JP2009088397A - Sheet peeling device and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device that can peel a sheet for sure without generating poor peeling when an adhesive sheet attached to an adherend is peeled off, and to provide a method of peeling. <P>SOLUTION: A sheet peeling device 10 includes a support means 11 for supporting a semiconductor waver W to which an adhesive sheet S is attached, a sheet adhesion means 12 for attaching a peeling sheet PS on the adhesive sheet S, a holding means 13 for holding a part to be held, a PS1 of the peeling sheet PS, a moving means 14 for turnably supporting the holding means 13 by setting an axis of rotation P at a predetermined position, and a pulling means 16 for pulling the peeling sheet PS in an outward direction. The pulling means 16 starts performing peeling at a small angle where a peeling angle θ is close to 0 degree as much as possible, by giving a peeling force Fr to the peeling sheet PS outward along the surface of the wafer W, when a peeling of the adhesive sheet S starts. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more specifically, in the case of peeling an adhesive sheet affixed to an adherend from an adherend, in particular, a sheet peeling apparatus capable of reliably performing initial peeling. And a peeling method.

  A plate-like member such as a semiconductor wafer (hereinafter simply referred to as “wafer”) has an adhesive sheet such as a dicing sheet attached to the circuit surface side. This adhesive sheet is finally peeled from the wafer via a sheet peeling device.

  As shown in FIG. 7, the peeling method using such a sheet peeling apparatus is a method of sticking a strip-like peeling sheet PS to an adhesive sheet S stuck to a wafer W, and folding the peeling sheet PS at a peeling angle θ. In this state, a method is known in which a tensile force is applied to peel the adhesive sheet S from the wafer W (see, for example, Patent Document 1).

JP 2002-124494 A

  However, in the sheet peeling apparatus described in Patent Document 1, at the start of peeling, the adhesive strength of the peeling sheet PS is lost by the rigidity of the adhesive sheet S itself in addition to the adhesive strength of the adhesive sheet S to the wafer W. Therefore, there is a disadvantage that the peeling sheet PS is peeled off from the adhesive sheet S and cannot be peeled off. This is because when the peeling angle θ is large, the adhesive sheet S is bent at a wide angle all at once at the start of peeling. Such inconvenience becomes apparent when the adhesive sheet S is thick or when the rigidity is high.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to provide a peeling force at a small peeling angle in the initial stage of peeling the adhesive sheet affixed to the adherend. Another object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of realizing reliable and smooth peeling.

  In order to achieve the above object, the present invention provides a supporting means for supporting an adherend having an adhesive sheet attached to an adherend surface, an attaching means for attaching a release sheet to the adhesive sheet, and an adhesive sheet attached to the adhesive sheet. A sheet peeling device comprising: holding means for holding one end of the peeled sheet, moving means rotatable about a predetermined position as a central axis, and tension means provided between the holding means and the moving means An apparatus, wherein the pulling means forms a peeling trigger portion by rotating the holding means while pulling the peeling sheet to the outside along the adherend surface via the holding means. Adopted.

  The present invention also provides a supporting means for supporting an adherend having an adhesive sheet attached to an adherend surface, an attaching means for attaching a release sheet to the adhesive sheet, and a release sheet attached to the adhesive sheet. A holding means for holding one end of the sheet, a sheet peeling device for peeling the adhesive sheet from the adherend by relative movement of the support means and the holding means, and a tension means connected to the holding means, Displacement means for relatively displacing the holding means and the support means in a direction orthogonal to the adherend surface, the pulling means pulling the release sheet outward along the adherend surface via the retainer means Thus, it is possible to adopt a configuration in which the peeling trigger part is formed by relatively displacing the holding means and the support means via the displacement means.

  Furthermore, the present invention provides a supporting means for supporting an adherend having an adhesive sheet attached to an adherend surface, an attaching means for attaching a release sheet to the adhesive sheet, and a winding means for winding the release sheet. A sheet peeling apparatus comprising: a moving means rotatable around a predetermined position as a central axis; and a pulling means provided between the winding means and the moving means. You may employ | adopt the structure that a peeling trigger part is formed by rotating the said winding means in the state which pulled the sheet | seat for peeling to the outer side along a to-be-adhered surface via a means.

  The present invention also provides a supporting means for supporting an adherend having an adhesive sheet attached to an adherend surface, an attaching means for attaching a release sheet to the adhesive sheet, and a winding means for winding the release sheet. And a sheet peeling device for peeling the adhesive sheet from the adherend by relative movement between the support means and the winding means, the pulling means connected to the winding means, the holding means and the support means, Displacement means for relative displacement in a direction orthogonal to the adherend surface, and the displacement means in a state where the pulling means has pulled the peeling sheet outward along the adherend surface via the winding means. The peeling trigger part can be formed by relatively displacing the winding means and the supporting means via the squeeze.

  The sheet peeling apparatus may further include a peeling assisting unit positioned on the adherend, and may be provided so as to perform the peeling in a state where the peeling sheet and / or the adhesive sheet are wound around the peeling assisting unit.

  In addition, the present invention attaches a release sheet to the adhesive sheet and holds one end side of the release sheet in a state where the adherend having the adhesive sheet attached to the adherend surface is supported by the support means. In the sheet peeling method in which the adhesive sheet is peeled from the adherend by relative movement between the holding position of the held portion and the supporting means, one end side of the peeling sheet is pulled outward along the adherend surface. In this state, a method is adopted in which a peeling trigger portion is formed by relatively moving one end side of the peeling sheet and the supporting means.

  Furthermore, the present invention is to stick a release sheet to the adhesive sheet in a state where the adherend having the adhesive sheet attached to the adherend surface is supported by a supporting means, and wind one end side of the release sheet. In the sheet peeling method in which the adhesive sheet is peeled off from the adherend by taking, the winding side of the release sheet is supported with the winding side of the peeling sheet pulled outward along the surface of the adherend surface. It is possible to adopt a technique in which a peeling trigger part is formed by moving the means relative to each other.

According to the present invention, at the start of peeling of the adhesive sheet, the holding means is rotated while the peeling sheet is pulled outward along the adherend surface, or the holding means or the winding means and the supporting means are moved relative to each other. By displacing, a peeling force for peeling the adhesive sheet from the adherend is applied. Therefore, in the initial stage of peeling of the adhesive sheet, peeling starts at an angle as close to 0 degrees as possible. Therefore, even if the adhesive sheet is rigid, the adhesive sheet will not be bent at a wide angle at once, so that the inconvenience that the peeling sheet is peeled off from the adhesive sheet and defective peeling can be effectively eliminated. it can.
Further, in the case where the structure includes the peeling assisting means positioned on the adherend, the adherend is prevented from being lifted, and after the peeling trigger portion is formed, the peeling angle is kept constant and adhesion is performed. The sheet can be peeled off.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic perspective view of a sheet peeling apparatus according to this embodiment. In this figure, a sheet peeling apparatus 10 includes a supporting means 11 for supporting a substantially circular wafer W (adhered body) to which an adhesive sheet S is attached with an upper surface side as an adherend surface, and a strip-like peeling on the adhesive sheet S. The sticking means 12 for sticking the sheet PS, the holding means 13 for holding the peeling sheet PS stuck to the adhesive sheet S, and the center axis P along the direction perpendicular to the sheet of FIG. It is provided between the movable moving means 14, the holding means 13 and the moving means 14, and outward from the central axis P in the vertical plane of the central axis P (in the plane perpendicular to the central axis P). A pulling means 16 for pulling the peeling sheet PS and a peeling assisting means 15 provided on the wafer W so as to be positioned are provided.

  The support means 11 is constituted by a table T that supports the wafer W with the upper surface side serving as a suction surface.

  The affixing means 12 includes a frame 23 that can be moved up and down by a driving means (not shown), a supply unit 17 for a release sheet PS that is provided on the frame 23 and is a heat-sensitive adhesive sheet, and an adhesive sheet for the release sheet PS. And a cutting unit 18 for welding to S and cutting the peeling sheet PS into a predetermined length. The supply unit 17 includes a support roller 20 for the peeling sheet PS wound in a roll shape above the sheet supply unit 19 located at the lower part of the frame 23, and the right side of the sheet supply unit 19 in FIG. Is provided with a sheet guide plate 21 movable in the X-axis direction. The sheet guide plate 21 has a recess 21 </ b> A on the upper surface, and is always urged to the right side by a coil spring 25 provided on the outer peripheral side of a shaft (not shown) located between the sheet guide plate 19. It has become.

The cutting unit 18 includes a heat block 27 having a heating means (not shown) having a lower end provided in a pointed shape, a cylinder 28 for moving the heat block 27 in the vertical direction, and a cylinder 26 fixed to the heat block 27. And a cutter blade 29 fixed to the slider 26A. The cutter blade 29 can move up and down together with the heat block 27, and the cutter blade 29 moves along the recess 21A by driving the cylinder 26 so that the peeling sheet PS can be cut in the width direction. It has become.
The pasting means 12 is substantially the same as that disclosed in Japanese Patent Application No. 2007-170011 filed by the present applicant.

  The holding means 13 includes a chuck cylinder 32, and the upper chuck 30A and the lower chuck 30B opposed thereto form a holding portion 30. The holding unit 30 is configured to sandwich and hold a held portion PS1 that is one end side of the peeling sheet PS between the upper and lower chucks 30A and 30B (see FIG. 3A).

  The moving means 14 is constituted by a robot 35. As shown in FIG. 2, the robot 35 includes a base portion 36, a first arm 36 </ b> A to a sixth arm 36 </ b> F disposed on the upper surface side of the base 36 portion and provided to be rotatable in the directions of arrows A to F. The chuck cylinder 32 is disposed on the distal end side of the sixth arm 36F. The second, third, and fifth arms 36B, 36C, and 36E are rotatably provided in the directions of arrows B, C, and E in the Y × Z plane in FIG. 2, and the first, fourth, and sixth arms are provided. The arms 36A, 36D, and 36F are provided so as to be rotatable around their axes, that is, in the directions of arrows A, D, and F. The robot 35 in this embodiment is controlled by NC (Numerical Control), and the tip can be moved in three orthogonal directions of the X, Y, and Z axes. That is, the movement amount of each joint with respect to the wafer W is controlled by the numerical information corresponding to each, and all the movement amounts are controlled by the program. The chuck cylinder 32 is supported by the output shaft 37 of the tension means 16 composed of a linear motion motor M attached to the tip of the sixth arm 36F.

  The peeling assisting means 15 is constituted by a press roller 40. The press roller 40 is provided so as to be movable in the X-axis direction via a single-axis robot 41, and is provided so as to be movable in the Z-axis direction via a Z-axis cylinder 43 provided in front of the slider 42. It has been.

  Next, the sheet peeling method by the sheet peeling apparatus 10 in this embodiment is demonstrated, also referring FIG. The method of sticking the release sheet PS to the adhesive sheet S is substantially the same as that disclosed in the Japanese Patent Application No. 2007-170011 except for the configuration in which the holding unit 30 holds the release sheet PS. Therefore, in the following, as shown in FIG. 3A, it is assumed that one end side of the peeling sheet PS cut to a predetermined length is held by the upper and lower chucks 30A and 30B as the held portion PS1. The subsequent peeling process will be described.

  First, as shown in FIG. 3A, the press roller is set on the release sheet PS and the adhesive sheet S. In this state, the linear motion motor M operates to pull the holding sheet 30 to the outer side along the surface to be adhered, that is, the surface of the wafer W with the pulling force Fr.

  Next, as shown in FIG. 3B with the tensile force Fr applied, the sixth arm 36F of the robot 35 moves in the direction indicated by the arrow R with the predetermined position, that is, the lower point of the press roller 40 as the central axis P. Rotate in the direction. By this operation, the separation trigger portion C is formed at the end portions of the wafer W and the adhesive sheet S. The peeling angle θ1 of the peeling trigger portion C is infinitely peeled at a peeling angle close to 0 degrees.

  Then, as shown in FIG. 3C, as the rotation of the robot 35 proceeds, the peeling angle gradually becomes a wide angle to θ2, and finally, as shown by a two-dot chain line in FIG. The peeling sheet PS and the adhesive sheet S are wound around the press roller 40. Here, in FIGS. 3A to 3C, as the peeling angle θ increases, the distance from the press roller 40 to the held portion PS1 is reduced by the press roller 40 as shown in FIG. As shown, the output shaft 37 of the linear motor M is absorbed so as to absorb the tensile force Fr so as to keep it at a predetermined value.

  Thereafter, as shown in FIG. 3D, when the robot 35 moves the holding unit 30 toward the left side in the figure, the press roller 40 also rotates in synchronization and moves to the left side, and the table T is synchronized. To the right. As a result, the adhesive sheet S is completely peeled from the wafer W.

  The adhesive sheet S peeled through the peeling sheet PS in this way is discarded into a waste box (not shown) through the movement operation of the robot 35, and the robot 35 is in an initial standby position in preparation for the next peeling. Will return to the normal state.

Therefore, according to such an embodiment, the peeling angle θ when the peeling trigger portion C is formed is peeled at a narrow angle close to 0 degrees, and the peeling angle θ is gradually increased. Even when the adhesive sheet S is thick or has high rigidity, the adhesive sheet S is not bent at a wide angle at once, and the peeling sheet PS is peeled off from the adhesive sheet S. Can be eliminated.
Further, since the adhesive sheet S is peeled off so that the adhesive sheet S is wound around the press roller 40, the wafer W is put on the table 16 by the press roller 40 after the peeling trigger portion C is formed. While pressing, the adhesive sheet S can be reliably peeled while preventing the wafer W from being lifted.
In addition, according to such embodiment, a pressure-sensitive-adhesive adhesive sheet can also be used for the peeling sheet PS. In this case, no heating means is required for the heat block 27, and it is sufficient if the peeling sheet PS can be pressed against the adhesive sheet S.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, as shown in FIG. 4A, instead of the holding means 13, a take-up roller 52 as the take-up means 50 can be adopted and the pulling means 16 can be connected to the take-up roller 52. In this case, a supply roller 51 is provided to support the peeling sheet PS, which is a pressure-sensitive adhesive sheet, so that it can be fed out, and the take-up roller 52 is bracketed to the output shaft 37 of the linear motor M constituting the tension means 16. An adhesive sheet S is supported by a motor (not shown) through 53, and the release sheet PS extending between the supply roller 51 and the take-up roller 52 is pressed by a press roller 40 as a sticking means 12. (See FIG. 4B).

  In this configuration, as shown in FIG. 4C, the peeling sheet PS is pasted over the predetermined length in the radial direction of the adhesive sheet S by the press roller 40. Thereafter, in a state in which the rotation of the supply roller 51 and the take-up roller 52 is restricted, the linear motion motor M operates to move the take-up roller 52 to the outside along the surface of the wafer W with the tensile force Fr. pull. Then, the sixth arm 36F of the robot 35 rotates in the direction of arrow R with the lower point of the press roller 40 as the central axis P. By this operation, the separation trigger portion C is formed at the end portions of the wafer W and the adhesive sheet S, and the separation sheet S is wound around the press roller 40. The release sheet PS can be peeled from the wafer W by rotating the supply roller 51 and the take-up roller 52 in synchronization with the operation of moving the table T to the right. In this case, the press roller 40 also functions as the peeling assisting means 15. And when peeling is completed, it can wait for the next peeling by feeding and winding up the peeling sheet PS while returning the press roller 40 and the winding roller 52 to the initial positions. .

  According to such a modification, since the structure of the sticking means 12 can be simplified and the peeling assisting means 15 can be used also, further simplification is possible. Note that a heat-sensitive adhesive sheet can be used as the release sheet PS. In this case, a heating means may be provided separately, or a heating means may be provided on the press roller 40 to weld the peeling sheet PS to the adhesive sheet S.

  In the above-described embodiment, the case where the tension means 16 is provided on the sixth arm 36F that is the tip of the robot 35 has been shown and described. You may comprise. According to this, the robot 35 also achieves the function as the pulling means 16. In addition to the robot 35, the moving means 14 is provided with a moving body that can move along a circumferential locus in the vertical plane of the rotation center axis P, and the chuck cylinder 32 is attached to the moving body via the pulling means 16. The chuck cylinder 32 may be pulled and pulled in the direction of the arrow Fr. In the case of such a configuration, the structure can be simplified without using the robot 35 described above. In short, the moving means 14 in the present invention can employ other moving means that can move the pulling means 16 along a predetermined trajectory.

  Further, as shown in FIG. 6, the table T constituting the support means 11 is a lower table T1 and an upper table T2, and the upper table T2 is provided so as to be movable up and down via a linear motor M1 as a displacement means. The peeling trigger portion C (see FIG. 6B) may be formed by relatively displacing the table T and the holding means 13 in a direction perpendicular to the surface. In this configuration, after the peeling trigger portion C is formed, the upper table T2 is further lowered or the holding means 13 is raised, and then the table T is moved to the right side in FIG. The adhesive sheet S2 can be peeled off by relative movement.

  In the example of FIG. 4, the configuration in which the take-up roller 52 rotates in the vertical plane of the central axis C via the moving means 14 is shown. However, the table T is provided so as to be movable up and down via a displacing means (not shown). By separating the table T and the winding means 50 in the direction orthogonal to the surface of the wafer W, the separation trigger portion C can be formed without rotating the winding roller 52.

  Furthermore, the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer can be a silicon wafer or a compound wafer. It may be.

  Further, the holding means is not limited to the chuck cylinder 32 and is not limited in any way that can hold the peeling sheet.

  Further, the peeling assisting means 15 may be a blade material or air jet other than the press roller 40.

  In addition, the tensile force Fr by the tension means 16 can be arbitrarily set according to conditions such as the thickness and rigidity of the adhesive sheet S and the tensile strength of the peeling sheet PS. It is also possible to control such that it is not applied only at the beginning of peeling of the adhesive sheet S, that is, when the peeling angle θ reaches a predetermined angle (for example, 45 degrees), or the strength is increased.

  Furthermore, the tension means 16 and the displacement means are not limited to the direct acting motors M and M1, and other configurations such as an air cylinder and a hydraulic cylinder can be adopted.

The schematic perspective view of the sheet peeling apparatus which shows this embodiment. The side view of the robot which comprises the moving means in the said sheet peeling apparatus. (A)-(D) are operation | movement explanatory drawings at the time of peeling an adhesive sheet from a wafer using the said sheet peeling apparatus. (A) is a principal part schematic front view which shows the modification of the said embodiment, (B) is a principal part schematic front view which shows the initial stage which affixes the sheet | seat for peeling on an adhesive sheet, (C) is an adhesive sheet from a wafer. The principal part schematic front view which shows the state which peels. FIG. 5 is an operation explanatory diagram illustrating the operation of the present invention. (A)-(C) are operation | movement explanatory drawings which concern on the other modification of this invention. The schematic front view which shows a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Support means 12 Sticking means 13 Holding means 14 Moving means 15 Peeling auxiliary means 16 Pulling means C Peeling trigger part Fr Tensile force M1 Linear motion motor (displacement means)
P rotation axis (predetermined position)
PS Peeling sheet PS1 Holding part S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (7)

A support means for supporting the adherend having the adhesive sheet attached to the adherend surface;
An attaching means for attaching a release sheet to the adhesive sheet;
Holding means for holding one end side of the peeling sheet attached to the adhesive sheet;
A moving means rotatable around a predetermined position as a central axis;
A sheet peeling apparatus comprising a tension means provided between the holding means and the movement means,
A sheet peeling apparatus, wherein the pulling means forms a peeling trigger portion by rotating the holding means in a state where the peeling means pulls the peeling sheet to the outside along the adherend via the holding means. A support means for supporting the adherend having the adhesive sheet attached to the adherend surface;
An attaching means for attaching a release sheet to the adhesive sheet;
Holding means for holding one end side of the peeling sheet attached to the adhesive sheet;
A sheet peeling apparatus for peeling the adhesive sheet from the adherend by relative movement between the support means and the holding means,
A tensioning means connected to the holding means; and a displacement means for relatively displacing the holding means and the supporting means in a direction perpendicular to the adherend surface,
In the state where the pulling means pulls the peeling sheet to the outside along the adherend surface via the holding means, the peeling means is formed by relatively displacing the holding means and the supporting means via the displacement means. The sheet peeling apparatus characterized by performing. A support means for supporting the adherend having the adhesive sheet attached to the adherend surface;
An attaching means for attaching a release sheet to the adhesive sheet;
Winding means for winding the release sheet;
A moving means rotatable around a predetermined position as a central axis;
A sheet peeling apparatus comprising a tension means provided between the winding means and the moving means,
The sheet peeling is characterized in that the pulling means forms a peeling trigger part by rotating the winding means in a state where the peeling sheet is pulled to the outside along the adherend surface via the winding means. apparatus. A support means for supporting the adherend having the adhesive sheet attached to the adherend surface;
An attaching means for attaching a release sheet to the adhesive sheet;
Winding means for winding the release sheet;
A sheet peeling device for peeling the adhesive sheet from the adherend by relative movement between the support means and the winding means;
A tension means connected to the winding means; and a displacement means for relatively displacing the holding means and the support means in a direction perpendicular to the adherend surface,
In the state where the pulling means pulls the peeling sheet to the outside along the adherend surface via the winding means, the peeling trigger portion is formed by relatively displacing the winding means and the supporting means via the displacement means. The sheet peeling apparatus characterized by forming.   The peeling assisting means positioned on the adherend is further included, and peeling is performed in a state where the peeling sheet and / or the adhesive sheet are wound around the peeling assisting means. The sheet peeling apparatus as described. In a state where the adherend having the adhesive sheet attached to the adherend surface is supported by a support means, the release sheet is attached to the adhesive sheet, and one end side of the release sheet is held, and the held portion In the sheet peeling method for peeling the adhesive sheet from the adherend by relative movement between the holding position and the supporting means,
In a state where one end side of the peeling sheet is pulled outward along the adherend surface, a peeling trigger portion is formed by relatively moving the one end side of the peeling sheet and the supporting means. Sheet peeling method. In the state where the adherend having the adhesive sheet stuck on the adherend surface is supported by the support means, the peeling sheet is stuck to the adhesive sheet and the one end side of the peeling sheet is wound up. In the sheet peeling method for peeling the adhesive sheet from the body,
In a state where the winding side of the release sheet is pulled outward along the surface of the adherend surface, a peeling trigger portion is formed by relatively moving the winding side of the release sheet and the support means. Sheet peeling method.

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