JP2009137286A5 - - Google Patents

Download PDF

Info

Publication number
JP2009137286A5
JP2009137286A5 JP2008286980A JP2008286980A JP2009137286A5 JP 2009137286 A5 JP2009137286 A5 JP 2009137286A5 JP 2008286980 A JP2008286980 A JP 2008286980A JP 2008286980 A JP2008286980 A JP 2008286980A JP 2009137286 A5 JP2009137286 A5 JP 2009137286A5
Authority
JP
Japan
Prior art keywords
substrate
base plate
actuator
actuators
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008286980A
Other languages
English (en)
Japanese (ja)
Other versions
JP5590785B2 (ja
JP2009137286A (ja
Filing date
Publication date
Priority claimed from EP07021676A external-priority patent/EP2058107B1/de
Application filed filed Critical
Publication of JP2009137286A publication Critical patent/JP2009137286A/ja
Publication of JP2009137286A5 publication Critical patent/JP2009137286A5/ja
Application granted granted Critical
Publication of JP5590785B2 publication Critical patent/JP5590785B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008286980A 2007-11-08 2008-11-07 基板の均一な構造化のためのシステム Active JP5590785B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07021676.7 2007-11-08
EP07021676A EP2058107B1 (de) 2007-11-08 2007-11-08 Vorrichtung zum gleichmäßigen Strukturieren von Substraten

Publications (3)

Publication Number Publication Date
JP2009137286A JP2009137286A (ja) 2009-06-25
JP2009137286A5 true JP2009137286A5 (enExample) 2013-10-17
JP5590785B2 JP5590785B2 (ja) 2014-09-17

Family

ID=39102908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008286980A Active JP5590785B2 (ja) 2007-11-08 2008-11-07 基板の均一な構造化のためのシステム

Country Status (3)

Country Link
US (1) US8763239B2 (enExample)
EP (2) EP2450175B1 (enExample)
JP (1) JP5590785B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014057589A1 (ja) * 2012-10-12 2014-04-17 アイトリックス株式会社 多軸プレス装置及びそれを利用したインプリント装置
JP6116937B2 (ja) * 2013-02-28 2017-04-19 公立大学法人大阪府立大学 パターン形成装置およびそれを用いたパターン形成方法
JP6370539B2 (ja) * 2013-09-13 2018-08-08 公立大学法人大阪府立大学 パターン形成装置およびそれを用いたパターン形成方法
US10495989B2 (en) 2015-02-12 2019-12-03 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
SG11201901367RA (en) * 2016-09-05 2019-03-28 Ev Group E Thallner Gmbh Apparatus and method for embossing micro- and/or nanostructures
CN107144909B (zh) * 2017-04-06 2019-06-07 陕西师范大学 一种实现非对称传输的单层金纳米结构及其制备方法
US12030236B2 (en) * 2018-07-03 2024-07-09 TC Tech Sweden AB (PUBL.) Method and tool for embossing
CN115398133B (zh) * 2020-06-30 2025-06-13 Ev集团E·索尔纳有限责任公司 用于对准基板的装置和方法
JP2023069027A (ja) * 2021-11-04 2023-05-18 キヤノン株式会社 成形装置、成形方法、インプリント方法および物品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH682108A5 (enExample) * 1991-04-30 1993-07-15 Mettler Toledo Ag
US7432634B2 (en) * 2000-10-27 2008-10-07 Board Of Regents, University Of Texas System Remote center compliant flexure device
DE20122179U1 (de) 2000-07-17 2004-09-16 Board of Regents, The University of Texas System, Austin Vorrichtung zum automatischen Abgeben von Flüssigkeit für Prägelithographieprozesse
AU2003217184A1 (en) * 2002-01-11 2003-09-02 Massachusetts Institute Of Technology Microcontact printing
CN1732075A (zh) * 2003-01-15 2006-02-08 天成科威有限公司 图案形成装置、图案形成方法、图案形成系统
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
DE10323365A1 (de) * 2003-05-21 2004-12-09 Robert Bürkle GmbH Vorrichtung zur Herstellung geprägter Substrate
US7037458B2 (en) * 2003-10-23 2006-05-02 Intel Corporation Progressive stamping apparatus and method
JP2005268675A (ja) * 2004-03-22 2005-09-29 Canon Inc 微細パターン形成装置および半導体デバイス製造方法
JP2006116602A (ja) * 2004-09-24 2006-05-11 Bondotekku:Kk 加圧装置の平行調整方法及び装置
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US7500431B2 (en) * 2006-01-12 2009-03-10 Tsai-Wei Wu System, method, and apparatus for membrane, pad, and stamper architecture for uniform base layer and nanoimprinting pressure

Similar Documents

Publication Publication Date Title
JP2009137286A5 (enExample)
JP2013254938A5 (enExample)
JP5590785B2 (ja) 基板の均一な構造化のためのシステム
EP4250342A3 (en) Bonding system and bonding method
CN202270830U (zh) 一种可调节的自适应式热冲压模具板料定位支撑装置
JP2009542174A5 (enExample)
IL186897A0 (en) Transfer system and transfer device
JP2005271082A5 (enExample)
JP2010508533A5 (enExample)
WO2006123300A3 (en) Micro-electro-mechanical transducers
CN110314963B (zh) 板状金属材料的弯曲成形装置以及成形方法
CN201437284U (zh) 电子标签固化压力传导装置
CA2686539A1 (en) Device for press-forming a thin sheet and press-forming method
CN202622796U (zh) 用于精密装配的压电驱动微夹持钳
JP2013038365A5 (enExample)
JP2007015375A5 (enExample)
CN204944965U (zh) 微型精密原位纳米压痕及刻划测试装置
JP2011145281A5 (enExample)
KR20150140562A (ko) 성막 장치
US9061462B2 (en) Stamping and/or drilling device comprising a substrate support head with continuously controlled orientation
EP1177887A3 (en) Precision device molding machine and method of molding by using it
TW200720863A (en) Lithographic apparatus and device manufacturing method
JP2013031873A (ja) プレス装置用の振子ゲージユニット
CN213920215U (zh) 一体式快速定位圆压圆烫金版
CN202794003U (zh) 一种平板滑动摩擦测量装置