JP5599294B2 - Imaging module, manufacturing method thereof, and electronic information device - Google Patents

Description

  The present invention relates to an imaging module, a manufacturing method thereof, and an electronic information device, and more particularly, in an imaging module in which a solid-state imaging device is mounted on a mounting substrate, the solid-state imaging device mounted on the solid-state imaging device. The present invention relates to a heat dissipation structure that efficiently dissipates heat generated in the above, a method for manufacturing such an imaging module, and an electronic information device equipped with such an imaging module.

  Conventionally, in a semiconductor device (semiconductor module) in which an electronic component is mounted on a mounting substrate, a heat dissipation structure for releasing heat generated in the electronic component to the outside of the semiconductor device has been used.

  FIG. 5 is a diagram for explaining a conventional semiconductor device, and shows a heat dissipation structure in the semiconductor device.

  The semiconductor device B is obtained by mounting an electronic component D on a printed wiring board A. The printed circuit board A includes an insulating substrate 10 and conductive metal layers 12 a and 12 b formed on the front surface side and the back surface side of the insulating substrate 10.

  The conductive metal layer 12 is patterned to form a large number of wiring patterns. An end portion of the wiring pattern located outside the printed wiring board A is an outer lead portion serving as an input-side outer lead and an output-side outer lead, and the wiring pattern formed on the mounting surface side of the insulating substrate 10 End portions located on the inner side of the printed circuit board serve as inner lead portions as input inner leads and output inner leads for mounting electronic components.

  Further, the printed wiring board A is formed so as to penetrate the heat radiating member 14 formed on the lower surface of the conductive metal 12b on the back side of the insulating substrate 10, and the insulating substrate 10 and the upper and lower conductive metal layers 12a and 12b. And a metal penetrating column E. The upper end of the metal penetrating column E is connected to the conductive bump F, and the lower end of the metal penetrating column E is in contact with the heat radiating member 14.

  Further, the printed wiring board A has a mounting area C in which the electronic component D is mounted. The electronic component D is on the mounting area C, and the lower surface of the electronic component D is the tip of the conductive bump F. A heat dissipation path from the electronic component D to the heat dissipation member 14 via the conductive bump F and the metal through pillar E is formed.

  Next, a method for producing a printed wiring board and a method for assembling a semiconductor device will be briefly described.

  6A and 6B are diagrams for explaining a method of assembling the semiconductor device. FIG. 6A shows a printed wiring board before electronic components are mounted, and FIG. 6B shows a printed wiring board on which electronic components are mounted. Show.

  As shown in FIG. 6A, conductive metal layers 12a and 12b are formed on the front and back surfaces of the insulating substrate 10, and then the metal through pillars E that penetrate the conductive metal layers 12a and 12b and the insulating substrate 10 are formed. Form.

  Next, the conductive metal layers 12a and 12b formed on the surface of the insulating substrate 10 are etched into a desired shape to form a wiring pattern, and the conductive bumps F are formed in a predetermined region including the region on the metal through pillar E. Formed in the region.

  Thereafter, as shown in FIG. 6 (b), the electronic component D is placed on the printed wiring board A, and the electronic component D is electrically connected to the conductive bump F on the printed wiring board A. To implement.

  In the semiconductor device B having such a configuration, the printed wiring board A has the heat radiating member 14 provided on the back side thereof, and the electronic component D and the heat radiating member 14 are connected by the metal through pillar E and the conductive bump F. Therefore, the heat generated in the electronic component D can be transmitted to the heat radiating member 14 through the metal through pillars E and the conductive bumps F, and the heat radiating member 14 can efficiently radiate heat.

  There are various types of electronic components D. As one of the semiconductor devices (semiconductor modules), for example, a solid-state imaging device equipped with a solid-state imaging device and an optical system such as a CCD image sensor or a CMOS image sensor is electronic. There is an imaging module or the like having a structure that is mounted on a mounting substrate as a component, but such a heat dissipation structure can also be used in such a semiconductor module. In cameras equipped with an imaging module, the rise in the temperature of the solid-state imaging device may cause discomfort to the user and cause image quality degradation.In the imaging module, heat dissipation efficiency is an important factor from the viewpoint of maintaining image quality. Become.

JP 2010-21400 A

  However, although the heat dissipation structure of the conventional semiconductor device (semiconductor module) has a very high heat dissipation effect, it is necessary to attach a heat dissipation member to a mounting board such as a printed wiring board, and the number of parts increases, so that the manufacturing process There is a problem that it becomes long and it becomes difficult to reduce the size.

  In particular, in an imaging module incorporating not only a semiconductor chip as an image sensor but also an optical system, it is necessary to dissipate not only the heat generated in the semiconductor chip but also the heat generated in the drive unit of the optical system. A high heat dissipation structure is required, and such an imaging module tends to be further downsized. However, the heat dissipation configuration in which a heat dissipation member as described above is separately provided hinders downsizing of the imaging module. There is.

  The present invention has been made to solve the above-described problems, and not only heat generated in a semiconductor chip mounted as a solid-state imaging device such as an image sensor, but also an optical component mounted as an optical system. An object of the present invention is to obtain an imaging module capable of increasing the heat dissipation efficiency of the heat generated in the drive section of the motor so as not to hinder downsizing, a manufacturing method thereof, and an electronic information device equipped with such an imaging module. .

  An imaging module according to the present invention mounts on a mounting substrate a solid-state imaging device including a solid-state imaging device that images a subject and generates an imaging signal, and an optical system that guides light from the subject to the solid-state imaging device. An imaging module having a mounting structure, wherein the solid-state imaging device supports the solid-state imaging device and the optical system, takes out the imaging signal from the solid-state imaging device, and is connected to a driving unit of the optical system. A support substrate for supplying a control signal; the support substrate is attached to the mounting substrate; the mounting substrate receives an imaging signal generated by the solid-state imaging device from the support substrate; The solid-state imaging device is supported by the support substrate so that the back surface opposite to the light receiving surface faces the mounting substrate. And the The gap between the body image pickup device and the mounting substrate is filled with an adhesive resin so that a heat radiation path from the solid-state image pickup device to the mounting substrate is formed, thereby achieving the above object. .

  In the imaging module according to the aspect of the invention, the optical system includes a condenser lens that collects light from the subject on a light receiving unit of the solid-state imaging element, and the solid-state imaging element of the support substrate. It is preferable to have a lens holder that is attached on a surface opposite to the surface and holds the condenser lens, and a lens driving unit that moves the condenser lens in the optical axis direction based on the control signal.

  According to the present invention, in the imaging module, the support substrate has a concave portion formed on a surface on the mounting substrate side, and the solid-state imaging device is accommodated and held in the concave portion. An electrode pad is disposed around the concave portion so as to surround an adhesive resin filled in a gap between the solid-state imaging device and the mounting substrate, and heat generated by the imaging signal or the control signal causes the electrode pad to It is preferable that heat is radiated to the mounting substrate.

  In the imaging module according to the present invention, an opening for introducing light from the subject into the solid-state imaging device is formed in the concave portion of the support substrate facing the solid-state imaging device. The optical system preferably includes an optical filter attached to the support substrate so as to cover the opening.

  In the imaging module according to the aspect of the invention, it is preferable that the mounting board is a flexible printed board.

  According to the present invention, in the imaging module, the flexible printed circuit board is formed so as to cover a flexible strip-shaped core member, a wiring pattern formed on a surface of the strip-shaped core member, and the wiring pattern. It is preferable to have an insulating protective layer.

  An imaging module manufacturing method according to the present invention includes a solid-state imaging device including a solid-state imaging device that images a subject and generates an imaging signal, and an optical system that guides light from the subject to the solid-state imaging device. A method for manufacturing an imaging module having a mounting structure including a mounting step of mounting on a mounting substrate and mounting a solid-state imaging device on the mounting substrate, the solid-state imaging device including the solid-state imaging device and the optical system And a support substrate for taking out the imaging signal from the solid-state imaging device and supplying a control signal to the drive unit of the optical system, the support substrate being attached to the mounting substrate, Is configured to receive an imaging signal generated by the solid-state imaging device from the support substrate and to supply a control signal to the drive unit of the optical system to the support substrate. Imaging device When the mounting substrate is electrically and mechanically connected, the solid-state imaging device supported by the support substrate and the mounting substrate are simultaneously connected with an adhesive resin, thereby achieving the above object. .

  The present invention provides the imaging module manufacturing method, wherein the mounting step includes the step of applying the adhesive resin to an element arrangement region on the mounting substrate where the solid-state imaging element is to be arranged, and the solid-state imaging device. A step of disposing the back surface opposite to the light receiving surface of the solid-state imaging element on the mounting substrate so as to contact the adhesive resin applied to the mounting substrate; and the support substrate of the solid-state imaging device and the mounting substrate are soldered It is preferable to include a step of performing a heat treatment so that the solid-state imaging device and the mounting substrate are connected by curing of an adhesive resin interposed between the solid-state imaging element and the mounting substrate at the same time as being connected by bonding.

  The present invention provides the imaging module manufacturing method, wherein the mounting step includes a step of applying an adhesive resin to a back surface opposite to a light receiving surface of the solid-state imaging element in the solid-state imaging device, and the solid-state imaging device is mounted on the mounting substrate. A step of placing the adhesive resin applied to the back surface of the solid-state imaging element so as to contact the mounting substrate; and a support substrate of the solid-state imaging device and the mounting substrate are connected by solder bonding, It is preferable to include a step of performing a heat treatment so that the solid-state imaging device and the mounting substrate are connected by curing of an adhesive resin interposed therebetween.

  An electronic information device according to the present invention is an electronic information device including an image pickup unit that picks up an image of a subject, and the image pickup unit includes the above-described image pickup module according to the present invention. Is achieved.

  Next, the operation of the present invention will be described.

  In the present invention, an imaging module having a mounting structure in which a solid-state imaging device including a solid-state imaging device that images a subject and an optical system that guides light from the subject to the solid-state imaging device is mounted on a mounting substrate. The solid-state imaging device has a support substrate that supports the solid-state image sensor and the optical system, and the solid-state image sensor is supported by the support substrate so that the back surface opposite to the light receiving surface faces the mounting substrate. Since the adhesive resin is filled in the gap between the image sensor and the mounting substrate so that a heat radiation path from the solid-state image sensor to the mounting substrate is formed, the heat radiation effect can be enhanced without increasing the number of components.

  Further, in the present invention, the support substrate has a concave portion formed on the surface on the mounting substrate side, and the solid-state imaging element is accommodated and held in the concave portion, and the concave portion of the support substrate An electrode pad is placed around the adhesive resin that fills the gap between the solid-state imaging device and the mounting substrate, and heat generated by the electrical signal is radiated to the mounting substrate through the electrode pad. The heat generated in the imaging module can be radiated more effectively.

  As described above, according to the present invention, a solid-state imaging device equipped with a solid-state imaging device and an optical system can extract an electrical signal generated by the solid-state imaging device and supply a control signal to a drive unit of the optical system. Is mounted on the mounting board, and the gap between the solid-state imaging element mounted on the solid-state imaging device and the mounting board is filled with an adhesive resin, so that a heat radiation path from the solid-state imaging element to the mounting board is formed. As a result, it is possible to provide a high-quality, inexpensive, compact heat-resistant imaging module, and an electronic information device equipped with such an imaging module. It becomes.

1A and 1B are diagrams for explaining an imaging module according to Embodiment 1 of the present invention. FIG. 1A schematically shows a cross-sectional structure, and FIG. 1B shows a solid-state imaging device mounted on a support substrate. The structure of the surface on the side to be performed is shown. FIG. 2 is a diagram for explaining a method of manufacturing an imaging module according to Embodiment 1 of the present invention. FIG. 2A is a diagram illustrating a solid-state imaging device 100 as an electronic component and a flexible printed wiring board (not shown) mounted thereon. 2 (b) shows a state where an adhesive resin is applied to a component placement region of the flexible printed wiring board, and FIG. 2 (c) shows a state where a solid-state imaging device is mounted on the flexible printed wiring board. Is shown. FIG. 3 is a diagram for explaining a modification of the method for manufacturing the imaging module according to the first embodiment of the present invention. FIG. 3A is a diagram illustrating a solid-state imaging device 100 as an electronic component, and a flexible print before this is mounted. 3 shows a wiring board (mounting board), FIG. 3B shows a state in which an adhesive resin is attached to the back surface of the solid-state imaging device mounted on the solid-state imaging device, and FIG. 3C shows the flexible printed wiring. The state which mounted the solid-state imaging device on the board | substrate is shown. FIG. 4 is a block diagram illustrating a schematic configuration example of an electronic information device using the imaging module according to the first embodiment as an imaging unit as the second embodiment of the present invention. FIG. 5 is a diagram for explaining a conventional semiconductor device, and shows a heat dissipation structure in the semiconductor device. 6A and 6B are diagrams for explaining a conventional method for assembling a semiconductor device. FIG. 6A shows a wiring board before electronic components are mounted, and FIG. 6B shows a wiring board on which electronic components are mounted. Is shown.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
1A and 1B are diagrams illustrating an imaging module according to Embodiment 1 of the present invention. FIG. 1A schematically illustrates a cross-sectional structure, and FIG. 1B illustrates a solid of a support substrate in the imaging module. The structure of the surface where the image sensor is mounted is shown.

  The imaging module 1 according to Embodiment 1 includes a solid-state imaging device 140 that images a subject and generates an imaging signal, and an optical system 2 that guides light from the subject to the solid-state imaging device 140. Is mounted on a mounting substrate 150.

  The solid-state imaging device 100 supports the solid-state imaging element 140 and the optical system 2, extracts the imaging signal from the solid-state imaging element 140, and supplies a control signal to the driving unit 120 of the optical system 2. A support substrate 130 is provided.

  The support substrate 130 is attached to the mounting substrate 150, and the mounting substrate 150 receives an imaging signal generated by the solid-state imaging device 140 from the support substrate 130, and applies it to the driving unit 120 of the optical system 2. A control signal is configured to be supplied to the support substrate 130.

  The solid-state imaging device 140 is supported by the support substrate 130 so that the back surface opposite to the light receiving surface faces the mounting substrate 150.

  A gap between the solid-state image sensor 140 and the mounting substrate 150 is filled with an adhesive resin 161 such as a silver paste so that a heat radiation path from the solid-state image sensor 140 to the mounting substrate 150 is formed. In addition, although silver paste is used as this adhesive resin 161, adhesive resin is not limited to this, For example, a silicon paste may be sufficient.

  Here, the optical system 2 includes a condenser lens L that condenses light from the subject onto a light receiving unit (not shown) of the solid-state image sensor 140, and the solid-state image sensor 140 of the support substrate 130. A lens holder 110 that is mounted on a surface opposite to the surface on which the lens is disposed and holds the condenser lens L, and a lens driving unit that moves the condenser lens L in the optical axis direction based on the control signal. 120. The lens holder 110 includes an upper holder 111 that holds the condenser lens L and a lower holder 112 that houses the upper holder 111.

  The lens driving unit 120 includes a permanent magnet 121 to which the lower holder 112 is attached, and an electromagnet 122 disposed so as to face the permanent magnet 121. The lens driving unit 120 and the lens holder 110 are mounted on a component mounting plate 123 fixed on the support substrate 130 via a spacer member 123a.

  The support substrate 130 has a concave portion 130b formed on the surface on the mounting substrate 150 side, and accommodates and holds the solid-state image sensor 140 in the concave portion 130b. The reinforcing resin R is filled between the surface and the inner peripheral surface of the concave portion 130b.

  In addition, an electrode pad 130a is disposed around the concave portion 130b of the support substrate 130 so as to surround an adhesive resin 161 filled in a gap between the solid-state imaging device 140 and the mounting substrate 150. Heat generated by an electrical signal such as a signal is dissipated to the mounting substrate 150 through the electrode pad 130a.

  In addition, the support substrate 130 has an opening 130c for introducing light from a subject into the solid-state image sensor 140 at a portion of the concave portion 130b facing the solid-state image sensor 140, and the optical system An optical filter (IR cut filter) 113 that cuts infrared rays is attached to the support substrate 130 so as to cover the opening.

  Here, a flexible printed circuit board is used as the mounting substrate 150. The flexible printed circuit board 150 includes a flexible strip-shaped insulating core member 151, and the surface of the strip-shaped insulating core member 151 and A wiring pattern 152 formed on the back surface and an insulating protective layer (for example, a resist layer) 153 formed so as to cover the wiring pattern 152 are provided. However, the insulating protective layer 153 is removed at a portion where a connection terminal (not shown) connected to the bump electrode of the support substrate is disposed.

  The wiring pattern 152 is obtained by patterning a conductive layer formed on the front and back surfaces of the insulating core member 151. Further, the wiring patterns 152 formed on the front surface and the back surface of the insulating core member 151 are electrically connected to each other through a through hole 151a.

  Next, a manufacturing method will be described.

  FIG. 2 is a diagram for explaining a manufacturing method of an imaging module according to Embodiment 1 of the present invention. FIG. 2A is a diagram illustrating a solid-state imaging device 100 as an electronic component and a flexible printed circuit board (mounting) before the mounting. 2 (b) shows the state where the adhesive resin is applied to the component placement region of the flexible printed circuit board, and FIG. 2 (c) shows the state where the solid-state imaging device is mounted on the flexible printed circuit board. Yes.

  The imaging module manufacturing method according to Embodiment 1 includes a solid-state imaging device 140 that images a subject and generates an imaging signal, and an optical system 2 that guides light from the subject to the solid-state imaging device. This includes a mounting step of mounting 100 on the mounting substrate 150.

  In this mounting process, first, as shown in FIG. 2A, a solid-state imaging device 100 having a solid-state imaging element 140 mounted face-down on a support base 130, an electrical signal is taken out from the solid-state imaging device 100, and A flexible printed circuit board (mounting board) that supplies control signals to the solid-state imaging device 100 is prepared.

  Next, as shown in FIG. 2B, an adhesive resin 161 is applied to a region of the flexible printed board 150 where the solid-state imaging device is to be disposed. In the figure, 160 is an adhesive resin coating device, and 161a is an adhesive resin emitted from the nozzle 160a of the coating device 160.

  Thereafter, the solid-state imaging device 100 is placed on the flexible printed circuit board 150 so that the back surface opposite to the light receiving surface of the solid-state imaging element 140 is in contact with the adhesive resin 161 applied to the flexible printed circuit board 150. At this time, bump electrodes 130 a such as solder bumps formed on the lower surface of the support substrate 130 are brought into contact with connection terminals (not shown) of the flexible printed circuit board 150.

  Further, the support substrate 130 of the solid-state imaging device 100 and the flexible printed circuit board 130 are connected by solder bonding, and at the same time, the adhesive resin 161 in which the solid-state imaging element 140 and the flexible printed circuit board 150 are interposed therebetween. Heat treatment is performed so as to be connected by curing.

  Thereby, the imaging module 1 which mounts a solid-state imaging device on a flexible printed circuit board is obtained.

  As described above, in the imaging module 1 of the present embodiment, the solid-state imaging device 100 including the solid-state imaging device 140 that images the subject and the optical system 2 that guides light from the subject to the solid-state imaging device 140 is mounted on a flexible printed circuit board (mounted). In the imaging module 1 having a mounting structure mounted on a substrate 150, the solid-state imaging device 100 includes a support substrate 130 that supports the solid-state imaging device 140 and the optical system 2, and the solid-state imaging device 140 is The back surface opposite to the light receiving surface is supported by the support substrate 130 so as to face the flexible printed circuit board 150, and in the gap between the solid-state image sensor 140 and the flexible printed circuit board 150, heat radiation from the solid-state image sensor 140 to the flexible printed circuit board 150 is performed. Since the adhesive resin 161 is filled so that a path is formed, the solid-state imaging device 1 0 and the flexible printed circuit board 150 from which the electrical signal is extracted are directly joined by filling the space between the solid-state imaging device and the flexible printed circuit board with an adhesive resin, so that the heat generated in the imaging module can be reduced. The heat dissipation effect can be enhanced without increasing the number of components, and as a result, it is possible to provide a high-quality, inexpensive, small-sized, heat-resistant imaging module.

  In the present embodiment, the support substrate 130 has a concave portion 130b formed on the surface of the flexible printed circuit 150, and the solid-state imaging device 140 is accommodated and held in the concave portion 130b. An electrode pad 130a is disposed around the concave portion of the support substrate 130 so as to surround an adhesive resin filled in a gap between the solid-state imaging device and the flexible printed circuit board, and heat generated by the electric signal is transmitted to the electrode. Since heat is radiated to the flexible printed board 150 through the pad 130a, the heat generated in the imaging module 1 can be radiated more effectively.

  In the imaging module manufacturing method of Embodiment 1, the solid-state imaging device and the flexible printed circuit board are electrically connected in one heat treatment step, and at the same time, the back surface of the solid-state imaging element and the flexible printed circuit board are bonded with a connecting resin. Thus, the mounting process can be simplified.

  In the first embodiment, a flexible printed board having flexibility is used as the mounting board. However, the mounting board may be a normal printed board having no flexibility.

  In the imaging module manufacturing method according to the first embodiment, the adhesive resin is applied in advance to the arrangement area of the solid-state imaging device on the flexible printed circuit board. You may affix on the back surface side of the solid-state image sensor mounted in the solid-state imaging device.

  Hereinafter, such an imaging module manufacturing method will be described with reference to FIG. 3 as a modification of the imaging module manufacturing method according to the first embodiment.

  FIG. 3 is a diagram for explaining a modification of the method for manufacturing the imaging module according to the first embodiment of the present invention. FIG. 3A is a diagram illustrating a solid-state imaging device 100 as an electronic component, and a flexible print before this is mounted. FIG. 3B shows a state in which an adhesive resin (resin film) is pasted on the back surface of the solid-state imaging device mounted on the solid-state imaging device, and FIG. The state which mounted the solid-state imaging device on the flexible printed circuit board is shown.

  The manufacturing method of the imaging module according to the modification of the first embodiment, like the manufacturing method of the solid-state imaging device according to the first embodiment, captures the subject and generates an imaging signal, and the light from the subject. A mounting step of mounting the solid-state imaging device 100 including the optical system 2 leading to the solid-state imaging device on a flexible printed circuit board (mounting substrate) 150. In this modification, the solid-state imaging device 100 is mounted on the solid-state imaging device. In the point which affixes the resin film 162 on the back surface of the solid-state image sensor 140, it differs from apply | coating the adhesive resin 161 to the arrangement | positioning area | region of the solid-state imaging device of the flexible printed circuit board 150 in the said Embodiment 1. FIG.

  Specifically, as shown in FIG. 3A, first, a solid-state imaging device 100 having a solid-state imaging device 140 mounted face-down on a support substrate 130, an imaging signal is extracted from the solid-state imaging device 100, and A flexible printed circuit board (mounting board) 150 that supplies control signals to the solid-state imaging device 100 is prepared.

  Next, as illustrated in FIG. 3B, a resin film 162 is attached to the back surface of the solid-state imaging device 140 mounted on the solid-state imaging device 100.

  Thereafter, the solid-state imaging device 100 is placed on the flexible printed board 150 so that the resin film 162 attached to the back surface of the solid-state imaging element 140 is in contact with the flexible printed board 150. At this time, bump electrodes 130 a such as solder bumps formed on the lower surface of the support substrate 130 come into contact with connection terminals (not shown) of the flexible printed circuit board 150.

  Furthermore, the support substrate 130 of the solid-state imaging device 100 and the flexible printed circuit board 150 are connected by solder bonding, and at the same time, the resin film 162 in which the solid-state imaging element 140 and the flexible printed circuit board 150 are interposed therebetween. Heat treatment is performed so as to be connected by curing.

Furthermore, although not specifically described in the first embodiment, a digital camera such as a digital video camera or a digital still camera, an image input camera, a scanner, or a facsimile using the imaging module of the first embodiment as an imaging unit. An electronic information device having an image input device such as a camera-equipped mobile phone device will be briefly described below.
(Embodiment 2)
FIG. 4 is a block diagram illustrating a schematic configuration example of an electronic information device using the imaging module according to Embodiment 1 of the present invention as an imaging unit as Embodiment 2 of the present invention.

  An electronic information device 90 according to Embodiment 2 of the present invention shown in FIG. 4 includes the imaging module 1 according to Embodiment 1 of the present invention as an imaging unit 91 that captures a subject, and such an imaging unit. Memory unit 92 such as a recording medium for recording data after high-definition image data obtained by photographing with a predetermined signal processing for recording, and a liquid crystal display screen after a predetermined signal processing for display of this image data A display unit 93 such as a liquid crystal display device that displays on the display screen, a communication unit 94 such as a transmission / reception device that performs communication processing after the image data is subjected to predetermined signal processing for communication, and prints (prints) the image data. And an image output unit 95 that outputs (prints out).

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. It is understood that the patent documents cited in the present specification should be incorporated by reference into the present specification in the same manner as the content itself is specifically described in the present specification.

  The present invention is an image pickup module, a manufacturing method thereof, and an electronic information device. As an image pickup module used for a portable terminal including a communication device that is increasingly reduced in size and thickness, a high-quality and inexpensive heat-resistant and small-sized image module. An imaging module can be provided, and further, an electronic information device equipped with such an imaging module can be provided.

DESCRIPTION OF SYMBOLS 1 Imaging module 2 Optical system 90 Electronic information apparatus 91 Imaging part 92 Memory part 93 Display means 94 Communication means 95 Image output means 100 Solid-state imaging device 110 Lens holder 111 Upper holder 112 Lower holder 113 Optical filter (IR cut filter)
DESCRIPTION OF SYMBOLS 120 Drive part 121 Permanent magnet 122 Electromagnet 123 Component mounting plate 123a Spacer member 130 Support substrate 130a Electrode pad 130c Opening 140 Solid-state image sensor 150 Flexible printed circuit board 151 Insulating core member 151a Through hole 152 Wiring pattern 153 Insulating protective layer (resist layer) )
160 coating device 160a coating nozzle 161, 161a adhesive resin 162 resin film L condenser lens R reinforcing resin

Claims (10)

Imaging having a mounting structure in which a solid-state imaging device including a solid-state imaging device that images a subject and generates an imaging signal and an optical system that guides light from the subject to the solid-state imaging device is mounted on a mounting substrate. A module,
The solid-state imaging device has a support substrate for supporting the solid-state imaging device and the optical system, taking out the imaging signal from the solid-state imaging device, and supplying a control signal to the driving unit of the optical system,
The support substrate is attached to the mounting substrate,
The mounting substrate is configured to receive an imaging signal generated by the solid-state imaging device from the support substrate and supply a control signal to the drive unit of the optical system to the support substrate.
The solid-state imaging device is supported by the support substrate so that the back surface opposite to the light receiving surface faces the mounting substrate.
An imaging module, wherein a gap between the solid-state imaging device and the mounting substrate is filled with an adhesive resin so that a heat radiation path from the solid-state imaging device to the mounting substrate is formed. The imaging module according to claim 1,
The optical system is
A condensing lens that condenses the light from the subject on the light receiving portion of the solid-state imaging device;
A lens holder attached to a surface of the support substrate opposite to the surface on which the solid-state imaging device is disposed, and holding the condenser lens;
An imaging module comprising: a lens driving unit that moves the condenser lens in the optical axis direction based on the control signal. The imaging module according to claim 1,
The support substrate has a concave portion formed on the surface on the mounting substrate side, and accommodates and holds the solid-state imaging device in the concave portion,
An electrode pad is disposed around the concave portion of the support substrate so as to surround an adhesive resin filled in a gap between the solid-state imaging device and the mounting substrate, and heat generated by the imaging signal or the control signal is An imaging module that radiates heat to the mounting substrate via an electrode pad. The imaging module according to claim 3,
The support substrate has an opening for introducing light from the subject into the solid-state image sensor at a portion of the concave portion facing the solid-state image sensor,
The optical module includes an optical filter attached to the support substrate so as to cover the opening. The imaging module according to claim 1,
The mounting module is an imaging module which is a flexible printed circuit board. The imaging module according to claim 5, wherein
The flexible printed circuit board includes a strip-shaped core member having flexibility, a wiring pattern formed on a surface of the strip-shaped core member, and an insulating protective layer formed to cover the wiring pattern. module. A mounting step of mounting on a mounting substrate a solid-state image pickup device including a solid-state image pickup device that picks up an image of a subject and generates an image pickup signal and an optical system that guides light from the subject to the solid-state image pickup device; A method of manufacturing an imaging module having a mounting structure in which a solid-state imaging device is mounted on a substrate,
The solid-state imaging device has a support substrate for supporting the solid-state imaging device and the optical system, taking out the imaging signal from the solid-state imaging device, and supplying a control signal to the driving unit of the optical system,
The support substrate is attached to the mounting substrate,
The mounting substrate is configured to receive an imaging signal generated by the solid-state imaging device from the support substrate and supply a control signal to the drive unit of the optical system to the support substrate.
The mounting process is as follows:
A method for manufacturing an imaging module, wherein when the solid-state imaging device and the mounting substrate are electrically and mechanically connected, the solid-state imaging device supported by the support substrate and the mounting substrate are simultaneously connected with an adhesive resin. In the manufacturing method of the imaging module according to claim 7,
The mounting process includes
Applying the adhesive resin to an element arrangement region where the solid-state imaging element is to be arranged on the mounting substrate;
Arranging the solid-state imaging device on the mounting substrate such that the back surface opposite to the light-receiving surface of the solid-state imaging element is in contact with the adhesive resin applied to the mounting substrate;
The support substrate of the solid-state imaging device and the mounting substrate are connected by solder bonding, and at the same time, heat treatment is performed so that the solid-state imaging device and the mounting substrate are connected by curing of the adhesive resin interposed therebetween. A method of manufacturing an imaging module. In the manufacturing method of the imaging module according to claim 7,
The mounting process includes
Applying an adhesive resin to the back surface opposite to the light receiving surface of the solid-state imaging device in the solid-state imaging device;
Arranging the solid-state imaging device on the mounting substrate so that the adhesive resin applied to the back surface of the solid-state imaging element is in contact with the mounting substrate;
The support substrate of the solid-state imaging device and the mounting substrate are connected by solder bonding, and at the same time, heat treatment is performed so that the solid-state imaging device and the mounting substrate are connected by curing of the adhesive resin interposed therebetween. A method of manufacturing an imaging module. An electronic information device having an imaging unit for imaging a subject,
The electronic imaging device includes the imaging module according to any one of claims 1 to 6.

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