CN112259494A - Apparatus and method for removing a wafer from a dicing tape attached to a wafer frame - Google Patents
Apparatus and method for removing a wafer from a dicing tape attached to a wafer frame Download PDFInfo
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- CN112259494A CN112259494A CN202011129894.6A CN202011129894A CN112259494A CN 112259494 A CN112259494 A CN 112259494A CN 202011129894 A CN202011129894 A CN 202011129894A CN 112259494 A CN112259494 A CN 112259494A
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- dicing tape
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- tape attached
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000001179 sorption measurement Methods 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 293
- 230000001105 regulatory effect Effects 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 210000003811 finger Anatomy 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 210000003813 thumb Anatomy 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000005224 forefinger Anatomy 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 210000001138 tear Anatomy 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Abstract
An apparatus and method for removing a wafer from a dicing tape attached to a wafer frame is provided. An apparatus for removing a wafer from a dicing tape attached to a wafer frame comprising: the bearing disc is arranged on the bracket and is used for bearing the wafer; a first vacuum generating device communicated with the through hole on the carrier tray through a first pipeline, the first vacuum generating device being capable of generating vacuum in a space formed by the carrier tray and the wafer when the wafer is carried on the carrier tray; the adsorption gun is provided with a suction nozzle for adsorbing the wafer; and a second vacuum generating device communicated with the adsorption gun through a second pipeline. According to the invention, the efficiency is obviously improved, the wafer is not easy to drop and damage, the fingers of an operator are not easy to pollute the wafer, and the wafer cannot move and collide with the wafer frame to crack in the process of peeling off the cutting tape.
Description
Technical Field
The present invention relates to the manufacture of chips, and more particularly to an apparatus and method for removing a wafer from a dicing tape attached to a wafer frame.
Background
Wafer bonding is an important step in the chip manufacturing process before the wafer is diced into individual dies (also referred to as chips or dies) by a dicing step. In the wafer bonding step, a dicing tape is attached to a wafer frame (also referred to as a bonding ring), and then the wafer is attached to the dicing tape. Both the wafer and the wafer frame are attached to the adhesive layer on the dicing tape surface by the wafer-attaching step. In the wafer mounting process, there sometimes occur quality problems such as air bubbles or particles between the wafer and the dicing tape, wrinkling of the dicing tape, over-tightening or loosening of the dicing tape, scratching of the dicing tape, cracking or other damage, eccentricity of the wafer with respect to the wafer frame or eccentricity of the dicing tape with respect to the wafer frame, which may adversely affect the subsequent dicing step. To avoid adverse effects on the subsequent dicing step, it is often necessary to remove the wafer from the dicing tape to re-bond the wafer.
One of the existing methods for removing the wafer from the dicing tape attached to the wafer frame is that an operator holds the wafer frame with both hands with the wafer attached, separates the dicing tape from the wafer frame with the thumb until the wafer edge is exposed, holds the wafer frame with one hand and pinches the wafer edge with the thumb and forefinger, tears the dicing tape from the back of the wafer with the other hand, and then places the wafer in a storage rack, with the wafer oriented vertically toward the operator. Another method is that one operator holds the wafer frame in a horizontal orientation with the circuit side facing up, another operator separates the dicing tape from the wafer frame until the wafer edge is exposed, then holds the exposed wafer edge with one hand, tears the dicing tape off the back side of the wafer with the other hand, and then places the wafer in a storage shelf. Both of these methods are inefficient and risk the wafer being damaged by dropping it, contamination of the wafer by the operator's fingers, or the wafer breaking by hitting the wafer frame during the dicing tape stripping process.
To this end, a special apparatus and method for removing a wafer from a dicing tape attached to a wafer frame is required.
Disclosure of Invention
The present invention is directed to overcoming at least one of the above-mentioned deficiencies of the prior art and providing an apparatus and method for removing a wafer from a dicing tape attached to a wafer frame.
According to an aspect of the present invention, there is provided an apparatus for removing a wafer from a dicing tape attached to a wafer frame, comprising:
the bearing disc is arranged on the bracket and is used for bearing the wafer;
a first vacuum generating device communicated with the through hole on the carrier tray through a first pipeline, the first vacuum generating device being capable of generating vacuum in a space formed by the carrier tray and the wafer when the wafer is carried on the carrier tray;
the adsorption gun is provided with a suction nozzle for adsorbing the wafer; and
and the second vacuum generating device is communicated with the adsorption gun through a second pipeline.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
a sensor for sensing a vacuum level in the space; and
a vacuum regulating device for regulating the vacuum in the space based on the vacuum level sensed by the sensor.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
a guide means for guiding the wafer frame loaded with the wafer by the dicing tape to be placed around the carrier tray.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
and the stop part is arranged on the periphery of the bearing disc and can be matched with the straight cut part of the wafer frame so as to prevent the wafer frame from rotating relative to the bearing disc.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
and the supporting pins are arranged around the bearing plate and used for supporting the wafer frame, and the height of the supporting pins is lower than that of the bearing plate or is flush with that of the bearing plate, so that the wafer frame can be supported by the supporting pins, and the wafer can be supported on the bearing plate and forms a closed space with the bearing plate.
Preferably, the apparatus for removing the wafer from the dicing tape attached to the wafer frame further comprises:
and the rubber gasket is arranged on the contact part of the bearing disc and the wafer.
Preferably, the carrier plate is designed in the shape of a disk having an annular flange at its periphery for supporting the wafers.
Preferably, the surface of the bearing disc facing the wafer is coated with an antistatic coating.
Preferably, the vacuum regulating means is an air regulating valve communicating with the space.
Preferably, the guide means is a plurality of guide pins arranged around the carrier disc.
Preferably, the guide pin has a tapered tip.
According to another aspect of the present invention there is provided a method for removing a wafer from a dicing tape attached to a wafer frame, the method using an apparatus for removing a wafer from a dicing tape attached to a wafer frame as described above, the method comprising the steps of:
placing the wafer frame with the wafer carried thereon by the dicing tape on the device for taking off the wafer from the dicing tape attached to the wafer frame in such a manner that the wafer faces downward and the dicing tape faces upward, so that the wafer is supported on a carrier tray and forms a closed space with the carrier tray;
opening the first vacuum generating device to generate vacuum in a closed space formed by the wafer and the bearing plate;
peeling the dicing tape from the edge of the wafer frame while the wafer is adsorbed on the carrier tray, and then tearing off the dicing tape;
turning off the first vacuum generating device;
opening the second vacuum generating device;
adsorbing the wafer by using the adsorption gun; and
cutting off the vacuum generated by the second vacuum generating device when the wafer is conveyed to the preset position so as to place the wafer.
Preferably, the method for removing the wafer from the dicing tape attached to the wafer frame further comprises bringing the vacuum in the space to a predetermined range by a sensor for sensing a vacuum level in the space and a vacuum adjusting means.
Preferably, the method for removing the wafer from the dicing tape attached to the wafer frame further comprises bringing the vacuum in the space close to zero by a vacuum adjusting device before adsorbing the wafer by the adsorption gun.
Preferably, the method for removing the wafer from the dicing tape attached to the wafer frame further comprises inspecting and confirming that the wafer is supported on and forms a hermetic space with the susceptor.
Preferably, the method for removing the wafer from the dicing tape attached to the wafer frame further comprises removing the wafer frame carrying the wafer by the dicing tape without forming a hermetic space between the wafer and the carrier tray.
According to the invention, the wafer is fixedly held on the bearing plate through vacuum adsorption, and the wafer after the cutting tape is torn off is transferred to the preset position through the adsorption gun without the contact of fingers of an operator with the wafer.
Drawings
FIG. 1 schematically illustrates a wafer frame;
FIG. 2 schematically shows a wafer frame with a wafer adhered thereto by dicing tape;
FIG. 3 is a schematic perspective view of an apparatus for removing a wafer from dicing tape attached to a wafer frame according to the present invention;
FIG. 4 is another schematic perspective view of an apparatus for removing a wafer from dicing tape attached to a wafer frame according to the present invention; and
fig. 5 is a schematic front view of an apparatus for removing a wafer from dicing tape attached to a wafer frame according to the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, and it should be understood by those skilled in the art that these exemplary embodiments do not imply any limitation on the present invention.
Fig. 1 schematically shows a wafer frame. As shown in fig. 1, the wafer frame 1 includes a substantially circular frame body 3, and a pair of straight cut portions 5 are oppositely formed at the periphery of the frame body 3 so that the circular frame body 3 can be held fixed against rotation relative to a support device (not shown).
Fig. 2 schematically shows a wafer frame to which a wafer is adhered by dicing a tape. As shown in fig. 2, a dicing tape 7 is attached to the frame body 3, and a wafer 9 is in turn adhered to the dicing tape 7 attached to the frame body 3. The wafer frame 1 to which the wafer 9 is adhered by cutting the adhesive tape 7 is then sent to a subsequent dicing step to cut the wafer into individual dies.
Fig. 3 is a schematic perspective view of an apparatus for removing a wafer from a dicing tape attached to a wafer frame according to the present invention, fig. 4 is another schematic perspective view of an apparatus for removing a wafer from a dicing tape attached to a wafer frame according to the present invention, and fig. 5 is a schematic front view of an apparatus for removing a wafer from a dicing tape attached to a wafer frame according to the present invention. As shown in fig. 3-5, the apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention includes a holder 11. Although in the preferred embodiment the stand 11 is shown as a dolly 13 with wheels to enable movement, it will be appreciated that the stand 11 may also be provided as a support platform without wheels. The apparatus 10 for removing wafers from dicing tape attached to a wafer frame according to the present invention further includes a carrier tray 15 provided on the top 13a of the dolly 13 and for carrying wafers. The susceptor 15 is shaped to support the wafer and the circuits on the wafer are not damaged by contact with the susceptor 15 when the wafer is positioned on the susceptor 15, so that the susceptor 15 may be, for example, shaped as a disk having an annular flange at the periphery for supporting the wafer. The carrier tray 15 may be made of any suitable material such as ceramic, metal, plastic, etc. To prevent static electricity from damaging wafers placed on the susceptor 15, the surface of the susceptor 15 facing the wafers may be coated with an antistatic coating.
The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention further includes a first vacuum generating device 17, the first vacuum generating device 17 communicating with the through-holes 15a on the bottom of the susceptor 15 through a first line (not shown) so that a vacuum can be generated in a space formed by the susceptor 15 and the wafer as needed when the wafer is carried on the susceptor 15, so that the wafer is firmly adsorbed on the susceptor 15. Of course, the through holes 15a may be formed on the side walls of the carrier tray 15. Although the first vacuum generating device 17 may be provided on the top 13a of the dolly 13, the first vacuum generating device 17 is preferably provided below the top 13a of the dolly 13 or other suitable position. The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention further includes a suction gun 19 having a suction nozzle, and the suction gun 19 communicates with the second vacuum generating apparatus 21 through a second line so as to suck the wafer by vacuum suction using the suction nozzle of the suction gun 19 when necessary. Although in the preferred embodiment the second vacuum generating means 21 is two distinct vacuum generating means from the first vacuum generating means 17, it will be appreciated that the second vacuum generating means 21 may be the same vacuum generating means as the first vacuum generating means 17. Further, in the preferred embodiment, the second vacuum generating device 21 is disposed on the top 13a of the dolly 13, but the second vacuum generating device 21 may be disposed below the top 13a of the dolly 13 or other suitable location.
The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention may further include a sensor 23 for sensing a level of vacuum generated in a space formed by the carrier plate 15 and the wafer. The sensor 23 is preferably a digital sensor. The vacuum generated in the space formed by the susceptor 15 and the wafer may be adjusted based on the vacuum level sensed by the sensor 23. To this end, the apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention may further include a vacuum adjusting device 25 for adjusting a vacuum generated in a space formed by the susceptor 15 and the wafer. In a preferred embodiment, the vacuum regulating device 25 may be an air regulating valve communicating with a space formed by the susceptor and the wafer.
The apparatus 10 for removing wafers from dicing tape attached to a wafer frame according to the present invention may further comprise a guide 27 for placing the wafer frame around the susceptor 15 in a proper and correct position. In a preferred embodiment, the guiding means 27 is a plurality of (e.g. 4) guiding pins 29 arranged around the carrier disc 15. Preferably, the guide pins 29 have tapered ends (or free ends) to help guide the wafer frame properly around the susceptor 15 to ensure that the wafer on the wafer frame is not off-centered with respect to the susceptor 15. In order to prevent the wafer frame from rotating relative to the susceptor 15, a stopper 31 may be further provided around the susceptor 15. The stop 31 cooperates with the cut-out 5 of the wafer frame 1 to prevent rotation of the wafer frame relative to the susceptor 15.
The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention may further include support pins 33 disposed around the susceptor 15 and supporting the wafer frame 1. The height of the support pins 33 is slightly lower than the height of the annular flange of the susceptor 15 or substantially flush with the height of the annular flange, so that the wafer frame can be supported by the support pins 33 while the wafer can be supported on the susceptor 15 and form a closed space with the susceptor 15. In the preferred embodiment, eight support pins 33 are shown, but it should be understood that there may be more or less than eight support pins.
The apparatus 10 for removing a wafer from a dicing tape attached to a wafer frame according to the present invention may further include a dicing tape receiving space 35 and/or a wafer frame receiving space 37 provided below the support 11, for example, the top 13a of the cart 13, to receive the dicing tape and/or the wafer frame from which the wafer is removed, respectively.
A method for removing a wafer from a dicing tape attached to a wafer frame according to the present invention will be described below.
First, the wafer frame to which the wafer is adhered by the dicing tape is placed on the apparatus 10 for taking off the wafer from the dicing tape adhered to the wafer frame according to the present invention with the wafer facing downward and the dicing tape facing upward, guided by the guide means 27, so that the wafer frame is supported by the support pins 33 and the wafer is supported on the susceptor 15 and forms a closed space with the susceptor 15. In order to prevent damage to the portion of the wafer in contact with the susceptor 15 and to ensure a reliable seal at the contact between the wafer and the susceptor, a rubber gasket 39 may be provided at the portion of the susceptor 15 in contact with the wafer (e.g., on an annular flange of the susceptor 15). The placed wafer and wafer frame are inspected to confirm that the wafer and carrier plate are substantially aligned without significant eccentricity relative to each other. In the case where the wafer and the carrier plate are significantly eccentric so that the wafer and the carrier plate cannot form a closed space, the wafer frame to which the wafer is attached by the dicing tape is not suitable for processing in the apparatus for removing the wafer from the dicing tape attached to the wafer frame according to the present invention, and should be removed from the apparatus for removing the wafer from the dicing tape attached to the wafer frame according to the present invention.
The first vacuum generating device 17 is turned on so that a vacuum is generated in the airtight space formed by the wafer and the susceptor 15. The sensor 23 is checked to determine whether the vacuum in the sealed space formed by the wafer and the susceptor 15 reaches a predetermined range. The vacuum in the enclosed space formed by the wafer and the susceptor 15 cannot be too great, otherwise the wafer is easily broken; the vacuum in the enclosed space formed by the wafer and the susceptor 15 cannot be too small, otherwise the wafer cannot be reliably held. When the vacuum in the sealed space formed by the wafer and the susceptor 15 is too large, it can be adjusted to a suitable range by the vacuum adjusting device 25.
In the case where the wafer is reliably adsorbed, the dicing tape is peeled off from the edge of the wafer frame using a finger, and then the dicing tape is torn off and the torn dicing tape is put into the dicing tape housing space 35. Then, the wafer frame is taken away and put into the wafer frame receiving space 37. Subsequently, the first vacuum generating device 17 is turned off and the vacuum in the enclosed space formed by the wafer and the susceptor 15 is made to approach zero by the vacuum regulating device 25.
The second vacuum generating device 21 is turned on and the wafer is sucked by the suction nozzle of the suction gun 19 and then turned upside down so that the circuit of the wafer is directed upward. The wafer is then transferred into the wafer storage rack 41, and the wafer is placed in the wafer storage rack 41 by switching off the vacuum generated by the second vacuum generating device (e.g., pressing a button on the suction gun 19).
Subsequently, a similar operation may be performed as necessary for the next wafer frame to which the wafer is adhered by dicing the tape.
According to the device and the method for removing the wafer from the dicing tape attached to the wafer frame of the present invention, the wafer is fixedly held on the carrier tray by vacuum suction, and the wafer after the dicing tape is peeled off is transferred to a predetermined position by the suction gun without the occurrence of the contact of the operator's fingers with the wafer. Therefore, the device and the method for removing the wafer from the dicing tape attached to the wafer frame according to the present invention not only significantly improve efficiency, but also prevent the wafer from falling off and being damaged, prevent the fingers of the operator from contaminating the wafer, and prevent the wafer from moving and colliding with the wafer frame and breaking during the dicing tape peeling process.
While the invention has been described in detail in connection with the preferred embodiments thereof, it is to be understood that such detail is solely for that purpose and that no limitation of the invention is thereby intended. The scope of the invention is determined by the claims.
Claims (16)
1. An apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame, the dicing tape to which the wafer is adhered in turn being attached to the wafer frame, the apparatus (10) for removing a wafer from the dicing tape attached to the wafer frame comprising:
a bearing disc (15) which is arranged on the bracket (11) and is used for bearing the wafer;
a first vacuum generating device (17) communicated with the through hole (15a) on the carrier plate (15) through a first pipeline, wherein the first vacuum generating device (17) can generate vacuum in the space formed by the carrier plate (15) and the wafer when the wafer is carried on the carrier plate (15);
a suction gun (19) having a suction nozzle for sucking the wafer; and
and a second vacuum generating device (21) communicated with the adsorption gun (19) through a second pipeline.
2. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 1, further comprising:
a sensor (23) for sensing a vacuum level in the space; and
a vacuum regulating device (25) for regulating the vacuum in the space in dependence on the vacuum level sensed by the sensor (23).
3. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 1, further comprising:
a guide device (27) for guiding the wafer frame loaded with the wafer by the dicing tape to be placed around the carrier tray (15).
4. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 1, further comprising:
a stop portion (31) disposed about the susceptor (15), the stop portion (31) being capable of interacting with a straight cut portion of the wafer frame to prevent rotation of the wafer frame relative to the susceptor (15).
5. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 1, further comprising:
support pins (33) disposed around the susceptor (15) and supporting the wafer frame, the support pins (33) having a height lower than or level with the height of the susceptor so that the wafer frame can be supported by the support pins (33) and the wafer can be supported on the susceptor (15) and form a sealed space with the susceptor (15).
6. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 1, further comprising:
and the rubber gasket (39) is arranged on the part of the bearing disc (15) contacted with the wafer.
7. Device (10) for removing wafers from dicing tape attached to a wafer frame according to claim 1, characterized in that the carrier plate (15) is designed in the shape of a disc with an annular flange at the periphery for supporting the wafer.
8. The apparatus (10) for removing wafers from dicing tape attached to a wafer frame as claimed in claim 1, wherein the surface of the susceptor (15) facing the wafer is coated with an antistatic coating.
9. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 2, wherein the vacuum regulating means (25) is an air regulating valve communicating with the space.
10. Device (10) for removing wafers from dicing tape attached to a wafer frame according to claim 3, characterized in that the guiding means (27) are a plurality of guiding pins (29) arranged around the carrier plate (15).
11. The apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 10, wherein the guide pin (29) has a tapered end.
12. A method for removing a wafer from a dicing tape attached to a wafer frame, the method using the apparatus (10) for removing a wafer from a dicing tape attached to a wafer frame of claim 1, the method comprising the steps of:
placing the wafer frame loaded with the wafer by the dicing tape on the device (10) for taking off the wafer from the dicing tape attached to the wafer frame in such a manner that the wafer faces downward and the dicing tape faces upward, so that the wafer is supported on a carrier tray (15) and forms a closed space with the carrier tray (15);
opening the first vacuum generating device (17) so as to generate vacuum in a closed space formed by the wafer and the bearing disc (15);
peeling the dicing tape from the edge of the wafer frame while the wafer is adsorbed on the carrier tray (15), and then tearing off the dicing tape;
-turning off the first vacuum generating means (17);
-opening said second vacuum generating means (21);
adsorbing the wafer by using the adsorption gun (19); and
cutting off the vacuum generated by the second vacuum generating device when the wafer is conveyed to the preset position so as to place the wafer.
13. The method for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 12, further comprising bringing the vacuum in the space to a predetermined range by means of a sensor (23) for sensing the vacuum level in the space and a vacuum regulating device (25).
14. The method for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 12, further comprising bringing the vacuum in the space close to zero by a vacuum adjusting device (25) before adsorbing the wafer with the adsorption gun (19).
15. The method for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 12, further comprising inspecting and confirming that the wafer is supported on a susceptor (15) and forms a closed space with the susceptor (15).
16. The method for removing a wafer from a dicing tape attached to a wafer frame as claimed in claim 15, further comprising removing the wafer frame carrying the wafer by the dicing tape without forming a hermetic space between the wafer and the carrier tray (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011129894.6A CN112259494B (en) | 2020-10-21 | 2020-10-21 | Apparatus and method for removing a wafer from dicing tape attached to a wafer frame |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011129894.6A CN112259494B (en) | 2020-10-21 | 2020-10-21 | Apparatus and method for removing a wafer from dicing tape attached to a wafer frame |
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| CN112259494A true CN112259494A (en) | 2021-01-22 |
| CN112259494B CN112259494B (en) | 2023-10-31 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113172778A (en) * | 2021-04-28 | 2021-07-27 | 华虹半导体(无锡)有限公司 | Taizhou ring removing method and positioning device for Taizhou ring removing |
| CN114346474A (en) * | 2022-01-17 | 2022-04-15 | 深圳市陆芯半导体有限公司 | Full-automatic laser wafer cutting device and cutting method |
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| US20120090763A1 (en) * | 2010-10-19 | 2012-04-19 | Chouhei Okuno | Method and apparatus for separating protective tape |
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| JP2004087660A (en) * | 2002-08-26 | 2004-03-18 | Takatori Corp | Method and device for transferring wafer to dicing tape |
| JP2007110014A (en) * | 2005-10-17 | 2007-04-26 | Lintec Corp | Sheet peeler and peeling method |
| JP2009141314A (en) * | 2007-11-13 | 2009-06-25 | Takatori Corp | Peeling method and device for protective tape of wafer |
| JP2010076864A (en) * | 2008-09-25 | 2010-04-08 | Fujifilm Corp | Film peeling device and film peeling method |
| US20120090763A1 (en) * | 2010-10-19 | 2012-04-19 | Chouhei Okuno | Method and apparatus for separating protective tape |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113172778A (en) * | 2021-04-28 | 2021-07-27 | 华虹半导体(无锡)有限公司 | Taizhou ring removing method and positioning device for Taizhou ring removing |
| CN114346474A (en) * | 2022-01-17 | 2022-04-15 | 深圳市陆芯半导体有限公司 | Full-automatic laser wafer cutting device and cutting method |
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