JP2009129970A5 - - Google Patents
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- Publication number
- JP2009129970A5 JP2009129970A5 JP2007300511A JP2007300511A JP2009129970A5 JP 2009129970 A5 JP2009129970 A5 JP 2009129970A5 JP 2007300511 A JP2007300511 A JP 2007300511A JP 2007300511 A JP2007300511 A JP 2007300511A JP 2009129970 A5 JP2009129970 A5 JP 2009129970A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- conductive film
- optical sensor
- condition
- reflectance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 41
- 230000003287 optical effect Effects 0.000 claims 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007300511A JP2009129970A (ja) | 2007-11-20 | 2007-11-20 | 研磨装置及び研磨方法 |
| US12/292,453 US7780503B2 (en) | 2007-11-20 | 2008-11-19 | Polishing apparatus and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007300511A JP2009129970A (ja) | 2007-11-20 | 2007-11-20 | 研磨装置及び研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009129970A JP2009129970A (ja) | 2009-06-11 |
| JP2009129970A5 true JP2009129970A5 (https=) | 2010-06-17 |
Family
ID=40642470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007300511A Pending JP2009129970A (ja) | 2007-11-20 | 2007-11-20 | 研磨装置及び研磨方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7780503B2 (https=) |
| JP (1) | JP2009129970A (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5728239B2 (ja) | 2010-03-02 | 2015-06-03 | 株式会社荏原製作所 | 研磨監視方法、研磨方法、研磨監視装置、および研磨装置 |
| JP5581798B2 (ja) * | 2010-05-12 | 2014-09-03 | 株式会社デンソー | 半導体装置の製造方法 |
| JP2013219248A (ja) * | 2012-04-10 | 2013-10-24 | Ebara Corp | 研磨装置および研磨方法 |
| JP2015126179A (ja) * | 2013-12-27 | 2015-07-06 | 株式会社荏原製作所 | 研磨終点検出方法、及び研磨終点検出装置 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| KR20240015167A (ko) | 2014-10-17 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| CN104503112B (zh) * | 2014-12-16 | 2017-08-25 | 昆山国显光电有限公司 | 阵列基板的修补方法及其系统 |
| JP6940495B2 (ja) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| JP7023062B2 (ja) | 2017-07-24 | 2022-02-21 | 株式会社荏原製作所 | 基板研磨装置及び方法 |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP6847811B2 (ja) | 2017-10-24 | 2021-03-24 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
| CN111684571A (zh) * | 2018-02-05 | 2020-09-18 | 应用材料公司 | 用于3d打印的cmp垫的压电终点指示 |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| JP7472111B2 (ja) * | 2018-09-24 | 2024-04-22 | アプライド マテリアルズ インコーポレイテッド | Ｃｍｐプロセス制御アルゴリズムへの入力としてのマシンビジョン |
| CN109968185B (zh) * | 2019-04-17 | 2024-05-10 | 北京科技大学 | 一种金刚石膜研磨工装及其研磨方法 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN117066973B (zh) * | 2023-05-11 | 2026-01-13 | 中国人民解放军国防科技大学 | 光学元件的时变去除函数控时磨削补偿加工方法及系统 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3313505B2 (ja) * | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| EP0806266A3 (en) * | 1996-05-09 | 1998-12-09 | Canon Kabushiki Kaisha | Polishing method and polishing apparatus using the same |
| US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
| US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
| KR100718737B1 (ko) * | 2000-01-17 | 2007-05-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱 장치 |
| JP3916375B2 (ja) * | 2000-06-02 | 2007-05-16 | 株式会社荏原製作所 | ポリッシング方法および装置 |
| JP4810728B2 (ja) * | 2000-12-04 | 2011-11-09 | 株式会社ニコン | 研磨状況モニタ方法及びその装置、研磨装置、並びに半導体デバイス製造方法 |
| JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
| JP3779636B2 (ja) * | 2002-03-27 | 2006-05-31 | 株式会社東芝 | 光学測定による残膜の判定方法 |
| JP4542324B2 (ja) | 2002-10-17 | 2010-09-15 | 株式会社荏原製作所 | 研磨状態監視装置及びポリッシング装置 |
| JP4714427B2 (ja) * | 2004-05-14 | 2011-06-29 | 株式会社荏原製作所 | 基板上に形成された薄膜の研磨方法 |
| JP2005322939A (ja) * | 2005-06-08 | 2005-11-17 | Tokyo Seimitsu Co Ltd | ウェーハ研磨方法 |
-
2007
- 2007-11-20 JP JP2007300511A patent/JP2009129970A/ja active Pending
-
2008
- 2008-11-19 US US12/292,453 patent/US7780503B2/en active Active
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