JP2009164720A - 撮像装置及び撮像装置の製造方法 - Google Patents

撮像装置及び撮像装置の製造方法 Download PDF

Info

Publication number
JP2009164720A
JP2009164720A JP2007339608A JP2007339608A JP2009164720A JP 2009164720 A JP2009164720 A JP 2009164720A JP 2007339608 A JP2007339608 A JP 2007339608A JP 2007339608 A JP2007339608 A JP 2007339608A JP 2009164720 A JP2009164720 A JP 2009164720A
Authority
JP
Japan
Prior art keywords
adhesive
bonding
outer frame
frame member
sensor cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007339608A
Other languages
English (en)
Japanese (ja)
Inventor
Takeshi Kamisaka
武史 上坂
Yusuke Suzuki
裕介 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Priority to JP2007339608A priority Critical patent/JP2009164720A/ja
Priority to CN200810184927XA priority patent/CN101471359B/zh
Publication of JP2009164720A publication Critical patent/JP2009164720A/ja
Withdrawn legal-status Critical Current

Links

Images

Landscapes

  • Studio Devices (AREA)
  • Blocking Light For Cameras (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2007339608A 2007-12-28 2007-12-28 撮像装置及び撮像装置の製造方法 Withdrawn JP2009164720A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007339608A JP2009164720A (ja) 2007-12-28 2007-12-28 撮像装置及び撮像装置の製造方法
CN200810184927XA CN101471359B (zh) 2007-12-28 2008-12-23 摄像装置及摄像装置的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007339608A JP2009164720A (ja) 2007-12-28 2007-12-28 撮像装置及び撮像装置の製造方法

Publications (1)

Publication Number Publication Date
JP2009164720A true JP2009164720A (ja) 2009-07-23

Family

ID=40828618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007339608A Withdrawn JP2009164720A (ja) 2007-12-28 2007-12-28 撮像装置及び撮像装置の製造方法

Country Status (2)

Country Link
JP (1) JP2009164720A (zh)
CN (1) CN101471359B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170066875A (ko) * 2015-12-07 2017-06-15 엘지이노텍 주식회사 카메라 모듈
KR20170071834A (ko) * 2015-12-16 2017-06-26 엘지이노텍 주식회사 카메라 모듈
JP2018088545A (ja) * 2011-06-30 2018-06-07 ムラタ エレクトロニクス オサケユキチュア システムインパッケージデバイスを製造する方法、および、システムインパッケージデバイス
WO2019207897A1 (ja) * 2018-04-27 2019-10-31 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140128415A (ko) * 2012-02-07 2014-11-05 가부시키가이샤 니콘 촬상 유닛 및 촬상 장치
TWM513520U (zh) * 2015-06-11 2015-12-01 Altek Corp 攝像模組

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4170968B2 (ja) * 2004-02-02 2008-10-22 松下電器産業株式会社 光学デバイス
KR100704980B1 (ko) * 2005-11-28 2007-04-09 삼성전기주식회사 카메라 모듈 패키지
KR100770684B1 (ko) * 2006-05-18 2007-10-29 삼성전기주식회사 카메라 모듈 패키지

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018088545A (ja) * 2011-06-30 2018-06-07 ムラタ エレクトロニクス オサケユキチュア システムインパッケージデバイスを製造する方法、および、システムインパッケージデバイス
KR20170066875A (ko) * 2015-12-07 2017-06-15 엘지이노텍 주식회사 카메라 모듈
KR102521612B1 (ko) * 2015-12-07 2023-04-13 엘지이노텍 주식회사 카메라 모듈
KR20170071834A (ko) * 2015-12-16 2017-06-26 엘지이노텍 주식회사 카메라 모듈
KR102477249B1 (ko) * 2015-12-16 2022-12-13 엘지이노텍 주식회사 카메라 모듈
WO2019207897A1 (ja) * 2018-04-27 2019-10-31 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Also Published As

Publication number Publication date
CN101471359B (zh) 2013-04-10
CN101471359A (zh) 2009-07-01

Similar Documents

Publication Publication Date Title
US7720374B2 (en) Camera module
US7643081B2 (en) Digital camera module with small sized image sensor chip package
WO2017166798A1 (zh) 摄像模组及其模塑感光组件和制造方法以及电子设备
JP4764941B2 (ja) 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US7515817B2 (en) Camera module
US8194182B2 (en) Solid-state image pickup apparatus with positioning mark indicating central part of light-receiving section of solid-state image sensing device and electronic device comprising the same
JP2012222546A (ja) 固体撮像装置及びその製造方法、並びに電子機器
US20050242410A1 (en) Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module
JP2010141865A (ja) イメージセンサカメラモジュール及びその製造方法
JP2009164720A (ja) 撮像装置及び撮像装置の製造方法
KR102465474B1 (ko) 일체형 패키징 공정 기반 카메라 모듈, 그 일체형 기저 부품 및 그 제조 방법
JP2010103490A (ja) 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US20090147115A1 (en) Solid-state image pick-up device, method for producing the same, and electronics device with the same
US7527441B2 (en) Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module
JP2001345391A (ja) 電子部品及びその製造方法
JP2010283760A (ja) カメラモジュール及びその製造方法
JP2006106716A (ja) カメラモジュール
CN109672806B (zh) 摄像模组和感光组件及其封装方法
JPH1074923A (ja) 光電変換素子の実装装置およびその製造方法
JP2013110593A (ja) カメラモジュール
EP3955561A1 (en) Camera module, molded photosensitive assembly and manufacturing method therefor, and electronic device
JP5599294B2 (ja) 撮像モジュールおよびその製造方法、並びに電子情報機器
JP2007329813A (ja) 固体撮像装置及びこの固体撮像装置を備えた撮像装置
JP2005217322A (ja) 固体撮像装置用半導体素子とそれを用いた固体撮像装置
US20090315130A1 (en) Solid-state imaging apparatus and method for manufacturing the same

Legal Events

Date Code Title Description
RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20100913

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101007

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101013

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20101215