JP2009149839A5 - - Google Patents
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- Publication number
- JP2009149839A5 JP2009149839A5 JP2008147743A JP2008147743A JP2009149839A5 JP 2009149839 A5 JP2009149839 A5 JP 2009149839A5 JP 2008147743 A JP2008147743 A JP 2008147743A JP 2008147743 A JP2008147743 A JP 2008147743A JP 2009149839 A5 JP2009149839 A5 JP 2009149839A5
- Authority
- JP
- Japan
- Prior art keywords
- laser welding
- group
- resin
- resin composition
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 19
- 229920005992 thermoplastic resin Polymers 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- -1 polyethylene terephthalate Polymers 0.000 claims description 8
- 229920006127 amorphous resin Polymers 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 5
- 125000003368 amide group Chemical group 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004609 Impact Modifier Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008147743A JP5332323B2 (ja) | 2007-06-07 | 2008-06-05 | レーザー溶着用熱可塑性樹脂組成物およびそれからなる成形品ならびに複合成形体 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007151213 | 2007-06-07 | ||
| JP2007151213 | 2007-06-07 | ||
| JP2007306652 | 2007-11-27 | ||
| JP2007306652 | 2007-11-27 | ||
| JP2008147743A JP5332323B2 (ja) | 2007-06-07 | 2008-06-05 | レーザー溶着用熱可塑性樹脂組成物およびそれからなる成形品ならびに複合成形体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009149839A JP2009149839A (ja) | 2009-07-09 |
| JP2009149839A5 true JP2009149839A5 (enExample) | 2011-08-04 |
| JP5332323B2 JP5332323B2 (ja) | 2013-11-06 |
Family
ID=40919350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008147743A Expired - Fee Related JP5332323B2 (ja) | 2007-06-07 | 2008-06-05 | レーザー溶着用熱可塑性樹脂組成物およびそれからなる成形品ならびに複合成形体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5332323B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102190308B1 (ko) | 2015-12-21 | 2020-12-14 | 사빅 글로벌 테크놀러지스 비.브이. | 적층 가공 적용을 위한 향상된 분말 흐름 및 용융 흐름의 폴리머 |
| US11577458B2 (en) | 2018-06-29 | 2023-02-14 | 3M Innovative Properties Company | Additive layer manufacturing method and articles |
| JP7188003B2 (ja) * | 2018-11-14 | 2022-12-13 | 大日本印刷株式会社 | ハードコート基材接合体、及び、その製造方法 |
| US11518868B2 (en) * | 2020-11-04 | 2022-12-06 | Aptiv Limited Technologies | Laser transmissive compositions and related methods |
| JP2024506251A (ja) * | 2021-01-21 | 2024-02-13 | セラニーズ・インターナショナル・コーポレーション | レーザー溶接可能なポリエステル組成物 |
| JP2023069935A (ja) * | 2021-11-08 | 2023-05-18 | 旭化成株式会社 | 樹脂成形品の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4911548B2 (ja) * | 2002-01-29 | 2012-04-04 | 東レ株式会社 | レーザ溶着用樹脂組成物およびそれを用いた複合成形体 |
| JP2004315776A (ja) * | 2003-02-28 | 2004-11-11 | Toray Ind Inc | レーザー溶着用樹脂組成物およびそれを用いた複合成形体 |
| JP2006249260A (ja) * | 2005-03-10 | 2006-09-21 | Toray Ind Inc | レーザー溶着可能な耐加水分解性ポリエステル樹脂組成物 |
-
2008
- 2008-06-05 JP JP2008147743A patent/JP5332323B2/ja not_active Expired - Fee Related
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