JP5590785B2 - 基板の均一な構造化のためのシステム - Google Patents

基板の均一な構造化のためのシステム Download PDF

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Publication number
JP5590785B2
JP5590785B2 JP2008286980A JP2008286980A JP5590785B2 JP 5590785 B2 JP5590785 B2 JP 5590785B2 JP 2008286980 A JP2008286980 A JP 2008286980A JP 2008286980 A JP2008286980 A JP 2008286980A JP 5590785 B2 JP5590785 B2 JP 5590785B2
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Japan
Prior art keywords
substrate
base plate
actuator
actuators
die
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JP2008286980A
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English (en)
Japanese (ja)
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JP2009137286A (ja
JP2009137286A5 (enExample
Inventor
フリードリヒ・ポール・リンドナー
トーマス・グリンスナー
マルクス・ウィンプリンガー
Original Assignee
エーファウ・グループ・エー・タルナー・ゲーエムベーハー
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2008286980A 2007-11-08 2008-11-07 基板の均一な構造化のためのシステム Active JP5590785B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07021676.7 2007-11-08
EP07021676A EP2058107B1 (de) 2007-11-08 2007-11-08 Vorrichtung zum gleichmäßigen Strukturieren von Substraten

Publications (3)

Publication Number Publication Date
JP2009137286A JP2009137286A (ja) 2009-06-25
JP2009137286A5 JP2009137286A5 (enExample) 2013-10-17
JP5590785B2 true JP5590785B2 (ja) 2014-09-17

Family

ID=39102908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008286980A Active JP5590785B2 (ja) 2007-11-08 2008-11-07 基板の均一な構造化のためのシステム

Country Status (3)

Country Link
US (1) US8763239B2 (enExample)
EP (2) EP2058107B1 (enExample)
JP (1) JP5590785B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014057589A1 (ja) * 2012-10-12 2014-04-17 アイトリックス株式会社 多軸プレス装置及びそれを利用したインプリント装置
JP6116937B2 (ja) * 2013-02-28 2017-04-19 公立大学法人大阪府立大学 パターン形成装置およびそれを用いたパターン形成方法
JP6370539B2 (ja) * 2013-09-13 2018-08-08 公立大学法人大阪府立大学 パターン形成装置およびそれを用いたパターン形成方法
US10495989B2 (en) 2015-02-12 2019-12-03 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
CN109643060B (zh) * 2016-09-05 2022-11-08 Ev 集团 E·索尔纳有限责任公司 用于压印微和/或纳米结构的设备和方法
CN107144909B (zh) * 2017-04-06 2019-06-07 陕西师范大学 一种实现非对称传输的单层金纳米结构及其制备方法
EP4461508A1 (en) * 2018-07-03 2024-11-13 TC TECH Sweden AB (publ) Method and tool for embossing
US12199062B2 (en) * 2020-06-30 2025-01-14 Ev Group E. Thallner Gmbh Device and method for the alignment of substrates
JP2023069027A (ja) * 2021-11-04 2023-05-18 キヤノン株式会社 成形装置、成形方法、インプリント方法および物品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH682108A5 (enExample) * 1991-04-30 1993-07-15 Mettler Toledo Ag
US7432634B2 (en) * 2000-10-27 2008-10-07 Board Of Regents, University Of Texas System Remote center compliant flexure device
DE20122179U1 (de) * 2000-07-17 2004-09-16 Board of Regents, The University of Texas System, Austin Vorrichtung zum automatischen Abgeben von Flüssigkeit für Prägelithographieprozesse
WO2003065120A2 (en) * 2002-01-11 2003-08-07 Massachusetts Institute Of Technology Microcontact printing
EP1593477A1 (en) * 2003-01-15 2005-11-09 Scivax Corporation Device, method, and system for pattern forming
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
DE10323365A1 (de) * 2003-05-21 2004-12-09 Robert Bürkle GmbH Vorrichtung zur Herstellung geprägter Substrate
US7037458B2 (en) * 2003-10-23 2006-05-02 Intel Corporation Progressive stamping apparatus and method
JP2005268675A (ja) * 2004-03-22 2005-09-29 Canon Inc 微細パターン形成装置および半導体デバイス製造方法
JP2006116602A (ja) 2004-09-24 2006-05-11 Bondotekku:Kk 加圧装置の平行調整方法及び装置
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US7500431B2 (en) * 2006-01-12 2009-03-10 Tsai-Wei Wu System, method, and apparatus for membrane, pad, and stamper architecture for uniform base layer and nanoimprinting pressure

Also Published As

Publication number Publication date
EP2450175B1 (de) 2013-09-11
EP2058107B1 (de) 2012-08-08
US20090151154A1 (en) 2009-06-18
JP2009137286A (ja) 2009-06-25
US8763239B2 (en) 2014-07-01
EP2450175A3 (de) 2012-12-19
EP2450175A2 (de) 2012-05-09
EP2058107A1 (de) 2009-05-13

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