JP2009164720A - Imaging apparatus and method of manufacturing the same - Google Patents

Imaging apparatus and method of manufacturing the same Download PDF

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Publication number
JP2009164720A
JP2009164720A JP2007339608A JP2007339608A JP2009164720A JP 2009164720 A JP2009164720 A JP 2009164720A JP 2007339608 A JP2007339608 A JP 2007339608A JP 2007339608 A JP2007339608 A JP 2007339608A JP 2009164720 A JP2009164720 A JP 2009164720A
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Japan
Prior art keywords
adhesive
imaging
bonding
unit
sensor cover
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JP2007339608A
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Japanese (ja)
Inventor
Takeshi Kamisaka
Yusuke Suzuki
武史 上坂
裕介 鈴木
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Konica Minolta Opto Inc
コニカミノルタオプト株式会社
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Priority to JP2007339608A priority Critical patent/JP2009164720A/en
Publication of JP2009164720A publication Critical patent/JP2009164720A/en
Withdrawn legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To simplify a process for manufacturing an imaging apparatus by dispensing with an independent blocking process of a communicating opening, and to improve production efficiency. <P>SOLUTION: An imaging apparatus has: an imaging unit having a storage space formed by bonding and fixing each of a printed circuit board 11 mounting an image sensor and an infrared cut filter 4 to a sensor cover 3; and a lens unit mounted to the imaging unit. In the sensor cover, there is a first unit bonding section 341 smeared with an adhesive to mount the lens unit by bonding. At the first unit bonding section, a communicating opening 341a, which enables the storage space to communicate with the outside, is formed at a position blocked by bonding the lens unit for attachment. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an imaging apparatus, in particular, an imaging apparatus that can be mounted on a small electronic device such as a mobile phone or a mobile computer, and a method for manufacturing the same.

2. Description of the Related Art In recent years, small imaging devices that are mounted on small portable terminals (electronic devices) such as mobile phones and mobile computers have been developed.
The imaging device generates image data of a subject image formed by an imaging lens using an imaging element such as a CCD image sensor or a CMOS image sensor.
In this imaging apparatus, for example, a sensor cover is bonded and fixed to a predetermined position of a substrate on which the imaging element is mounted so as to cover the periphery of the imaging element, and then optically so as to cover the imaging element on the sensor cover from the subject side. After the filter is bonded and fixed to make the imaging device sealed, the lens unit including the imaging lens is bonded and fixed to the subject side of the sensor cover.

In the manufacturing process of the imaging apparatus, the bonding process between the members, that is, the bonding of the sensor cover to the substrate, the bonding process of the optical filter to the sensor cover, and the bonding process of the lens unit to the sensor cover, requires a shorter bonding time. However, there are cases where the processing temperature becomes high and those where the processing temperature is low but adhesion takes time.
In order to improve the production efficiency of the imaging apparatus, it is preferable that the bonding time between the members is shorter. In particular, the bonding of the sensor cover to the substrate and the bonding of the optical filter to the sensor cover are preferably performed in a shorter time because they are bonding processes performed in the middle of the production line of the imaging device.
Therefore, it is desirable to use a thermosetting or ultraviolet curable adhesive that requires a shorter bonding time for bonding the sensor cover to the substrate and bonding the optical filter to the sensor cover.

However, when the optical filter is bonded to the sensor cover, the imaging element is stored in a sealed state when the temperature becomes high due to the importance of production efficiency and the use of an adhesive that requires a shorter bonding time. There is a risk that the internal pressure of the storage space of the image sensor formed by the sensor cover and the optical filter will increase, the sensor cover will be damaged, the adhesive will peel off before it is sufficiently cured, or the optical filter will be deformed. there were.
In view of this, there has been developed one that suppresses an increase in internal pressure of the storage space by forming a through hole that communicates the storage space with the outside (see, for example, Patent Document 1). Specifically, a through-hole penetrating a surface portion of the housing facing the image sensor of the die pad is formed, and the through-hole functions as a communication hole that communicates the storage space of the image sensor with the outside.
In addition, as a heat countermeasure for the image sensor, a vent hole is provided in the storage container of the solid-state image sensor package in order to protect the heat-sensitive portion inside the container when soldering the solid-state image sensor package, and the vent is provided through the vent hole. A device for ventilating cooling air has also been developed (see, for example, Patent Document 2).

On the other hand, when the lens unit is bonded to the sensor cover after the image pickup device is sealed, the bonding process does not necessarily have to be performed on the production line. Although it takes time, an adhesive treatment using a thermosetting adhesive or a moisture-curing adhesive that cures at a lower temperature for a long time can be employed. That is, conditions such as the bonding temperature applicable to the lens unit bonding process to the sensor cover and the material of the adhesive have many options compared to the bonding of the sensor cover to the substrate and the bonding process of the optical filter to the sensor cover, By lowering the temperature compared to the case of using an ultraviolet curable adhesive, the sensor cover breaks, the adhesive peels off, the optical filter deforms as the internal pressure of the image sensor storage space increases. Problems can be prevented from occurring.
JP-A-2005-26426 JP 2007-165462 A

By the way, in the above-mentioned Patent Document 1 or the like, when a through hole that communicates between the storage space and the outside is formed with emphasis on the production efficiency of the imaging device, the storage space is opened through the through hole if the through hole remains open. There is a problem that dust or dust enters. Similarly, in the case of the vent hole in Patent Document 2, if the vent hole remains open when attached to the image pickup apparatus, dust or dust that has entered through the vent hole rotates toward the light receiving surface side of the solid-state imaging device package. There is a problem that it is crowded.
For this reason, although the communication hole is finally closed, if the process of closing the communication hole is performed separately, the manufacturing process of the imaging device is complicated, and the production efficiency of the imaging device is reduced. I will invite you.

  Therefore, an object of the present invention is to eliminate the need for performing the communication hole closing process independently, thereby simplifying the manufacturing process of the imaging device and improving the production efficiency of the imaging device and the imaging device. It is to provide a manufacturing method.

In order to solve the above problem, an imaging apparatus according to claim 1 is provided.
An imaging unit in which a storage space is formed by bonding and fixing an imaging element or a substrate on which the imaging element is mounted and an optical member to an outer frame member;
A lens unit attached to the imaging unit,
The outer frame member is provided with an adhesive attachment portion on which an adhesive is smeared to attach the lens unit by adhesion,
The adhesive attachment portion is characterized in that a communication hole that connects the storage space and the outside is formed at a position that is closed by the adhesive attachment of the lens unit.

The imaging device of the invention according to claim 2
An imaging unit is provided in which a housing space is formed by bonding and fixing a substrate on which an imaging element is mounted, at least a part of which has flexibility, and an optical member, to an outer frame member. ,
An outer frame in which the outer frame member is attached to a portion of the outer frame member adjacent to the flexible portion, or a connection portion between the outer frame member and the flexible portion, or the outer frame member other than the flexible portion of the substrate. An adhesive smearing portion is provided on which a reinforcing adhesive that reinforces the connecting portion between the member mounting substrate portion and the flexible portion is smeared;
The adhesive smearing portion is characterized in that a communication hole is formed in the position closed by the reinforcing adhesive to communicate the storage space with the outside.

  Here, the substrate on which at least a part is made of a flexible part and is mounted with an imaging device may be a film-based flexible board (FPC) that is made entirely of a flexible part, or flexible. It may be a rigid FPC board in which a substrate and a glass-based rigid board are combined and integrated, or a flexible board and a rigid board are conductively connected via a conductive means such as an anisotropic conductive adhesive film. May be.

Invention of Claim 3 is a manufacturing method of the imaging device of Claim 1, Comprising:
The adhesive smeared on the adhesive mounting portion is used to bond the imaging element or the substrate on which the imaging element is mounted to the outer frame member or the optical member and the outer frame member. The lens unit and the outer frame member are bonded and fixed, and the communication hole is closed, by curing at a lower temperature than when the agent is cured.

Invention of Claim 4 is a manufacturing method of the imaging device of Claim 2, Comprising:
The reinforcing adhesive smeared on the adhesive smeared portion is used as an adhesive used for adhering the flexible portion and the outer frame member, and an adhesive used for adhering the outer frame member mounting substrate portion and the outer frame member. By curing at a lower temperature than the case where the adhesive or the adhesive used for bonding the optical member and the outer frame member is cured, the outer frame member and the bonded portion of the flexible portion and the outer frame member The connecting portion between the mounting substrate portion and the flexible portion is reinforced and the communication hole is closed.

  According to the present invention, it is not necessary to independently perform the communication hole closing process for communicating the storage space of the imaging unit with the outside, thereby simplifying the manufacturing process of the imaging apparatus and improving the production efficiency. Can

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.

[Embodiment 1]
FIG. 1 is a plan view of an imaging apparatus 100 exemplified as a preferred embodiment 1 to which the present invention is applied, and FIG. 2 is a side view of the imaging apparatus 100. FIG. 3 is a diagram schematically showing a cross section of the imaging apparatus 100 taken along the line III-III in FIG. FIG. 3 schematically shows the internal configuration of the lens unit 5.
In the following description, the direction along the optical axis direction of the imaging apparatus 100 is defined as the vertical direction.

  The imaging apparatus 100 according to the first embodiment includes, for example, as illustrated in FIGS. 1 to 3, a substrate 1, an imaging element 2 disposed on one surface of the substrate 1, and a sensor cover 3 attached and fixed to the substrate 1. And an infrared cut filter 4 attached and fixed to the sensor cover 3 so as to face the image sensor 2, a lens unit 5 attached and fixed to the sensor cover 3, and the like.

The substrate 1 includes a printed circuit board (PWB) 11 and a flexible substrate 12 connected to the printed circuit board 11.
The flexible substrate 12 has an external connection terminal 13 connected to one end (for example, the left end in FIG. 1) and the printed circuit board 11 connected to the other end (for example, the right end in FIG. 1).

  The printed circuit board 11 is formed in a plate shape having a substantially rectangular shape in plan view. An image sensor 2 is disposed at a predetermined position on one surface of the printed board 11 (for example, on the right side of the center in FIG. 1), and the image processing unit 6 is adjacent to the image sensor 2 (for example, on the left side in FIG. 1). In addition, a memory 7 is provided.

The image sensor 2 is, for example, a CCD image sensor, a CMOS image sensor, or the like, and is formed in a substantially rectangular shape in plan view.
A photoelectric conversion unit (imaging region) 2a in which pixels are two-dimensionally arranged is formed at a substantially central portion of the light receiving side surface of the imaging element 2, and a signal processing circuit (not shown) is formed around the photoelectric conversion unit 2a. ing. The signal processing circuit includes, for example, a driving circuit unit that sequentially drives each pixel to obtain a signal charge, an A / D conversion unit that converts each signal charge into a digital signal, a signal processing unit that outputs the digital signal, and the like. Has been.
A plurality of pads serving as connection terminals are provided outside the photoelectric conversion unit 2 a of the image sensor 2 and in the vicinity of the outer edge, and are connected to the printed circuit board 11 via wires W. Then, the image signal output from the signal processing circuit is output to a predetermined circuit on the substrate 1 through the wire W.

Further, as shown in FIG. 4, a sensor cover mounting portion 14 to which the lower end portion of the sensor cover 3 is bonded via a predetermined adhesive G1 is provided on one surface of the printed board 11.
In FIG. 4, the adhesive G1 smeared on the sensor cover mounting portion 14 is schematically represented by dots.

The sensor cover mounting portion 14 has a frame-shaped portion 141 formed in a substantially “B” shape so as to surround the imaging device 2, and a part of the frame-shaped portion 141 (for example, the lower end portion in FIG. 4). It extends to the image processing unit 6 and the memory 7 side (for example, the left side in FIG. 4). At a predetermined position of the frame-shaped portion 141, four grounded portions 141a serving as a reference ground surface of the sensor cover 3 are formed.
In other words, the sensor cover mounting portion 14 surrounds the imaging element 2 with the frame-shaped portion 141 by the sensor cover 3 being bonded and fixed, and the bonding portion between the substrate 1 and the lower end portion of the sensor cover 3 extends over the entire circumference. It seals (see FIG. 3 and FIG. 4).

  In addition, the sensor cover mounting portion 14 is bent in an L-shape independently of the frame-shaped portion 141 on the side opposite to the frame-shaped portion 141 of the image processing unit 6 and the memory 7 (for example, the left side in FIG. 4). A portion 142 is provided. The bent portion 142 extends along the short side direction (vertical direction in FIG. 4) of the printed circuit board 11, and one end thereof (for example, the lower end portion in FIG. 4) is on the image processing unit 6 and memory 7 side (for example, The right side of FIG. 4 is bent and extended.

Here, the method of adhering the sensor cover 3 to the sensor cover mounting portion 14 of the printed circuit board 11 requires a shorter adhering time, but a thermosetting or ultraviolet curable adhesive that causes a high processing temperature. There is an adhesion method using a thermosetting adhesive or a moisture curing type adhesive that cures at a lower temperature for a long time although adhesion takes time.
The bonding process of the sensor cover 3 to the sensor cover mounting portion 14 is a bonding process performed in the middle of the production line of the imaging device 100, and heat that requires a shorter bonding time to improve production efficiency. An adhesion method using a curable or ultraviolet curable adhesive is preferred.
In addition, in the bonding process using the thermosetting adhesive, the temperature of the adhesive is increased to be cured.
Moreover, the adhesion | attachment process using an ultraviolet curable adhesive is irradiated with an ultraviolet-ray in order to harden an adhesive agent. In addition, although ultraviolet-ray itself is not high temperature, as a result of the said ultraviolet irradiation, parts other than an adhesion site will also become hot.

The image processing unit 6 performs predetermined image processing on the digital signal output from the signal processing unit of the image sensor 2.
The memory 7 stores various data such as a digital signal output from the signal processing unit of the image sensor 2.
The image processing unit 6 and the memory 7 are arranged side by side along the short direction (vertical direction in FIG. 4) of the printed circuit board 11, and the image processing unit 6 is arranged on the upper side in FIG. A memory 7 is arranged on the side.

  As shown in FIGS. 2 and 3, the sensor cover 3 is attached to the sensor cover attaching portion 14 of the printed circuit board 11 so as to cover the imaging element 2, the image processing portion 6, the memory 7, and the like from the subject side. It is arranged. Specifically, the sensor cover 3 is disposed on the first covering portion 31 that covers the periphery of the image sensor 2 and on the image processing portion 6 and memory 7 side (the left side in FIGS. 2 and 3) of the first covering portion 31. A second covering portion 32 that is formed continuously and covers the image processing portion 6 and the memory 7 from the subject side is provided.

  The first covering portion 31 stands on the subject side from the printed circuit board 11, and has a side wall portion 311 formed in a frame shape along the frame shape portion 141 of the sensor cover mounting portion 14, and an inner side from the upper end portion of the side wall portion 311. And an upper wall portion 312 extending to the top.

  The upper wall portion 312 is formed with an opening 312a that exposes the photoelectric conversion portion 2a of the image sensor 2 at a substantially central portion thereof, and a filter attachment portion 33 to which the infrared cut filter 4 is attached around the opening 312a. A lens unit attachment portion 34 to which the lens unit 5 is attached is formed around 33.

As shown in FIG. 5, the filter mounting portion 33 is formed outside the opening 312 a, and four filter adhesive portions 332 that are smeared with a predetermined adhesive G <b> 2, and each rectangular corner portion has an arc shape. A first arrangement portion 35 where the chamfered infrared cut filter 4 is arranged, a second arrangement portion 36 where a rectangular infrared cut filter is arranged, and the like are provided.
In FIGS. 5 and 6 (described later), the adhesive G2 smeared on the filter adhesive portion 332 is schematically represented by dots.

  The infrared cut filter 4 is disposed between the optical lens 51 and the image pickup device 2, and cuts infrared light by transmitting visible light among the light that has passed through the optical lens 51.

  The infrared cut filter 4 includes a rectangular quadrangular shape such as a square and a rectangle, and a polygonal (rectangular) corner portion chamfered. In the present embodiment, the infrared cut filter 4 has a rectangular shape. It is assumed that the infrared cut filter 4 having a shape in which each corner is chamfered in an arc shape is used.

  A substantially central portion of the upper wall portion 312 is provided with a peripheral wall portion 37 that protrudes from the upper surface and is partially broken (for example, the lower left portion in FIG. 5) to have an inverted “C” shape. A first arrangement portion 35 is formed in the first.

  The first arrangement portion 35 is formed in a shape corresponding to the outer shape of the infrared cut filter 4, and supports the outer portion of the transmission-required region 4 a of the infrared cut filter 4 from the lower side by the edge portion of the opening 312 a. The cut filter 4 is positioned.

  And the infrared cut filter 4 is arrange | positioned in the 1st arrangement | positioning part 35, and the edge part of the said infrared cut filter 4 will be in the state arrange | positioned facing the filter adhesion part 332, and it adhere | attaches via the adhesive agent G2. (See FIG. 6).

  The 2nd arrangement part 36 positions the infrared cut filter by supporting the outside part of transmission required field 4a of a rectangular infrared cut filter from the lower part by the edge of opening 312a.

  When a rectangular filter is used as the infrared cut filter, the infrared cut filter is arranged in the second arrangement portion 36 so that the edge portion of the infrared cut filter is arranged opposite to the filter adhesion portion 332. It becomes a state and can be bonded via the adhesive G2 (not shown).

The filter adhesion part 332 adheres the infrared cut filter 4 with the adhesive G2. Further, four filter adhesive portions 332 are formed inside the peripheral wall portion 37 and along the edge portion of the opening 312a. Further, the filter adhesive portion 332 is formed continuously with the edge portion of the opening portion 312a and has a shape that is recessed below the edge portion of the opening portion 312a (see FIG. 3).
As a result, the filter adhesive portion 332 stores the predetermined adhesive G2 used for bonding the infrared cut filter 4 and is supported by the edge of the opening 312a via the adhesive G2. Glue the edge part. Specifically, the adhesive G2 stored in the filter adhesive portion 332 contacts the edge portion of the infrared cut filter 4 by making the edge portion of the infrared cut filter 4 face the four filter adhesive portions 332. Of the infrared cut filter 4 by spreading substantially into the gap between the portion of the infrared cut filter 4 not facing the filter bonding portion 332 and the edge of the opening 312a by an action substantially equivalent to the capillary phenomenon. The edge portion is sealed over the entire circumference.
Here, the printed circuit board 11, the image sensor 2, the sensor cover 3, and the infrared cut filter 4 constitute an image pickup unit that forms a storage space.

  Here, the method of adhering the infrared cut filter 4 to the filter adhering portion 332 requires a shorter adhering time, but adhering using a thermosetting or ultraviolet curable adhesive that causes a high processing temperature. Although there is a method and a bonding method using a thermosetting adhesive or a moisture curing type adhesive that cures for a long time at a lower temperature, although it takes time to bond, there is a method for bonding to the filter bonding portion 332. The bonding process of the infrared cut filter 4 is a bonding process performed in the middle of the production line of the imaging device 100, and in order to improve the production efficiency, a thermosetting type or an ultraviolet curing type that requires a shorter bonding time. The bonding method using the adhesive is preferable.

As shown in FIG. 6, the lens unit mounting portion 34 includes three first unit bonding portions 341,... Formed on the outer side of the peripheral wall portion 37, and a side wall portion 311 (see FIG. 3, a long second unit bonding portion 342 formed on the upper side of the left side wall portion 311) and four grounded portions 343 serving as a reference grounding surface of the lens unit 5.
In FIG. 6, the adhesive G3 smeared on the first unit adhesive portion 341 and the second unit adhesive portion 342 is schematically represented by dots.

The three first unit bonding portions 341,... Are formed at predetermined intervals along the outer surface of the peripheral wall portion 37. In addition, the first unit bonding portion 341 is disposed immediately above the storage space of the image sensor 2.
Further, the first unit adhesive portion 341 is shaped to be recessed below the flat surface 312b outside the peripheral wall portion 37 of the upper wall portion 312 so that a predetermined adhesive G3 is stored.
In addition, any one of the three first unit bonding portions 341,... (For example, lower right in FIG. 5) has a first unit bonding portion 341 in a position where it is blocked by bonding attachment of the lens unit 5. A communication hole 341 a is formed so as to penetrate the storage space side of the image sensor 2 along the inner surface of the first unit bonding portion 341. Therefore, before the adhesive G3 is smeared on the first unit bonding portion 341, the storage space of the image sensor 2 and the outside above the sensor cover 3 are in communication with each other through the communication hole 341a.

The second unit bonding portion 342 is formed in a long shape along the extending direction of the side wall portion 311 where the second covering portion 32 is continuously provided, and one end portion (lower end portion in FIG. 6) side of the center portion is an image pickup device. It has a shape protruding to the 2 side.
Further, the second unit adhesive portion 342 has a shape that is recessed below the flat surface 312b outside the peripheral wall portion 37 of the upper wall portion 312, and stores a predetermined adhesive G3.

Therefore, a predetermined adhesive G3 used for bonding the lens unit 5 is stored in the first unit bonding portion 341 and the second unit bonding portion 342, and the lens barrel 53 of the lens unit 5 is bonded via the adhesive G3. To do.
As a result, the communication hole 341a formed in the first unit bonding portion 341 can be closed simultaneously with the bonding of the lens unit 5, and the storage space of the image pickup device 2 can be sealed (see FIG. 8).
Here, the 1st unit adhesion part 341 and the 2nd unit adhesion part 342 comprise the adhesion attachment part where adhesive G3 is smeared in order to attach lens unit 5 by adhesion.
In FIG. 8, the lens unit 5 is schematically shown.

  As described above, the sensor cover 3 constitutes an outer frame member in which the substrate 2 is bonded and fixed to the lower side and the lens unit 5 is bonded and fixed to the upper side.

Here, the lens unit 5 can be bonded to the sensor cover 3 with a shorter bonding time, but a bonding method using a thermosetting or ultraviolet curable adhesive that causes a high processing temperature, There are bonding methods using a thermosetting adhesive or a moisture-curing adhesive that cures for a long time at a lower temperature, although it takes time to bond.
Since the lens unit 5 is not necessarily bonded to the sensor cover 3 on the production line, the bonding process takes time, but the sensor cover 3 is bonded to the sensor cover mounting portion 14 of the printed circuit board 11. A thermosetting adhesive that cures over a long period of time at a lower temperature than the adhesive used for bonding the infrared cut filter 4 to the filter bonding portion 332 is used.

The second covering portion 32 includes a connecting portion 321 connected to the side wall portion 311 of the first covering portion 31, a top surface portion 322 that is formed continuously with the connecting portion 321 and has a substantially rectangular shape in plan view, The top surface portion 322 has three side portions 323 formed continuously, and is formed in a box shape that covers the image processing unit 6 and the memory 7 from the subject side as a whole.
Of the two side surface portions 323 and 323 arranged along the longitudinal direction of the printed circuit board 11, the side surface portion 323 on the memory 7 side is formed with a memory opening 323a for exposing the memory 7 to the outside. The side surface 323 on the image processing unit 6 side is formed with an image processing unit opening 323b that exposes the image processing unit 6 to the outside.

  The lens unit 5 includes an optical lens 51 that guides subject light to the image sensor 2, a lens driving unit 52 that moves the optical lens 51 in the optical axis direction, a lens barrel 53 on which the optical lens 51 and the lens driving unit 52 are mounted, A cover member 54 that covers the lens barrel 53 is provided.

The optical lens 51 is held by the lens holder 55.
The optical lens 51 may be composed of a single lens or a plurality of lenses.

  The lens driving unit 52 is for moving the optical lens 51 in the optical axis direction in order to perform zooming and focusing. For example, although not shown, a driving source such as a piezoelectric element and a driving force of the driving source are omitted. Is transmitted to the optical lens 51 and moved in the optical axis direction.

The lens barrel 53 is formed in a substantially rectangular parallelepiped shape, and the subject side and the image sensor 2 side are communicated along the optical axis direction. The optical lens 51 and the lens driving unit 52 are mounted on the inner side. Further, the lens barrel 53 has four first and second grounded portions 534 and 531 that are bonded to the first unit bonding portion 341 and the second unit bonding portion 342 of the sensor cover 3 at the lower end thereof. Are provided with grounding portions 533 (see FIG. 8) for grounding.
The grounding portion 533 is grounded to the four grounded portions 343,... Of the sensor cover 3, and the first bonding portion 534 is bonded to the first unit bonding portion 341 using a predetermined adhesive G3. The lens unit 5 is bonded and fixed to the sensor cover 3 by bonding the second bonding portion 531 to the two-unit bonding portion 342 using a predetermined adhesive G3.

In addition, a drive portion mounting portion 532 to which the lens drive portion 52 is attached and fixed is formed in a portion slightly above the lower end portion of the lens barrel 53.
The drive portion mounting portion 532 is formed so as to protrude from a portion slightly above the lower end portion of the lens barrel 53 to a position where the distal end portion contacts the outer surface of the peripheral wall portion 37.

The cover member 54 is formed so as to cover the lens barrel 53 from the subject side, and an opening 54a for exposing the optical lens 51 to the subject side is formed on the upper end surface (see FIGS. 2 and 3).
As shown in FIGS. 2 and 3, a mask 56 is disposed around the opening 54a. In FIG. 1, the mask is not shown.

Next, a method for manufacturing the imaging device 100 will be described.
First, on the production line, a thermosetting adhesive G1 is smeared on the sensor cover mounting portion 14 of the printed circuit board 11 on which the imaging device 2 is mounted, and the lower end portion of the sensor cover 3 is set to four grounded portions 141a, After being grounded to ..., the adhesive G1 is cured by heating. Thereby, the sensor cover 3 is bonded and fixed to the printed circuit board 11.
The sensor cover 3 may be bonded to the sensor cover mounting portion 14 using an ultraviolet curable adhesive.

  The printed circuit board 11 to which the sensor cover 3 is bonded may already have the flexible circuit board 12 attached thereto, or the flexible circuit board 12 may be attached after the sensor cover 3 is bonded.

Next, on the production line, the ultraviolet curable adhesive G2 is smeared on the filter adhesive portion 332 of the sensor cover 3, and the infrared cut filter 4 is placed and positioned on the first placement portion 35, and then irradiated with ultraviolet rays. Then, the adhesive G2 is cured. Thereby, the infrared cut filter 4 is bonded and fixed to the sensor cover 3.
The infrared cut filter 4 may be bonded to the filter bonding portion 332 using a thermosetting adhesive.

Thereafter, the lens unit 5 in which the optical lens 51 and the lens driving unit 52 are assembled to the lens barrel 53 is bonded and fixed to the sensor cover 3.
Specifically, first, the first unit bonding portion 341 and the second unit bonding portion 342 of the sensor cover 3 are bonded to the sensor cover mounting portion 14 of the printed circuit board 11 and the infrared cut filter for the filter bonding portion 332. A thermosetting adhesive G3 that is cured at a low temperature for a long time as compared with the adhesive used for the adhesive treatment 4 is smeared. Next, the grounding portion 533 of the lens barrel 53 is grounded to the four grounded portions 343. Thereafter, a plurality of the sensor covers 3 mounted with the lens unit 5 on the sensor cover 3 that are not yet bonded and fixed are put together in a heat treatment furnace and heated to cure the adhesive G3. As a result, the lens unit 5 is bonded and fixed to the sensor cover 3, and the communication hole 341a of the first unit bonding portion 341 is closed by the adhesive G3.

  Thereafter, the lens barrel 53 is covered and bonded and fixed by the cover member 54, and then the mask 56 is attached around the opening 54a of the cover member 54, whereby the imaging device 100 is manufactured.

Therefore, according to the imaging apparatus 100 of the first embodiment, the first unit adhesive portion 341 and the second unit adhesive portion 341 of the sensor cover 3 are provided with the communication holes 341a that communicate the storage space with the outside. By coating the adhesive G3 on the unit bonding portion 342 and performing the bonding process of the lens unit 5, the lens unit 5 can be bonded and fixed to the sensor cover 3 and the communication hole 341a can be closed. . Specifically, it takes a long time at a lower temperature than the adhesive used for the bonding process of the sensor cover 3 to the sensor cover mounting part 14 of the printed circuit board 11 and the bonding process of the infrared cut filter 4 to the filter bonding part 332. By using the thermosetting adhesive G3 that cures, problems such as breakage of the sensor cover 3, peeling of the adhesive G3, and deformation of the infrared cut filter 4 due to an increase in the internal pressure of the storage space of the imaging device 2 are caused. While preventing the occurrence, the communication hole 341a can be closed, and dust and dust can be prevented from entering the storage space through the communication hole 341a.
Thereby, it is not necessary to independently perform the closing process of the communication hole 341a for communicating the storage space of the imaging device 2 with the outside, and as a result, the manufacturing process of the imaging device 100 is simplified and the production efficiency is improved. be able to.

  In addition, since the lens unit 5 is bonded to the sensor cover 3 by heat-treating a plurality of the lens cover 5 mounted on the sensor cover 3 that is not yet fixed and bonded, the bonding time is increased due to long-time heat curing. Even if it becomes a little longer, the bonding time for each image pickup device can be regarded as a short time, so that the production efficiency can be prevented from decreasing.

  In the first embodiment, the communication hole 341a is formed in any one of the three first unit bonding portions 341,..., But is not limited thereto. Instead, the communication hole 341a may be formed in any two of the three first unit bonding portions 341,..., Or the three first unit bonding portions 341, ... may be formed with communication holes 341a in all of them. Furthermore, although the three first unit bonding portions 341 are provided on the sensor cover 3, the number of the first unit bonding portions 341 can be arbitrarily changed as appropriate. Even in this case, the communication hole is similarly formed. The number of 341a can be arbitrarily changed as appropriate, and the communication hole 341a only needs to be formed in at least one of the first unit bonding portions 341.

[Embodiment 2]
FIG. 9 is a diagram schematically illustrating a cross section of the imaging apparatus 200 according to the second embodiment to which the present invention is applied. FIG. 10 is an enlarged view showing a part of the imaging apparatus 200 of FIG.
As illustrated in FIG. 9, the imaging apparatus 200 according to the second embodiment includes a flexible substrate 212 on which the imaging element 2 is mounted, and a reinforcing adhesive G4 that reinforces a bonding portion between the flexible substrate 212 and the sensor cover 203 is smeared. The adhesive smearing portion 203a is formed with a communication hole 203b that communicates the storage space of the image sensor 2 with the outside, and the adhesive smearing portion 203a is smeared and cured with a reinforcing adhesive G4. The adhesive portion of the flexible substrate 212 is reinforced and the communication hole 203b is closed.

  The flexible substrate 212 is a substrate composed of a flexible portion that is flexible as a whole, and a sensor cover attachment portion (not shown) to which the sensor cover 203 is attached is formed at a predetermined position of the flexible substrate 212. A sensor cover 203 is bonded and fixed to the sensor cover mounting portion. Various electronic components constituting the imaging device 200 are mounted on the flexible substrate 212.

The sensor cover 203 is for reinforcement that reinforces the bonding portion between the sensor cover 203 and the flexible substrate 212 at a predetermined position 311a of a side wall portion (for example, the left side wall portion 311 in FIG. 9) that is a portion near the flexible substrate 212. An adhesive smearing portion 203a where the adhesive G4 is smeared is provided.
The adhesive smearing portion 203a is formed with a communication hole 203b that penetrates the side wall portion 311 and communicates the storage space of the image sensor 2 with the outside (see FIG. 10).

Here, the adhesive curing method of the reinforcing adhesive G4 requires a shorter curing time, but a method using a thermosetting or ultraviolet curing adhesive that causes a high processing temperature, or an adhesive However, there are methods using a thermosetting adhesive or a moisture curing adhesive that cures at a lower temperature for a long time.
Since the adhesive curing process of the reinforcing adhesive G4 does not necessarily have to be performed on the production line, it takes time to bond, but the sensor cover 3 is bonded to a predetermined position of the flexible substrate 212 and the filter bonding part 332 is used. A thermosetting adhesive that cures for a long time at a lower temperature than the adhesive used for the adhesive treatment of the infrared cut filter 4 is used.

  The sensor cover 203 constitutes an outer frame member to which the flexible substrate 212 and the lens unit 5 are bonded and fixed, and the communication hole 341a in the first embodiment is not provided in the first unit bonding portion 341, and the second Except for not including the covering portion 32, the configuration is substantially the same as that of the sensor cover 3 of the first embodiment, and the description thereof is omitted.

Next, a method for manufacturing the imaging device 200 will be described.
First, as in the first embodiment, on the production line, a thermosetting adhesive G1 is smeared on the sensor cover mounting portion of the flexible substrate 212 on which the imaging device 2 is mounted, the sensor cover 203 is positioned, and then heated. Then, the adhesive G1 is cured. As a result, the sensor cover 203 is bonded and fixed to the flexible substrate 212.
The sensor cover 203 may be adhered to the sensor cover mounting portion 14 using an ultraviolet curable adhesive.

Next, in the same manner as in the first embodiment, on the production line, the filter adhesive portion 332 of the sensor cover 203 is smeared with the ultraviolet curable adhesive G2, and the infrared cut filter 4 is arranged on the first arrangement portion 35. After positioning, the adhesive G2 is cured by irradiating ultraviolet rays. As a result, the infrared cut filter 4 is bonded and fixed to the sensor cover 203.
The infrared cut filter 4 may be bonded to the filter bonding portion 332 using a thermosetting adhesive.

  Thereafter, the lens unit 5 in which the optical lens 51 and the lens driving unit 52 are assembled to the lens barrel 53 is bonded and fixed to the sensor cover 203. Specifically, first, a thermosetting adhesive G3 is smeared on the first unit adhesive portion 341 and the second unit adhesive portion 342 of the sensor cover 3, the lens unit 5 is positioned, and then heated to apply the adhesive G3. Is cured. Thereby, the lens unit 5 is bonded and fixed to the sensor cover 203.

  Next, the reinforcing adhesive G4 is smeared on the adhesive smearing portion 203a of the sensor cover 203. After that, a plurality of the sensor cover 3 on which the lens unit 5 is mounted on the sensor cover 3 in which the reinforcing adhesive G4 has not yet been cured are put together in a heat treatment furnace and heated to cure the adhesive G4. This reinforces the bonding portion between the sensor cover 203 and the flexible substrate 212, and the communication hole 203b is closed by the adhesive G4.

  Thereafter, the lens barrel 53 is covered with a cover member 54 and bonded and fixed, and then the mask 56 is attached around the opening 54a of the cover member 54, whereby the imaging device 200 is manufactured.

Therefore, according to the imaging apparatus 200 of the second embodiment, the adhesive smearing portion 203a of the sensor cover 203 is provided with the communication hole 203b that communicates the storage space with the outside, and therefore the adhesive smearing portion 203a has a reinforcing adhesive. G4 is smeared and the adhesive portion of the sensor cover 203 and the flexible substrate 212 is reinforced and bonded by hardening the reinforcing adhesive G4, thereby reinforcing the adhesive portion of the sensor cover 203 and the flexible substrate 212. The communication hole 203b can be closed. Specifically, a thermosetting type that cures for a long time at a lower temperature than the adhesive used for the adhesive treatment of the sensor cover 203 to the flexible substrate 212 and the adhesive treatment of the infrared cut filter 4 to the filter adhesive portion 332. By using the reinforcing adhesive G4, problems such as breakage of the sensor cover 203, peeling of the reinforcing adhesive G4, and deformation of the infrared cut filter 4 due to an increase in the internal pressure of the storage space of the image sensor 2 can be prevented. The communication hole 203b can be closed while preventing the dust and dust from entering the storage space through the communication hole 203b.
Thereby, it is not necessary to independently perform the closing process of the communication hole 203b for communicating the storage space of the imaging device 2 with the outside, and as a result, the manufacturing process of the imaging device 200 is simplified and the production efficiency is improved. be able to.

  In addition, the reinforcement bonding process of the bonding portion between the sensor cover 203 and the flexible substrate 212 is performed by heating a plurality of the uncured reinforcing adhesives G4 yet, so that the bonding time is slightly increased due to the long-time heat curing. Even if the length is increased, the bonding time for each image pickup device can be regarded as a short time, so that it is possible to prevent a reduction in production efficiency.

  In the second embodiment, the imaging device 200 includes the lens unit 5. However, whether or not the lens unit 5 is provided can be arbitrarily changed.

  Moreover, in the said Embodiment 2, although the flexible board | substrate 212 which has flexibility as a whole was illustrated as a board | substrate, it is not restricted to this, The flexible part which at least one part has flexibility Any substrate can be used. For example, it may be composed of a flexible part, a part of which is flexible, such as a rigid FPC board in which a flexible substrate and a glass-based rigid substrate are combined and integrated. In other words, the rigid FPC board is a mixture of a flexible board part that can be bent freely and a rigid board part on which components are mounted. The board can be efficiently used for products having complicated shapes such as digital cameras and mobile phones. There is an advantage that can be disposed.

Further, the substrate may be a substrate in which a flexible substrate and a rigid substrate are conductively connected through a conductive means such as an anisotropic conductive adhesive film (ACF). That is, as shown in FIGS. 11 and 12, a rigid substrate 411 to which the sensor cover 203 is bonded and fixed, and a flexible substrate 412 conductively connected to the rigid substrate 411 via an anisotropic conductive adhesive film (not shown) are connected. It may be a substrate 400 provided.
The rigid substrate 411 constitutes an outer frame member attachment substrate portion to which a sensor cover 203 other than the flexible substrate 412 of the substrate is attached. And the flexible substrate 412 is connected to the lower surface which is an edge part of the rigid board | substrate 411 and is the opposite side to the left side wall part 311 in which the adhesive smear part 203a was provided through the anisotropic conductive adhesive film. .

  In such a case, thermosetting that cures over a long period of time at a lower temperature than the adhesive used for bonding the sensor cover 203 to the rigid substrate 411 and bonding the infrared cut filter 4 to the filter bonding portion 332. Using the reinforcing adhesive G4 of the mold, the reinforcing adhesive G4 is smeared and cured on the adhesive smearing portion 203a to reinforce the connecting portion of the rigid substrate 411 and the flexible substrate 412, and to connect the communication hole 203b. Can be occluded.

The present invention is not limited to the above-described embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.
For example, in the first and second embodiments, the sensor covers 3 and 203 are bonded and fixed to the printed circuit board 11 and the flexible circuit board 212 on which the image sensor 2 is mounted. However, the present invention is not limited to this. You may make it adhere | attach a sensor cover directly to the image pick-up element 2 on the board | substrate 11 or the flexible substrate 212. FIG.

  In the first and second embodiments, the lens unit 5 is mounted with the lens driving unit 52. However, the present invention is not limited to this, and the lens driving unit 52 is bonded and fixed to the sensor cover. Also good. In such a case, the lens driving unit 52 is not necessarily bonded and fixed to the sensor cover on the production line, and production efficiency is not important. A thermosetting adhesive that cures for a long time at a lower temperature than the adhesive used for the bonding process of the sensor covers 3 and 203 to the substrate 212 and the bonding process of the infrared cut filter 4 to the filter bonding part 332 is used. May be.

  Furthermore, the bonding and fixing of the cover member 54 to the lens barrel 53 in the first and second embodiments is not necessarily performed on the production line and does not place importance on production efficiency. Thermosetting type that cures for a long time at a lower temperature than the adhesive used for the adhesive treatment of the sensor covers 3 and 203 to the printed circuit board 11 and the flexible substrate 212 and the adhesive treatment of the infrared cut filter 4 to the filter adhesive part 332. The adhesive may be used.

  In the first and second embodiments, the infrared filter 4 has been described as an example of the optical filter. However, the present invention is not limited to this, and at least one of the lights that have passed through the optical lens 51 is used. Any filter may be used as long as it transmits the light of the part. For example, it may be a low-pass filter that cuts unnecessary frequency components in the light entering the image sensor 2.

  Moreover, in the said Embodiment 1 and 2, although the thing of the shape where each corner | angular part of the rectangle was chamfered circularly as the infrared cut filter 4 was illustrated, even if it is a right-angled quadrilateral shape, such as a square and a rectangle, It may be a quadrangle whose corners other than the right quadrilateral are not 90 degrees.

  Furthermore, in the first and second embodiments, the lens driving unit 52 for performing zooming and focusing is provided. However, the present invention is not limited to this, and whether or not the lens driving unit 52 is provided is determined as appropriate. It can be changed arbitrarily.

  In addition, the configurations of the imaging devices 100 and 200 are merely examples, and are not limited to those illustrated in the above embodiment.

It is a top view of an imaging device illustrated as suitable Embodiment 1 to which the present invention is applied. It is a side view of the imaging device of FIG. It is a figure which shows typically the cross section of the imaging device in the III-III line | wire of FIG. It is a top view which shows the state which removed the lens unit and the sensor cover from the imaging device of FIG. It is a top view which shows the state which attached the sensor cover to the board | substrate of the imaging device of FIG. It is a top view which shows an example in the state which attached the infrared cut filter to the sensor cover of the imaging device of FIG. It is a figure which shows typically the cross section of the imaging device in the VII-VII line of FIG. It is a figure which shows typically the cross section of the imaging device in the VIII-VIII line of FIG. It is a figure which shows typically the cross section of the imaging device illustrated as suitable Embodiment 2 to which this invention is applied. It is a figure which expands and shows a part of imaging device of FIG. It is sectional drawing which shows the modification of an imaging device typically. It is a figure which expands and shows a part of imaging device of FIG.

Explanation of symbols

100, 200 Imaging device 1 Substrate 11 Printed substrate 212 Flexible substrate 2 Imaging element 3, 203 Sensor cover (outer frame member)
341 1st unit adhesion part 341a, 203b Communication hole 4 Infrared cut filter 5 Lens unit 51 Optical lens 53 Lens barrel G1, G2, G3 Adhesive G4 Reinforcing adhesive

Claims (4)

  1. An imaging unit in which a storage space is formed by bonding and fixing an imaging element or a substrate on which the imaging element is mounted and an optical member to an outer frame member;
    A lens unit attached to the imaging unit,
    The outer frame member is provided with an adhesive attachment portion on which an adhesive is smeared to attach the lens unit by adhesion,
    The imaging apparatus according to claim 1, wherein a communication hole that communicates the storage space with the outside is formed at a position that is closed by the adhesive attachment of the lens unit.
  2. An imaging unit is provided in which a housing space is formed by bonding and fixing a substrate on which an imaging element is mounted, at least a part of which has flexibility, and an optical member, to an outer frame member. ,
    An outer frame in which the outer frame member is attached to a portion of the outer frame member adjacent to the flexible portion, or a connection portion between the outer frame member and the flexible portion, or the outer frame member other than the flexible portion of the substrate. An adhesive smearing portion is provided on which a reinforcing adhesive that reinforces the connecting portion between the member mounting substrate portion and the flexible portion is smeared;
    The imaging device, wherein the adhesive smearing portion is formed with a communication hole that communicates the storage space with the outside at a position closed by the reinforcing adhesive.
  3. It is a manufacturing method of the imaging device according to claim 1,
    The adhesive smeared on the adhesive mounting portion is used to bond the imaging element or the substrate on which the imaging element is mounted to the outer frame member or the optical member and the outer frame member. A method of manufacturing an imaging device, wherein the lens unit and the outer frame member are bonded and fixed and the communication hole is closed by curing at a lower temperature than when the agent is cured.
  4. It is a manufacturing method of the imaging device according to claim 2,
    The reinforcing adhesive smeared on the adhesive smeared portion is used as an adhesive used for adhering the flexible portion and the outer frame member, and an adhesive used for adhering the outer frame member mounting substrate portion and the outer frame member. By curing at a lower temperature than the case where the adhesive or the adhesive used for bonding the optical member and the outer frame member is cured, the outer frame member and the bonded portion of the flexible portion and the outer frame member A method for manufacturing an imaging apparatus, comprising reinforcing a connection portion between an attachment substrate portion and the flexible portion and closing the communication hole.
JP2007339608A 2007-12-28 2007-12-28 Imaging apparatus and method of manufacturing the same Withdrawn JP2009164720A (en)

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JP2007339608A JP2009164720A (en) 2007-12-28 2007-12-28 Imaging apparatus and method of manufacturing the same
CN200810184927XA CN101471359B (en) 2007-12-28 2008-12-23 Image pickup apparatus and manufacturing method thereof

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Cited By (2)

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JP2018088545A (en) * 2011-06-30 2018-06-07 ムラタ エレクトロニクス オサケユキチュア Method of producing system-in-package device, and system-in-package device
WO2019207897A1 (en) * 2018-04-27 2019-10-31 ソニーセミコンダクタソリューションズ株式会社 Imaging device and method for manufacturing imaging device

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TWM513520U (en) * 2015-06-11 2015-12-01 Altek Corp Image pickup module

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JP4170968B2 (en) * 2004-02-02 2008-10-22 松下電器産業株式会社 Optical device
KR100704980B1 (en) * 2005-11-28 2007-04-09 삼성전기주식회사 Camera module package
KR100770684B1 (en) * 2006-05-18 2007-10-29 삼성전기주식회사 Camera module package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018088545A (en) * 2011-06-30 2018-06-07 ムラタ エレクトロニクス オサケユキチュア Method of producing system-in-package device, and system-in-package device
WO2019207897A1 (en) * 2018-04-27 2019-10-31 ソニーセミコンダクタソリューションズ株式会社 Imaging device and method for manufacturing imaging device

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CN101471359B (en) 2013-04-10

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