JP2009094656A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and low-profile piezoelectric oscillator equipped with a monitor electrode terminal which is reduced in the of a measurement value and has a desired size. <P>SOLUTION: The piezoelectric oscillator comprises a container which comprises a board, a first frame body, and a second frame body, and has a first recessed part and a second recessed part, an integrated circuit element provided with an electrode pad for container connection, a piezoelectric oscillation element, and a cover body. The piezoelectric oscillation element has its longitudinal direction of an outer shape of the piezoelectric oscillation element mounted in the second recessed part in parallel to a board long side, has a hollow part formed in the second recessed part, and has the monitor electrode terminal provided on the inside bottom surface of the hollow part. The integrated circuit element is mounted in the first recessed part so as to cover the hollow part, a prescribed electrode pad for container connection and an electrode terminal for connecting the integrated circuit element provided in the first recessed part are electrically connected, and the first recessed part is filled with insulation resin. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator.

  Conventionally, a piezoelectric oscillator is used as one of electronic components mounted in an electronic device such as a portable communication device. This piezoelectric oscillator is used as an operation timing signal generation source or a reference signal generation source of an electronic device mounted thereon. In particular, as a piezoelectric vibration element, a piezoelectric oscillator having a tuning fork-type bending crystal vibration element that excites a bending vibration of 32.768 kHz inside is used as a time clock signal generation source of electronic equipment.

  FIG. 7 is an exploded perspective view showing one embodiment of a conventional piezoelectric oscillator. The piezoelectric oscillator 700 is generally constituted by a container body 701, a piezoelectric vibration element 702, an integrated circuit element 703, and a lid body 704. The container body 701 is a plan view of the same material as the substrate 701a provided on the outer peripheral edge of each of the principal surfaces of the substrate 701a, and a rectangular substrate 701a formed of an insulating material such as ceramic. It is comprised by the cyclic | annular 1st frame 701b and the 2nd frame 701c. A first recess 705 is formed by the substrate 701a and the first frame 701b, and a second recess (not shown) is formed by the substrate 701a and the second frame 701c. .

  A piezoelectric vibration element 702 is disposed and mounted on one main surface of the substrate 701 a exposed in the first recess 705. This piezoelectric vibration element 702 is used for vibration, frequency adjustment, or external connection used for electrical connection with a container body to be accommodated on the surface of a crystal piece having a tuning fork type outer shape in plan view. Various electrodes are provided. In FIG. 7, various electrodes provided on the piezoelectric vibration element 702 are not shown.

  The first recess 705 in which the piezoelectric vibration element 702 is mounted is formed by replacing the metal lid 704 disposed so as to cover the opening of the first recess 705 with the first recess of the first frame 701b. By sealing the 705 opening side top, it is sealed airtight.

  An integrated circuit element 703 is disposed and mounted on the other main surface of the substrate 701a exposed in the second recess. In the integrated circuit element 703, a plurality of container body connection electrode pads (not shown) are provided on the main surface opposite to the main surface on the mounting side facing the other main surface of the substrate 701a. Further, on the other main surface of the other main surface of the substrate 701a in the second recess, the main surface portion other than the main surface portion on which the integrated circuit element 703 is disposed and mounted has a plurality of integrated circuit element connection electrode terminals (not shown). ) Is provided.

  The integrated circuit element 703 is connected to the other main surface of the substrate 701a and the mounting-side main surface of the integrated circuit element 703 with a conductive adhesive so that the mounting-side main surface of the integrated circuit element 703 has a desired potential. Furthermore, it is mounted in the second recess by electrically connecting a predetermined container body connecting electrode pad and an integrated circuit element connecting electrode terminal by a bonding wire. The predetermined terminals of the electrode terminals for connecting the integrated circuit elements are the piezoelectric resonator element 702 and the second recess opening side of the second frame body 701c by the conductive wiring or via hole formed in the container body 701 or on the surface thereof. These are electrically connected to external connection electrode terminals 706 provided at the four corners of the top, and a piezoelectric oscillator 700 is constituted by these components (see, for example, Patent Document 1).

  FIG. 8 is an exploded perspective view showing another embodiment of a conventional piezoelectric oscillator. A piezoelectric oscillator 800 in FIG. 8 is generally configured by a container body 801, a piezoelectric vibration element 802, an integrated circuit element 803, and a lid body 804. The container body 801 has an outer shape and components, and the container body 701 shown in FIG. 7 is provided with a pair of monitor electrode terminals 805 on the outer side surface on the short side in the plan view. Is different.

  The monitor electrode terminal 805 is provided on the bottom surface of the first concave portion 807 of the container body 801 and the electrodes 806 provided on the front and back main surfaces of the piezoelectric vibration element 802 having a rectangular shape in plan view mounted in the container body 801. It is electrically connected through the provided crystal vibration element connection electrode pad 808. A piezoelectric vibration element in which a measurement terminal (for example, a probe terminal) of an external measuring device is brought into contact with the monitor electrode terminal 805 and is hermetically sealed by a lid 804 mounted in a container body 801 before the integrated circuit element is mounted. Various characteristics such as a frequency value of 802 and a crystal impedance (CI) value are measured. In the piezoelectric oscillator 800, the quality of the piezoelectric vibration element 802 is determined based on the measured characteristic values, and then the integrated circuit element 803 is mounted only on the container body 801 on which the piezoelectric vibration element 802 determined to be non-defective is mounted. Compared with the piezoelectric oscillator 700 of FIG. 7, the occurrence of defective products in the piezoelectric oscillator 800 can be reduced. For the monitor electrode terminal provided in such a piezoelectric oscillator, it is desirable to make the area of the contact surface of the monitor electrode terminal as large as possible in order to ensure contact with the measurement terminal of the external measurement device. (For example, refer to Patent Document 2).

JP 2003-229720 A JP 2006-54321 A (Page 8, FIGS. 4 and 5)

  In addition, other than the prior art documents specified by the prior art document information described above, no prior art documents related to the present invention have been found by the time of filing of the present application.

  However, as the piezoelectric oscillator has become smaller and thinner, it has become difficult to provide a monitor electrode terminal with a contact surface of a desired size on the outer side surface of the container body constituting the piezoelectric oscillator.

  Further, in a piezoelectric oscillator including a substrate and a container body provided with a frame on both main surfaces of the substrate and provided with a recess which is a mounting space for the piezoelectric vibration element and the integrated circuit element, for example, an electrode terminal for monitoring is provided. It is also possible to provide on the surface of the bottom surface of the recess where the integrated circuit element is mounted. However, in that case, a monitor electrode terminal cannot be provided at a portion where the integrated circuit element is disposed and fixed on the inner bottom surface of the recess because the main surface on the mounting side of the integrated circuit element has a desired potential. Therefore, the electrode terminal for monitoring is provided avoiding other electrode terminals and electronic devices other than the portion where the integrated circuit element is arranged and fixed on the bottom surface in the recess, but the space for this is provided on the bottom surface in the recess. It is necessary separately, and there is a possibility of hindering the miniaturization of the piezoelectric oscillator.

  Further, when the monitor electrode terminal is provided on the outer side surface of the container body or the bottom surface of the recess, between the monitor electrode terminal and the electrode pad for connecting the piezoelectric vibration element to which the piezoelectric vibration element is electrically connected, It is necessary to electrically connect the inside and the surface of the container by a predetermined distance by a conductive wiring, a via hole, or the like. As a result of this routing, stray capacitance is generated between the conductive wiring or the like and the ground, and an error may occur in the frequency characteristic value of the piezoelectric vibration element measured by the stray capacitance.

  Accordingly, the present invention provides a piezoelectric oscillator that solves the above-described problems and that can provide a monitor electrode terminal of a desired size with a small measurement value error even if the device is reduced in size and thickness. Objective.

  The present invention has been made to solve the above-described problem, and is a first substrate formed by a rectangular substrate in plan view and a first frame provided on one main surface edge of the substrate. And a second recess formed by a second frame provided at the edge of the other main surface of the substrate, and an opening having a rectangular shape in plan view exposed in the first recess. A container body comprising two pairs of depressions on one main surface; a plurality of integrated circuit element connection electrode terminals provided on one main surface of the substrate exposed in the first recess; The monitor electrode terminal provided on the inner bottom surface of the portion, and the substrate that is electrically connected to a predetermined terminal of the monitor electrode terminal and the integrated circuit element connection electrode terminal and is exposed in the second recess The piezoelectric vibration element connecting electrode pad provided on the other main surface of the first electrode and the first portion so as to cover the opening of the recess It is mounted on one main surface of the substrate exposed in the recess, and a plurality of container body connection electrode pads are provided on the main surface opposite to the main surface to be mounted on the container body. An integrated circuit element electrically connected between the electrode pad for electrode and the electrode terminal for connecting the integrated circuit element, and the electrode pad mounted in the second recess and electrically and mechanically connected to the electrode pad for connecting the piezoelectric vibration element A piezoelectric oscillator comprising: a connected piezoelectric vibration element; a lid that hermetically seals the second recess; and an insulating resin that fills the first recess.

  In addition, a step portion having a height dimension higher than the thickness dimension of the lid body is provided over the entire inner peripheral corner portion of the second frame body surrounding the opening portion of the second recess portion. The above-described piezoelectric oscillator is also characterized in that the lid body is fitted together.

  Further, the substrate having a rectangular shape in plan view, a recess formed by a frame provided on one main surface edge of the substrate, and one of the substrates having a rectangular opening in plan view exposed in the recess. A container body composed of a pair of two recesses on the main surface, a plurality of integrated circuit element connection electrode terminals provided on the other main surface of the substrate, and a monitor provided on the inner bottom surface of the recess Piezoelectric vibration element connection provided on one main surface of the substrate that is electrically connected to a predetermined terminal of the electrode terminal, the monitor electrode terminal, and the integrated circuit element connection electrode terminal and exposed in the recess A plurality of electrode pads for connecting a container body are mounted on a main surface opposite to the main surface to be mounted on the other main surface of the substrate so as to cover the electrode pad for use and the opening of the recess. And a predetermined container body connection electrode pad and an integrated circuit element connection electrode terminal. An integrated circuit element electrically connected between the piezoelectric vibration element mounted in the recess and electrically and mechanically connected to the electrode pad for connecting the piezoelectric vibration element, and the recess are hermetically sealed. A piezoelectric oscillator comprising a lid, an integrated circuit element, and an insulating resin covering the other main surface of the substrate on which the integrated circuit element is mounted.

  In addition, a step having a height higher than the thickness of the lid is provided over the entire inner peripheral corner of the frame surrounding the opening of the recess, and the lid is fitted to the step. The piezoelectric oscillator described above is characterized in that they are combined.

  Further, in the piezoelectric oscillator described above, the piezoelectric vibration element is a tuning fork type bending piezoelectric vibration element.

  In the piezoelectric oscillator of the present invention, the main surface of the substrate on which the integrated circuit element is mounted is not opposed to the portion exposed in the concave portion on which the piezoelectric vibration element on the main surface of the substrate constituting the container body is mounted. Are provided with a pair of recesses each having a rectangular opening in plan view, and an electrode terminal for monitoring electrically connected to the piezoelectric vibration element is provided on the inner bottom surface of the recesses. The contact surface of a piezoelectric oscillator that has been reduced in size and thickness has been larger than that of a conventional piezoelectric oscillator by adopting a structure that is mounted on the other main surface of the substrate so as to cover the opening of the recess. A monitor electrode terminal can be provided.

  Further, since the monitor electrode terminal is provided in the recess, the monitor electrode terminal is electrically connected to the mount side main surface of the integrated circuit element even if the mount side main surface of the integrated circuit element has a desired potential. Never connect to. Therefore, the monitor electrode terminal can be provided in a portion where the integrated circuit element is disposed and fixed on the bottom surface in the recess, and a space for providing the monitor electrode terminal needs to be provided separately in the bottom surface in the recess as in the prior art. This will reduce the size of the piezoelectric oscillator.

  Furthermore, by providing a monitor electrode terminal on the inner bottom surface of the recess, a conductive wiring for connecting between the monitor electrode terminal and the piezoelectric vibration element connection electrode pad to which the piezoelectric vibrator element is electrically connected, etc. Can be made shorter than the conventional piezoelectric oscillator. Therefore, the stray capacitance can be reduced between the conductive wiring or the like and the ground, and an error in the measured frequency characteristic value of the piezoelectric vibration element due to the stray capacitance is reduced.

  As described above, the present invention provides a piezoelectric oscillator that can cope with downsizing and thinning, and can provide a piezoelectric oscillator having a small measurement error and provided with a monitor electrode terminal having a desired size.

Embodiments of a piezoelectric oscillator according to the present invention will be described below with reference to the drawings.
In each drawing, for clarity of explanation, some of the components are not shown, and some dimensions of the components shown in the drawings are exaggerated. In particular, the thickness dimension of each component is exaggerated.

(First embodiment)
FIG. 1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention, FIG. 2 is a plan view of the piezoelectric oscillator shown in FIG. 1, and (a) is from an integrated circuit element mounting side. It is the shown top view, (b) is the top view shown from the piezoelectric vibration element mounting side. 3 is a cross-sectional view taken along the line AA of FIG. The piezoelectric oscillator 100 according to the first embodiment of the present invention is roughly constituted by a container body 101, a piezoelectric vibration element 102, an integrated circuit element 103, and a lid body 104.

  The container body 101 includes a substrate 101a having a rectangular shape in plan view, a first frame body 101b provided on an outer peripheral edge of one main surface of the substrate 101a, and an outer peripheral edge of the other main surface of the substrate 101a. It is mainly configured by the second frame 101c provided in the part. The substrate 101a, the first frame body 101b, and the second frame body 101c are made of the same material, for example, a ceramic material such as glass-ceramic or alumina ceramic. The first frame 101b and the second frame 101c have a substantially rectangular inner peripheral shape and an annular shape in plan view, and the outer peripheral shape in plan view and the outer peripheral shape in plan view are the same shape.

  A first recess 105 is formed by the substrate 101a and the first frame 101b. A second recess 106 is formed by the substrate 101a and the second frame 101c. Here, the inner peripheral shape of the first frame 101b is a size that matches the outer shape of the integrated circuit element 103 described later, and the inner peripheral shape of the second frame 101c is a piezoelectric vibration described later. The size is adapted to the outer shape of the element 102.

  On the other main surface of the substrate 101 a exposed in the second recess 106, two pairs of piezoelectric vibration element connecting electrode pads 107 are arranged along one short side of the main surface. The piezoelectric vibration element connection electrode pad 107 is electrically and mechanically connected to an electrode provided on the surface of the piezoelectric vibration element 102 described later. In addition, a stepped portion 108 having a height dimension higher than the thickness dimension of the lid body 104 to be described later is provided over the entire inner peripheral corner portion of the second frame 101c surrounding the opening of the second recess 106. Yes.

Furthermore, at the four corners of the main surface opposite to the main surface bonded to the substrate 101a of the second frame 101c,
An external connection electrode terminal 109 is provided. The external connection electrode terminal 109 is electrically connected to a predetermined electrode pad of an integrated circuit element connection electrode pad 110 described later. The piezoelectric oscillator 100 is used by being electrically and mechanically connected to an external wiring board such as a mother board of an electronic device by the external connection electrode terminal 109.

  On one main surface of the substrate 101a exposed in the first recess 105, a plurality of integrated circuit element connection electrode pads 110 arranged along two short sides of the main surface shape are provided. . The integrated circuit element connection electrode pad 110 is electrically connected to an electric circuit built in the integrated circuit element 103 described later. In addition, a GND electrode terminal 111 is provided in the center of one main surface of the substrate 101a exposed in the first concave portion 105 so that a mounting-side main surface of an integrated circuit element 103 to be described later becomes a GND potential. .

  Two pairs of recesses 112 are provided on one main surface of the substrate 101a exposed in the first recess that is inside the electrode pad 110 for connecting the integrated circuit element and outside the GND electrode terminal 111. The recess 112 has a rectangular opening on one main surface of the substrate 101a and is recessed in the direction of the other main surface of the substrate 101b. The two depressions 112 are such that one long side in the opening of each depression 112 is along the long side of one main surface shape of the substrate 101a exposed to the first depression 105, and the depression The bottom surface in the portion 112 has a position and a size that do not face the other main surface portion of the substrate 101 a exposed in the second recess 106.

  A monitor electrode terminal 113 electrically connected to a predetermined piezoelectric vibration element connection electrode pad 107 is provided on the inner bottom surface of each recess 112.

  The piezoelectric vibration element 102 is a tuning fork-type bending crystal vibration element configured by forming electrodes and wiring (not shown) on the surface of a crystal piece made of a tuning-fork-shaped external crystal. The crystal axis direction of the crystal piece constituting the piezoelectric vibration element 102 is such that the width direction of the crystal piece is the X-axis direction, the length direction is the Y′-axis direction, and the thickness direction is the Z′-axis direction. The crystal piece includes a base portion 102a having a substantially rectangular plate shape in plan view, a first vibrating arm portion 102b provided integrally protruding in the same direction from a side surface of one side of the base portion 102a, and a second vibration. It is comprised from the arm part 102c. When an alternating voltage is applied to the electrode provided on the surface of the piezoelectric vibration element 102, an expansion / contraction phenomenon occurs in each vibration arm portion, and, for example, a bending vibration having a frequency value of 32.768 kHz is obtained.

  The integrated circuit element 103 is roughly formed of a substrate layer having a circuit formation surface provided with at least an oscillation circuit that is electrically connected to the piezoelectric vibration element 102, and covers the substrate layer to form an outer shape of the integrated circuit element. It is made of insulating resin. This integrated circuit element 103 has a plurality of container body connection electrode pads 115 on the main surface opposite to the main surface of the substrate 101a exposed in the first recess 105 during mounting. Is provided. The container body connection electrode pad 115 is electrically connected to a predetermined electronic circuit in the integrated circuit element 103.

  The lid 104 is a flat plate made of 42 alloy, Kovar, phosphor bronze, or the like, and fits into a step 108 provided in the opening of the second recess 106 to hermetically seal the space in the second recess 106. It has an outline shape that is rectangular in plan view.

  The piezoelectric oscillator 100 is configured by combining the container body 101, the piezoelectric vibration element 102, the integrated circuit element 103, and the lid body 104. The piezoelectric vibration element 102 is electrically and mechanically connected to a piezoelectric vibration element connection electrode pad 107 provided in the second recess 106 of the container body 101 by a conductive adhesive 116. The second recess 106 is provided so that the longitudinal direction of the opening is parallel to the longitudinal direction of the container body 101 in the plan view. The piezoelectric vibration element 102 is mounted such that the longitudinal direction of its outer shape is parallel to the long side of the opening of the second recess 106. The second recess 106 in which the piezoelectric vibration element 102 is mounted is hermetically sealed by fitting the lid body 104 into the stepped portion 108 and joining the lid body 104 and the stepped portion 108.

  The integrated circuit element 103 is disposed so that the mounting-side main surface of the integrated circuit element 103 is opposed to the GND electrode terminal 111 in the first recess 105, and the GND electrode terminal is formed by a conductive adhesive (not shown). 111 and the mounting-side main surface of the integrated circuit element 103 are mechanically and electrically connected. Further, between the electrode pad 115 for connecting the container body and the electrode pad 110 for connecting the integrated circuit element provided on the main surface opposite to the mounting main surface of the integrated circuit element 103 is between predetermined electrode pads. Are electrically connected by bonding wires. Note that the opening of the recess 112 in which the monitor electrode terminal 113 is provided on the inner bottom surface is covered with the mounting-side main surface of the integrated circuit element 103.

  The first recess 105 in which the integrated circuit element 103 is mounted is filled with an insulating resin 116 to protect the integrated circuit element 103 and the bonding wire.

  Even in a piezoelectric oscillator that has been reduced in size and thickness by the piezoelectric oscillator 100 having such a structure, the monitor electrode terminal 113 having a larger contact surface than the monitor electrode terminal provided on the outer side surface of the conventional piezoelectric oscillator is provided. Can be provided.

  Further, since the monitoring electrode terminal 113 is provided in the recess 112, the monitoring electrode terminal 113 is not electrically connected to the mounting side main surface of the integrated circuit element 103 having the GND potential. Therefore, the monitor electrode terminal 113 can be provided in a portion where the integrated circuit element 103 is arranged and fixed on the inner bottom surface of the first recess 105, and a space for providing the monitor electrode terminal can be provided in the recess as in the prior art. There is no need to separately provide the bottom surface, and the piezoelectric oscillator 100 can be downsized.

  Furthermore, by providing the monitor electrode terminal 113 on the inner bottom surface of the recess 112, the monitor electrode terminal 113 and the piezoelectric vibration element connection electrode pad 107 to which the piezoelectric vibrator element 102 is electrically connected are provided. The routing distance of the conductive wiring or the like for connecting can be made shorter than that of the conventional piezoelectric oscillator. Therefore, the stray capacitance can be reduced between the conductive wiring or the like and the ground, and an error in the measured frequency characteristic value of the piezoelectric vibration element due to the stray capacitance is reduced.

(Second embodiment)
FIG. 4 is a cross-sectional view showing a piezoelectric oscillator according to the second embodiment of the present invention. The piezoelectric oscillator 400 according to the second embodiment of the present invention is roughly composed of a container body 401, a piezoelectric vibration element 402, an integrated circuit element 403, and a lid body 404, as in the first embodiment. The structure of the container body 401 is different from that of the first embodiment.

  A container body 401 of a piezoelectric oscillator 400 according to the second embodiment of the present invention is mainly composed of a substrate 401a having a rectangular shape in plan view and a frame body 401b provided on an outer peripheral edge of one main surface of the substrate 401a. It is configured. The substrate 401a and the frame body 401b are formed of the same material such as a ceramic material such as glass-ceramic or alumina ceramic. The frame 401b has an annular shape having a substantially rectangular inner peripheral shape in plan view, and has the same outer peripheral shape in plan view as the outer peripheral shape in plan view of the substrate 401a. A concave portion 405 is formed by the substrate 401a and the frame body 401b. The structure in the recess 405, the structure and mounting form of the piezoelectric vibration element 402 mounted in the recess 405, the external connection electrode terminal 406, and the hermetic sealing form of the space in the recess 405 by the lid 404 are as follows. This is the same as the form of the second recess or the like in one embodiment.

The other main surface of the substrate 401a is provided with a plurality of integrated circuit element connection electrode pads (not shown) arranged along two short sides of the main surface. This electrode pad for connecting an integrated circuit element is electrically connected to an electric circuit built in the integrated circuit element 403. In addition, a GND electrode terminal (not shown) for setting the mounting-side main surface of the integrated circuit element 403 to the GND potential is provided in the center on one main surface of the substrate 401a, as in the first embodiment. Yes.

  Further, two pairs of recesses 407 are provided on the other main surface of the substrate 401a which is inside the electrode pad for connecting the integrated circuit element and outside the GND electrode terminal. The recess 407 has a rectangular opening on the other main surface of the substrate 401a and is recessed in the direction of the one main surface of the substrate 401b. In addition, the two recesses 407 have one long side in the opening of each recess 407 along the long side of one main surface of the substrate 401a, and the bottom in the recess 407 is in the recess. The position and size are not opposite to one main surface portion of the substrate 401a exposed to the surface.

  In addition, a monitor electrode terminal 408 that is electrically connected to a predetermined piezoelectric vibration element connection electrode pad (not shown) provided in the recess 405 is provided on the inner bottom surface of each recess 407.

  In the piezoelectric oscillator 400, the integrated circuit element 403 is disposed so that the mounting-side main surface of the integrated circuit element 403 is opposed to the GND electrode terminal provided on the other main surface of the substrate 401a. As shown in the figure, the GND electrode terminal and the mounting side main surface of the integrated circuit element 403 are mechanically and electrically connected. Further, between the electrode pad 409 for connecting the container body and the electrode pad for connecting the integrated circuit element provided on the main surface opposite to the mounting main surface of the integrated circuit element 403, between the predetermined electrode pads, It is electrically connected by a bonding wire. The opening of the recess 407 in which the monitor electrode terminal 408 is provided on the inner bottom surface is covered with the mounting side main surface of the integrated circuit element 403.

  In order to protect the integrated circuit element 403 and the bonding wire, the integrated circuit element 403 and the bonding wire are covered with an insulating resin 410 on the other main surface of the substrate 401a.

  The piezoelectric oscillator 400 having such a structure can achieve the same effects as the piezoelectric oscillator 100 according to the first embodiment.

(Third embodiment)
FIG. 5 is a cross-sectional view showing a piezoelectric oscillator according to a third embodiment of the present invention. The piezoelectric oscillator according to the third embodiment of the present invention is different in that the mounting position of the piezoelectric vibration element and the integrated circuit element in the container is opposite to that of the first embodiment.

  A container body 501 constituting a piezoelectric oscillator 500 according to the third embodiment of the present invention has a rectangular substrate 501a in plan view and an annular shape in plan view provided on the outer peripheral edge of one main surface of the substrate 501a. The first frame body 501b and a second frame body 501c having an annular shape in plan view provided at the outer peripheral edge of the other main surface of the substrate 501a are configured. Due to the substrate 501a and the first frame body 501b, a first recess 502 that has a piezoelectric vibration element 504 mounted therein and hermetically sealed by a lid body 505 is formed on one main surface of the substrate 501a. It is formed in the same manner as the second recess 106 in the embodiment. In addition, the substrate 501a and the second frame body 501c provide a second recess 503 for mounting the integrated circuit element 506 therein on the other main surface of the substrate 501a. It is formed in the same manner as the recess 105. The other main surface of the substrate 501a exposed in the second recess 503 has a recess 508 provided with a monitor electrode terminal 507 on the inner bottom surface, and the recess 112 and the monitor in the first embodiment. The electrode terminal 113 is provided in the same form.

  External connection electrode terminals 509 described later are provided at the four corners of the main surface opposite to the main surface joined to the substrate 501a of the second frame 501c. The piezoelectric oscillator 500 is used by being electrically and mechanically connected to an external wiring board such as a mother board of an electronic device by the external connection electrode terminal 506.

  The piezoelectric oscillator 500 having such a structure can achieve the same effects as the piezoelectric oscillator 100 according to the first embodiment.

(Fourth embodiment)
FIG. 6 is a cross-sectional view showing a piezoelectric oscillator according to a fourth embodiment of the present invention. The piezoelectric oscillator according to the fourth embodiment of the present invention is different from the third embodiment in the hermetic sealing form of the first recess in which the piezoelectric vibration element is mounted inside by the lid.

  A container body 601 constituting a piezoelectric oscillator 600 according to the fourth embodiment of the present invention has a rectangular substrate 601a in plan view and an annular shape in plan view provided on the outer peripheral edge of one main surface of the substrate 601a. The first frame body 601b and a second frame body 601c having an annular shape in plan view provided at the outer peripheral edge of the other main surface of the substrate 601a are configured. Due to the substrate 601a and the first frame 601b, a first recess 602 in which the piezoelectric vibration element 604 is mounted is formed on one main surface of the substrate 601a, and the first recess 502 in the third embodiment. The second recess 603 for mounting the integrated circuit element 605 therein is formed on the other main surface of the substrate 601a by the substrate 601a and the second frame 601c. It is formed in the same manner as the second recess 503 in the embodiment. The other main surface of the substrate 601a exposed in the second recess 603 is provided with a recess 607 provided with a monitor electrode terminal 606 on the inner bottom surface, and the recess 508 and the monitor in the third embodiment. It is provided in the same form as the electrode terminal 507.

  The first recess 602 in which the piezoelectric vibration element 604 is mounted is hermetically sealed by a lid 608 having a rectangular shape in plan view and having a larger outer peripheral shape than the opening of the first recess 602. The lid 608 is arranged so as to cover the opening of the first recess 602 at the inner peripheral side edge of the main surface opposite to the main surface joined to the substrate 601a in the first frame 601b. The first recess 602 is hermetically sealed by joining the inner peripheral side edge of the main surface opposite to the main surface joined to the substrate 601a in the first frame 601b and the lid 608. Has been.

  Also in the piezoelectric oscillator 600 having such a structure, the same effect as that of the piezoelectric oscillator 100 according to the first embodiment can be obtained.

  In addition to the above, various changes and improvements can be made without departing from the scope of the present invention. In the piezoelectric oscillator shown in the present embodiment, a tuning fork type quartz crystal vibrating element is shown as a piezoelectric vibrating element mounted inside, but the present invention is not limited to this. For example, when the outer shape is a rectangular outer shape other than the tuning fork type, or a piezoelectric oscillator using a piezoelectric vibration element whose vibration mode is a thickness-shear vibration mode other than flexural vibration.

1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention. FIG. 2 is a plan view of the piezoelectric oscillator shown in FIG. 1, (a) is a plan view shown from the integrated circuit element mounting side, and (b) is a plan view shown from the piezoelectric vibration element mounting side. It is sectional drawing in the AA cut line of FIG. It is sectional drawing which showed the piezoelectric oscillator which concerns on 2nd embodiment of this invention. It is sectional drawing which showed the piezoelectric oscillator which concerns on 3rd embodiment of this invention. It is sectional drawing which showed the piezoelectric oscillator which concerns on 4th embodiment of this invention. It is the disassembled perspective view which showed one form of the conventional piezoelectric oscillator. It is the disassembled perspective view which showed the other form of the conventional piezoelectric oscillator.

Explanation of symbols

100, 400, 500, 600 ... piezoelectric oscillator 101, 401, 501, 601 ... container body 101a, 401a, 501a, 601a ... substrate 101b, 501b, 601b ... first frame body 101c, 501c, 601c ... second frame 102, 402, 504, 604 ... piezoelectric vibration element 103, 403, 506, 605 ... integrated circuit element 104, 404, 505, 608 ... lid 105 , 502, 602... First recess 106, 503, 603... Second recess 107... Electrode pad for connecting piezoelectric vibration element 108 .. Step portion 109, 406, 509. Electrode terminal 110... Integrated circuit element connection electrode pad 111... GND electrode terminal 112, 407, 508, 607. 408, 507, 606 ... Monitor electrode terminals 115, 409 ... Container body connection electrode pads 116, 410 ... Insulating resin 401b ... Frame body 405 ... Recess

Claims (5)

A rectangular substrate in plan view, a first recess formed by a first frame provided on one principal surface edge of the substrate, and a second principal surface edge of the substrate. A second recess formed by the second frame and a pair of two recesses having a rectangular opening in plan view on one main surface of the substrate exposed in the first recess. A container body,
A plurality of integrated circuit element connection electrode terminals provided on one main surface of the substrate exposed in the first recess;
A monitor electrode terminal provided on the inner bottom surface of the recess,
Piezoelectric vibration provided on the other main surface of the substrate that is electrically connected to a predetermined terminal of the monitor electrode terminal and the integrated circuit element connection electrode terminal and exposed in the second recess. An electrode pad for element connection;
It is mounted on one main surface of the substrate exposed in the first recess so as to cover the opening of the recess, and a plurality of main surfaces on the opposite side from the main surface to be mounted on the container body An integrated circuit element provided with the container body connecting electrode pad, and electrically connecting between the predetermined container body connecting electrode pad and the integrated circuit element connecting electrode terminal;
A piezoelectric vibration element mounted in the second recess and electrically and mechanically connected to the piezoelectric vibration element connection electrode pad; and
A lid for hermetically sealing the second recess;
An insulating resin filling the first recess;
A piezoelectric oscillator comprising:   A stepped portion having a height dimension higher than the thickness dimension of the lid body is provided over the entire inner peripheral corner of the second frame surrounding the opening of the second recess, and the stepped portion is The piezoelectric oscillator according to claim 1, wherein the lid is fitted. A substrate having a rectangular shape in plan view, a recess formed by a frame provided on one main surface edge of the substrate, and one main surface of the substrate having an opening having a rectangular shape in plan view exposed in the recess. A container body composed of a pair of two depressions on the surface;
A plurality of integrated circuit element connecting electrode terminals provided on the other main surface of the substrate;
A monitor electrode terminal provided on the inner bottom surface of the recess,
For connecting a piezoelectric vibration element provided on one main surface of the substrate that is electrically connected to a predetermined terminal of the electrode terminal for monitoring and the electrode terminal for connecting the integrated circuit element and exposed in the recess. An electrode pad;
It is mounted on the other main surface of the substrate so as to cover the opening of the recess, and a plurality of container body connection electrode pads are provided on the main surface opposite to the main surface to be mounted with the container body. An integrated circuit element electrically connected between the predetermined container body connection electrode pad and the integrated circuit element connection electrode terminal;
A piezoelectric vibration element mounted in the recess and electrically and mechanically connected to the piezoelectric vibration element connection electrode pad; and
A lid for hermetically sealing the recess,
An insulating resin that covers the other main surface of the substrate on which the integrated circuit element and the integrated circuit element are mounted;
A piezoelectric oscillator comprising:   A step portion having a height dimension higher than the thickness of the lid body is provided over the entire inner peripheral corner of the frame body surrounding the opening of the concave portion, and the lid body is fitted to the step portion. The piezoelectric oscillator according to claim 3, wherein the piezoelectric oscillator is provided.   5. The piezoelectric oscillator according to claim 1, wherein the piezoelectric vibration element is a tuning fork-type bending piezoelectric vibration element.

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