CN114346474A - Full-automatic laser wafer cutting device and cutting method - Google Patents
Full-automatic laser wafer cutting device and cutting method Download PDFInfo
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- CN114346474A CN114346474A CN202210051738.5A CN202210051738A CN114346474A CN 114346474 A CN114346474 A CN 114346474A CN 202210051738 A CN202210051738 A CN 202210051738A CN 114346474 A CN114346474 A CN 114346474A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 127
- 238000007789 sealing Methods 0.000 description 36
- 239000012528 membrane Substances 0.000 description 10
- 230000009471 action Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a full-automatic laser wafer cutting device and a cutting method, the full-automatic laser wafer cutting device comprises a wafer, a suction plate and a wafer collecting device, the wafer collecting device is arranged on the upper end surface of the suction plate, the wafer collecting device can move on the upper end surface of the suction plate to separate the wafer from the attachment state of the suction plate, the wafer can be rapidly collected, the packaging and the collection of the wafer can be automatically completed, the efficiency is improved, and the wafer loss is reduced.
Description
Technical Field
The invention relates to the technical field of wafer cutting, in particular to a full-automatic laser wafer cutting device and a cutting method.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on the silicon wafer to become IC products with specific electrical functions; the wafer is cut into pieces and then used as a processor core.
Chinese patent CN109175726A discloses an automatic wafer cutting and positioning device, comprising: the device comprises a base, a pneumatic lifting table, a vacuum ceramic sucker and a mounting rack; the base is of a rectangular plate-shaped structure; the pneumatic lifting platform is arranged on the upper side of the base, and the pneumatic lifting platform is fixedly connected with the base through bolts; the vacuum ceramic sucker is arranged on the upper side of the pneumatic lifting platform and is fixedly connected with the pneumatic lifting platform through bolts; the mounting frame is arranged on the upper side of the base and is connected with the base in a welding mode; through the improvement of above structure, the device has the accurate convenient, efficient, effectual, the high and high advantage of commonality of degree of automation of processing location to the effectual problem and the not enough that exist among the current device of having solved.
However, the positioning and fixing structure of the device for the wafer in the wafer cutting process is simple, the stability and the position accuracy of the wafer in the cutting process cannot be guaranteed, and once the wafer is deviated in the cutting process, the whole wafer plate is scrapped, so that the positioning and fixing structure needs to be optimized in actual use production, and the stability of the wafer in the cutting process is kept.
Therefore, it is necessary to provide a full-automatic laser wafer cutting apparatus and a cutting method to solve the above-mentioned technical problems.
Disclosure of Invention
The invention aims to provide a full-automatic laser wafer cutting device, which solves the problems that in the background technology, the positioning and fixing structures for wafers in the wafer cutting process are simple, the stability and the position accuracy of the wafers in the cutting process cannot be guaranteed, and once the wafers deviate in the cutting process, the whole wafer plate is scrapped, so that the positioning and fixing structures need to be optimized in actual use and production, and the stability of the wafers in the cutting process is kept.
Based on the above thought, the invention provides the following technical scheme: the utility model provides a full-automatic laser wafer cutting device, includes the wafer, suction disc and wafer collection device, wafer collection device sets up the up end of suction disc, wafer collection device can the laminating state that the upper end surface of suction disc removed the wafer and suction disc apart can be collected the wafer fast, can automize and accomplish the packing of wafer and collect, and lifting efficiency reduces the wafer loss.
Preferably, the wafer collecting device comprises a storage bin, a collecting film, connecting holes, a slide way, a moving block and connecting pins, the storage bin is fixedly arranged on one side of the suction plate, the collecting film is rotatably arranged in the storage bin, the slide way is arranged on two sides of the suction plate perpendicular to the storage bin, the moving block is connected in the slide way in a sliding mode, the connecting pins are fixedly arranged at the front ends of the moving block, and two rows of connecting holes matched with the connecting pins are formed in two sides of the collecting film.
Preferably, the wafer collecting device further comprises a handle, and the handle is fixedly arranged at the rear end of the moving block.
Preferably, the upper surface of the moving block is slightly lower than the end face of the suction plate, after the wafer is separated from the diaphragm and the air pump is stopped, the positioning hole is matched with the positioning pin, the handle is pulled, and as the upper surface of the moving block is slightly lower than the end face of the suction plate, the collecting film can easily separate the joint state of the wafer and the suction plate, one end of the collecting film is cut off after the wafer slides to the end of the slide way, at the moment, the packaging and the collection of the wafer can be automatically completed, the efficiency is improved, and the wafer loss is reduced.
Preferably, the wafer support device comprises a base and a sliding frame arranged at the top of the base in a sliding manner, wherein a rotating frame is arranged at the top of the sliding frame, a support plate is fixedly connected inside the rotating frame, and a wafer support assembly is arranged on the support plate;
the supporting plate is provided with a limiting column in a sliding mode, the top of the rotating frame is provided with a limiting block in a sliding mode, and when the sliding frame moves upwards to jack the limiting column, the side face of the limiting column is in contact with the wafer supporting assembly and lifts the wafer supporting assembly upwards to be in contact with the limiting block.
Preferably, the top of the base is provided with a sliding groove along the height direction of the base, the sliding frame is in sliding connection with the base through the sliding groove, a first spring is arranged inside the sliding groove, and the first spring is arranged between the base and the sliding frame.
Preferably, the wafer support assembly comprises a wafer and a support base for supporting the wafer, and a membrane is arranged between the support base and the wafer in an adhering mode.
Preferably the spacing post sets up to the round platform form, the bottom of backup pad is located spacing post outside fixedly connected with guide bar, the guide bar passes bar groove and spacing post sliding connection on the spacing post.
A wafer cutting method uses a full-automatic laser wafer cutting device to perform positioning cutting and collection.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a schematic view of the connection structure of the sliding frame and the suction plate of the present invention;
FIG. 4 is a schematic view of a coupling structure of the rotating frame and the supporting plate according to the present invention;
FIG. 5 is an exploded view of the present invention;
FIG. 6 is a schematic view of the seal plate construction of the present invention;
FIG. 7 is a schematic view of the wafer support assembly of the present invention after being flipped 180 degrees;
FIG. 8 is a schematic view of the circular hole arrangement of the present invention;
FIG. 9 is a schematic view of the slider and seal block configuration of the present invention;
FIG. 10 is a cross-sectional view of the present invention;
FIG. 11 is an enlarged view of FIG. 4 at B according to the present invention;
FIG. 12 is an enlarged schematic view of FIG. 1 at A in accordance with the present invention;
FIG. 13 is an enlarged view of FIG. 9 at C in accordance with the present invention;
FIG. 14 is a schematic view of a main structure of the wafer collecting apparatus according to the present invention;
figure 15 is a side view of the moving mass of the present invention.
In the figure: 1. a base; 2. a sliding frame; 3. a motor; 4. a rotating shaft; 5. a wafer support assembly; 6. a first draft tube; 7. an air pump; 8. a vertical plate; 9. a magnetic strip; 10. a limiting column; 11. a limiting block; 12. a top block; 13. sucking a plate; 14. a through groove; 15. rotating the frame; 16. a sealing strip; 17. a magnetic block; 18. a wafer; 19. a diaphragm; 20. a supporting seat; 21. a chute; 22. a strut; 23. a thimble; 24. a sealing plate; 25. a slider; 26. a sealing block; 27. a hinged seat; 28. a circular hole; 29. a through hole; 30. pulling a rope; 31. a support plate; 32. a guide bar; 33. a first spring; 34. a second spring; 35. an electric heating wire; 36. positioning blocks; 37. a wafer collection device; 371. a storage bin; 372. collecting the membrane; 373. connecting holes; 374. a slideway; 375. a moving block; 376. a connecting pin; 377. and (4) a handle. .
Detailed Description
Example 1
As shown in fig. 1-4, a full-automatic laser wafer dicing apparatus and a dicing method thereof include a base 1 and a sliding frame 2 slidably disposed on the top of the base 1, a sliding slot 21 is disposed on the top of the base 1 along the height direction thereof, the sliding frame 2 is slidably connected to the base 1 through the sliding slot 21, a first spring 33 is disposed inside the sliding slot 21, and the first spring 33 is disposed between the base 1 and the sliding frame 2, which is beneficial to increase the stability of sliding between the sliding frame 2 and the base 1.
And be provided with at the top of sliding frame 2 and rotate frame 15, the bottom that rotates frame 15 contacts with the sealing strip 16 that sliding frame 2 top was arranged, rotates the equal fixedly connected with pivot 4 of both sides central point of frame 15, can impel to rotate frame 15 and rotate with the central line of pivot 4 through rotating, can cause the extrusion to sliding frame 2 when rotating frame 15 and rotating to drive sliding frame 2 and slide towards base 1 direction along spout 21.
Furthermore, a support plate 31 is fixedly connected to the inside of the rotating frame 15, the wafer support assembly 5 is disposed on the support plate 31, and the wafer support assembly 5 can be supported by the support plate 31.
The wafer support assembly 5 specifically includes a wafer 18 and a support base 20 for supporting the wafer 18, a membrane 19 is disposed between the support base 20 and the wafer 18, and in actual use, the wafer 18 is adhered to the top of the membrane 19, and the membrane 19 is adhered to the support base 20, so that the wafer 18 is supported by the support base 20.
As shown in fig. 5-6 and 9-13, a through groove 14 is formed in the support plate 31, a limiting post 10 is disposed at the through groove 14, the limiting post 10 is in a circular truncated cone shape, the diameter of the top of the limiting post is smaller than that of the bottom of the limiting post, a guide rod 32 is fixedly connected to the bottom of the support plate 31 and located outside the limiting post 10, the guide rod 32 penetrates through a strip-shaped groove in the limiting post 10 to be slidably connected with the limiting post 10, and the limiting post 10 can only reciprocate in the vertical direction through the limiting of the guide rod 32.
Offer the notch that runs through on the lateral surface that rotates frame 15, notch department is provided with stopper 11, stopper 11 passes through the notch and rotates frame 15 sliding connection, and stopper 11 extends to the one end fixedly connected with magnetic path 17 that rotates the frame 15 outside, fixedly connected with second spring 34 between magnetic path 17 and the side of rotating frame 15, stopper 11 top sets up to the inclined plane, be favorable to wafer supporting component 5 to place on backup pad 31, when wafer supporting component 5 downstream with the inclined plane extrusion on stopper 11 drive stopper 11 lateral shifting, thereby be convenient for place wafer supporting component 5 wholly on backup pad 31.
During practical use, because the limiting column 10 is set to be in a circular truncated cone shape, when the limiting column 10 moves upwards, the outer side surface of the limiting column gradually contacts and abuts against the outer circumferential surface of the supporting seat 20, the whole wafer supporting component 5 can be driven to move upwards along with the continuous upward movement of the limiting column 10, so that the top of the supporting seat 20 contacts and abuts against the limiting block 11, the supporting seat 20 can be positioned and fastened through the matching of the limiting column 10 and the limiting block 11, the wafer 18 is positioned, and the wafer 18 is cut conveniently, preferably, the number of the limiting columns 10 is set to be four and distributed outside the supporting seat 20 in an annular array mode, and the number of the limiting blocks 11 is set to be two and distributed on one side surface, close to the rotating shaft 4, of the rotating frame 15.
In order to drive the limiting column 10 to move upwards, a suction plate 13 is fixedly connected to the inner side of the sliding frame 2, a through circular hole 28 is arranged on the suction plate 13, a top block 12 is fixedly connected to the top of the suction plate 13 and is positioned outside the circular hole 28, the top block 12 is coaxially arranged with the limiting column 10 in the vertical direction, so that the top block 12 can drive the limiting column 10 to move upwards in the upward moving process of the suction plate 13, a sealing plate 24 is rotatably arranged at the bottom of the suction plate 13, the sealing plate 24 is semicircular, the sealing plate 24 is hinged with the suction plate 13 through a hinge seat 27 arranged at the outer side of the sealing plate 24, when two symmetrically arranged sealing plates 24 rotate towards the direction of the suction plate 13 and are contacted with the suction plate 13, the two suction plates 13 enclose a circular shape to seal the circular hole 28 area on the suction plate 13, and when the two sealing plates 24 rotate towards the direction far away from the suction plate 13, a positioning block 36 fixedly arranged on the hinge seat 27 is used for sealing the two sealing plates 24, the sealing plate 24 is limited to a certain angular range of rotation, where the maximum angle of outward rotation of the sealing plate 24 is preferably 30 °, and the circular hole 28 is exposed to the external environment when the sealing plate 24 is rotated 30 ° outward.
Further, an air pump 7 is arranged outside the base 1, the air pump 7 is provided with a first guide pipe 6 and a second guide pipe, the first guide pipe 6 penetrates through the base 1 and extends into the base 1, when the two sealing plates 24 are combined to seal the circular hole 28 area on the suction plate 13, at this time, the base 1, the sliding frame 2 and the suction plate 13 inside the sliding frame 2 are enclosed into a sealed space, and air is fed into the base 1 or sucked into the base 1 through the air pump 7, so that the air pressure inside the base 1 is increased or decreased, and the sliding frame 2 is promoted to ascend or descend along the chute 21 on the base 1.
In order to support the sealing plate 24, a pulling rope 30 is fixedly connected between the sealing plate 24 and the suction plate 13, one end of the pulling rope 30 is fixed to the sealing plate 24, the other end of the pulling rope 30 is fixed to the suction plate 13, and the pulling rope 30 is made of a material having a certain elasticity, such as rubber.
Specifically, when in use, the air pump 7 is arranged to send air into the base 1 to increase the air pressure inside the base 1, and the pulling force of the pulling rope 30 on the sealing plate 24 causes the initial state of the sealing plate 24 to be closer to the suction plate 13, so that when the air enters the base 1 and flows upwards, the sealing plate 24 is driven to rotate upwards, the sealing plates 24 on both sides gradually approach the suction plate 13 and finally seal the circular hole 28 area on the suction plate 13, at the moment, the air pump 7 continues to inject air into the base 1, the air pressure inside the base 1 can be continuously increased, the suction plate 13 and the sliding frame 2 can be driven to move upwards, when the suction plate 13 moves upwards to cause the top block 12 at the top to gradually contact the limiting column 10, the limiting column 10 can be driven to move upwards by the top block 12 moving upwards, and when the limiting column 10 moves upwards and gradually abuts against the outer circumferential surface of the supporting seat 20, can drive supporting seat 20 rebound through spacing post 10 to make the top of supporting seat 20 and stopper 11 counterbalance tightly, can fix a position and fix supporting seat 20 and wafer 18 through the cooperation of spacing post 10 and stopper 11, and then be favorable to cutting wafer 18.
As shown in fig. 1-2 and 7-8, a supporting rod 22 is fixedly connected at the inner corner of the base 1, a thimble 23 is fixedly connected at the top of the supporting rod 22, a through hole 29 coaxial with the thimble 23 is arranged on the suction plate 13, when the suction plate 13 moves downwards, the thimble 23 can pass through the through hole 29, vertical plates 8 are arranged on both sides of the base 1, a rotating shaft 4 passes through the vertical plates 8 and is rotatably connected with the vertical plates 8, a motor 3 is arranged on one side of one of the vertical plates 8, an output shaft of the motor 3 is connected with the rotating shaft 4, when in use, the rotating shaft 4 can be driven by the motor 3 to rotate, so as to drive the rotating frame 15 to rotate, a magnetic strip 9 is arranged on the inner side of the vertical plate 8, the magnetic strip 9 and the vertical plate 8 are fixed by a fixing rod, when the rotating frame 15 rotates 180 degrees, the magnetic block 17 on the outer side of the rotating frame 15 and the magnetic strip 9 on the inner side of the vertical plate 8 are on the same horizontal plane, at this time, the magnetic stripe 9 attracts the magnetic block 17 to drive the limiting block 11 to move towards the vertical plate 8 against the action force of the second spring 34, so that the limiting block 11 gradually disengages from the supporting seat 20.
Further, the circular holes 28 on the suction plate 13 are arranged in a plurality of groups, as shown in fig. 8, the arrangement of the circular holes 28 in each group corresponds to each wafer 18 after dicing, so that each small wafer 18 after dicing corresponds to one group of the circular holes 28.
Still further, an electric heating wire 35 is disposed on the inner side surface of the base 1, and the inner space inside the base 1 and the slide frame 2 can be heated by the electric heating wire 35.
The bottom of the suction plate 13 is provided with a sealing block 26 and a sliding block 25 at the through hole 29, the sliding block 25 is fixedly arranged at two sides of the through hole 29 and is fixed with the suction plate 13, the sealing block 26 is arranged at one side opposite to the sliding block 25 and is in sliding connection with the sliding block 25, a third spring is arranged inside the sliding block 25 and is arranged between the sliding block 25 and the sealing block 26, the through hole 29 can be sealed when the two sealing blocks 26 are attached to each other, and the side opposite to the sealing block 26 is arranged to be an inclined plane.
When the wafer 18 is used specifically, after the wafer 18 is cut, the rotating frame 15 can be driven to rotate by the motor 3, the sliding frame 2 can be gradually extruded to drive the sliding frame to move downwards in the process that the rotating frame 15 rotates for 180 degrees, the sliding frame 2 can be driven to move upwards under the action of the first spring 33 after the rotating frame 15 rotates for 90 degrees, the sliding frame 2 moves upwards to the initial position when the rotating frame 15 rotates for 180 degrees, the rotating frame 15 can be prevented from interfering with the suction plate 13 in the overturning process through the structure, the rotating block overturns for 180 degrees, the magnetic block 17 on the outer side of the rotating block corresponds to the magnetic strip 9 on one side of the vertical plate 8, the magnetic attraction of the magnetic strip 9 to the magnetic block 17 can drive the limiting block to gradually get away from the supporting seat 20, so that the limiting block 11 loses the limiting to the supporting seat 20, and the limiting column 10 on the outer side of the supporting seat 20 is not enough to support the supporting seat 20, therefore, the gas in the base 1 is discharged by the air pump 7, so that the inside of the base 1 is in a negative pressure state, the sealing plate 24 at the bottom of the suction plate 13 rotates downwards under the action of gravity, the sealing of the circular hole 28 is lost, the support seat 20 is placed in the circular hole 28 area at the top of the suction plate 13, when the inside of the base 1 is in a negative pressure state, the support seat 20 can be adsorbed on the top of the suction plate 13, the air pressure in the base 1 is gradually reduced along with the continuous discharge of the air in the base 1 by the air pump 7, the sliding frame 2 slides downwards under the atmospheric pressure against the acting force of the first spring 33, so that the suction plate 13 and the wafer supporting assembly 5 at the top of the suction plate are driven to move downwards, and when the suction plate 13 moves to the thimble 23, the thimble 23 will contact with the sealing block 26 at the bottom of the suction plate 13 at both sides of the through hole 29 and press the inclined surface, so that the sealing block 26 will move towards both sides against the action of the third spring, and further the thimble 23 will pass through the through hole 29 and gradually contact and press the diaphragm 19 covering on the base 1, at this time, when the suction plate 13 continues to move downwards, because each group of round holes 28 on the suction plate 13 corresponds to each wafer 18 after being cut, each wafer 18 after being cut can be adsorbed at each group of round holes 28 on the suction plate 13 by using the negative pressure inside the base 1, and the thimble 23 limits the base 1 and the diaphragm 19 to block them from continuing to move downwards, therefore, at this time, there is a tendency of mutual separation between the wafer 18 being cut and the diaphragm 19, and the diaphragm 19 has a certain viscosity at normal temperature, so that the wafer 18 and the supporting seat 20 are stably connected, the cutting is convenient, but the electric heating wire 35 inside the base 1 heats the inner space of the base 1, so that when the suction plate 13 and the wafer 18 on the top of the suction plate move downwards, the membrane 19 is heated, the viscosity of the membrane is gradually lost, and therefore, the wafer 18 after being cut can be easily separated from the membrane 19, by this time, the cut wafer 18 continues to move downwards under the absorption of the suction plate 13, and the support base 20 and the membrane 19 stop moving under the blocking of the thimble 23, so that the wafer 18 and the membrane 19 are separated from each other, and then the air pump 7 is stopped, and the wafer 18 on the suction plate 13 is taken down.
In summary, the suction plate 13 is utilized to jack up the limiting columns 10, the wafer supporting assembly 5 is supported by matching with the limiting blocks 11, the wafer 18 is cut conveniently, the wafer supporting assembly 5 is turned over by 180 degrees and then falls on the top of the suction plate 13, the diaphragm 19 is separated from the cut wafer 18 by matching with the ejector pins 23 in the downward moving process of the suction plate 13, the cut wafer 18 is convenient to take down, the efficiency is higher in actual use, the wafer 18 can be taken down quickly after cutting, and the practicability is high.
Example 2
The utility model provides a full-automatic laser wafer cutting device, includes wafer 18, suction plate 13 and wafer collection device 37, wafer collection device 37 sets up the up end of suction plate 13, wafer collection device 37 can the upper end face surface of suction plate 13 removes the laminating state of separating wafer 18 and suction plate 13, can collect wafer 18 fast, can automize and accomplish the packing of wafer and collect, and raise the efficiency reduces the wafer loss.
Specifically, the wafer collecting device 37 includes a receiving chamber 371, a collecting film 372, a connecting hole 373, a slide way 374, a moving block 375 and a connecting pin 376, the receiving chamber 371 is fixedly disposed on one side of the suction plate 13, the collecting film 372 is rotatably disposed inside the receiving chamber 371, the slide way 374 is disposed on two sides of the suction plate 13 perpendicular to the receiving chamber 371, the moving block 375 is slidably connected in the slide way 374, the connecting pin 376 is fixedly disposed at the front end of the moving block 375, and two rows of connecting holes 373 for matching with the connecting pin 376 are disposed on two sides of the collecting film 372.
Specifically, the wafer collecting device 37 further includes a pull handle 377 fixedly disposed at the rear end of the moving block 375.
Specifically, the upper surface of the moving block 375 is slightly lower than the end surface of the suction plate 13, after the wafer is separated from the diaphragm and the air pump is stopped, the positioning hole is matched with the positioning pin, the handle is pulled, and since the upper surface of the moving block is slightly lower than the end surface of the suction plate, the collecting film can easily separate the bonding state of the wafer and the suction plate, one end of the collecting film is cut off after the wafer slides to the end of the slide way, at the moment, the wafer can be automatically packed and collected, the efficiency is improved, and the wafer loss is reduced.
The wafer support device comprises a base and a sliding frame arranged at the top of the base in a sliding mode, wherein a rotating frame is arranged at the top of the sliding frame, a support plate is fixedly connected inside the rotating frame, and a wafer support assembly is arranged on the support plate;
the supporting plate is provided with a limiting column in a sliding mode, the top of the rotating frame is provided with a limiting block in a sliding mode, and when the sliding frame moves upwards to jack the limiting column, the side face of the limiting column is in contact with the wafer supporting assembly and lifts the wafer supporting assembly upwards to be in contact with the limiting block.
Specifically, the top of the base is provided with a sliding groove along the height direction of the base, the sliding frame is in sliding connection with the base through the sliding groove, a first spring is arranged inside the sliding groove, and the first spring is arranged between the base and the sliding frame.
Specifically, the wafer support assembly comprises a wafer and a support base for supporting the wafer, and a diaphragm is arranged between the support base and the wafer in an adhering mode.
Specifically spacing post sets up to the round platform form, the bottom of backup pad is located spacing post outside fixedly connected with guide bar, the guide bar passes bar groove and spacing post sliding connection on the spacing post.
A wafer cutting method uses a full-automatic laser wafer cutting device to perform positioning cutting and collection.
The working principle is as follows: when the rotating frame 15 rotates to 180 degrees, the sliding frame 2 moves upwards to an initial position, the structure can prevent the rotating frame 15 from interfering with the suction plate 13 in the overturning process, the rotating block overturns 180 degrees, the magnetic block 17 on the outer side of the rotating block corresponds to the magnetic strip 9 on one side of the vertical plate 8, the magnetic attraction of the magnetic strip 9 to the magnetic block 17 can drive the limiting quarts to gradually leave away from the supporting seat 20, so that the limiting block 11 loses the limiting on the supporting seat 20, the limiting column 10 on the outer side of the supporting seat 20 is not enough to support the supporting seat 20, therefore, the rotating frame gradually falls into the circular hole 28 area on the top of the suction plate 13 under the action of the self gravity, the circular hole 28 area is covered, the air in the base 1 is discharged through the air pump 7 at the moment, the inside of the base 1 is in a negative pressure state, the sealing plate 24 at the bottom of the suction plate 13 rotates downwards under the action of the gravity, and then the sealing of the circular hole 28 is lost, and at this time, the supporting seat 20 is placed in the circular hole 28 area on the top of the suction plate 13, so that when the inside of the base 1 is in a negative pressure state, the supporting seat 20 can be adsorbed on the top of the suction plate 13, and with the continuous discharge of the air inside the base 1 by the air pump 7, the air pressure inside the base 1 is gradually reduced, at this time, the sliding frame 2 is made to slide downwards against the action force of the first spring 33 under the atmospheric pressure, so as to drive the suction plate 13 and the wafer supporting component 5 on the top thereof to move downwards, when the suction plate 13 moves to the thimble 23, the thimble 23 will contact with the sealing blocks 26 on the bottom of the suction plate 13 on both sides of the through hole 29 and press the inclined surface thereof, so that the sealing blocks 26 move towards both sides against the action force of the third spring, and further, the thimble 23 is made to pass through the through hole 29 and gradually contact and press the diaphragm 19 covering the base 1, at this time, when the suction plate 13 continues to move downwards, because each group of circular holes 28 on the suction plate 13 corresponds to each wafer 18 after cutting, each wafer 18 after cutting can be adsorbed at each group of circular holes 28 on the suction plate 13 by using the negative pressure inside the base 1, and the ejector pins 23 limit the base 1 and the diaphragm 19 to prevent the wafers from continuing to move downwards, so that the wafers 18 after cutting and the diaphragm 19 are separated from each other, after the wafers are separated from the diaphragm and the air pump is stopped, the positioning holes are matched with the positioning pins, the handle is pulled, and because the upper surface of the moving block is slightly lower than the end surface of the suction plate, the collecting film can easily separate the bonding state of the wafers and the suction plate, one end of the collecting film is cut after the wafer slides to the end of the slide way, at this time, the packaging and collecting of the wafers can be automatically completed, the efficiency is improved, and the wafer loss is reduced.
Claims (9)
1. The utility model provides a full-automatic laser wafer cutting device which characterized in that: the wafer collecting device is arranged on the upper end face of the suction plate, and can move on the surface of the upper end face of the suction plate to separate the wafer from the attaching state of the suction plate, so that the wafer can be collected quickly.
2. The full-automatic laser wafer dicing apparatus according to claim 1, wherein: the wafer collecting device comprises a containing bin, a collecting film, connecting holes, a slide way, a moving block and connecting pins, wherein the containing bin is fixedly arranged on one side of a suction plate, the collecting film is rotatably arranged in the containing bin, the slide way is formed in the two sides, perpendicular to the containing bin, of the suction plate, the moving block is connected in the slide way in a sliding mode, the connecting pins are fixedly arranged at the front ends of the moving block, and two rows of connecting holes matched with the connecting pins are formed in the two sides of the collecting film.
3. The full-automatic laser wafer dicing apparatus according to claim 1, wherein: the wafer collecting device further comprises a handle, and the handle is fixedly arranged at the rear end of the moving block.
4. The full-automatic laser wafer dicing apparatus according to claim 2, wherein: the upper surface of the moving block is slightly lower than the end surface of the suction plate.
5. The full-automatic laser wafer dicing apparatus according to claim 1, wherein: the wafer support device comprises a base and a sliding frame arranged on the top of the base in a sliding mode, wherein a rotating frame is arranged on the top of the sliding frame, a support plate is fixedly connected inside the rotating frame, and a wafer support assembly is arranged on the support plate;
the supporting plate is provided with a limiting column in a sliding mode, the top of the rotating frame is provided with a limiting block in a sliding mode, and when the sliding frame moves upwards to jack the limiting column, the side face of the limiting column is in contact with the wafer supporting assembly and lifts the wafer supporting assembly upwards to be in contact with the limiting block.
6. The full-automatic laser wafer cutting device according to claim 5, wherein: the top of base has seted up the spout along its direction of height, the sliding frame passes through spout and base sliding connection to inside being provided with first spring in the spout, first spring is arranged in between base and the sliding frame.
7. The full-automatic laser wafer cutting device according to claim 5, wherein: the wafer supporting assembly comprises a wafer and a supporting seat for supporting the wafer, and a diaphragm is arranged between the supporting seat and the wafer in a bonding mode.
8. The full-automatic laser wafer cutting device according to claim 5, wherein: the limiting column is arranged to be round platform-shaped, the bottom of the supporting plate is located on the outer side of the limiting column and is fixedly connected with a guide rod, and the guide rod penetrates through a strip-shaped groove in the limiting column and is connected with the limiting column in a sliding mode.
9. A wafer cutting method is characterized in that: the full-automatic laser wafer cutting device as claimed in any one of claims 1 to 8 is used for positioning, cutting and collecting.
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Cited By (1)
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| CN114888609A (en) * | 2022-06-16 | 2022-08-12 | 安庆中船动力配套有限公司 | Composite boring and milling clamp |
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| CN114346474B (en) | 2023-05-16 |
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