a probe card which is an inspection tool for measuring various electrical characteristics of a semiconductor device such as an LSI chip.
[0002]
[Prior art]
2. Description of the Related Art In testing electrical characteristics of a semiconductor device such as an LSI chip having many electrode pins, an inspection system including a semiconductor test apparatus and a probe card as an inspection jig is required. In an inspection system, a connecting body such as a flock ring is required to electrically connect a test head on a semiconductor test apparatus side to an electrode substrate of a probe card. In this case, a power supply voltage or an electric signal is transmitted from the performance board on the test head side of the semiconductor test apparatus to the probe card through the connecting body, further transmitted to the semiconductor device through the probe card, and the electric test of the semiconductor device is performed. Becomes possible.
[0003]
In addition to the above, for example, in the case of performing an electrical test on a plurality of electronic devices mounted on a circuit board, a power supply voltage and a signal voltage are transferred from the semiconductor test apparatus to the circuit board via the connection intervening body. There are cases.
[0004]
In the above case, in order to perform an accurate electrical test, the connection intervening body needs to supply a normal power supply voltage to a device or a circuit board and to exchange a precise high-frequency signal voltage.
[0005]
FIG. 5 is a conceptual diagram showing a cross-sectional structure of a test board including a conventional connection intervening body I. A substrate 1, which is a performance board on the semiconductor test apparatus side, has a plurality of electrodes 2 connected to the electrodes 2 corresponding to power supply lines and signal lines on one surface and the electrodes 2 on the other semiconductor test apparatus side. (Omitted). The substrate 3 on the probe card P side has a plurality of electrodes 4 corresponding to power supply lines and signal lines on one surface, and a plurality of electrodes (not shown) connected to the electrodes 4 on the other surface. The plurality of electrodes (not shown) arranged on the other surface of the substrate 3 are connected to the electrodes of the wafer 7 of the semiconductor device by the plurality of contacts 6 via the intervening body 5 and the like. The probe card P is held by the card holder 8 via the substrate 3.
[0006]
The connecting body I (flock ring in this case) has a ring shape and is interposed between the substrate 1 and the substrate 3. The conventional connection intervening body I includes a support body 41 formed of a non-insulating resin plate having a plurality of through holes 40 formed therein, and a conductive body inserted and fixed in the holes 40 supported by the support body 41. And a connector 42 formed of a spring spring pin. The corresponding electrode 2 and electrode 4 are electrically connected to each other by the connector 42. These constitute a conventional inspection board.
[0007]
[Problems to be solved by the invention]
However, in the connection intervening body according to the prior art, since the connector is only supported by the support made of the resin plate, it is difficult to adjust the impedance of the power supply line and the characteristic impedance matching of the signal line, and the semiconductor device and the like are difficult to adjust. In the electrical inspection described above, there is a case where a drop in the power supply voltage occurs, which sometimes hinders the handling of high-frequency electrical signals, and there is a problem that accurate electrical inspection becomes difficult.
[0008]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a connection body that does not cause a reduction in power supply voltage in a power supply line and allows an accurate high-frequency electric signal to pass through a signal line in an inspection system.
[0009]
[Means for Solving the Problems]
In order to solve this problem, the connection interposition body of the present invention, as a solution,
A connection intervening body that is interposed between two substrates having a plurality of electrodes corresponding to a power supply line and a signal line to electrically connect corresponding electrodes from both sides,
A support having a penetrated hole formed therein, a connector inserted into the hole and having connection terminals on both sides, and the connector is configured to be held in the hole while ensuring insulation with respect to the support. is there.
[0010]
Specifically, the support is formed from a conductive material, and specifically, the support is configured such that a conductive layer is disposed on at least one surface of a non-conductive plate.
[0011]
In more detail, it is configured to have a dielectric between the hole and the support.
[0012]
Further, in more detail, the diameter of the hole, the wire diameter of the connector or the permittivity of the dielectric is changed, or the dielectric constant of the dielectric is adjusted and formed, and the impedance of the connector is reduced to a low impedance in the power supply line. The signal lines are configured to perform impedance matching.
[0013]
Specifically, the support is configured to be at the same potential as the ground potential.
[0014]
Desirably, the support is formed of a material having excellent vibration absorption.
[0015]
More specifically, the connector is conductive and is formed from a metal material or a material having a metal layer formed on the surface.
[0016]
More specifically, the connector is configured to have elasticity on one or both sides of the support.
[0017]
Further, more specifically, the connector is configured to be bent in a predetermined direction with substantially regularity.
[0018]
Further, specifically, the connector is a coaxial connector in which the outside is surrounded by a conductor having a ground potential, and the connector and the conductor are insulated from each other. It is configured to protrude from the conductor.
[0019]
Further, specifically, the connector is configured such that a positioning plate is disposed on at least one surface of the support, and is bent using a guide hole formed in the positioning plate.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0021]
FIG. 1 is a conceptual diagram illustrating a cross-sectional structure of an inspection board including a connection interposer J according to an embodiment of the present invention. 1, the same components as those in the conventional example of FIG. 4 are denoted by the same reference numerals. In the inspection board, a plurality of electrodes 2 corresponding to power supply lines and signal lines are connected to one surface of a substrate 1 which is a performance board on the semiconductor test apparatus side, and a plurality of electrodes (not shown) are connected to the other surface. ). A plurality of electrodes 4 corresponding to power supply lines and signal lines are connected to one surface of the substrate 3 on the probe card P side, and a plurality of electrodes (not shown) are arranged by connecting the electrodes 4 to the other surface. An electrode (not shown) disposed on the other surface of the substrate 3 is connected to an electrode of a wafer 7 of a semiconductor device by a plurality of contacts 6 via an intervening body 5 or the like. The probe card P is held by the card holder 8 via the substrate 3.
[0022]
The connection intervening body J (flock ring in this case) of the embodiment of the present invention is, for example, a ring-shaped structure, and is interposed between the substrate 1 and the substrate 3. The support 11 of the connection intervening body J is conductive and is formed from a conductive material. For example, a material such as NOVINITE CF-5 manufactured by Enomoto Casting Co., Ltd., which is a metal material having excellent vibration absorption properties, is used. Also, other conductive materials can be used.
[0023]
FIG. 2 is a conceptual diagram showing a cross-sectional structure of a connection interposer J in which a part of FIG. 1 is enlarged.
[0024]
In FIG. 2, a plurality of through holes 10 are formed and arranged in a conductive support 11 at the same potential as the ground potential, and a connector 12 having connection terminals 13 on both sides is inserted into each of the holes 10. A dielectric 14 is formed between the hole 10 and the support 11 by filling, for example, an epoxy resin material, and the connector 12 is held with respect to the conductive support 11 while ensuring insulation. The connector 12 is formed of a metal material such as BeCu, which is conductive, or a metal having good conductivity such as Au plating formed on the surface of the metal material. Further, as shown in FIG. 2, the connector 12 or at least the connection terminal 13 is of a cantilever type using an elastic body having elasticity on one or both sides of the support 11. A positioning plate 15 is disposed on at least one surface of the support body 11, and a connector 12 or at least a connection terminal 13 is formed by using a penetrating guide hole 16 designed and formed with a high precision in a position and a diameter formed in the positioning plate 15. Are arranged in a predetermined direction with substantially regularity.
[0025]
In the connection body J shown in FIG. 2, the diameter R of the hole 10 of the support 12, the diameter r of the connector 11, and the dielectric 14 at any of the connection points corresponding to the power supply line or the signal line (not shown). Is formed by changing the dielectric constant ε of these or by combining them. Preferably, as a relative comparison between the power supply line and the signal line, the hole diameter of the support 12 is large / small, the wire diameter of the connector 11 is large / small, and the dielectric constant of the dielectric is the power supply line. In this case, a dielectric material having a high dielectric constant, such as an epoxy resin having a dielectric constant of about 3.8 or a polyimide resin having a dielectric constant of about 3.6, is used. A dielectric material having a high dielectric constant, for example, polyethylene having a dielectric constant of about 2.3 or Teflon (registered trademark) having a dielectric constant of about 2 is used to adjust and form. By the control according to the above-described method, the impedance of the connector 12 is set to a low impedance of 1Ω or less for the connector (not shown) corresponding to the power supply line, and approximately 50Ω or less for the connector (not shown) corresponding to the signal line. The control is created so as to perform impedance matching of about 75Ω.
[0026]
Returning to FIG. 1, a connection intervening body J is interposed between the substrate 1 and the substrate 3, the distance between the connection with the substrate on both sides is adjusted, and the connection terminal 13 of the connector 12 and the corresponding electrode 2 and the electrode 4 are electrically connected by pressure connection from both sides. These form an inspection board. As described above, by adjusting the thickness t of the support 11, the distance between the connection with the substrates on both sides can also be adjusted.
[0027]
FIG. 3 is a conceptual diagram showing a cross-sectional structure of a connection interposition body according to another example of the embodiment of the present invention. Some of them are omitted to explain the connectors. In place of the cantilevered needle-shaped connector in which the connection terminals on both sides in FIG. 2 are oriented in the same direction, a connector in which the connection terminals on both sides are opposite to each other as shown in FIG. A connector having a bent connection terminal as shown in FIG. 3B, or a connector having a spring spring pin shape as shown in FIG. 3C may be used.
[0028]
FIG. 4 is a conceptual diagram showing a cross-sectional structure of a connection interposition body according to another example of the embodiment of the present invention. Components having the same configuration as in FIG. 2 are denoted by the same reference numerals. Also, some of the connectors are omitted to explain the connectors. In FIG. 4, the conductive support 11 has the same potential as the ground potential. The connector 22 is formed by surrounding the outside of the connector 22 with a conductor 24 such as Cu, and sandwiching the dielectric 14 having a predetermined dielectric constant between the connector 22 and the conductor 24. A coaxial connector with insulation between them. In this coaxial connector 22, at least the distal end portion 25 of the elastic connection terminal 23 made of an elastic body is formed so as to protrude from the surrounding conductor 24. The coaxial connector 22 is inserted into the hole 10 and fixed to the support 11, and the outer conductor 24 is set to the same potential as the ground potential.
[0029]
Above, the conductive support formed of a conductive material or in which a conductive layer is disposed on a non-conductive plate is set to the same potential as the ground potential, and the diameter of the hole of the support or the support is insulated from the support. By changing the diameter of the conductive connector and the dielectric constant of the dielectric, or by adjusting and combining them, the impedance of the connector, low impedance for power supply lines, and impedance matching for signal lines can be easily adjusted. Thus, the power supply line does not cause a decrease in the power supply voltage, and the signal line can pass an accurate high-frequency electric signal.
[0030]
Further, in the above, since the support is formed of a material having excellent vibration absorption properties, the vibration can be immediately absorbed even if an impact is applied from other parts, and the connection body is resistant to impact vibration.
[0031]
In addition, by forming at least one connection terminal of the connector on one or both sides of the support so as to have elasticity, it is possible to suppress the conduction failure to the both-side substrates by biasing contact or connection.
[0032]
In the above description, the connector is a coaxial connector in which the outside is surrounded by a conductor having a ground potential, and the connector and the conductor are insulated from each other. This reduces the influence of the surroundings on the connector, makes it extremely easy to match the impedance of the connector, and makes it possible to use a connection body that can accurately transmit high-frequency signals, etc. Become.
[0033]
Further, in the above, the support is bent in a predetermined direction with substantially regularity, so that the tip of the connection terminal is at an accurate position with respect to the corresponding electrode, and the conduction between the electrodes is satisfactorily performed. It is possible to secure.
[0034]
In addition, a positioning plate having a guide hole formed with high precision is arranged on the surface of the support, and the connector or at least the connection terminal is bent in a predetermined direction with substantially regularity using the guide hole. With this arrangement, the tip of the connection terminal is located at a more accurate position with respect to the corresponding electrode, and conduction between the electrodes can be more appropriately secured.
[0035]
In the above description, the support is described as being formed from a conductive material. However, a conductive layer formed of a metal layer is formed and arranged on one or both surfaces of a ceramic plate or a resin plate made of a non-conductive material. Even if it is made to be a support body, it can be similarly implemented.
[0036]
In the above description, the connection terminal of the connector is configured to have elasticity on one side or both sides of the support, and the corresponding electrodes are connected by a pressure connection method. For example, at least one connection terminal is connected. As a method, a method of diffusion connection in which one electrode surface is Au-plated and the other terminal is plated with Sn and heat diffusion bonded at a temperature of 230 ° C. or higher, or a connection method such as soldering or a wire bonder is also the same. Can be implemented.
[0037]
In the above description, the connection interposition body of the present invention has been described as an example of the flock ring that is interposed and connected between the substrate of the probe card as the inspection jig and the substrate of the test head on the semiconductor test apparatus side in the inspection system. However, it is also possible to use the probe card as an interposer in the probe card instead of the ring shape. In addition to the above, in the case of performing an electrical inspection of a plurality of electronic devices mounted on the circuit board, a power supply voltage and a signal voltage are transferred from the circuit test equipment to the circuit board via the connection intervening body. The connecting body of the invention is effective. In addition, it can be used as a connection intervening body for various circuit device inspections, general circuit board connection, and the like.
[0038]
【The invention's effect】
As described above, according to the present invention, the conductive support is set to the same potential as the ground potential, the diameter of the hole in the support, the diameter of the conductive connector insulated from the support, and the permittivity of the dielectric. , Or by adjusting and forming them, the impedance of the connector is obtained, the impedance of the power supply line is low, and the impedance of the signal line is impedance matching. In this case, an accurate high-frequency electric signal can be transmitted, and more accurate electric inspection can be performed.
[0039]
Also, as a connector, the outside is surrounded by a conductor of the ground potential, a coaxial connector insulated from the connector and the conductor, and at least the tip portion of the connection terminal protrudes from the surrounding conductor. This makes it extremely easy to achieve impedance matching of the connector.
[0040]
In addition, the support body is formed of a material having excellent vibration absorption properties, and the connection terminals of the connector are bent and arranged in a predetermined direction with substantially regularity, thereby providing a connection intermediate which suppresses poor conduction and is resistant to shock vibration. be able to.
[Brief description of the drawings]
FIG. 1 is a conceptual diagram showing a cross-sectional structure of an inspection board including a connection intermediary J according to an embodiment of the present invention. FIG. 2 is a conceptual diagram showing a cross-sectional structure of a connection intermediary J in which a part of FIG. FIG. 3 is a conceptual diagram showing a cross-sectional structure of another connection interposition body according to the embodiment of the present invention. FIG. 4 is a conceptual diagram showing a cross-sectional structure of another connection interposition body according to the embodiment of the present invention. Conceptual diagram showing the cross-sectional structure of the inspection board including the intervening body I [Description of reference numerals]
1, 3 Substrate 2, 4 Electrode 5 Intermediate 6 Contact 7 Wafer 8 Card holder 10 Hole 11 Support 12, 22 Connector 13, 23 Connection terminal 14 Dielectric 15 Positioning plate 16 Guide hole R Diameter r Wire diameter 24 Conductivity Body 25 tip

Claims (14)

A connection intervening body that is interposed between two substrates having a plurality of electrodes corresponding to a power supply line and a signal line to electrically connect corresponding electrodes from both sides,
A support having a through hole formed therein, a connector inserted into the hole and having connection terminals on both sides, and the connector is held in the hole while securing insulation to the support. Configured connection mediator. The connecting body according to claim 1, wherein the support is formed from a conductive material. The connection interposition body according to claim 1, wherein the support is configured such that a conductive layer is disposed on at least one surface of a non-conductive plate. The connection interposition body according to any one of claims 1 to 3, wherein a dielectric is provided between the hole and the support. 5. The connector according to claim 1, wherein the diameter of the hole is adjusted and formed so that the impedance of the connector is low impedance in the power supply line and impedance matching in the signal line. 6. Connection intermediary. 6. The connector according to claim 1, wherein the connector is formed by changing and adjusting the wire diameter so that the impedance of the connector is low in the power supply line and the impedance of the signal line is impedance matching. 7. The connection intermediary according to the above. 7. The semiconductor device according to claim 1, wherein the impedance of the connector is adjusted to be low in the power supply line and the impedance of the signal line is adjusted by changing and adjusting the dielectric constant of the dielectric. The connection intermediary according to the above. The connection interposition body according to any one of claims 1 to 7, wherein the support is configured to have the same potential as a ground potential. The connection intermediate according to any one of claims 1 to 8, wherein the support is formed of a material having excellent vibration absorption properties. The connection interposition body according to any one of claims 1 to 9, wherein the connector is conductive and is formed from a metal material or a material having a metal layer formed on a surface. The connection intermediate according to any one of claims 1 to 10, wherein the connector is configured to have elasticity on one side or both sides of the support. The connection interposition body according to any one of claims 1 to 11, wherein the connector is configured to be bent in a predetermined direction with substantially regularity. The connector is a coaxial connector in which the outside is surrounded by a conductor having a ground potential, and the connector and the conductor are insulated from each other. The connection interposition body according to any one of claims 1 to 12, wherein the connection intermediate body is configured to protrude. 13. The connection interposition body according to claim 12, wherein the connector has a positioning plate disposed on at least one surface of the support, and is configured to be bent using a guide hole formed in the positioning plate.

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