JP2009163178A5 - - Google Patents

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Publication number
JP2009163178A5
JP2009163178A5 JP2008003046A JP2008003046A JP2009163178A5 JP 2009163178 A5 JP2009163178 A5 JP 2009163178A5 JP 2008003046 A JP2008003046 A JP 2008003046A JP 2008003046 A JP2008003046 A JP 2008003046A JP 2009163178 A5 JP2009163178 A5 JP 2009163178A5
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JP
Japan
Prior art keywords
substrate
transparent resin
filler
light
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008003046A
Other languages
English (en)
Japanese (ja)
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JP2009163178A (ja
JP5262118B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008003046A priority Critical patent/JP5262118B2/ja
Priority claimed from JP2008003046A external-priority patent/JP5262118B2/ja
Priority to US12/257,415 priority patent/US20090180732A1/en
Publication of JP2009163178A publication Critical patent/JP2009163178A/ja
Publication of JP2009163178A5 publication Critical patent/JP2009163178A5/ja
Application granted granted Critical
Publication of JP5262118B2 publication Critical patent/JP5262118B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008003046A 2008-01-10 2008-01-10 光モジュールの製造方法 Expired - Fee Related JP5262118B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008003046A JP5262118B2 (ja) 2008-01-10 2008-01-10 光モジュールの製造方法
US12/257,415 US20090180732A1 (en) 2008-01-10 2008-10-24 Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008003046A JP5262118B2 (ja) 2008-01-10 2008-01-10 光モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2009163178A JP2009163178A (ja) 2009-07-23
JP2009163178A5 true JP2009163178A5 (enExample) 2010-09-09
JP5262118B2 JP5262118B2 (ja) 2013-08-14

Family

ID=40850701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008003046A Expired - Fee Related JP5262118B2 (ja) 2008-01-10 2008-01-10 光モジュールの製造方法

Country Status (2)

Country Link
US (1) US20090180732A1 (enExample)
JP (1) JP5262118B2 (enExample)

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US20100047959A1 (en) * 2006-08-07 2010-02-25 Emcore Solar Power, Inc. Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells
US8778199B2 (en) 2009-02-09 2014-07-15 Emoore Solar Power, Inc. Epitaxial lift off in inverted metamorphic multijunction solar cells
CN103119484B (zh) * 2010-10-01 2015-05-20 住友电木株式会社 光波导模块、光波导模块的制造方法以及电子设备
US9570883B2 (en) * 2011-12-28 2017-02-14 Intel Corporation Photonic package architecture
JP5845923B2 (ja) * 2012-01-24 2016-01-20 日立金属株式会社 光モジュール及びその製造方法
JP5842714B2 (ja) * 2012-03-30 2016-01-13 富士通株式会社 光導波路デバイス、および、光導波路デバイスの製造方法
US9490240B2 (en) 2012-09-28 2016-11-08 Intel Corporation Film interposer for integrated circuit devices
US9377596B2 (en) * 2014-07-22 2016-06-28 Unimicron Technology Corp. Optical-electro circuit board, optical component and manufacturing method thereof
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
CN110010485A (zh) * 2018-10-10 2019-07-12 浙江集迈科微电子有限公司 一种具有光路转换功能的密闭型光电模块制作工艺
JP7353056B2 (ja) * 2019-03-29 2023-09-29 日東電工株式会社 光素子付き光電気混載基板
US11199673B2 (en) 2019-07-31 2021-12-14 Hewlett Packard Enterprise Development Lp Optoelectronic device with integrated underfill exclusion structure
US11715928B2 (en) * 2019-08-29 2023-08-01 Intel Corporation Decoupling layer to reduce underfill stress in semiconductor devices
TW202207481A (zh) * 2020-07-01 2022-02-16 日商日東電工股份有限公司 光模組
CN116458021A (zh) 2020-11-13 2023-07-18 罗姆股份有限公司 半导体发光装置
US20230084375A1 (en) * 2021-09-14 2023-03-16 Intel Corporation Selective protection of integrated circuit chip surface regions from underfill contact

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266828A (en) * 1988-10-14 1993-11-30 Matsushita Electric Industrial Co., Ltd. Image sensors with an optical fiber array
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
CN1287624A (zh) * 1998-08-05 2001-03-14 精工爱普生株式会社 光组件
JP3612243B2 (ja) * 1999-06-29 2005-01-19 株式会社東芝 光配線パッケージ及び光配線装置
US6516104B1 (en) * 1999-06-25 2003-02-04 Kabushiki Kaisha Toshiba Optical wiring device
US6531333B2 (en) * 2000-04-05 2003-03-11 Hong-Ming Lin Chip photoelectric sensor assembly and method for making same
JP3764640B2 (ja) * 2000-09-26 2006-04-12 京セラ株式会社 光モジュール及びその製造方法
JP2004354532A (ja) * 2003-05-27 2004-12-16 Seiko Epson Corp 光モジュール及びその製造方法、光通信装置、電子機器
JP2005079385A (ja) * 2003-09-01 2005-03-24 Toshiba Corp 光半導体装置および光信号入出力装置
US7499614B2 (en) * 2003-10-24 2009-03-03 International Business Machines Corporation Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards
JP4370158B2 (ja) * 2003-12-24 2009-11-25 シャープ株式会社 光結合器およびそれを用いた電子機器
US7092603B2 (en) * 2004-03-03 2006-08-15 Fujitsu Limited Optical bridge for chip-to-board interconnection and methods of fabrication
JP2005333018A (ja) * 2004-05-20 2005-12-02 Seiko Epson Corp 光部品、光通信装置、電子機器、及び光部品の製造方法
US7551811B2 (en) * 2005-01-19 2009-06-23 Bridgestone Corporation Optical device and method for producing the same
JP4760133B2 (ja) * 2005-05-23 2011-08-31 住友ベークライト株式会社 光導波路構造体
JP4690870B2 (ja) * 2005-11-29 2011-06-01 京セラ株式会社 光電気集積配線基板及び光電気集積配線システム
JP2007178950A (ja) * 2005-12-28 2007-07-12 Kyocera Corp 光配線基板および光配線モジュール
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US7577323B2 (en) * 2007-07-02 2009-08-18 Fuji Xerox Co., Ltd. Photoelectric circuit board

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