JP2009141314A5 - - Google Patents

Claims (7)

A method for peeling off a protective tape on a wafer, wherein a peeling tape is attached to a protective tape attached to the front side of a wafer whose back side is mounted on a dicing frame via a dicing tape, and then the protective tape is removed together with the peeling tape. In
Than the wafer elongated to approximate release tape narrow on the outer peripheral edge portion of the wafer surface,
While maintaining the inclined state to away from the peeling tape dicing tape located outside the wafer, peeling the tape was thermocompression over its entire width along the outer peripheral edge of the peeling starting end of the protection tape,
The release tape and with at least one of the wafer is horizontally moving along the length of the peeling tape, to return folded around thermocompression bonded portions of the peeling tape approximately 180 °,
After fixing the recovery side portion and the supply side of the release tape subsequently,
Relatively moving the peeling unit and the wafer along the length direction of the peeling tape to peel off the protective tape from the wafer;
After releasing the fixed state of the peeling tape in the middle of peeling of the protective tape, the reeling tape and the protective tape are wound up and collected,
A method for peeling off a protective tape from a wafer, wherein the protective tape is separated from the wafer in the vicinity of a peeling termination portion of the protective tape. After crimping of the thermocompression bonding heater, the protection of the wafer according to claim 1, characterized in that solving the crimping of thermocompression bonding the heater peeling tape located outside the wafer in a state of relaxed the tension of their being supported from below Tape peeling method.   The air tape is blown toward the protective tape from the rear end side of the wafer peeling from the middle stage to the final stage of the peeling process of the protective tape from the wafer, and the protective tape is lifted so as not to contact the dicing tape. 3. A method for peeling off a wafer protective tape according to 1 or 2. The protective tape backside and the separation table for attracting and holding the mounted wafer dicing frame via the dicing tape from the paste the peeling tape to the protective tape joined to the surface side of the wafer on the peeling table In the wafer protective tape peeling device comprising a peeling unit that removes the peeling tape and the wafer,
Wherein the peeling table and stripping units, the relative proximity away recoil of respect to the wafer surface, the relative horizontal movement along the length direction of the release tape is provided freely,
The peeling unit includes a peeling tape running mechanism for supplying and recovering the release tape narrow than the wafer with elongated,
When the peeling tape is brought close to the outer peripheral edge of the wafer surface, the peeling tape is held in an inclined state so as to be separated from the dicing tape at a position outside the wafer, and when the peeling of the protective tape is started. A release tape holding mechanism for fixing the supply side and the recovery side of the release tape;
And thermocompression bonding the heater you thermocompression over substantially the entire width of the release tape along the outer peripheral edge of the peeling starting end of the protective tape,
It is configured to be movable back and forth with respect to the peeling tape. At the advanced position, the peeling tape is positioned below the peeling tape located outside the wafer to support the peeling tape from below, and the peeling unit and the peeling table are peeled off. When moving relatively horizontally along the length direction of the tape, the release tape located outside the wafer is pushed back to the upper surface side of the wafer to form a fold of about 180 ° on the release tape. A peeling device for a protective tape on a wafer, comprising a guide pin that moves away toward the outside in the width direction of the peeling tape .   5. The wafer according to claim 4, further comprising: an air blow device that blows air from a rear end side of the wafer toward a protective tape in a peeling process, and floats the protective tape so as not to contact the dicing tape. Protective tape peeling device.   6. The apparatus for peeling off a wafer protective tape according to claim 4, wherein the peeling table has a wafer mounting portion raised from the periphery.   The adsorption part of the peeling table is smaller than the outer diameter of the dicing tape and is formed so as to straddle part of the lower surface of the dicing frame attached to the dicing frame. The apparatus for peeling off a protective tape for a wafer according to the item.