CN113172778A - Taizhou ring removing method and positioning device for Taizhou ring removing - Google Patents
Taizhou ring removing method and positioning device for Taizhou ring removing Download PDFInfo
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- CN113172778A CN113172778A CN202110467221.XA CN202110467221A CN113172778A CN 113172778 A CN113172778 A CN 113172778A CN 202110467221 A CN202110467221 A CN 202110467221A CN 113172778 A CN113172778 A CN 113172778A
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005520 cutting process Methods 0.000 claims abstract description 33
- 210000000959 ear middle Anatomy 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims description 5
- 210000000078 claw Anatomy 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000004364 calculation method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 241001050985 Disco Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a method for removing a Taizhou ring.A wafer is processed and thinned by adopting a Taizhou process, the middle part of the wafer is thinned to a preset thickness, and the edge part of the wafer forms the Taizhou ring; step S2, fixing the wafer on a frame; step S3, placing the frame on a cutting equipment table disc, and positioning the wafer by using a positioning device; the invention also discloses a positioning device for removing the tympanum.
Description
Technical Field
The present invention relates to a method for manufacturing a semiconductor integrated circuit, and more particularly, to a method for removing a Taiko (Taiko) ring and a positioning apparatus thereof.
Background
The development of semiconductor integrated circuit technology, the wafer is thinner and thinner, and the thinning of the wafer can reduce the volume of subsequent packaging materials, and can also reduce the conduction resistance, thereby reducing the heat accumulation effect and prolonging the service life of the chip. However, how to reduce the thickness of the wafer in the thinning process, and also consider the strength of the wafer to reduce the breakage rate is one of the key points in the research of the wafer processing technology.
The japanese Disco corporation developed a Taiko thinning process, which is different from the conventional back grinding process, in which the wafer is ground while leaving the peripheral edge portion (about 3 mm) of the wafer and only the inner side of the circle is ground. A thicker ring, called a Taiko ring, is formed at the outer ring of the wafer. This allows the ring to be used to maintain the mechanical strength of the entire wafer during subsequent handling and processing of the wafer. Then the removal of the taiwan ring is needed in the subsequent process steps, and various methods for removing the taiwan ring are disclosed in the prior art to prevent the wafer from being broken when the taiwan ring is cut, such as publications CN104517804B, CN104934309B, CN105428220A and CN 112475627A. However, the prior art only focuses on the problem of wafer breakage during cutting removal, does not focus on the problem of breakage in the wafer positioning process before cutting, and does not position accurately under the condition that a cutting film is attached.
Disclosure of Invention
The invention aims to solve the technical problem of preventing the wafer from being damaged in the positioning process in the process of removing the Taizhou ring.
The invention provides a method for removing a Taizhou ring, which comprises the following steps:
step S1, processing and thinning the wafer by adopting a Taibo process, thinning the middle part of the wafer to a preset thickness, and forming a Taibo ring at the edge part of the wafer;
step S2, fixing the wafer on a frame;
step S3, placing the frame on a cutting equipment table disc, and positioning the wafer by using a positioning device;
the positioning device comprises a camera, a control unit and a mobile unit; the camera shoots photos of a plurality of different edges of the wafer; the control unit calculates the center position of the wafer by using the photo information and calculates the deviation from the preset center position required by cutting; the moving unit moves the frame under the control of the control unit to move the center position of the wafer to a preset center position required by cutting; when the moving unit moves the frame, the moving unit is only in contact connection with the frame;
and step S4, cutting off the tympanum.
Preferably, in step S2, the wafer is fixed to the frame by attaching a dicing film, one surface of the dicing film is attached to the frame in contact, and the other surface of the dicing film is attached to the non-thinned surface of the wafer in contact.
Preferably, the diameter of the dicing film is slightly larger than the diameter of the wafer.
Preferably, in step S3, the moving unit is connected to the frame by suction.
Preferably, the tera-drum ring is removed in step S4 by laser cutting.
The present invention also provides a positioning device for removal of a tympanum, comprising:
comprises a camera, a control unit and a mobile unit;
the camera is used for shooting a picture of a designated position of a wafer, the control unit is used for acquiring the information of the picture shot by the camera, calculating the positioning deviation of the wafer and controlling the movement of the moving unit;
the moving unit comprises a mechanical arm and a driving unit, the mechanical arm is used for being connected with the frame, a contact fixing point of the mechanical arm and the frame is located on the frame, and the driving unit drives the mechanical arm to move on the cutting equipment table disc to position the wafer under the control of the control unit.
Preferably, the number of the cameras is at least 1, and the wafer designated position is an edge of the wafer.
Preferably, the positioning deviation is obtained by the control unit by calculating a current center position of the wafer and then comparing the current center position with a preset center position.
Preferably, the mechanical arm is connected with the frame in an adsorption mode, and the contact fixing point is located on the surface of the frame.
Preferably, the robot arm is connected to the frame by means of a claw, the contact fixing point being located on the side of the frame.
Compared with the prior art, the wafer cannot be clamped and fixed by external equipment in the positioning process before the cutting and removal of the wafer hoop, so that the risk of damage to the edge of the wafer is reduced. In addition, under the condition that the wafer is attached with the cutting film, the wafer can be positioned more accurately in the positioning process in a mode of directly moving the frame.
Drawings
FIG. 1 is a schematic diagram of the process for removing the Taiwan ring in example 1.
Fig. 2 is a schematic view of wafer mounting in embodiment 1.
Fig. 3 is a schematic view of wafer positioning in embodiment 1.
Fig. 4 is a schematic view of a frame contact fixing point in wafer positioning of example 1.
Detailed Description
Example 1
Example 1 Taizhou ring removal method
FIG. 1 is a schematic diagram of the steps of the method for removing the Taichou ring of this embodiment
Step S1, processing and thinning the wafer 1 by adopting a Taibo process, thinning the middle part of the wafer 1 to a preset thickness, and forming the Taibo ring 2 without thinning the edge part of the wafer 1.
In step S2, the dicing film 3 is attached to the non-thinned surface of the wafer 1, and the wafer 1 is fixed to the frame 4, as shown in fig. 2.
The diameter of the dicing film 3 is larger than the diameter of the wafer 1. The dicing film 3 is in face contact with the frame 4.
The frame 4 is usually made of stainless steel, and can be shaped as shown in fig. 1, and the periphery of the frame is slightly larger than the cutting film 3, so that the frame can be used as a fixing member for cutting the hoop 2, and can be subsequently packaged with the wafer 1 to serve as a structural member for protecting the wafer 1. The outer ring of the frame 4 is provided with a plurality of gaps, which is convenient for mechanical equipment to carry.
Step S3, the frame 4 is placed on the dicing apparatus table, and the wafer 1 is positioned.
As shown in fig. 3 and 4, the positioning method is as follows
The positioning device comprises a camera, a control unit and a mobile unit. The camera is used to take a picture of the wafer 1, for example, to take a picture of the edge of the wafer 1, and 4 cameras are provided in the embodiment to take pictures of the edge of the wafer 1 at 4 positions, as shown by the 4 shooting points in fig. 3. 4 cameras are just one embodiment and positioning can also be achieved with 3 cameras, although more cameras, e.g. 6 cameras, can achieve higher positioning accuracy. Of course, 1 camera may be used, and the object is achieved by moving the camera.
The photo information is transmitted to the control unit, the control unit obtains the center position a of the current wafer 1 through analysis and calculation of the edge position in the photo, and then calculates the deviation from the preset center position B required by cutting, for example, the deviation can be decomposed into components in the X and Y directions. Then the control unit controls the moving unit to move the frame 4 to move the center of the wafer 1 to the preset center position required by cutting, namely, the position A to the position B after the movement.
The moving unit includes a robot arm and a driving unit. The mechanical arm is used for connecting the frame 4, and the contact fixing point with the frame 4 is positioned on the frame 4, namely the mechanical arm is only contacted with the frame 4 and is not contacted with the wafer 1 or the tera-drum ring 2 at the outer ring of the wafer 1.
When moving, fix frame 4 with the arm earlier, the connected mode can adopt the absorption mode, for example the arm of a vacuum principle, is convenient for connect and connect the needs of relieving, and the fixed point quantity of connecting is two at least, and this embodiment is 4. The connection mode can also adopt a claw method to clamp the periphery or the gap of the frame 4.
The driving unit drives the mechanical arm to move on the cutting equipment table under the control of the control unit, namely, the center position of the wafer 1 is moved to a preset center position required by cutting, namely, the positions A to B are moved.
The moving unit may also play a role in fixing in the subsequent cutting removal step S4.
In step S4, the tympanum 2 is cut away.
The cutting of the tympanum 2 can be achieved by means of blade cutting or laser cutting. Preferably, laser cutting is adopted, so that the cutting efficiency can be improved, and residues are avoided.
By the method, the wafer is not clamped and fixed by external equipment in the positioning process before the wafer is cut, and the risk of damage to the edge of the wafer 1 is reduced. Because the wafer positioning in the prior art is directly clamped by the wafer for moving, and because the frame is made of stainless steel material and the mass is much larger than that of the wafer, the wafer edge is easily damaged in the positioning and moving process.
In addition, when the wafer is attached to the dicing film, the dicing film itself has a certain elasticity, and when the wafer is directly held during movement, the dicing film is driven by the wafer, and then the heavy frame is driven by the dicing film, which causes a certain deviation in positioning under the influence of elastic deformation factors of the dicing film. Therefore, the embodiment can realize the accurate positioning of the wafer before cutting.
Example 2
Example 2 positioning device for removal of the tympanum
The positioning device comprises a camera, a control unit and a mobile unit. The camera is used to take a picture of the designated position of the wafer, for example, the edge of the wafer, and 4 cameras are provided in this embodiment, which can take pictures of the edge of the wafer at 4 positions at the same time. 4 cameras are just one embodiment and positioning can also be achieved with 3 cameras, although more cameras, e.g. 6 cameras, can achieve higher positioning accuracy.
The control unit is used for acquiring the photo information, calculating the positioning deviation of the wafer and controlling the movement of the moving unit. After the control unit acquires the photo information, the center position A of the current wafer is obtained through analysis and calculation of the edge position in the photo, then the deviation between the center position A and the preset center position B required by cutting is obtained through calculation, and then the control unit controls the moving unit to move the frame, so that the center position of the wafer is moved to the preset center position required by cutting.
The moving unit includes a robot arm and a driving unit. The robot arm is used for connecting the frame, and the contact fixing point with the frame 4 is positioned on the frame, namely the robot arm only contacts with the frame and does not contact with the wafer or the too-drum ring of the outer ring of the wafer. When moving, connect the frame with the arm earlier, the connected mode can adopt the absorption mode, for example the arm of a vacuum principle, the needs of being convenient for connect and relieve, and the tie point quantity is two at least, and this embodiment is 4. The connection mode can also adopt a claw method to clamp the periphery or the gap of the frame.
The driving unit drives the mechanical arm to move on the cutting equipment table disc under the control of the control unit, namely the center position of the wafer is moved to a preset center position required by cutting, namely the positions A to B are moved. The driving mode can adopt various modes such as a rotating motor, a linear motor and the like.
The present invention has been described in detail with reference to the specific embodiments and examples, but these are not intended to limit the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.
Claims (10)
1. A method of pseudotympanum removal comprising:
step S1, processing and thinning the wafer by adopting a Taibo process, thinning the middle part of the wafer to a preset thickness, and forming a Taibo ring at the edge part of the wafer;
step S2, fixing the wafer on a frame;
step S3, placing the frame on a cutting equipment table disc, and positioning the wafer by using a positioning device;
the positioning device comprises a camera, a control unit and a mobile unit;
the camera shoots photos of a plurality of different edges of the wafer;
the control unit calculates the center position of the wafer by using the photo information and calculates the deviation from the preset center position required by cutting;
the moving unit moves the frame under the control of the control unit to move the center position of the wafer to a preset center position required by cutting;
when the moving unit moves the frame, the moving unit is only in contact connection with the frame;
and step S4, cutting off the tympanum.
2. The method of removing a pseudodrum ring according to claim 1, wherein:
in the step S2, the wafer is fixed on the frame by attaching a dicing film,
one side of the cutting film is in contact attachment with the frame, and the other side of the cutting film is in contact attachment with the non-thinning surface of the wafer.
3. The method of removing a pseudodrum ring according to claim 2, wherein:
the diameter of the dicing film is slightly larger than the diameter of the wafer.
4. The method of removing a pseudodrum ring according to claim 1, wherein:
in step S3, the moving unit is connected to the frame by suction.
5. The method of removing a pseudodrum ring according to claim 1, wherein:
in step S4, the tympanum is removed by laser cutting.
6. A positioning device for removal of the tympanum, comprising:
comprises a camera, a control unit and a mobile unit;
the camera is used for shooting a picture of a designated position of a wafer, the control unit is used for acquiring the information of the picture shot by the camera, calculating the positioning deviation of the wafer and controlling the movement of the moving unit;
the moving unit comprises a mechanical arm and a driving unit, the mechanical arm is used for being connected with the frame, a contact fixing point of the mechanical arm and the frame is located on the frame, and the driving unit drives the mechanical arm to move on the cutting equipment table disc to position the wafer under the control of the control unit.
7. The positioning device for the removal of the tympanum as claimed in claim 6, wherein:
the number of the cameras is at least 1, and the wafer designated position is the edge of the wafer.
8. The positioning device for the removal of the tympanum as claimed in claim 7, wherein:
the positioning deviation is obtained by the control unit by calculating the current center position of the wafer and then comparing the current center position with a preset center position.
9. The positioning device for the removal of the tympanum as claimed in claim 6, wherein:
the mechanical arm is connected with the frame in an adsorption mode, and the contact fixing point is located on the surface of the frame.
10. The positioning device for the removal of the tympanum as claimed in claim 6, wherein:
the mechanical arm is connected with the frame in a claw mode, and the contact fixing point is located on the side face of the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110467221.XA CN113172778A (en) | 2021-04-28 | 2021-04-28 | Taizhou ring removing method and positioning device for Taizhou ring removing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110467221.XA CN113172778A (en) | 2021-04-28 | 2021-04-28 | Taizhou ring removing method and positioning device for Taizhou ring removing |
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| CN113172778A true CN113172778A (en) | 2021-07-27 |
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| CN202110467221.XA Pending CN113172778A (en) | 2021-04-28 | 2021-04-28 | Taizhou ring removing method and positioning device for Taizhou ring removing |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114474440A (en) * | 2022-03-16 | 2022-05-13 | 江苏京创先进电子科技有限公司 | Method for controlling adjustment precision of fine adjustment device |
| CN114582780A (en) * | 2022-03-01 | 2022-06-03 | 江苏京创先进电子科技有限公司 | Method and device for removing ring of Taiko wafer |
| CN117213348A (en) * | 2023-11-09 | 2023-12-12 | 迈为技术(珠海)有限公司 | Method, device, equipment and storage medium for detecting cutting contact position of cutter wheel |
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