JP2009141029A - Processing device and processing method of electronic component, and program for processing - Google Patents

Processing device and processing method of electronic component, and program for processing Download PDF

Info

Publication number
JP2009141029A
JP2009141029A JP2007314081A JP2007314081A JP2009141029A JP 2009141029 A JP2009141029 A JP 2009141029A JP 2007314081 A JP2007314081 A JP 2007314081A JP 2007314081 A JP2007314081 A JP 2007314081A JP 2009141029 A JP2009141029 A JP 2009141029A
Authority
JP
Japan
Prior art keywords
electronic component
processing
holding mechanism
time
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007314081A
Other languages
Japanese (ja)
Other versions
JP5019534B2 (en
Inventor
Eizui Iwamoto
英瑞 岩本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ueno Seiki Co Ltd
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Priority to JP2007314081A priority Critical patent/JP5019534B2/en
Publication of JP2009141029A publication Critical patent/JP2009141029A/en
Application granted granted Critical
Publication of JP5019534B2 publication Critical patent/JP5019534B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/52Improvements relating to the production of bulk chemicals using catalysts, e.g. selective catalysts

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology for processing an electronic component making sure of a long processing time with a few additional mechanisms at low cost, and excellent in a transferring efficiency and processing efficiency of the electronic component. <P>SOLUTION: The processing device of the electronic component includes: a plurality of absorption nozzles 110 for retaining the electronic component S; a transferring part 100 for transferring the electronic component S by repeating the cycle of advance and halt; and a processing part 200 provided with processing mechanisms 1A to 4B for processing the electronic component S transferred from each absorption nozzle 110. It is set so that the absorption nozzle 110 retains every other electronic component S, and simultaneously transfers the received electronic component S to every other processing mechanisms 1A to 4A (or 1B to 4B), and at timing different from this, simultaneously receives the processed electronic component S from the other processing mechanisms 1B to 4B (or 1A to 4A). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば、半導体素子などの電子部品の搬送過程において、工程処理を行うための工程処理装置及び工程処理方法並びに工程処理用プログラムに関する。   The present invention relates to a process processing apparatus, a process processing method, and a process processing program for performing process processing, for example, in the process of transporting an electronic component such as a semiconductor element.

半導体素子は、前工程と呼ばれるプロセスで、Siウェハ上に多数作成された後、後工程と呼ばれるプロセスにて個片に分離され、電気特性試験、特性分類、マーキング、外観検査等の工程を経た後、テープ、コンテナチューブなどに梱包されて出荷される。   A number of semiconductor elements are produced on a Si wafer in a process called a pre-process, and then separated into individual pieces in a process called a post-process, and then subjected to steps such as electrical property testing, property classification, marking, and appearance inspection. After that, they are packed in a tape or container tube and shipped.

このような半導体素子は、個片に分離された後の工程において、保持機構に保持されて搬送機構により搬送され、搬送経路に沿って設けられた各工程処理部において、各種の処理を施される。搬送機構による搬送方法としては、直線搬送、ターンテーブル搬送等が用いられるが、いずれの場合でも、保持機構を所定の工程順に従って進行させるステップと、各工程処理部において半導体素子の処理開始から終了まで保持機構を停止させるステップを繰り返す、いわゆる間欠搬送が用いられることが多い。   Such a semiconductor element is held by a holding mechanism and transported by a transport mechanism in a process after being separated into individual pieces, and various processes are performed in each process processing unit provided along the transport path. The As the transfer method by the transfer mechanism, linear transfer, turntable transfer, etc. are used. In any case, the step of moving the holding mechanism according to a predetermined process order and the end of the process of the semiconductor element in each process processing unit In many cases, so-called intermittent conveyance is used in which the step of stopping the holding mechanism is repeated.

ところで、上記のような間欠搬送による工程処理には、長い処理時間への対応、高速化が困難となるという問題がある。まず、1搬送サイクル時間=搬送時間+搬送停止時間であり、停止時間>最大工程処理時間+受け渡し時間である。ここで、最大工程処理時間を70ms、停止時間中の受け渡し時間を20msとすると、停止時間の下限は90msとなる。そして、搬送時間を30msとすると、1搬送サイクル時間の下限は120msとなり、これ以上の高速化は困難である。   By the way, the process processing by intermittent conveyance as described above has a problem that it is difficult to cope with a long processing time and to increase the speed. First, 1 transport cycle time = transport time + transport stop time, and stop time> maximum process processing time + delivery time. Here, if the maximum process processing time is 70 ms and the delivery time during the stop time is 20 ms, the lower limit of the stop time is 90 ms. If the transport time is 30 ms, the lower limit of one transport cycle time is 120 ms, and it is difficult to increase the speed further.

このように、高速化が困難となる理由としては、以下のものが挙げられる。
(1)機構上の制約から、搬送、停止を搬送機構全体で同時に行う必要がある。このため、最大工程処理時間で停止時間を決めざるを得ず、搬送停止時間を律速する。
(2)搬送の高速化で生産性を向上させてきたが、限界に達しつつある。
(3)例えば、複雑なテストサイクルが要求される電気特性検査のように、長い処理が必要な工程が含まれる場合には、最大処理時間が長くなり、1搬送サイクル時間はさらに長くなる。
As described above, the reasons why it is difficult to increase the speed include the following.
(1) Due to mechanical limitations, it is necessary to simultaneously carry and stop the entire carrying mechanism. For this reason, the stop time must be determined by the maximum process processing time, and the transport stop time is limited.
(2) Although productivity has been improved by speeding up the transfer, it is reaching its limit.
(3) For example, when a process that requires a long process is included, such as an electrical characteristic inspection that requires a complicated test cycle, the maximum processing time becomes longer and the one transport cycle time becomes longer.

これに対処するため、特許文献1に開示されたような工程処理装置が提案されている。これは、複数の半導体素子を並行して搬送しながら、工程処理も並列で行う装置であり、搬送も工程処理も並列で行うために、全体としての生産性が高まるというものである。また、搬送経路上に同一工程の処理機構を複数配置し、並列して工程処理を行う方法、すなわち、搬送=1個毎、工程処理=並列で行う方法も考えられる。   In order to cope with this, a process processing apparatus as disclosed in Patent Document 1 has been proposed. This is an apparatus for carrying out process processing in parallel while carrying a plurality of semiconductor elements in parallel, and carrying out and carrying out process processing in parallel increases productivity as a whole. Also, a method of arranging a plurality of processing mechanisms for the same process on the transport path and performing process processing in parallel, that is, a method of performing transport = one by one and process processing = parallel, can be considered.

また、特許文献2には、以下のような工程処理技術が開示されている。この工程処理技術は、工程処理部に処理機構を複数設け、半導体素子を保持機構から処理機構の一つに受け渡した後、受け渡し場所とは別の場所に移動させて、工程処理を行う。これにより、半導体素子の保持機構から処理機構への受け渡しと、処理機構から保持機構への受け渡しとを、別のサイクルで行うことができる。このような従来技術によれば、処理機構の移動時間を、搬送機構の搬送時間よりも短くできるので、同じサイクルタイムであっても、従来より工程処理時間を長くすることが可能となる。   Patent Document 2 discloses the following process technology. In this process processing technique, a plurality of processing mechanisms are provided in a process processing unit, and after transferring a semiconductor element from a holding mechanism to one of the processing mechanisms, the process is performed by moving the semiconductor element to a place different from the delivery place. Thereby, the delivery from the holding mechanism of the semiconductor element to the processing mechanism and the delivery from the processing mechanism to the holding mechanism can be performed in different cycles. According to such a conventional technique, since the moving time of the processing mechanism can be made shorter than the conveying time of the conveying mechanism, it is possible to make the process processing time longer than in the prior art even with the same cycle time.

さらに、特許文献3には、複数の処理機構と保持機構を、電子部品の搬送方向に複数設けて、いずれかの保持機構から処理機構へ電子部品を渡し、他のいずれかの保持機構が処理機構から電子部品を受け取る工程処理装置が提案されている。かかる装置においては、処理機構の数を増やすことにより、処理機構による工程処理時間を長く確保することができる。   Further, in Patent Document 3, a plurality of processing mechanisms and holding mechanisms are provided in the electronic component transport direction, and the electronic component is transferred from one holding mechanism to the processing mechanism, and any other holding mechanism performs processing. A process processing apparatus that receives an electronic component from a mechanism has been proposed. In such an apparatus, by increasing the number of processing mechanisms, it is possible to secure a long process time for the processing mechanisms.

例えば、特許文献3の図9に示す例では、3つの処理機構を備え、隣接する保持機構の3つのうち1つが電子部品を保持した状態で搬送し、9回の停止回数のうち1回の割り合いで電子部品の受け渡し及び受け取りを行うことができる。図10に示す例では、4つの処理機構を備え、隣接する保持機構の4つのうち2つが電子部品を保持した状態で搬送し、4回の停止回数のうち1回の割り合いで、電子部品の受け渡し及び受け取りを行うことができる。
特開平5−229509号公報 国際公開WO02/065824号公報 国際公開WO05/015630号公報
For example, in the example shown in FIG. 9 of Patent Document 3, three processing mechanisms are provided, and one of three adjacent holding mechanisms is transported in a state of holding an electronic component, and is one out of nine stop times. Electronic parts can be delivered and received in proportion. In the example shown in FIG. 10, four processing mechanisms are provided, two of the four holding mechanisms adjacent to each other are transported in a state in which the electronic component is held, and the electronic component is divided by one out of four stop times. Can be delivered and received.
JP-A-5-229509 International Publication WO02 / 0665824 International Publication WO05 / 015630

しかしながら、上記のような従来技術には、以下のような問題があった。すなわち、特許文献1に開示されたように並列処理を行う技術では、処理時間が短くて済む工程であっても、工程処理の長い工程と同数の処理機構を配置しなくてはならず、無駄が生じて装置のコストを増加させることになる。また、かかる並列処理のための高コスト化とともに、並列搬送のために搬送機構が複雑化し、装置稼働の信頼性の低下を招く可能性もある。そして、搬送機構の慣性質量増大による駆動力増加、ランニングコスト増大につながる。   However, the prior art as described above has the following problems. That is, in the technology for performing parallel processing as disclosed in Patent Document 1, even in a process that requires a short processing time, the same number of processing mechanisms as in a process with a long process must be arranged, which is wasteful. Will increase the cost of the device. In addition to the increase in cost for such parallel processing, the transport mechanism may be complicated for parallel transport, leading to a decrease in reliability of apparatus operation. And it leads to an increase in driving force and an increase in running cost due to an increase in inertial mass of the transport mechanism.

次に、特許文献2に開示された発明では、上記のような工程処理機構の複雑化、装置稼働信頼性の低下、高コスト化という問題があるとともに、処理機構を工程処理部内で移動させるため、処理条件の不安定化、電気特性測定時のインピーダンス変動による高周波特性測定の精度低下を招くとともに、処理機構の移動時間の分だけ工程処理時間が短くなる。さらに、工程処理機構が大型化すると、搬送経路に沿って複数の工程処理機構を並べることができず、生産性をさらに向上させることが困難となる。   Next, in the invention disclosed in Patent Document 2, there is a problem that the process processing mechanism is complicated as described above, the apparatus operation reliability is lowered, and the cost is increased, and the processing mechanism is moved in the process processing unit. In addition, the processing conditions become unstable and the accuracy of high-frequency characteristic measurement is reduced due to impedance fluctuations during electrical characteristic measurement, and the process processing time is shortened by the movement time of the processing mechanism. Further, when the process processing mechanism is enlarged, a plurality of process processing mechanisms cannot be arranged along the transport path, and it becomes difficult to further improve productivity.

さらに、特許文献3に開示された発明では、図9の例の場合、保持機構の3つのうちの1つが電子部品を保持した状態で搬送することになるため、保持機構の空きが多く、搬送効率が良くない。また、図10の例の場合、電子部品を処理していない処理機構が常に存在しているので、処理効率が良くない。また、処理機構が2つの場合に比べて、処理時間の延長は期待できない。   Furthermore, in the invention disclosed in Patent Document 3, in the case of the example in FIG. 9, one of the three holding mechanisms carries the electronic component while holding the electronic component. Inefficient. Further, in the case of the example in FIG. 10, there is always a processing mechanism that does not process the electronic component, so that the processing efficiency is not good. In addition, the processing time cannot be extended as compared with the case where there are two processing mechanisms.

本発明は、以上のような従来技術の問題点を解決するために提案されたものであり、その目的は、追加機構が少なく低コストで、工程処理時間を長く確保することができるとともに、電子部品の搬送効率及び処理効率に優れた電子部品の工程処理装置及び工程処理方法並びに工程処理用プログラムを提供することにある。   The present invention has been proposed in order to solve the above-described problems of the prior art, and its purpose is to reduce the number of additional mechanisms and to reduce the cost, and to ensure a long process time, An object of the present invention is to provide a process processing apparatus, a process processing method, and a process processing program for an electronic component that are excellent in parts conveyance efficiency and processing efficiency.

上記の目的を達成するため、請求項1の発明は、電子部品を保持する保持機構を備え、前記保持機構を進行及び停止させるサイクルを繰り返しながら電子部品を搬送する搬送部と、前記保持機構から渡された電子部品に、工程処理を施す処理機構を備えた処理部とを有する電子部品の工程処理装置において、前記保持機構及び前記処理機構は、電子部品の搬送方向に複数設けられ、前記保持機構は、電子部品を一つおきに保持するとともに、一つおきの処理機構へ電子部品を同時に渡し、これと異なるタイミングで、他の処理機構から処理を終えた電子部品を同時に受け取るように設定されていることを特徴とする。   In order to achieve the above object, the invention of claim 1 includes a holding mechanism that holds an electronic component, and includes a transport unit that transports the electronic component while repeating a cycle of advancing and stopping the holding mechanism, and the holding mechanism. In an electronic component process processing apparatus having a processing unit having a processing mechanism for performing a process on the delivered electronic component, a plurality of the holding mechanisms and the processing mechanisms are provided in the transport direction of the electronic component, and the holding The mechanism is set to hold every other electronic component, and simultaneously deliver the electronic component to every other processing mechanism, and simultaneously receive the processed electronic components from other processing mechanisms at different timings. It is characterized by being.

請求項3の発明は、電子部品を保持する保持機構が、進行及び停止するサイクルを繰り返しながら電子部品を搬送し、処理機構が、前記保持機構から渡された電子部品に工程処理を施す電子部品の工程処理方法において、前記保持機構及び前記処理機構は、電子部品の搬送方向に複数設けられ、前記保持機構が、電子部品を一つおきに保持するとともに、一つおきの処理機構へ電子部品を同時に渡し、他の処理機構において処理を終えた電子部品を同時に受け取ることを特徴とする。   The invention according to claim 3 is an electronic component in which the holding mechanism for holding the electronic component conveys the electronic component while repeating a cycle of proceeding and stopping, and the processing mechanism performs a process on the electronic component delivered from the holding mechanism. In the step processing method, a plurality of the holding mechanisms and the processing mechanisms are provided in the electronic component transport direction, and the holding mechanism holds every other electronic component and sends the electronic component to every other processing mechanism. And electronic components that have been processed by another processing mechanism are received at the same time.

請求項5の発明は、電子部品を保持する保持機構に、進行及び停止するサイクルを繰り返しながら電子部品を搬送させる制御と、処理機構に、前記保持機構から渡された電子部品に工程処理をさせる制御とを、コンピュータに行わせる電子部品の工程処理用プログラムにおいて、前記保持機構及び前記処理機構は、電子部品の搬送方向に複数設けられ、前記保持機構に、電子部品を一つおきに保持させる制御と、一つおきの処理機構へ電子部品を同時に渡させる制御と、これと異なるタイミングで、他の処理機構において処理を終えた電子部品を同時に受け取らせる制御と、をコンピュータに行わせることを特徴とする。   According to a fifth aspect of the present invention, there is provided a control for causing the holding mechanism for holding the electronic component to convey the electronic component while repeating a cycle of advancement and stop, and a processing mechanism for causing the electronic component passed from the holding mechanism to perform a process. In the electronic component process processing program for causing the computer to perform control, a plurality of the holding mechanism and the processing mechanism are provided in the electronic component transport direction, and the holding mechanism holds every other electronic component. Control the control unit to send electronic components to every other processing mechanism at the same time, and control to simultaneously receive electronic components that have been processed in other processing mechanisms at different timings. Features.

以上のような請求項1、3及び5の発明では、保持機構が、処理機構に一つおきに同時に電子部品を渡すタイミングと、他の処理機構から一つおきに同時に電子部品を受け取るタイミングとが異なっているので、両タイミングを一致させる場合に比べて、一つの処理機構における電子部品の処理時間を長く取ることが可能となる。また、処理機構に電子部品が存在しない時間を短くすることができるので、効率の良い処理が可能となる。   In the first, third, and fifth inventions described above, the holding mechanism simultaneously delivers every other electronic component to the processing mechanism, and simultaneously receives every other electronic component from the other processing mechanism. Therefore, it is possible to increase the processing time of the electronic component in one processing mechanism as compared with the case where both timings are matched. In addition, since the time during which no electronic component is present in the processing mechanism can be shortened, efficient processing can be performed.

請求項2の発明は、請求項1の電子部品の工程処理装置において、前記搬送部は、前記処理機構に対する前記保持機構の位置が一つずつ移動するように、前記保持機構を進行及び停止させるように設定され、前記処理機構における電子部品の処理時間が、前記保持機構の進行及び停止サイクルの単位時間に前記処理機構の数を乗じた時間以上となるように、前記保持機構が電子部品を前記処理機構に渡してから、前記保持機構が電子部品を前記処理機構から受け取るまでの時間が設定されていることを特徴とする。   According to a second aspect of the present invention, in the electronic component process processing apparatus according to the first aspect, the transport unit advances and stops the holding mechanism so that the position of the holding mechanism with respect to the processing mechanism moves one by one. The holding mechanism has the electronic component disposed so that the processing time of the electronic component in the processing mechanism is not less than the time obtained by multiplying the unit time of the advancement and stop cycle of the holding mechanism by the number of the processing mechanisms. A time is set until the holding mechanism receives the electronic component from the processing mechanism after it is delivered to the processing mechanism.

請求項4の発明は、請求項3の電子部品の工程処理方法において、前記保持機構は、前記処理機構に対する前記保持機構の位置が一つずつ移動するように進行及び停止し、前記保持機構が電子部品を前記処理機構に渡してから、前記保持機構が電子部品を前記処理機構から受け取るまでの時間が、前記保持機構の進行及び停止サイクルの単位時間に前記処理機構の数を乗じた時間以上であることを特徴とする。   According to a fourth aspect of the present invention, in the electronic component process processing method of the third aspect, the holding mechanism advances and stops so that the position of the holding mechanism with respect to the processing mechanism moves one by one, and the holding mechanism The time from when the electronic component is delivered to the processing mechanism until the holding mechanism receives the electronic component from the processing mechanism is equal to or longer than the time obtained by multiplying the unit time of the progress and stop cycle of the holding mechanism by the number of the processing mechanisms. It is characterized by being.

請求項6の発明は、請求項5の電子部品の工程処理プログラムにおいて、前記保持機構に、前記処理機構に対する前記保持機構の位置が一つずつ移動するように進行及び停止させる制御と、前記保持機構が電子部品を前記処理機構に渡してから、前記保持機構が電子部品を前記処理機構から受け取るまでの時間を、前記保持機構の進行及び停止サイクルの単位時間に前記処理機構の数を乗じた時間以上とする制御とを、コンピュータに行わせることを特徴とする。   According to a sixth aspect of the present invention, in the electronic component process processing program according to the fifth aspect, the holding mechanism advances and stops so that the position of the holding mechanism relative to the processing mechanism moves one by one, and the holding The time from when the mechanism passes the electronic component to the processing mechanism until the holding mechanism receives the electronic component from the processing mechanism is multiplied by the number of the processing mechanisms by the unit time of the holding mechanism advance and stop cycles. It is characterized by causing a computer to perform control over time.

以上のような請求項2、4及び6の発明では、処理機構によって一つの電子部品を処理する時間が、処理機構の数に対応する進行及び停止にかかる時間以上確保できるので、非常に長時間の処理を行うことができる。また、進行及び停止サイクルの単位時間には、短い処理の工程を済ませることができる。   In the inventions of claims 2, 4, and 6 as described above, the time for processing one electronic component by the processing mechanism can be ensured more than the time required for proceeding and stopping corresponding to the number of processing mechanisms, so that the time Can be processed. In addition, a short processing step can be completed in the unit time of the advance and stop cycles.

本発明によれば、追加機構が少なく低コストで、工程処理時間を長く確保することができるとともに、電子部品の搬送効率及び処理効率に優れた電子部品の工程処理装置及び工程処理方法並びに工程処理用プログラムを提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, while being able to ensure long process processing time with few additional mechanisms and low cost, the process processing apparatus of the electronic component which was excellent in the conveyance efficiency and processing efficiency of an electronic component, the process processing method, and process processing Program can be provided.

[実施形態の構成]
本発明の実施形態を、図面を参照して説明する。すなわち、本実施形態は、図1に示すように、搬送部100、処理部200を備えている。搬送部100は、ターンテーブルTに等間隔で、例えば36個配設された吸着ノズル110を有している。吸着ノズル110は、図示しない真空源に接続され、この切替に応じて電子部品Sを一つずつ吸着及び解放する保持機構である。この吸着ノズル110は、図示しない駆動機構によって昇降可能に設けられ、処理部200に対して下降したときに、電子部品Sを吸着及び解放することにより、処理部200との間での電子部品Sの受け取り及び受け渡しが可能となるように構成されている。
[Configuration of the embodiment]
Embodiments of the present invention will be described with reference to the drawings. That is, the present embodiment includes a transport unit 100 and a processing unit 200 as shown in FIG. The transport unit 100 includes, for example, 36 suction nozzles 110 disposed on the turntable T at regular intervals. The suction nozzle 110 is connected to a vacuum source (not shown), and is a holding mechanism that sucks and releases the electronic components S one by one in accordance with this switching. The suction nozzle 110 is provided so as to be movable up and down by a drive mechanism (not shown). When the suction nozzle 110 is lowered with respect to the processing unit 200, the electronic component S is sucked and released so that the electronic component S is connected to the processing unit 200. It is configured to be able to receive and deliver.

さらに、吸着ノズル110は、図示しない駆動機構によってターンテーブルTが間欠回転することにより、後述する処理機構1A〜4Bに対応する間隔で、図2〜図7に示す左から右の方向に前進した後、一時停止するという搬送サイクルを繰り返しながら、吸着された電子部品Sを搬送するように構成されている。なお、吸着ノズル110を移動させる機構は、ターンテーブルTでなくてもよく、例えば、直線搬送させるものや曲線搬送させるもの等、公知のあらゆる技術を適用できる。   Further, the suction nozzle 110 advances from the left to the right shown in FIGS. 2 to 7 at intervals corresponding to the processing mechanisms 1A to 4B described later by intermittently rotating the turntable T by a driving mechanism (not shown). Thereafter, the sucked electronic component S is transported while repeating a transport cycle of temporarily stopping. Note that the mechanism for moving the suction nozzle 110 does not have to be the turntable T, and for example, any known technique such as a straight-line conveyance or a curved-line conveyance can be applied.

次に、処理部200は、搬送ラインにおける吸着ノズル110の下部に配設された8台の処理機構1A,1B,2A,2B,3A,3B,4A,4Bによって構成されている。各処理機構1A〜4Bは、電子部品(デバイス)Sの電気的テストを行う。つまり、各処理機構1A〜4Bは、デバイスの電極に接触して、デバイスの電圧、電流、抵抗又は周波数等の電気特性を測定するテストステーションである。これらの処理機構1A〜4Bは、各吸着ノズル110の停止位置に対応する位置に設置され、この位置においてテストコンタクト工程を構成する。   Next, the processing unit 200 includes eight processing mechanisms 1A, 1B, 2A, 2B, 3A, 3B, 4A, and 4B disposed below the suction nozzle 110 in the transport line. Each processing mechanism 1A to 4B performs an electrical test of the electronic component (device) S. In other words, each of the processing mechanisms 1A to 4B is a test station that measures electrical characteristics such as voltage, current, resistance, or frequency of the device by contacting the electrode of the device. These processing mechanisms 1 </ b> A to 4 </ b> B are installed at a position corresponding to the stop position of each suction nozzle 110, and constitute a test contact process at this position.

さらに、ターンテーブルTにおける処理部200の上流の停止ポジションに対応する位置には、電子部品Sを各吸着ノズル110に供給するための供給装置300、電子部品Sの極性を判別するための極性判別装置400、極性判別に従って電子部品Sを反転させる反転装置500が配設されている。各装置は、ターンテーブルTに対して離間して水平配置されており、下降した吸着ノズル110に保持された電子部品Sに対して所定の処理を行うことができる。   Further, a supply device 300 for supplying the electronic component S to each suction nozzle 110 and a polarity determination for determining the polarity of the electronic component S at a position corresponding to the stop position upstream of the processing unit 200 in the turntable T. A device 400 and a reversing device 500 for reversing the electronic component S in accordance with polarity determination are arranged. Each device is horizontally disposed apart from the turntable T, and can perform a predetermined process on the electronic component S held by the lowered suction nozzle 110.

上記の供給装置300は、ボールフィーダ310並びにリニアフィーダ320から整列搬送されてくる電子部品Sを、エスケープから吸着ノズル110に受け渡すエスケープ工程を構成する。極性判別装置400は、電子部品Sの極性を判別する極性判別工程を構成する。反転装置500は、極性判別に基づいて、電子部品Sの極性を入れ替えるように回転させる左右反転工程を構成する。   The supply device 300 constitutes an escape process in which the electronic components S aligned and conveyed from the ball feeder 310 and the linear feeder 320 are delivered from the escape to the suction nozzle 110. The polarity discriminating apparatus 400 constitutes a polarity discriminating step for discriminating the polarity of the electronic component S. The reversing device 500 constitutes a left / right reversing process in which the polarity of the electronic component S is rotated based on polarity determination.

なお、これらの各装置は、処理機構1A〜4B以外の装置の例示に過ぎず、どのような装置を配置するか、その配置位置をどの停止ポジションとするか、処理部200の上流とするか下流とするか等は自由である。例えば、マーキング装置、外観検査装置、テーピング装置、不良品除去装置等、種々の装置を適用可能であり、これらを所望の箇所に配置することができる。   Each of these devices is merely an example of a device other than the processing mechanisms 1A to 4B, and what device is to be arranged, which stop position is to be arranged, or whether it is upstream of the processing unit 200. Whether it is downstream or the like is free. For example, various devices such as a marking device, an appearance inspection device, a taping device, and a defective product removal device can be applied, and these can be arranged at a desired location.

上記のターンテーブルTの駆動機構、吸着ノズル110を昇降させる駆動機構、吸着ノズル110の真空源、処理部200の処理機構1A〜4B、供給装置300、極性判別装置400及び反転装置500等は、以下に説明する手順で作動するように、所定のプログラムによって動作するコンピュータ若しくは専用の回路から成る制御装置によって制御される。   The drive mechanism of the turntable T, the drive mechanism that raises and lowers the suction nozzle 110, the vacuum source of the suction nozzle 110, the processing mechanisms 1A to 4B of the processing unit 200, the supply device 300, the polarity determination device 400, the reversing device 500, etc. It is controlled by a control device comprising a computer or a dedicated circuit that operates according to a predetermined program so as to operate according to the procedure described below.

[実施形態の作用]
以上のような構成を有する本実施形態の動作を、図2〜図7の工程図、図8のタイムチャート、図9のフローチャートを参照して説明する。なお、実際にはターンテーブルTは1ポジションずつ移動するが、説明の便宜のため、図2(4)〜図3(5)(6)、図4(9)〜(11)、図5(14)〜(16)、図6(19)〜図7(21)以外は、1ポジション分の移動を省いて表示している。また、図9における(5)〜(24)は、図3〜図7の(5)〜(24)に対応する。
[Operation of the embodiment]
The operation of the present embodiment having the above configuration will be described with reference to the process charts of FIGS. 2 to 7, the time chart of FIG. 8, and the flowchart of FIG. Actually, the turntable T moves one position at a time, but for convenience of explanation, FIGS. 2 (4) to 3 (5) (6), FIGS. 4 (9) to (11), and FIG. Except for 14) to (16) and FIGS. 6 (19) to 7 (21), the movement for one position is omitted. Further, (5) to (24) in FIG. 9 correspond to (5) to (24) in FIGS.

まず、図2及び図8(b)に示すように、供給装置300によって供給される電子部品Sは、吸着ノズル110に一つおきに吸着される(図2〜図7では、先頭の電子部品Sから順に0,1,2,3の連続番号を付している)。そして、吸着ノズル110は、ターンテーブルTが1ポジションずつ回転と停止を繰り返す間欠回転をすることにより、電子部品Sを搬送する。この過程で、図8(c)(d)に示すように、1ポジションおきに、極性判別装置400による極性判別、反転装置500によって極性を揃える反転処理が行われる。   First, as shown in FIG. 2 and FIG. 8B, every other electronic component S supplied by the supply device 300 is sucked by the suction nozzle 110 (in FIG. 2 to FIG. (Sequential numbers 0, 1, 2, 3 are assigned in order from S). And the suction nozzle 110 conveys the electronic component S by carrying out the intermittent rotation which the turntable T repeats rotation and a stop for every position. In this process, as shown in FIGS. 8C and 8D, polarity discrimination by the polarity discriminating device 400 and reversal processing for aligning the polarity by the inversion device 500 are performed every other position.

ここで、図2〜図7に示すように、供給装置300によって供給される電子部品Sを一つおきに吸着して搬送し、処理機構1A〜4Bに渡す吸着ノズル110をノズルAa,Baとし、4つのノズルAa、4つのノズルBaが交互に登場するものとする。また、処理機構1A〜4B上の電子部品Sを吸着して受け取る吸着ノズル110をノズルAb,Bbとし、4つをノズルAb、4つをノズルBbが交互に登場するものとする。   Here, as shown in FIGS. 2 to 7, the suction nozzles 110 that suck and convey every other electronic component S supplied by the supply device 300 and pass it to the processing mechanisms 1 </ b> A to 4 </ b> B are set as nozzles Aa and Ba. Assume that four nozzles Aa and four nozzles Ba appear alternately. Further, the suction nozzle 110 that sucks and receives the electronic component S on the processing mechanisms 1A to 4B is assumed to be nozzles Ab and Bb, four nozzles Ab, and four nozzles Bb appear alternately.

図2(1)〜(4)に示すように、吸着ノズル110が進行と停止を繰り返すことにより電子部品Sが搬送される過程で(ステップ01,02)、図3(5)に示すように、電子部品Sを吸着した4つのノズルAaが、処理機構1A,2A,3A,4A上まで来て停止すると(ステップ03)、下降して電子部品Sを解放した後に上昇する(ステップ04)。すると、処理機構1A,2A,3A,4A上に電子部品Sが搭載され、電子部品Sの検査が行われる。   As shown in FIGS. 2 (1) to (4), in the process in which the electronic component S is conveyed by the suction nozzle 110 being repeatedly moved and stopped (steps 01 and 02), as shown in FIG. 3 (5). When the four nozzles Aa attracting the electronic component S come to the processing mechanisms 1A, 2A, 3A, and 4A and stop (step 03), they are lowered and released after releasing the electronic component S (step 04). Then, the electronic component S is mounted on the processing mechanisms 1A, 2A, 3A, and 4A, and the electronic component S is inspected.

次に、図3(6)〜図4(10)に示すように、再び吸着ノズル110の進行と停止が行われる(ステップ05,06)。そして、図4(11)に示すように、電子部品Sを吸着した4つのノズルBaが、処理機構1B,2B,3B,4B上まで来て停止すると(ステップ07)、下降して電子部品Sを解放した後に上昇する(ステップ08)。すると、処理機構1B,2B,3B,4B上に電子部品Sが搭載され、電子部品Sの検査が行われる。   Next, as shown in FIGS. 3 (6) to 4 (10), the suction nozzle 110 is advanced and stopped again (steps 05 and 06). Then, as shown in FIG. 4 (11), when the four nozzles Ba sucking the electronic component S come to the processing mechanisms 1B, 2B, 3B, 4B and stop (step 07), the electronic nozzle S descends. Rises after releasing (step 08). Then, the electronic component S is mounted on the processing mechanisms 1B, 2B, 3B, and 4B, and the electronic component S is inspected.

次に、図4(12)〜図5(14)に示すように、再び吸着ノズル110の進行と停止が行われる(ステップ09,10)。そして、図5(14)に示すように、4つの空きのノズルAbが処理機構1A,2A,3A,4A上まで来て停止すると(ステップ11)、下降して処理の終了した電子部品Sを吸着した後に上昇する(ステップ12)。   Next, as shown in FIGS. 4 (12) to 5 (14), the suction nozzle 110 is advanced and stopped again (steps 09 and 10). Then, as shown in FIG. 5 (14), when the four empty nozzles Ab reach the processing mechanisms 1A, 2A, 3A, and 4A and stop (step 11), the electronic component S that has been lowered and finished processing is removed. It rises after adsorption (step 12).

さらに、吸着ノズル110が1ポジション進行して停止する(ステップ13,14)。すると、図5(15)に示すように、電子部品Sを吸着した4つのノズルAaが、処理機構1A,2A,3A,4A上まで来るので、下降して電子部品Sを解放した後に上昇する(ステップ15)。すると、処理機構1A,2A,3A,4A上に電子部品Sが搭載され、電子部品Sの検査が行われる。   Further, the suction nozzle 110 advances by one position and stops (steps 13 and 14). Then, as shown in FIG. 5 (15), since the four nozzles Aa that have attracted the electronic component S come to the processing mechanisms 1A, 2A, 3A, and 4A, they are lowered and then lifted after releasing the electronic component S. (Step 15). Then, the electronic component S is mounted on the processing mechanisms 1A, 2A, 3A, and 4A, and the electronic component S is inspected.

次に、図5(16)〜図6(19)に示すように、再び吸着ノズル110の進行と停止が行われる(ステップ16,17)。そして、図6(20)に示すように、4つの空きのノズルBbが処理機構1B,2B,3B,4B上まで来て停止すると(ステップ18)、下降して処理の終了した電子部品Sを吸着した後に上昇する(ステップ19)。   Next, as shown in FIGS. 5 (16) to 6 (19), the suction nozzle 110 is advanced and stopped again (steps 16 and 17). Then, as shown in FIG. 6 (20), when the four empty nozzles Bb come to the top of the processing mechanisms 1B, 2B, 3B, and 4B and stop (step 18), the electronic component S that has been lowered and finished processing is removed. It rises after adsorption (step 19).

さらに、吸着ノズル110が1ポジション進行して停止する(ステップ20,21)。すると、図7(21)に示すように、電子部品Sを吸着した4つのノズルBaが、処理機構1B,2B,3B,4B上まで来るので、下降して電子部品Sを解放した後に上昇する(ステップ22)。すると、処理機構1B,2B,3B,4B上に電子部品Sが搭載され、電子部品Sの検査が行われる。以上のように検査がなされた後、ノズルAb,Bbによって一つおきに吸着された電子部品Sは、次工程へと順次搬送されていく。   Further, the suction nozzle 110 advances by one position and stops (steps 20 and 21). Then, as shown in FIG. 7 (21), the four nozzles Ba that have attracted the electronic component S come to the top of the processing mechanisms 1B, 2B, 3B, and 4B. (Step 22). Then, the electronic component S is mounted on the processing mechanisms 1B, 2B, 3B, and 4B, and the electronic component S is inspected. After the inspection is performed as described above, every other electronic component S sucked by the nozzles Ab and Bb is sequentially transported to the next process.

[実施形態の効果]
以上のような本実施形態によれば、吸着ノズル110が、8つの処理機構1A〜4Bのうち、一つおきの4つの処理機構1A,2A,3A,4Aに、同時に電子部品Sを渡すタイミングと、他の4つの処理機構1B,2B,3B,4Bから同時に電子部品Sを受け取るタイミングとが異なっているので、両タイミングを一致させる場合に比べて、各処理機構1A〜4Bにおける電子部品Sの検査時間を長く取ることが可能となる。また、常時、いずれかの処理機構1A〜4Bに電子部品Sが存在するとともに、各処理機構1A〜4Bへの受け渡しのために電子部品Sが存在しなくなる時間を非常に短くすることができるので、長時間且つ効率の良い処理が可能となる。
[Effect of the embodiment]
According to the present embodiment as described above, the timing at which the suction nozzle 110 delivers the electronic component S simultaneously to every other four processing mechanisms 1A, 2A, 3A, and 4A among the eight processing mechanisms 1A to 4B. And the timing of receiving the electronic component S from the other four processing mechanisms 1B, 2B, 3B, 4B at the same time are different from each other, compared with the case where both timings are matched, the electronic component S in each processing mechanism 1A-4B. It is possible to take a long inspection time. In addition, the electronic component S is always present in any of the processing mechanisms 1A to 4B, and the time during which the electronic component S does not exist for delivery to the processing mechanisms 1A to 4B can be greatly shortened. Therefore, it is possible to perform an efficient process for a long time.

また、一つの電子部品Sを処理する時間が、処理機構1A〜4Bの数(ここでは8つ)に対応するポジションの進行及び停止に要する時間より以上確保できるので、非常に長時間の処理を行うことが可能となる。これは、図8(e)に示すように、テストコンタクト工程における解放から吸着までの時間が、停止時間+進行時間で定まる1搬送サイクル時間×8よりも長い時間となっていることからも明らかである。   In addition, since the time for processing one electronic component S can be secured more than the time required for the progress and stop of the positions corresponding to the number of processing mechanisms 1A to 4B (eight here), processing for a very long time is possible. Can be done. This is also clear from the fact that the time from release to adsorption in the test contact process is longer than one transport cycle time × 8 determined by the stop time + advance time as shown in FIG. 8 (e). It is.

また、進行及び停止サイクルの単位時間には、短い処理の工程を済ませることができる。これは、図8(b)〜(d)に示すように、2搬送サイクル時間における1回の停止時間において、エスケープ工程、極性判別工程、左右反転工程を行っていることからも明らかである。従って、短時間で処理が完了する工程の処理機構を増やす必要がなく、装置コストの増加、装置稼働の信頼性の低下を最小限にとどめることができる。   In addition, a short processing step can be completed in the unit time of the advance and stop cycles. This is also clear from the fact that the escape process, the polarity determination process, and the left-right reversing process are performed in one stop time in the two transport cycle times as shown in FIGS. 8B to 8D. Therefore, it is not necessary to increase the number of processing mechanisms for completing the process in a short time, and an increase in apparatus cost and a decrease in reliability of apparatus operation can be minimized.

また、図8のタイムチャートに示すように、隣接する処理機構において吸着と解放を行っている(14)(15)(20)(21)等のステップにおいては、1搬送サイクル(1ポジション)ずつの進行及び停止を行う必要がある。しかし、これ以外のステップでは、電子部品の処理を2搬送サイクル時間に1回行っているだけなので、2搬送サイクル中の停止をさせずに1ステップで(2ポジション分を一気に)移動させれば、全体の処理時間を更に短縮することができる。   Further, as shown in the time chart of FIG. 8, in the steps such as (14), (15), (20), and (21) in which adsorption and release are performed in adjacent processing mechanisms, one transport cycle (one position) is performed. Need to proceed and stop. However, in other steps, the electronic component is processed only once in two transport cycle times, so if it is moved in one step (two positions at a time) without stopping during the two transport cycles. The overall processing time can be further shortened.

また、本実施形態によれば、搬送部100に手を加えずに、従来の工程処理装置の保持機構(吸着ノズル110等)の停止位置に、処理部200の処理機構を追加し、制御プログラム若しくはソフトウェアを変更するのみで実現できる。このため、従来装置、特に搬送部100や保持機構の設計を大幅に変更する必要がない。そして、従来装置と装置構成上の互換性が高く、従来装置から本実施形態への改造等が容易である。また、必要に応じて従来装置の形態で装置を稼動させることも容易である。さらに、設計の変更点が少なくて済むため、部品、ユニットの互換性を保つことができ、実績のある部品、ユニットの使用による装置稼働の信頼性の向上、装置コストの低下が可能となる。   Further, according to the present embodiment, the processing mechanism of the processing unit 200 is added to the stop position of the holding mechanism (such as the suction nozzle 110) of the conventional process processing apparatus without changing the transport unit 100, and the control program Or it can be realized only by changing the software. For this reason, it is not necessary to change the design of the conventional apparatus, in particular, the transport unit 100 and the holding mechanism. Further, the compatibility of the conventional apparatus with the apparatus configuration is high, and the modification from the conventional apparatus to the present embodiment is easy. It is also easy to operate the apparatus in the form of a conventional apparatus as required. Furthermore, since there are few design changes, the compatibility of components and units can be maintained, and the reliability of device operation can be improved and the device cost can be reduced by using proven components and units.

さらに、本実施形態では、電子部品Sを吸着しているノズルAa,Baと吸着していないノズルAb,Bbとが交互に存在する状態で、処理機構1A〜4Bに電子部品Sを供給し、処理の終了した電子部品Sを吸着しているノズルAb,Bbと吸着していないノズルAa,Baとが交互に存在する状態で、次工程へと搬送させることができるので、使用する吸着ノズル110の無駄がなく、次工程での処理もし易くなる。   Further, in the present embodiment, the electronic components S are supplied to the processing mechanisms 1A to 4B in a state where the nozzles Aa and Ba that are sucking the electronic components S and the nozzles Ab and Bb that are not sucking are alternately present, Since the nozzles Ab and Bb sucking the processed electronic component S and the nozzles Aa and Ba not sucked can be alternately conveyed to the next process, the suction nozzle 110 to be used is used. Therefore, it is easy to process in the next process.

[他の実施形態]
本発明は、上記のような実施形態に限定されるものではなく、各部材の具体的構造、配置、大きさ、形状、数、材質、種類等は適宜変更可能である。すなわち、処理機構は複数台あればよく、上記の実施形態よりも少なくても多くてもよい。また、吸着ノズルの個数も、ターンテーブルの停止ポジション数も上記の実施形態に例示されたものには限定されない。
[Other Embodiments]
The present invention is not limited to the embodiment described above, and the specific structure, arrangement, size, shape, number, material, type, and the like of each member can be changed as appropriate. That is, there may be a plurality of processing mechanisms, and there may be fewer or more than the above embodiment. Further, the number of suction nozzles and the number of stop positions of the turntable are not limited to those exemplified in the above embodiment.

また、保持機構は吸着ノズルには限定されず、例えば、機械的保持、静電吸着、ベルヌーイチャックなど、既知のいかなる方法を用いてもよい。駆動機構による保持機構の移動制御方式、移動経路(直線か曲線かを問わない)についても、特定のものには限定されない。移動タイミングの制御は、上記の実施形態のように行うこともできるし、機械的に実現することもできる。電子部品を渡す保持機構が電子部品を受け取る処理機構上に来たかどうか、電子部品を受け取る保持機構が電子部品を渡す処理機構上に来たかどうかは、単純には移動したポジション数をカウントすることによって判断することができるが、センサ等によって検出して判断してもよい。   Further, the holding mechanism is not limited to the suction nozzle, and any known method such as mechanical holding, electrostatic chucking, Bernoulli chuck, or the like may be used. The movement control method of the holding mechanism by the drive mechanism and the movement path (whether linear or curved) are not limited to specific ones. The control of the movement timing can be performed as in the above embodiment, or can be realized mechanically. Whether the holding mechanism that receives the electronic component is on the processing mechanism that receives the electronic component, or whether the holding mechanism that receives the electronic component is on the processing mechanism that passes the electronic component, simply count the number of moved positions. However, it may be determined by detecting with a sensor or the like.

また、処理部が行う処理は、電気的な特性を測定するものには限定されず、電子部品に対する所定の処理を行うものが広く含まれる。さらに、本発明の処理対象は、半導体素子が代表的であるが、これに限らず、公知のあらゆる素子、部材、電子・電気部品、機械部品等に適用可能である。   Further, the processing performed by the processing unit is not limited to measuring electrical characteristics, and widely includes processing for performing predetermined processing on electronic components. Furthermore, the processing target of the present invention is typically a semiconductor element, but is not limited thereto, and can be applied to all known elements, members, electronic / electrical parts, mechanical parts, and the like.

本発明の一実施形態を示す構成図である。It is a block diagram which shows one Embodiment of this invention. 図1の実施形態による電子部品の搬送手順を示す工程図(1)〜(4)である。It is process drawing (1)-(4) which shows the conveyance procedure of the electronic component by embodiment of FIG. 図1の実施形態による電子部品の搬送及び検査手順を示す工程図(5)〜(8)である。It is process drawing (5)-(8) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. 図1の実施形態による電子部品の搬送及び検査手順を示す工程図(9)〜(12)である。It is process drawing (9)-(12) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. 図1の実施形態による電子部品の搬送及び検査手順を示す工程図(13)〜(16)である。It is process drawing (13)-(16) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. 図1の実施形態による電子部品の搬送及び検査手順を示す工程図(17)〜(20)である。It is process drawing (17)-(20) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. 図1の実施形態による電子部品の搬送及び検査手順を示す工程図(21)〜(24)である。It is process drawing (21)-(24) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. 図5〜7の工程図に対応するタイムチャートである。It is a time chart corresponding to the process drawing of FIGS. 図1の実施形態における処理手順を示すフローチャートである。It is a flowchart which shows the process sequence in embodiment of FIG.

符号の説明Explanation of symbols

100…搬送部
110…吸着ノズル
200…処理部
300…供給装置
310…ボールフィーダ
320…リニアフィーダ
400…極性判別装置
500…反転装置
1A,1B,2A,2B,3A,3B,4A,4B…処理機構
DESCRIPTION OF SYMBOLS 100 ... Conveyance part 110 ... Adsorption nozzle 200 ... Processing part 300 ... Supply apparatus 310 ... Ball feeder 320 ... Linear feeder 400 ... Polarity discrimination apparatus 500 ... Inversion apparatus 1A, 1B, 2A, 2B, 3A, 3B, 4A, 4B ... Processing mechanism

Claims (6)

電子部品を保持する保持機構を備え、前記保持機構を進行及び停止させるサイクルを繰り返しながら電子部品を搬送する搬送部と、前記保持機構から渡された電子部品に、工程処理を施す処理機構を備えた処理部とを有する電子部品の工程処理装置において、
前記保持機構及び前記処理機構は、電子部品の搬送方向に複数設けられ、
前記保持機構は、電子部品を一つおきに保持するとともに、一つおきの処理機構へ電子部品を同時に渡し、これと異なるタイミングで、他の処理機構から処理を終えた電子部品を同時に受け取るように設定されていることを特徴とする電子部品の工程処理装置。
A holding mechanism for holding the electronic component, a transport unit for transporting the electronic component while repeating a cycle for advancing and stopping the holding mechanism, and a processing mechanism for performing a process on the electronic component delivered from the holding mechanism. In an electronic component process processing apparatus having a processing unit,
A plurality of the holding mechanism and the processing mechanism are provided in the transport direction of the electronic component,
The holding mechanism holds every other electronic component, and simultaneously delivers the electronic component to every other processing mechanism, and simultaneously receives the processed electronic component from another processing mechanism at a different timing. An electronic component process processing apparatus, wherein
前記搬送部は、前記処理機構に対する前記保持機構の位置が一つずつ移動するように、前記保持機構を進行及び停止させるように設定され、
前記処理機構における電子部品の処理時間が、前記保持機構の進行及び停止サイクルの単位時間に前記処理機構の数を乗じた時間以上となるように、前記保持機構が電子部品を前記処理機構に渡してから、前記保持機構が電子部品を前記処理機構から受け取るまでの時間が設定されていることを特徴とする請求項1記載の電子部品の工程処理装置。
The transport unit is set to advance and stop the holding mechanism so that the position of the holding mechanism with respect to the processing mechanism moves one by one,
The holding mechanism passes the electronic component to the processing mechanism so that the processing time of the electronic component in the processing mechanism is equal to or longer than the unit time of the advance and stop cycles of the holding mechanism multiplied by the number of the processing mechanisms. 2. The electronic component process processing apparatus according to claim 1, wherein a time until the holding mechanism receives the electronic component from the processing mechanism is set.
電子部品を保持する保持機構が、進行及び停止するサイクルを繰り返しながら電子部品を搬送し、処理機構が、前記保持機構から渡された電子部品に工程処理を施す電子部品の工程処理方法において、
前記保持機構及び前記処理機構は、電子部品の搬送方向に複数設けられ、
前記保持機構が、電子部品を一つおきに保持するとともに、一つおきの処理機構へ電子部品を同時に渡し、これと異なるタイミングで、他の処理機構において処理を終えた電子部品を同時に受け取ることを特徴とする電子部品の工程処理方法。
In the electronic component process processing method in which the holding mechanism for holding the electronic component conveys the electronic component while repeating a cycle of proceeding and stopping, and the processing mechanism performs a process on the electronic component delivered from the holding mechanism.
A plurality of the holding mechanism and the processing mechanism are provided in the transport direction of the electronic component,
The holding mechanism holds every other electronic component, and simultaneously delivers the electronic component to every other processing mechanism, and simultaneously receives the electronic component that has been processed in another processing mechanism at a different timing. An electronic component process processing method characterized by the above.
前記保持機構は、前記処理機構に対する前記保持機構の位置が一つずつ移動するように進行及び停止し、
前記保持機構が電子部品を前記処理機構に受け渡してから、前記保持機構が電子部品を前記処理機構から受け取るまでの時間が、前記保持機構の進行及び停止サイクルの単位時間に前記処理機構の数を乗じた時間以上であることを特徴とする請求項3記載の電子部品の工程処理方法。
The holding mechanism advances and stops so that the position of the holding mechanism with respect to the processing mechanism moves one by one,
The time from when the holding mechanism delivers the electronic component to the processing mechanism until the holding mechanism receives the electronic component from the processing mechanism is equal to the number of the processing mechanisms per unit time of the advancement and stop cycle of the holding mechanism. The electronic component process processing method according to claim 3, wherein the time is not less than the multiplied time.
電子部品を保持する保持機構に、進行及び停止するサイクルを繰り返しながら電子部品を搬送させる制御と、処理機構に、前記保持機構から渡された電子部品に工程処理をさせる制御とを、コンピュータに行わせる電子部品の工程処理用プログラムにおいて、
前記保持機構及び前記処理機構は、電子部品の搬送方向に複数設けられ、
複数の保持機構に、
電子部品を一つおきに保持させる制御と、
複数の処理機構へ電子部品を一つおきに同時に渡させる制御と、これと異なるタイミングで、他の複数の処理機構において処理を終えた電子部品を一つおきに同時に受け取らせる制御と、
をコンピュータに行わせることを特徴とする電子部品の工程処理用プログラム。
The computer controls the holding mechanism that holds the electronic component to convey the electronic component while repeating the cycle of proceeding and stopping, and the control that causes the processing mechanism to process the electronic component passed from the holding mechanism. In the electronic component process processing program
A plurality of the holding mechanism and the processing mechanism are provided in the transport direction of the electronic component,
Multiple holding mechanisms
Control to hold every other electronic component,
Control for passing every other electronic component to multiple processing mechanisms at the same time, and control for simultaneously receiving every other electronic component that has been processed in other processing mechanisms at different timings,
A process processing program for electronic parts, characterized by causing a computer to perform the above.
前記保持機構に、前記処理機構に対する前記保持機構の位置が一つずつ移動するように進行及び停止させる制御と、
前記保持機構が電子部品を前記処理機構に受け渡してから、前記保持機構が電子部品を前記処理機構から受け取るまでの時間を、前記保持機構の進行及び停止サイクルの単位時間に前記処理機構の数を乗じた時間以上とする制御とを、コンピュータに行わせることを特徴とする請求項5記載の電子部品の工程処理用プログラム。
Control for causing the holding mechanism to advance and stop so that the position of the holding mechanism with respect to the processing mechanism moves one by one;
The time from when the holding mechanism delivers the electronic component to the processing mechanism until the holding mechanism receives the electronic component from the processing mechanism is set to the number of the processing mechanisms in the unit time of the advancement and stop cycle of the holding mechanism. 6. The electronic component process processing program according to claim 5, which causes a computer to perform control to make the multiplied time or more.
JP2007314081A 2007-12-04 2007-12-04 Electronic component process processing apparatus, process processing method, and process processing program Expired - Fee Related JP5019534B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007314081A JP5019534B2 (en) 2007-12-04 2007-12-04 Electronic component process processing apparatus, process processing method, and process processing program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007314081A JP5019534B2 (en) 2007-12-04 2007-12-04 Electronic component process processing apparatus, process processing method, and process processing program

Publications (2)

Publication Number Publication Date
JP2009141029A true JP2009141029A (en) 2009-06-25
JP5019534B2 JP5019534B2 (en) 2012-09-05

Family

ID=40871392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007314081A Expired - Fee Related JP5019534B2 (en) 2007-12-04 2007-12-04 Electronic component process processing apparatus, process processing method, and process processing program

Country Status (1)

Country Link
JP (1) JP5019534B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05229509A (en) * 1992-02-18 1993-09-07 Nichiden Mach Ltd Composite taping device for electronic component
WO2002065824A1 (en) * 2001-02-14 2002-08-22 Ismeca Holding Sa Method and device for treating components
WO2005015630A1 (en) * 2003-08-11 2005-02-17 Ueno Seiki Co., Ltd. Electronic part step-processing apparatus, step-processing method, and step-processing program
JP2006080483A (en) * 2004-08-10 2006-03-23 Ueno Seiki Kk Electronic component process handling equipment, process handling method and process handling program

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05229509A (en) * 1992-02-18 1993-09-07 Nichiden Mach Ltd Composite taping device for electronic component
WO2002065824A1 (en) * 2001-02-14 2002-08-22 Ismeca Holding Sa Method and device for treating components
WO2005015630A1 (en) * 2003-08-11 2005-02-17 Ueno Seiki Co., Ltd. Electronic part step-processing apparatus, step-processing method, and step-processing program
JP2006080483A (en) * 2004-08-10 2006-03-23 Ueno Seiki Kk Electronic component process handling equipment, process handling method and process handling program

Also Published As

Publication number Publication date
JP5019534B2 (en) 2012-09-05

Similar Documents

Publication Publication Date Title
JP6075663B1 (en) Relay device, transport device and inspection device
JP2012116528A (en) Taping unit and electronic component inspection device
TWI555687B (en) Electronic component handling device
TW201642377A (en) Substrate rotary loader
JPWO2013084298A1 (en) POSITIONING DEVICE AND ELECTRONIC COMPONENT CONVEYING DEVICE INCLUDING THE SAME
JP4202102B2 (en) Taping device for semiconductor device
JP5441241B2 (en) Process processing apparatus, process processing method, and program for process processing
JP5019534B2 (en) Electronic component process processing apparatus, process processing method, and process processing program
CN104418097A (en) Process station for a machine as well as control device and control method
JP2009141026A (en) Processing device and processing method of electronic component, and program for processing
JP6057303B2 (en) Electronic component process processing apparatus, process processing method, and process processing program
JP2004121990A (en) Work conveyance and storage device and method
JP4683415B2 (en) Electronic component process processing apparatus, process processing method, and process processing program
JP3591593B1 (en) Electronic component process processing apparatus, process processing method, and process processing program
JP2010131680A (en) Holding means driver
JP2019079941A (en) Substrate division device and substrate division method
JP2016102024A (en) Method and device for aligning semiconductor chips
JP3591592B1 (en) Electronic component process processing apparatus, process processing method, and process processing program
JP3631240B1 (en) Electronic component process processing apparatus, process processing method, and process processing program
CN107089497B (en) The processing unit and processing method of electronic component
JP5051714B2 (en) Holding means driving apparatus, control method thereof, and control program
JP5083733B2 (en) Holding means driving apparatus, control method thereof, and control program
JP4999003B2 (en) Electronic component measuring apparatus, control method thereof, and control program
JP5051713B2 (en) Electronic component measuring device
JP4301393B2 (en) Semiconductor device manufacturing equipment

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101126

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111019

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120529

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120608

R150 Certificate of patent or registration of utility model

Ref document number: 5019534

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150622

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150622

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150622

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees