JP2009111351A - Hdp−cvd堆積/エッチング/堆積プロセスの不純物コントロール - Google Patents
Hdp−cvd堆積/エッチング/堆積プロセスの不純物コントロール Download PDFInfo
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- JP2009111351A JP2009111351A JP2008230068A JP2008230068A JP2009111351A JP 2009111351 A JP2009111351 A JP 2009111351A JP 2008230068 A JP2008230068 A JP 2008230068A JP 2008230068 A JP2008230068 A JP 2008230068A JP 2009111351 A JP2009111351 A JP 2009111351A
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- 229910052736 halogen Inorganic materials 0.000 claims abstract description 46
- 150000002367 halogens Chemical class 0.000 claims abstract description 46
- 239000002243 precursor Substances 0.000 claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 30
- 239000002516 radical scavenger Substances 0.000 claims abstract description 8
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- 238000004544 sputter deposition Methods 0.000 claims description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
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- 230000000694 effects Effects 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 6
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- 229910052734 helium Inorganic materials 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
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- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000005234 chemical deposition Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
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- 150000004767 nitrides Chemical class 0.000 description 2
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- 239000004071 soot Substances 0.000 description 2
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
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- 238000009616 inductively coupled plasma Methods 0.000 description 1
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- 239000012528 membrane Substances 0.000 description 1
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
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- 230000002028 premature Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012686 silicon precursor Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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Abstract
【解決手段】高密度プラズマプロセスを使用して酸化シリコンの第1の部分を該基板上および該ギャップ内に堆積する。この後、該酸化シリコン膜の該堆積された第1の部分の一部がエッチングバックされる。これは、ハロゲン前駆体ソースから該基板処理チャンバにハロゲン前駆体を流すステップと、該ハロゲン前駆体から高密度プラズマを形成するステップと、該一部がエッチングバックされた後に該ハロゲン前駆体を流すことを終了するステップとを含んでいる。この後、ハロゲンスカベンジャーが該基板処理チャンバに流されて、該基板処理チャンバで残渣ハロゲンと反応する。この後、該酸化シリコン膜の第2の部分が、高密度プラズマプロセスを使用して該酸化シリコン膜の該第1の部分上および該ギャップ内に堆積される。
【選択図】なし
Description
堆積/スパッタ比は堆積の増大に伴って増大し、スパッタリングの増大に伴って減少する。D/Sの定義で使用されているように、「正味堆積レート」とは、堆積およびスパッタリングが同時に生じている場合に測定される堆積レートのことである。「ブランケットスパッタレート」は、堆積ガスなしでプロセスレシピが運用される場合に測定されるスパッタレートであり、プロセスチャンバ内の圧力は、堆積時の圧力、およびブランケット熱酸化膜で測定されたスパッタレートに調整される。
E/D≡(ソースのみの堆積レート)−(正味堆積レート)/(ソースのみの堆積レート)
であり、これはスパッタリングの増大に伴って増大し、堆積の増大に伴って減少する。E/Dの定義で使用されているように、「正味堆積レート」はまた、堆積およびスパッタリングが同時に生じている場合に測定された堆積レートのことをいう。「ソースのみの堆積レート」は、しかしながら、スパッタリングなしでプロセスレシピが運用される場合に測定される堆積レートのことである。本発明の実施形態はD/S比に関してここでは説明されている。D/SおよびE/Dは正確な逆数ではないが、これらは逆相関しており、両者間の変換は当業者に理解される。
Claims (13)
- 基板処理チャンバに配置されている基板上に酸化シリコン膜を堆積する方法であって、前記基板が隣接する隆起表面間にギャップを形成している方法において、
高密度プラズマプロセスを使用して前記基板上および前記ギャップ内に前記酸化シリコン膜の第1の部分を堆積するステップと、
この後、前記酸化シリコン膜の前記堆積された第1の部分の一部をエッチングバックするステップであって、
第1の導管を介してハロゲン前駆体ソースから前記基板処理チャンバにハロゲン前駆体を流す工程と、
前記ハロゲン前駆体から高密度プラズマを形成する工程と、
前記一部がエッチングバックされた後に前記ハロゲン前駆体を流すことを終了する工程と、を備えるステップと、
この後、前記基板処理チャンバで残渣ハロゲンと反応するようにハロゲンスカベンジャーを前記基板処理チャンバに流すステップと、
この後、高密度プラズマプロセスを使用して前記酸化シリコン膜の前記第1の部分上および前記ギャップ内に前記酸化シリコン膜の第2の部分を堆積するステップと、を備える方法。 - 前記ハロゲン前駆体がフッ素前駆体を備えており、前記ハロゲンスカベンジャーがO2を備える、請求項1に記載の方法。
- 前記ハロゲン前駆体に対して非反応性の第1のガス流によって前記第1の導管を洗い流すステップをさらに備える、請求項1に記載の方法。
- 前記ハロゲン前駆体に対して非反応性の前記第1のガスがArを備える、請求項3に記載の方法。
- 前記ハロゲン前駆体に対して非反応性の前記第1のガスがHeを備える、請求項3に記載の方法。
- 前記ハロゲン前駆体に対して非反応性の第2のガスを前記第1の導管と異なる第2の導管を介して前記基板処理チャンバに流すステップをさらに備える、請求項3に記載の方法。
- 前記ハロゲン前駆体に対して非反応性の前記第2のガスがHeを備える、請求項6に記載の方法。
- 前記酸化シリコン膜の前記第1の部分を堆積するステップが、
前記基板処理チャンバにシリコン含有ガスを流す工程と、
前記基板処理チャンバに酸素含有ガスを流す工程と、
前記基板処理チャンバにフルーエントガスを流す工程と、
前記シリコン含有ガス、前記酸素含有ガスおよび前記フルーエントガスから第1の高密度プラズマを形成する工程と、
900〜6000Å/分の堆積レートおよび20超の堆積/スパッタ比で前記第1の高密度プラズマを使用して前記酸化シリコン膜の前記第1の部分を堆積する工程であって、前記堆積/スパッタ比が、(正味堆積レート)+(ブランケットスパッタリングレート)/(ブランケットスパッタリングレート)の比として定義される工程と、を備える、請求項1に記載の方法。 - 前記シリコン含有ガスがSiH4を備えており、前記酸素含有ガスがO2を備える、請求項8に記載の方法。
- 前記ハロゲン前駆体から前記高密度プラズマを形成する工程が、ソース無線周波数電力を前記基板処理チャンバに誘導結合することを備えており、前記ソース無線周波数電力が85,000〜140,000W/m2の電力密度を前記基板に提供する、請求項1に記載の方法。
- 前記ソース無線周波数電力が、前記基板処理チャンバの上部および前記基板処理チャンバの側部に配置されているソースによって提供され、
前記基板処理チャンバの前記側部に配置されている前記ソースによって提供された前記電力が、前記基板処理チャンバの前記上部に配置されている前記ソースによって提供された前記電力より大きい、請求項10に記載の方法。 - 前記基板処理チャンバの前記側部に配置されている前記ソースによって提供された前記電力が、前記基板処理チャンバの前記上部に配置されている前記ソースによって提供された前記電力の少なくとも3倍である、請求項11に記載の方法。
- 前記酸化シリコン膜の前記堆積された第2の部分の一部をエッチングバックするステップであって、
前記第1の導管を介して前記ハロゲン前駆体ソースから前記基板処理チャンバにハロゲン前駆体を流す工程と、
前記ハロゲン前駆体から高密度プラズマを形成する工程と、
前記一部がエッチングバックされた後に前記ハロゲン前駆体を流すことを終了する工程と、を備えるステップと、
この後、前記基板処理チャンバで残渣ハロゲンと反応するように前記基板処理チャンバに前記ハロゲンスカベンジャーを流すステップと、
この後、高密度プラズマプロセスを使用して前記酸化シリコン膜の前記第2の部分上および前記ギャップ内に前記酸化シリコン膜の第3の部分を堆積するステップと、をさらに備える、請求項1に記載の方法。
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TWI352390B (en) | 2011-11-11 |
KR101216358B1 (ko) | 2012-12-28 |
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