CN112259494B - Apparatus and method for removing a wafer from dicing tape attached to a wafer frame - Google Patents
Apparatus and method for removing a wafer from dicing tape attached to a wafer frame Download PDFInfo
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- CN112259494B CN112259494B CN202011129894.6A CN202011129894A CN112259494B CN 112259494 B CN112259494 B CN 112259494B CN 202011129894 A CN202011129894 A CN 202011129894A CN 112259494 B CN112259494 B CN 112259494B
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 289
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004378 air conditioning Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 5
- 210000003811 finger Anatomy 0.000 description 6
- 238000003860 storage Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 210000003813 thumb Anatomy 0.000 description 2
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Abstract
An apparatus and method for removing a wafer from dicing tape attached to a wafer frame are provided. The apparatus for removing a wafer from dicing tape attached to a wafer frame includes: a carrier tray disposed on the support and configured to carry the wafer; a first vacuum generating device communicated with the through holes on the carrying disc through a first pipeline, wherein the first vacuum generating device can generate vacuum in a space formed by the carrying disc and the wafer when the wafer is carried on the carrying disc; an adsorption gun having a suction nozzle for adsorbing the wafer; and a second vacuum generating device in communication with the adsorption gun through a second line. According to the invention, not only is the efficiency remarkably improved, but also the wafer is not easy to drop to be damaged, the operator finger is not easy to pollute the wafer, and the wafer cannot move to collide with the wafer frame to crack in the process of stripping the dicing tape.
Description
Technical Field
The present invention relates to the manufacture of chips, and more particularly, to an apparatus and method for removing a wafer from dicing tape attached to a wafer frame.
Background
In the chip manufacturing process, wafer bonding is an important step before dicing the wafer into individual dies (also referred to as dice or dice) by a dicing step. In the wafer bonding step, dicing tape is first attached to a wafer frame (also referred to as a bonding ring) and then the wafer is attached to the dicing tape. Through the wafer bonding step, both the wafer and the wafer frame are attached to an adhesive layer on the dicing tape surface. In the wafer bonding process, there are sometimes quality problems between the wafer and dicing tape, such as bubbles or particles, dicing tape wrinkling, dicing tape tightening or loosening, dicing tape scraping, cracking or other damage, wafer eccentricity with respect to the wafer frame, or dicing tape eccentricity with respect to the wafer frame, which can adversely affect the subsequent dicing step. In order to avoid adverse effects on the subsequent dicing step, the wafer is typically removed from the dicing tape for re-taping.
One of the existing methods of removing a wafer from a dicing tape attached to a wafer frame is to hold the wafer frame with one operator's hands, separate the dicing tape from the wafer frame with the thumb until the wafer edge is exposed, hold the wafer frame with one hand and pinch the wafer edge with the thumb and index finger with the wafer in a vertical orientation, tear the dicing tape from the wafer back with the other hand, and then place the wafer in a storage rack. Another approach is for one operator to hold the wafer frame in a horizontal orientation with the circuit side up, and the other operator to separate the dicing tape from the wafer frame until the wafer edge is exposed, then hold the exposed wafer edge with one hand, tear the dicing tape from the back of the wafer with the other hand, and then place the wafer in a storage rack. Both of these methods are inefficient and risk the wafer falling off and being damaged, the wafer being contaminated by the operator's fingers, or the wafer breaking when it hits the wafer frame during dicing tape stripping.
For this reason, a special apparatus and method for removing the wafer from the dicing tape attached to the wafer frame is required.
Disclosure of Invention
The present invention is directed to overcoming at least one of the above-mentioned drawbacks of the prior art by providing an apparatus and method for removing a wafer from a dicing tape attached to a wafer frame.
According to one aspect of the present invention, there is provided an apparatus for removing a wafer from dicing tape attached to a wafer frame, comprising:
a carrier tray disposed on the support and configured to carry the wafer;
a first vacuum generating device communicated with the through holes on the carrying disc through a first pipeline, wherein the first vacuum generating device can generate vacuum in a space formed by the carrying disc and the wafer when the wafer is carried on the carrying disc;
an adsorption gun having a suction nozzle for adsorbing the wafer; and
and the second vacuum generating device is communicated with the adsorption gun through a second pipeline.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
a sensor for sensing a vacuum level in the space; and
and a vacuum adjusting device for adjusting the vacuum in the space according to the vacuum level sensed by the sensor.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
and a guide means for guiding the wafer frame carrying the wafer by the dicing tape to be placed around the carrier tray.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
and the stopping part is arranged around the bearing plate and can be matched with the straight cutting part of the wafer frame, so that the wafer frame is prevented from rotating relative to the bearing plate.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
and a support pin disposed around the carrier tray and for supporting the wafer frame, the support pin having a height lower than or flush with a height of the carrier tray such that the wafer frame can be supported by the support pin while the wafer can be supported on the carrier tray and form a closed space with the carrier tray.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
and the rubber gasket is arranged at the contact part of the bearing disc and the wafer.
Preferably, the carrier plate is designed as a disk with an annular flange at its periphery for supporting the wafer.
Preferably, the surface of the carrying tray facing the wafer is coated with an antistatic coating.
Preferably, the vacuum regulating means is an air regulating valve in communication with the space.
Preferably, the guide means is a plurality of guide pins arranged around the carrier disc.
Preferably, the guide pin has a tapered end.
According to another aspect of the present invention, there is provided a method for removing a wafer from a dicing tape attached to a wafer frame, the method using the apparatus for removing a wafer from a dicing tape attached to a wafer frame as described above, the method comprising the steps of:
placing the wafer frame carrying the wafer by the dicing tape on the device for removing the wafer from the dicing tape attached to the wafer frame in such a manner that the wafer faces down and the dicing tape faces up, so that the wafer is supported on a carrier tray and forms a closed space with the carrier tray;
opening the first vacuum generating device to generate vacuum in a closed space formed by the wafer and the bearing plate;
peeling the dicing tape from an edge of the wafer frame while the wafer is being adsorbed on the carrier tray, and then tearing the dicing tape off;
turning off the first vacuum generating device;
opening the second vacuum generating device;
adsorbing the wafer by using the adsorption gun; and
the vacuum generated by the second vacuum generating means is cut off to place the wafer while the wafer is being sent to a predetermined position.
Preferably, the method for removing the wafer from the dicing tape attached to the wafer frame further comprises bringing the vacuum in the space to a predetermined range by a sensor for sensing the vacuum level in the space and a vacuum adjusting means.
Preferably, the method for removing a wafer from dicing tape attached to a wafer frame further comprises bringing the vacuum in the space to near zero before the wafer is suctioned by the suction gun and by a vacuum adjusting device.
Preferably, the method for removing a wafer from dicing tape attached to a wafer frame further comprises inspecting and confirming that the wafer is supported on a carrier tray and forms a closed space with the carrier tray.
Preferably, the method for removing a wafer from a dicing tape attached to a wafer frame further comprises removing the wafer frame carrying the wafer by the dicing tape without forming a closed space with the carrier tray.
According to the device and the method for removing the wafer from the dicing tape attached to the wafer frame, the wafer is not easy to fall and damage, the operator's finger is not easy to pollute the wafer, and the wafer is not moved to collide with the wafer frame and crack in the process of peeling the dicing tape.
Drawings
FIG. 1 schematically illustrates a wafer frame;
fig. 2 schematically shows a wafer frame on which a wafer is adhered by dicing tape;
FIG. 3 is a schematic perspective view of an apparatus for removing a wafer from dicing tape attached to a wafer frame according to the invention;
FIG. 4 is another schematic perspective view of an apparatus for removing a wafer from dicing tape attached to a wafer frame according to the invention; and
fig. 5 is a schematic front view of an apparatus for removing a wafer from dicing tape attached to a wafer frame according to the invention.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, and it will be understood by those skilled in the art that these exemplary embodiments are not meant to limit the present invention in any way.
Fig. 1 schematically illustrates a wafer frame. As shown in fig. 1, the wafer frame 1 includes a substantially circular frame body 3, and pairs of straight cut portions 5 are oppositely formed at the periphery of the frame body 3 so that the circular frame body 3 can be held stationary against rotation with respect to a supporting device (not shown).
Fig. 2 schematically shows a wafer frame on which a wafer is adhered by dicing tape. As shown in fig. 2, the dicing tape 7 is attached to the frame body 3, and the wafer 9 is attached to the dicing tape 7 attached to the frame body 3. The wafer frame 1, to which the wafer 9 is attached by dicing tape 7, is then sent to a subsequent dicing step to dice the wafer into individual dies.
Fig. 3 is a schematic perspective view of an apparatus for removing a wafer from a dicing tape attached to a wafer frame according to the present invention, fig. 4 is another schematic perspective view of an apparatus for removing a wafer from a dicing tape attached to a wafer frame according to the present invention, and fig. 5 is a schematic front view of an apparatus for removing a wafer from a dicing tape attached to a wafer frame according to the present invention. As shown in fig. 3-5, an apparatus 10 for removing a wafer from dicing tape attached to a wafer frame according to the present invention includes a holder 11. Although in the preferred embodiment the stand 11 is shown as a trolley 13 with wheels to be movable, it will be appreciated that the stand 11 may also be provided as a support platform without wheels. The apparatus 10 for removing wafers from dicing tape attached to a wafer frame according to the present invention further includes a carrying tray 15 provided on the top 13a of the dolly 13 and for carrying wafers. The carrier plate 15 is shaped to be suitable for carrying a wafer and the circuits on the wafer are not damaged by contact with the carrier plate 15 when the wafer is on the carrier plate 15, and thus the carrier plate 15 may be, for example, designed as a disk shape having an annular flange at its periphery for supporting the wafer. The carrier plate 15 may be made of any suitable material such as ceramic, metal, plastic, etc. In order to prevent static electricity from damaging the wafer placed on the carrier tray 15, the surface of the carrier tray 15 facing the wafer may be coated with an anti-static coating.
The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention further includes a first vacuum generating device 17, the first vacuum generating device 17 being in communication with the through-holes 15a on the bottom of the carrier tray 15 through a first line (not shown) so that a vacuum can be generated in a space formed by the carrier tray 15 and the wafer as needed when the wafer is carried on the carrier tray 15, so that the wafer is firmly adsorbed on the carrier tray 15. Of course, the through holes 15a may also be located on the side walls of the carrier tray 15. Although the first vacuum generating device 17 may be provided on the top 13a of the trolley 13, the first vacuum generating device 17 is preferably provided below the top 13a of the trolley 13 or other suitable location. The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the invention further includes a suction gun 19 having a suction nozzle, the suction gun 19 being in communication with the second vacuum generating device 21 through the second line so as to suction the wafer by vacuum suction using the suction nozzle of the suction gun 19 when necessary. Although in the preferred embodiment the second vacuum generating means 21 and the first vacuum generating means 17 are two different vacuum generating means, it will be appreciated that the second vacuum generating means 21 and the first vacuum generating means 17 may be the same vacuum generating means. Furthermore, in the preferred embodiment, the second vacuum generating means 21 is arranged on the top 13a of the trolley 13, but the second vacuum generating means 21 may also be arranged below the top 13a of the trolley 13 or at other suitable locations.
The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention may further include a sensor 23 for sensing a level of vacuum generated in a space formed by the carrier tray 15 and the wafer. The sensor 23 is preferably a digital sensor. The vacuum generated in the space formed by the carrier platter 15 and the wafer may be adjusted based on the vacuum level sensed by the sensor 23. To this end, the apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention may further include a vacuum adjusting device 25 for adjusting a vacuum generated in a space formed by the carrier tray 15 and the wafer. In a preferred embodiment, the vacuum adjustment device 25 may be an air-conditioning valve in communication with the space formed by the carrier platter and the wafer.
The device 10 according to the invention for removing wafers from dicing tape attached to a wafer frame may further comprise guiding means 27 for placing the wafer frame around the carrier plate 15 in a proper correct position. In a preferred embodiment, the guide means 27 are a plurality of (e.g. 4) guide pins 29 arranged around the carrier disc 15. Preferably, the guide pins 29 have tapered ends (or free ends) to help guide the wafer frame properly around the carrier plate 15 to ensure that the wafers on the wafer frame are not eccentric with respect to the carrier plate 15. In order to prevent rotation of the wafer frame relative to the carrier plate 15, a stop 31 may also be provided around the carrier plate 15. The stop 31 cooperates with the straight cut 5 of the wafer frame 1 to prevent rotation of the wafer frame relative to the carrier tray 15.
The apparatus 10 for removing a wafer from dicing tape attached to a wafer frame according to the present invention may further include support pins 33 provided around the carrier tray 15 and for supporting the wafer frame 1. The support pins 33 have a height slightly lower than or substantially flush with the height of the annular flange of the carrier plate 15 so that the wafer frame can be supported by the support pins 33 while the wafer can be supported on the carrier plate 15 and form a closed space with the carrier plate 15. In the preferred embodiment, eight support pins 33 are shown, but it should be understood that there may be more or less than eight support pins.
The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention may further include a dicing tape receiving space 35 and/or a wafer frame receiving space 37 provided under the top 13a of the rack 11 such as the dolly 13 to receive the dicing tape and/or the wafer frame, respectively, after the wafer is removed.
A method for removing a wafer from a dicing tape attached to a wafer frame according to the present invention will be described below.
First, a wafer frame to which a wafer is attached by dicing tape is placed on the apparatus 10 for removing a wafer from dicing tape attached to the wafer frame according to the present invention in such a manner that the wafer is directed downward and the dicing tape is directed upward by the guide means 27, so that the wafer frame is supported by the support pins 33 while the wafer is supported on the carrier tray 15 and forms a closed space with the carrier tray 15. In order to prevent damage to the portion of the wafer in contact with the carrier plate 15 and to ensure that a reliable seal is formed at the contact site between the wafer and the carrier plate, a rubber gasket 39 may be provided at the site of the carrier plate 15 in contact with the wafer (e.g., on the annular flange of the carrier plate 15). The placed wafer and wafer frame are inspected to confirm that the wafer and carrier plate are generally aligned without significant eccentricity relative to each other. For wafers and carrier plates that are significantly eccentric such that they cannot form a closed space, such wafer frames with wafers adhered by dicing tape are unsuitable for processing on the apparatus for removing wafers from dicing tape attached to the wafer frame according to the present invention, and should be removed from the apparatus for removing wafers from dicing tape attached to the wafer frame according to the present invention.
The first vacuum generating means 17 is opened so that a vacuum is generated in the closed space formed by the wafer and the carrier plate 15. The sensor 23 is checked to determine whether the vacuum in the closed space formed by the wafer and the carrier tray 15 reaches a predetermined range. The vacuum in the enclosed space formed by the wafer and the carrier plate 15 cannot be too great, otherwise the wafer is easily broken; the vacuum in the enclosed space formed by the wafer and the carrier plate 15 cannot be too small, otherwise the wafer cannot be reliably sucked. When the vacuum in the closed space formed by the wafer and the carrier plate 15 is too large, it can be adjusted to a proper range by the vacuum adjusting device 25.
In the case where the wafer is reliably sucked, the dicing tape is peeled off from the edge of the wafer frame using a finger, and then the dicing tape is peeled off and put into the dicing tape accommodating space 35. Next, the wafer frame is taken away and placed into the wafer frame accommodating space 37. Subsequently, the first vacuum generating means 17 is turned off and the vacuum in the closed space formed by the wafer and the carrier plate 15 is made to be close to zero by the vacuum adjusting means 25.
The second vacuum generating device 21 is turned on, and the wafer is sucked through the suction nozzle of the suction gun 19, and then turned over so that the circuit of the wafer is directed upward. The wafers are then sent to the wafer storage rack 41, and the wafers are placed in the wafer storage rack 41 by cutting off the vacuum generated by the second vacuum generating device (e.g., pressing a button on the suction gun 19).
Then, a similar operation can be performed as needed for the next wafer frame to which the wafer is attached by dicing tape.
According to the apparatus and method for removing a wafer from a dicing tape attached to a wafer frame of the present invention, the wafer is fixedly held to a carrier plate by vacuum suction, and the wafer after tearing off the dicing tape is transferred to a predetermined position by a suction gun without touching the wafer by the fingers of an operator. Therefore, the device and the method for removing the wafer from the dicing tape attached to the wafer frame according to the invention not only significantly improve the efficiency, but also prevent the wafer from falling off to be damaged, prevent the wafer from being polluted by the fingers of an operator, and prevent the wafer from moving to collide with the wafer frame to crack during the dicing tape stripping process.
While the invention has been described in detail in connection with the preferred embodiments thereof, it should be understood that this detailed description is merely illustrative of the invention and is not intended to be limiting. The scope of the invention is defined by the claims.
Claims (15)
1. An apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame to which the dicing tape to which the wafer is attached, the apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame comprising:
a carrier plate (15) arranged on the support (11) and used for carrying the wafer, wherein the carrier plate (15) is designed into a disc shape with an annular flange for supporting the wafer at the periphery;
a first vacuum generating device (17) communicating with a through hole (15 a) on the carrier plate (15) through a first pipeline, the first vacuum generating device (17) being capable of generating a vacuum in a space formed by the carrier plate (15) and the wafer when the wafer is carried on the carrier plate (15);
a suction gun (19) having a suction nozzle for sucking the wafer; and
and a second vacuum generating device (21) communicated with the adsorption gun (19) through a second pipeline.
2. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame according to claim 1, further comprising:
a sensor (23) for sensing a vacuum level in the space; and
and a vacuum adjusting device (25) for adjusting the vacuum in the space according to the vacuum level sensed by the sensor (23).
3. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame according to claim 1, further comprising:
and a guide means (27) for guiding the wafer frame carrying the wafer by the dicing tape to be placed around the carrier tray (15).
4. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame according to claim 1, further comprising:
and a stop (31) arranged around the carrying tray (15), wherein the stop (31) can be mutually matched with the straight cutting part of the wafer frame so as to prevent the wafer frame from rotating relative to the carrying tray (15).
5. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame according to claim 1, further comprising:
and support pins (33) provided around the carrier plate (15) and used for supporting the wafer frame, wherein the height of the support pins (33) is lower than or flush with the height of the carrier plate, so that the wafer frame can be supported by the support pins (33), and the wafer can be supported on the carrier plate (15) and form a closed space with the carrier plate (15).
6. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame according to claim 1, further comprising:
and a rubber gasket (39) provided on a portion of the carrier plate (15) which is in contact with the wafer.
7. The device (10) for removing a wafer from a dicing tape attached to a wafer frame according to claim 1, wherein the surface of the carrier plate (15) facing the wafer is coated with an antistatic coating.
8. The device (10) for removing wafers from dicing tape attached to a wafer frame according to claim 2, wherein the vacuum adjusting means (25) is an air-conditioning valve communicating with the space.
9. A device (10) for removing wafers from dicing tape attached to a wafer frame according to claim 3, characterized in that the guiding means (27) are a plurality of guiding pins (29) arranged around the carrier disc (15).
10. The device (10) for removing a wafer from a dicing tape attached to a wafer frame according to claim 9, wherein the guide pin (29) has a tapered end.
11. A method for removing a wafer from a dicing tape attached to a wafer frame, the method utilizing the apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 1, the method comprising the steps of:
placing the wafer frame carrying the wafer by the dicing tape on the device (10) for removing the wafer from the dicing tape attached to the wafer frame in such a manner that the wafer faces down and the dicing tape faces up, so that the wafer is supported on a carrier tray (15) and forms a closed space with the carrier tray (15);
opening the first vacuum generating device (17) so as to generate vacuum in a closed space formed by the wafer and the bearing plate (15);
peeling the dicing tape from the edge of the wafer frame while the wafer is being adsorbed on the carrier tray (15), and then tearing the dicing tape off;
turning off the first vacuum generating means (17);
-opening said second vacuum generating means (21);
adsorbing the wafer by using the adsorption gun (19); and
the vacuum generated by the second vacuum generating means is cut off to place the wafer while the wafer is being sent to a predetermined position.
12. The method for removing a wafer from a dicing tape attached to a wafer frame according to claim 11, further comprising bringing the vacuum in the space to a predetermined range by a sensor (23) for sensing the vacuum level in the space and a vacuum adjusting means (25).
13. The method for removing a wafer from a dicing tape attached to a wafer frame according to claim 11, further comprising bringing the vacuum in the space to near zero before the wafer is sucked by the suction gun (19) and by a vacuum adjusting device (25).
14. The method for removing a wafer from a dicing tape attached to a wafer frame according to claim 11, further comprising checking and confirming that the wafer is supported on a carrier tray (15) and forms a closed space with the carrier tray (15).
15. The method for removing a wafer from a dicing tape attached to a wafer frame according to claim 14, further comprising removing the wafer frame carrying the wafer by the dicing tape without forming a closed space with the carrier plate (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011129894.6A CN112259494B (en) | 2020-10-21 | 2020-10-21 | Apparatus and method for removing a wafer from dicing tape attached to a wafer frame |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011129894.6A CN112259494B (en) | 2020-10-21 | 2020-10-21 | Apparatus and method for removing a wafer from dicing tape attached to a wafer frame |
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| CN112259494A CN112259494A (en) | 2021-01-22 |
| CN112259494B true CN112259494B (en) | 2023-10-31 |
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| CN113172778A (en) * | 2021-04-28 | 2021-07-27 | 华虹半导体(无锡)有限公司 | Taizhou ring removing method and positioning device for Taizhou ring removing |
| CN114346474B (en) * | 2022-01-17 | 2023-05-16 | 博捷芯(深圳)半导体有限公司 | Full-automatic laser wafer cutting device and cutting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5635363B2 (en) * | 2010-10-19 | 2014-12-03 | 日東電工株式会社 | Protective tape peeling method and protective tape peeling apparatus |
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| JP2004087660A (en) * | 2002-08-26 | 2004-03-18 | Takatori Corp | Method and device for transferring wafer to dicing tape |
| JP2007110014A (en) * | 2005-10-17 | 2007-04-26 | Lintec Corp | Sheet peeler and peeling method |
| JP2009141314A (en) * | 2007-11-13 | 2009-06-25 | Takatori Corp | Peeling method and device for protective tape of wafer |
| JP2010076864A (en) * | 2008-09-25 | 2010-04-08 | Fujifilm Corp | Film peeling device and film peeling method |
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