JP7032357B2 - Devices and methods for stripping structures from the main surface area of carriers - Google Patents

Description

Embodiments of the present disclosure relate to devices and methods for stripping structures from the main surface area of carriers .

Structures, devices, or thin wafers must be transferred from the carrier wafer to the film frame. With thin wafer handling techniques, there is residual force that must be overcome in order to lift the structure from the carrier wafer. In fact, lifting the device from the wafer during peeling is
・ Slide off ・ Peel off with a wedge ・ Lift in parallel (do not make an angle between the carrier and the device)
It is done by such an operation.

Normally, a structure, device, or thin wafer can be lifted all at once, either uncurved or slightly curved. Therefore, the total required force that the tool must apply during peeling is very large.

Therefore, there is a better compromise between reducing the force applied by the tool during peeling and optimizing the transfer of the stripped structure from the carrier / wafer to the new destination ("Transfer") . It is hoped that the concept of attachment will be obtained.

This problem is solved by an independent claim such as device claim 1 or method claim 10.

The embodiment is defined by a dependent claim.

One embodiment relates to a device for stripping a structure from the main surface area of a carrier. For example, the device comprises a tape for laminating on a structure and a first holding and a second holding for tensioning the tape. At least the second holding portion may be movable to a lifting position having an offset in the direction perpendicular to the main surface area of the carrier. The device also provides a deflection line placed between the first holding and the second holding to tape in response to the movement of the second holding to the lifting position. It may be equipped with a deflection element for deflection. The deflection element can be arranged so that it can move parallel to the carrier in order to move the deflection line parallel to the carrier and to detach the structure affixed to the tape from the carrier.

One embodiment is a method for stripping the structure from the main surface area of the carrier. In this method, the main carrier is a step of attaching the tape to the structure, a step of connecting the tape while maintaining tension between the first holding portion and the second holding portion, and a second holding portion. A step of moving to a lifting position with a vertical offset with respect to the surface area and a step of setting a deflection element on the tape towards the first end of the structure, the first holding and the first. A step of deflecting the tape in response to movement of the second retainer to a lifting position by providing a deflection line placed between the two retainers and a second of the structure parallel to the carrier the deflector. It may include moving the deflection line parallel to the carrier by moving it from one end to the second end of the structure, whereby the structure affixed to the tape is stripped from the carrier. can.

The method described above can be based on the same considerations as the device described above. It should be noted that the method can be complete with all the features and functions described also with respect to the device.

The emphasis is on drawing, not necessarily to a uniform scale, but to show the principles of aspects of the present disclosure in general. In the following description, various embodiments will be described with reference to the following drawings.

It is a schematic diagram of the device by one Embodiment. It is a schematic diagram of the structure on the main surface area of a carrier according to one embodiment. FIG. 6 is a schematic diagram of a device in a state where a tape is attached to a structure according to an embodiment. FIG. 6 is a schematic diagram of a device configured for peeling a structure according to an embodiment. It is a figure which shows the device in the state which the structure was peeled off from a carrier by one Embodiment. It is a figure which shows the device configured for sticking a tape with a structure to a tape frame by one Embodiment. FIG. 6 is a schematic diagram of a structure on the main surface region of a carrier, wherein the structure is a thin wafer, according to one embodiment. FIG. 6 is a schematic diagram of a device according to an embodiment, in which the structure is a thin wafer and the tape is attached to the structure. FIG. 6 is a schematic diagram of a device configured for peeling a structure, wherein the structure is a thin wafer, according to one embodiment. It is a figure which shows the device in the state which the structure is a thin wafer, and the structure is peeled off from a carrier according to one Embodiment. FIG. 5 is a diagram illustrating a device configured to attach a tape with a structure to a tape frame, according to one embodiment, where the structure is a thin wafer. FIG. 6 is a schematic diagram of a structure on the main surface region of a carrier, wherein the structure is a thin wafer bonded to the carrier according to one embodiment. FIG. 6 is a schematic diagram of a device according to an embodiment, in which the structure is a thin wafer bonded to a carrier and the tape is attached to the structure. FIG. 6 is a schematic diagram of a device configured for peeling a structure, wherein the structure is a thin wafer bonded to a carrier, according to one embodiment. FIG. 6 is a schematic diagram of a device configured to detach a structure, wherein the structure is a thin wafer bonded to a carrier and the deflection element is a wedge, according to one embodiment. It is a schematic diagram of the structure adhered to the carrier on the main surface area of the carrier according to one embodiment. FIG. 6 is a schematic diagram of a device in a state where the tape is attached to a structure adhered to a carrier according to an embodiment. FIG. 6 is a schematic diagram of a device configured for peeling a structure adhered to a carrier according to an embodiment. It is a figure which shows the device in the state which the structure adhered to a carrier is peeled off from a carrier by one Embodiment. It is a figure which shows the device which was configured to attach the tape with the structure to the tape frame by one Embodiment. FIG. 6 is a schematic representation of a structure on the main surface region of a carrier, wherein the structure comprises a device, according to one embodiment. FIG. 6 is a schematic diagram of a device, wherein the structure comprises the device, according to one embodiment, with the tape affixed to the structure. FIG. 6 is a schematic diagram of a device configured to detach a structure, wherein the structure comprises the device according to one embodiment. It is a figure which shows the device in the state which the structure comprises a device, and the structure is detached from a carrier by one Embodiment. FIG. 5 is a diagram illustrating a device configured for attaching a tape with a structure to a tape frame, wherein the structure comprises the device according to one embodiment. FIG. 6 is a block diagram of a method for stripping a structure from the main surface area of a carrier according to an embodiment.

In the following description, the same or equivalent elements, or elements having the same or equivalent function, are represented by the same or equivalent reference numbers even if they are shown in different figures.

In the following description, a number of details are given in order to provide a more complete description of the embodiments of the present disclosure. However, it will be apparent to those skilled in the art that embodiments can be realized without these specific details. It should be noted that, in order to avoid obscuring embodiments, well-known structures and devices are shown in block diagram format rather than in detail. Moreover, the features of the different embodiments described herein can be combined with each other unless otherwise indicated.

FIG. 1 shows a device 100 for stripping the structure 110 from the main surface region of the carrier 120.

The present embodiment can be based on the idea that the force applied by the device 100 for stripping the structure 110 from the main surface region of the carrier 120 can be reduced by deflecting the tape 130. The deflection of the tape 130 allows the device 100 to pull the structure 110 from the main surface area of the carrier 120 instead of tearing the structure 110 from the main surface area of the carrier 120, thereby allowing the structure 110 to be peeled off from the main surface area of the carrier 120. The stress caused by the device 100 on the structure 110 is smaller. Therefore, the transfer of the structure 110 from the main surface area of the carrier to the tape 130 is optimized by the device 100.

For example, the device 100 includes a tape 130 for being attached to the structure 110, and a first holding portion 140 and a second holding portion 142 for supporting the tape 130 while maintaining tension . At least the second holding portion 142 may be movable to a lifting position 144 having a vertical offset of 146 with respect to the main surface region of the carrier 120. Therefore, the first holding portion 140 and the second holding portion 142 can prevent the tape 130 from loosening by bridging the tape 130 in this way . The vertical displacement 146 of the lift position 144 with respect to the main surface region of the carrier 120 can define the distance between the lift position 144 and the main surface region of the carrier 120 in the direction perpendicular to the main surface region of the carrier 120. .. For example, the lift position 144 may have a vertical displacement 146 with respect to the main surface region of the carrier 120 and may be in a plane parallel to the main surface region of the carrier 120, where the vertical displacement 146 is. For example, it is continuously adjustable.

The device 100 also provides a deflection line 152 disposed between the first holding portion 140 and the second holding portion 142 in response to the movement of the second holding portion 142 to the lifting position 144. A deflection element 150 for deflecting the tape 130 may also be provided. The deflection line 152 at the position of the deflection element 150 can divide the tape 130 into two parts. Thus, for example, the first portion of the two portions can be arranged parallel to the main surface region of the carrier 120, the second portion of the two portions with the first portion and the lifting position 144. Can be connected, whereby the tape 130 can be deflected by the deflection line 152. Thus, for example, the second portion can define a deflection angle 154 formed by the main surface region of the carrier and the second portion of the tape.

The deflection element 150 may be configured to be movable in parallel to the carrier 120 in order to move the deflection line 152 in parallel to the carrier 120 and to separate the structure 110 attached to the tape 130 from the carrier 120. can. Therefore, the structure 110 is transferred from the main surface region of the carrier 120 to the tape 130, for example, by a deflection line 152. The deflection element 150 can move, for example, in parallel to, for example, the main surface region of the carrier 120.

The first holding portion 140 and the second holding portion 142 are shown in FIG. 1 as a box. Thus, for example, the second holding portion 142 may be movable to the lifting position 144 so that the tension of the tape 130 is maintained, or, for example, the first holding portion 140 or the second holding portion 142 may be the tape 130. A moving element connected to the tape 130 may be provided to stretch or contract the tape 130 in order to maintain the tension of the tape 130.

According to one embodiment, the first holding portion 140 and / or the second holding portion 142 can be arranged so as to keep the tension of the tape 130 constant. By keeping the tension of the tape 130 constant, it is possible for the device 100 to detach the structure 110 from the main surface region of the carrier 120 under control. Also, when the structure is attached (bonded) to the tape 130, the constant tension of the tape 130 may be advantageous in reducing the stress that may be applied to the structure 110. Therefore, it is possible to reduce the stress in the longitudinal direction and the vertical direction in the structure 110.

For example, if the tape 130 is subjected to a tension change such as a higher tension than before the change, the structure 110 may be subjected to tensile stress, and if the tape 130 has a lower tension than before the change, the structure 110 may be subjected to a tensile stress. The structure 110 may be subjected to compressive stress. Therefore, the stress of the structure 110 can be reduced by the constant tension of the tape 130.

According to one embodiment, the first holding portion 140 and / or the second holding portion 142 may be a roller, particularly a rotatable roller. Therefore, by rotating the first holding portion 140 and / or the second holding portion 142, the tape 130 is rolled and bridged onto the first holding portion 140 and / or the second holding portion 142. Can be done. When the first holding portion 140 or the second holding portion 142 is realized as a roller, the tension of the tape 130 can be easily adjusted by rotating the first holding portion 140 and / or the second holding portion 142. It is possible to do.

According to one embodiment, the second holding portion 142 is movable in a direction having a first component parallel to the main surface region of the carrier 120 and a second component perpendicular to the main surface region of the carrier 120. Can be configured to be. In other words, the second holding portion 142 may be movable along a vector having a first component and a second component. Therefore, the second holding portion 142 can be moved obliquely with respect to the carrier 120. Therefore, it is possible to maintain the tension of the tape 130 and, for example, keep the length of the tape 130 constant. Therefore, the second holding portion 142 can maintain the tension of the tape 130 without using, for example, an element for stretching or contracting the tape 130. With this function, the tension of the tape 130 can be maintained by moving the second holding portion 142.

Optionally, the first holding portion 140 and / or the second holding portion 142 can also be realized as a hook. According to one embodiment, the first holding portion 140 and the first holding portion 140 as a flat or three-dimensional object by an adhesive connection to the tape 130, a connection to the tape 130 by suction control, or a connection to the tape 130 using a hook-and-loop fastener. / Or it is also possible to realize the second holding portion 142. Further, the first holding portion 140 and / or the second holding portion 142 may include two plates, and the tape 130 may be gripped between the two plates. The above enumeration of embodiments of the first holding unit 140 and / or the second holding unit 142 should be regarded as exemplary rather than comprehensive.

According to one embodiment, the deflection element 150 is a wedge as shown in FIG. 1, particularly a wedge with rounded corners that are corners at the deflection line 152, or a roller, particularly a rotatable roller. The radius of the rounded corners of the wedge 150 or the diameter of the rotatable rollers can be varied individually. The smaller the radius or diameter of the deflecting element 150, the greater the angle 154 between the undeflected tape 130 and the deflected tape 130 due to the movement of the second holding portion 142 to the lifting position 144. The larger the angle 154, the easier it is for the structure 110 to be detached from the main surface region of the carrier 120. Thus, the deflection element (eg, the diameter of the roller or the radius of the wedge) will detach the structure 110 from the carrier 120 with only a small force and the allowable deflection of the tape 130 with respect to the structure 110 caused by the deflection of the tape 130. It can be selected to take into account the optimized compromise with the optimum angle 154 for.

For example, the diameter of a roller or wedge (an example of a deflection element 150) can be defined in the range of 1 mm to 20 cm, 3 mm to 10 cm, or 5 mm to 5 cm. Thus, for example, if the structure 110 does not crack and allows only small deflections, it is possible, for example, to use a roller with a diameter of about 15 cm as the deflection element 150. If the structure 110 is flexible, for example, a large deflection by a wedge with rounded corners having a radius of about 5 mm as a deflection element for peeling the flexible structure 110 from the carrier 120 with a small force. The angle 154 can be realized. Therefore, it is possible to personalize the device 100 with respect to the various structures to be peeled off.

For example, the deflection element 150 can stabilize the detachment of the structure 110 from the carrier 120. Therefore, for example, the structure 110 is peeled off little by little by the device 100 at the deflection line 152, and the entire structure is not peeled off by one operation.

According to one embodiment, the deflection line 152 is detached from the carrier 120 and transferred / attached to the tape 130 with the first portion 132 of the structure 110 coupled to the carrier 120 and attached to the tape 130. Separate from the second portion 134 of the combined structure 110. Therefore, the deflection line 152 can define where the device detaches the structure 110 from the carrier 120. In other words, the deflection line 152 can define where the structure 110 is transferred from the carrier 120 to the tape 130.

Optionally, the deflection angle 154 can be defined by a first portion 132 and a second portion 134. Therefore, the deflection angle 154 can be defined as a value obtained by subtracting the acute angle formed by the first portion 132 of the structure 110 and the second portion 134 of the structure 110 from 180 °.

According to one embodiment, the second holding portion 142 may also be movable laterally with respect to the main surface of the carrier 120, and the deflection angle 154 of the tape 130 at the deflection line 152 is the second. It is adjustable based on a continuous or simultaneous combination of lateral and vertical movements of the holding portion 142 and based on the lateral position of the deflection element 150. Thus, the deflection angle 154 can be changed, for example, by moving the second holding portion 142 to the lift position 144 and by moving the deflection element 150 parallel to the main surface region of the carrier 120.

For example, by setting the first holding portion 140 to the first position and setting the second holding portion 142 to the lifting position 144, and by simply moving the deflection element 150 parallel to the carrier 120, the structure. The body 110 can be detached from the carrier 120. Therefore, the structure 110 can be peeled from the carrier 120 by the device 100 by changing the deflection angle 154 at the time of peeling. It is also possible to detach the structure 110 from the carrier 120 at a constant deflection angle 154. Thus, for example, both the deflection element 150 and the second holding portion 142 can change their positions during peeling. Thus, for example, the deflection element 150 moves parallel to the carrier 120 and the second holding portion 142 changes its lifting position 144, for example by moving vertically and laterally to the main surface of the carrier 120.

According to one embodiment, the deflection angle 154 may be between 10 ° and 170 °, 15 ° and 120 °, or 20 ° and 90 °. The larger the angle 154, the less force is required and the easier it is to separate the structure 110 from the carrier 120. With the defined deflection angle 154, it is possible to detach the structure 110 from the carrier 120 with less force and thus very efficiently.

According to one embodiment, the deflection element 150 can be configured to control the deflection angle 154 by the diameter of a roller that can be used as the deflection element 150 or the radius of the rounded corner of the wedge. Therefore, the diameter or radius can define the largest possible deflection angle 154 for the device 100. According to one embodiment, the smaller the radius or diameter, the larger the deflection angle 154 can be selected.

The device 100 may include, for example, a control device, which controls, for example, the movement of the second holding unit 142, the movement of the deflection element 150, and optionally the movement of the first holding unit 140. be able to. For example, the control device 160 may include a connecting line with a first holding unit 140, a second holding unit 142, and a deflection element 150, or a first holding unit 140, a second holding unit 142, And can be configured to communicate wirelessly with the deflection element 150. The control device may control the movement of the first holding portion 140, the second holding portion 142, and the deflection element 150, for example, so that the tape 130 is stretched over and the tension is maintained. can. The control device 160 can control the movement, for example, so that the deflection angle 154 is kept constant and the tension of the tape 130 is maintained.

Optionally, the deflection element 150 can be configured to control the speed at which the structure 110 is detached from the carrier 120 by the device. For example, by moving the deflection element 150 parallel to the carrier 120, the deflection line 152 changes its position over time. The faster the deflection line 152 changes its position, the faster the structure 110 is detached from the carrier 120 at the deflection line 152.

According to one embodiment, the structure 110 to be stripped may be flexible and may comprise a polymer device or silicon having an extension perpendicular to the carrier 120 smaller than 50 μm, 30 μm, or 20 μm. The flexible structure 110 can be understood as a structure 110 capable of following the radius of the curved portion of the deflection element 150 without causing cracks. Thus, for example, if the deflection element 150 is a roller, flexibility can mean that the structure 110 can follow the diameter of the roller, and if the deflection element 150 is a wedge, the flexibility is For example, it can mean that the structure 110 can follow the radius of the rounded corners. According to one embodiment, the structure 110 may be a flexible layer, a brittle layer, or a flexible metal layer of silicon. The extension of the structure can be understood as an extension perpendicular to the main surface of the carrier 120. Optionally, the structure 110 can also include small silicon chips with extensions perpendicular to the main surface of the carrier 120 larger than 50 μm, which silicon chips are parallel to the main surface of the carrier 120. Due to the very small dimensions, a single chip produces only a small curvature.

In other words, the device 100 is for using the tape 130 to strip the thin device (eg, structure 110) from the carrier wafer (eg, carrier 120) and transfer the thin device to a new destination. be. Thin devices can, for example, be thin enough to have sufficient flexibility, or are made from flexible materials. The tape 130 is, for example, glued to the device and stripped from the carrier 120. The device attaches to, for example, the tape 130 and thus detaches from the carrier 120. According to one embodiment, the tape 130 can be peeled off like a sticker, so the total force required at the time of peeling off is negligible. Therefore, the device 100 may be configured for peeling a thin device by peeling the tape.

The device 100 can be used, for example, to detach the device (structure 110) from the carrier 120. Therefore, the structure 110 may be, for example, a particle filter for a MEMS microphone. Therefore, the device 100 can be used to strip the particle barrier for the MEMS microphone from the carrier 120.

For example, the device 100 can be used to strip the semiconductor structure from the carrier 120.

In other words, the device to be stripped (structure 110) is thin enough to bend without cracking. This applies, for example, to polymer devices or silicon less than about 20 μm. First, the tape 130 (eg, dicing tape) is adhered to the device to be stripped (see, eg, FIG. 1, FIG. 2b, FIG. 3b, FIG. 4b, FIG. 5b, or FIG. 6b). The tape 130 is then stripped from the carrier wafer 120 at a small angle 154 like a sticker (see, eg, FIG. 1, FIG. 2c, FIG. 3c, FIG. 4c, FIG. 4d, FIG. 5c, or FIG. 6c). In this way, the device 110 is sequentially peeled off only on the peeling front surface (deflection line 152). Rollers (eg, deflection element 150) can be used to control the peel front surface 152 with respect to speed and bending angle 154. The dimensions of the roller 150 can define the bending angle 154 of the device 110. When all devices 110 are stripped from the carrier wafer 120, all devices 110 are on tape 130. You can now use this tape to transfer the device to another destination. According to one embodiment, the tape 130 is a film frame (eg, a tape frame 170 ₁ as shown in FIGS. 2d, 2e, 3d, 3e, 5d, 5e, or 6d, 6e. It can be attached to 170 ₂ ). The device 110 can be delivered to the customer in this form. The device (eg, structure 110) is aligned and pressed against, for example, another device and a new wafer with adhesive on top (eg, carrier 120) to transfer the device to this new device wafer. Can be done. When UV tape / thermal tape (tape 130) is used, the device 110 can be released from the transfer tape 130 by UV irradiation / heat treatment at a new delivery destination. The core is to use tape 130 to strip the thin device 110 from the carrier wafer 120 and transfer the thin device 110 to a new destination.

FIG. 2a shows a carrier 120 which can also be understood as a carrier wafer below. For example, the carrier 120 can include, for example, a silicon or glass material having a thickness 122 of about 700 μm. The thickness 122 of the carrier 120 is perpendicular to the main surface of the carrier 120. The thickness of the carrier 120 may be in the range of 100 μm to 5 mm, 300 μm to 1 mm, or 500 μm to 900 μm.

The structure 110 can be placed on the carrier 120. The structure 110 may be, for example, a build-up device. According to one embodiment, the structure 110 can include a dimension 112 perpendicular to the carrier 120 of about 45 μm. The dimension 112 may be in the range of 5 μm to 100 μm, 10 μm to 60 μm, or 20 μm to 50 μm. According to one embodiment, the structure 110 can comprise a polymeric structure.

For example, the structure 110 may include a predetermined break point or adhesive connection to the main surface area of the carrier 120.

FIG. 2b shows a device 100 with a first holding section 140, a second holding section 142, a tape 130, and optionally a deflection element 150. FIG. 2b shows a step of attaching the tape 130 to the structure 110. For example, the device 100 can use the deflection element 150 to attach the tape 130 to the structure 110. To that end, the tape 130 is, for example, bridged between a first holding portion 140 and a second holding portion 142, for example, a deflection element 150 (eg, a roller) is mounted from one end of the structure 110 to the structure. It is adhered to the structure 110 by rolling it to the other end of the 110.

The first holding portion 140 and the second holding portion 142 can be bridged with the tape 130 so that the tension is maintained from the viewpoint of maintaining the stress in the longitudinal direction and the lateral direction, for example.

For example, if the tape 130 is attached to the structure 110 by other means, such as heat or UV radiation, the device 100 pulls back, for example, the deflection element 150, eg, the deflection element 150 in the next step shown in FIG. 2c. Can be used.

According to one embodiment, FIG. 2b shows, for example, bonding the dicing tape 130 onto the structure 110. According to one embodiment, the dicing tape 130 can be in contact with the front surface of the wafer (carrier 120).

FIG. 2c shows the next step performed by the device 100. The device 100 shown in FIGS. 2b, 2c, 2d, and 2e can have the same functions and features as the device 100 in FIG.

According to one embodiment, the second holding portion 142 is moved to a lifting position 144 having a vertical offset with respect to the main surface region of the carrier 120, as shown in FIG. 2c. The deflection element 150 provides a deflection line 152 disposed between the first holding portion 140 and the second holding portion 142 and tapes in response to the movement of the second holding portion 142 to the lifting position 144. 130 can be deflected. Thus, the tape 130 has, for example, a portion of the tape 130 deflected by the deflection element 150 bonded to the second portion 134 of the structure 110 and a plane parallel to the main surface of the carrier 120 about 90 °. It is deflected to maintain the deflection angle 154 of. Thus, for example, the second portion 134 of the structure 110 has already been stripped from the carrier 120 and by moving the deflection element 150 parallel to the main surface region of the carrier 120, the first portion 132 of the structure 110. Can be peeled off by the device 100. In other words, FIG. 2c shows the tape peeling of the dicing tape 130 with the structure 110 peeled off. In other words, the dicing tape 130 can be peeled off from the wafer (carrier 120), and the structure 110 can stay on the dicing tape 130.

FIG. 2d shows a device 100 including a first holding portion 140 and a second holding portion 142, in which the device 100 has a tape 130 placed between the first holding portion 140 and the second holding portion 142. It is configured to pass . Further, the tape 130 is attached to the structure 110, and the structure 110 has already been peeled from the carrier 120 by the device 100. In the step shown in FIG. 2d, for example, the deflection element 150 of the device 100 is pulled back by the control device 160, whereby the device 100 attaches the tape 130 with the structure 110 to the tape frames 170 ₁ , 170 ₂ , for example. Can be transferred.

The first holding portion 140 and the second holding portion 142 can be bridged with the tape 130 so that the tension is maintained from the viewpoint of maintaining the stress in the longitudinal direction and the lateral direction, for example.

According to one embodiment, the tape 130 can be configured to transfer the structure 110 from the carrier 120 to the tape frames 170 ₁ and 170 ₂ . Further, the tape frames 170 ₁ and 170 ₂ can be understood as a dicing frame. The tape frames 170 ₁ and 170 ₂ stabilize the tape 130 with the structure 110 so that it can be easily transferred to a new destination.

FIG. 2e shows a step of attaching the tape 130 with the structure 110 to the tape frames 170 ₁ and 170 ₂ . The deflection element 150 can be used to attach the tape 130 to the tape frames 170 ₁ and 170 ₂ . Therefore, the deflection element 150 can be rolled, for example, from the first tape frame 170 ₁ to the second tape frame 170 ₂ . After the tape 130 with the structure 110 is attached to the tape frames 170 ₁ and 170 ₂ , the tape 130 can be diced at the tape frames 170 ₁ and 170 ₂ by the cutting element 180.

According to one embodiment, the device 100 includes tape frames 170 ₁ and 170 ₂ for attaching the tape 130 to the structure 110 peeled from the carrier 120. Therefore, this structure is transferred from the carrier 120 to the tape 130 and stabilized by the tape frames 170 ₁ and 170 ₂ to ensure that the structure 110 is delivered to another destination while reducing possible damage to the structure 110. Transfer to.

In other words, FIG. 2b shows the first step of the device 100, i.e., the bonding of the dicing tape 130 to the structure 110, and FIG. 2c is the second step, i.e. the transferred structure, carried out by the device 100. FIG. 2d and FIG. 2e show the tape stripping of the dicing tape 130 with the body 110, and FIGS. 2d and 2e show the third step performed by the device 100, namely the sticking of the tape 130 to the tape frames 170 ₁ and 170 ₂ . Can be done.

By affixing the structure 110 to the tape frames 170 ₁ and 170 ₂ , the next pick-and-place process can be made feasible by the device 100.

3a-3e can exhibit the same features and functions as those shown in FIGS. 2a-2e. The difference between FIGS. 3a-3e and 2a-2e is that the structure 110 can be a thin wafer. In other words, the carrier 120 may be a silicon wafer (eg, 700 μm) with a thin wafer (structure 110) on top. Therefore, FIG. 3b shows the bonding of the dicing tape 130 to the thin wafer 110, FIG. 3c shows the peeling of the thin wafer 110 from the carrier 120 by the device 100, and FIGS. 3d and 3e show the peeling from the carrier 120. A state in which the dicing tape with the thin wafer 110 is attached to the tape frames 170 ₁ and 170 ₂ is shown.

FIG. 4a shows the carrier 120 in a state where the structure 110 is bonded to the main surface region of the carrier 120 by, for example, an adhesive 114. For example, the structure 110 may be a thin wafer. According to one embodiment, the thin wafer 110 is temporarily bonded to the main surface region of the carrier 120 by the adhesive 114.

FIG. 4b shows a device 100 having the same features and functions as the device 100 shown in FIG. 2b or FIG. 3b. The difference between FIGS. 4b, 2b and 3b is that the structure 110 is connected to the carrier 120 by an adhesive 114. In FIG. 4b, the device 100 attaches the tape 130 to the structure 110. The bond between the structure 110 and the tape 130 created by bonding the tape 130 to the structure 110 should be stronger than the bond between the structure 110 and the carrier 120 made by the adhesive 114. Please note.

The strength of the bond between the structure 110 and the tape 130 is particularly important for the peeling steps shown in FIGS. 4c and 4d. The structure 110 can adhere to the tape 130 more strongly than the carrier 120 to be peeled off by the device 100.

4c and 4d show the peeling of the structure 110 having the same features and functions as those shown in FIGS. 2c and 3c, only the difference is that the structure 110 is placed on the carrier 120 with the adhesive 114. be.

In FIG. 4c, the deflection element 150 of the device 100 is, for example, a roller, and in FIG. 4d, the deflection element 150 of the device 100 is, for example, a wedge. Since the wedge 150 shown in FIG. 4d has, for example, the diameter of the rounded corner at the deflection line 152 that is smaller than the diameter of the roller 150 in FIG. 4c, the deflection angle 154 in FIG. 4d is the deflection in FIG. 4c. It can be selected larger than the angle 154. According to one embodiment, when the deflection element 150 is a roller, as shown in FIG. 4c, the deflection angle 154 may be 90 °, or as shown in FIG. 4d, the deflection element 150 is the diameter of the roller. For wedges with a smaller diameter, for example up to 143 °.

5a-5e show the same features and functions as FIGS. 2a-2e and 3a-3e, a thin die (non-built-up device) in which the structure 110 is adhered to, for example, a carrier 120 with an adhesive 114. There is a difference that it is equipped with. The adhesive 114 is also similar to the adhesive 114 shown in FIGS. 4a-4d and may be for temporary binding of the structure 110 to the carrier 120.

6a-6e show the same features and functions as FIGS. 2a-2e, 3a-3e, and 5a-5e, wherein the structure 110 is connected to the carrier 120 by the holding structure 116. There is a difference that it is equipped with. The retaining structure 116 can create a groove below the structure 110 (between the structure 110 and the main surface area of the carrier 120). For example, the device in structure 110 may be a flexible particle barrier for microphones.

According to one embodiment, by breaking off the structure from the holding structure 116 so that only the structure adheres to the tape 130 and the holding structure 116 remains on the carrier 120, as shown in FIG. 6c. , The structure 110 can be detached from the carrier 120. For example, the holding structure 116 may have a predetermined break point, where it can be broken by the device 100 to separate the structure 110.

FIG. 7 shows a method 200 for stripping the structure from the main surface area of the carrier.
Step 210 for attaching the tape to the structure, step 220 for extending the tape while maintaining tension between the first holding portion and the second holding portion, and the second holding portion for the main surface area of the carrier. Step 230 for moving to a lifting position with a vertical offset with respect to, and step 240 for setting a deflection element on the tape towards the first end of the structure, the first holding and the first. Step 240, which provides a deflection line disposed between the two holdings and deflects the tape in response to the movement of the second holding to the lifting position, and the deflection element at the first end of the structure. Includes step 250, which moves the deflection line parallel to the carrier by moving it parallel to the carrier from the portion to the second end of the structure, whereby the structure affixed to the tape is stripped from the carrier. The block diagram of the method 200 is shown. Peeling allows, for example, the structure to be transferred to tape.

Optionally, the step 210 to be bonded and the step 220 to be bridged are the step 220a in which the tape is bridged between the first holding portion and the second holding portion, which may correspond to the step 220 to be bridged . It can also be swapped as indicated by step 210a, which corresponds to step 210 and attaches the tape to the structure.

According to one embodiment, the method 200 is before step 210, where the tape is attached to the structure, or before step 220a, where the tape is bridged between the first holding portion and the second holding portion. Can include step 260 to cut into dimensions slightly larger than the dimensions of the structure. Therefore, the tape can already have the proper dimensions for stripping the structure from the carrier 120 by the device. Thus, for example, the steps shown in FIGS. 2e, 3e, 5e, and 6e are only optional, as the tape can already have the correct dimensions, for example by cutting step 260, eg, FIG. 2e, FIG. When the tape is attached to the tape frame as shown in 3e, 5e, and 6e, the first and second retainers tape without having to re-cut the tape with a cutting element. Can be released.

According to one embodiment, the method 200 includes a step 270 of attaching a tape with a structure to a tape frame. Therefore, the structure bonded to the tape is fixed to the tape frame and can be released from the device 100.

According to one embodiment, the method 200 can include step 270, where the tape with the structure is attached to the tape frame, followed by step 280, which cuts the tape to a size slightly larger than the size of the structure. ..

According to one embodiment, the method 200 can include cutting step 260 or cutting step 280. The tape does not need to be cut twice, at the beginning of the method and at the end of the method, for example, it is sufficient to cut the tape first by cutting step 260 or last by cutting step 280.

According to one embodiment, the device 100 for peeling the structure 110 from the main surface region of the carrier 120 spans the tape 130 for sticking to the structure 110 and the tape 130 while maintaining tension . One holding portion 140 and a second holding portion 142, at least the second holding portion 142, are movable to a lifting position 144 having a vertical displacement 146 with respect to the main surface region of the carrier 120. A second holding portion 140 and a second holding portion 142, and a deflection line 152 arranged between the first holding portion 140 and the second holding portion 142 are provided, and a second holding portion 144 to the lifting position 144 is provided. A deflection element 150 for deflecting the tape 130 in response to the movement of the holding portion 142 is provided, and the deflection element 150 moves the deflection line 152 in parallel with the carrier 120 to form a structure 110 bonded to the tape 130. It is arranged so as to be movable in parallel with the carrier 120 in order to be separated from the carrier 120.

Device (100) according to one embodiment, wherein the deflection element (150) is a roller, in particular a rotatable roller, or a wedge, in particular a wedge with rounded corners that are corners at the deflection line (152).

The deflection line (152) is separated from the carrier (120) and the first portion (132) of the structure (110) bonded to the carrier (120) and attached to the tape (130), and the tape (130). Device (100) according to one embodiment that separates from a second portion (134) of the structure (110) that is transferred to.

The second holding portion (142) can also move laterally with respect to the main surface of the carrier (120), and the deflection angle (154) of the tape (130) at the deflection line (152) is the second. Device (100) according to one embodiment, which is adjustable based on a combination of lateral and vertical movements of the holding portion (142) and based on the lateral position of the deflection element (150).

Device (100) according to one embodiment, wherein the deflection angle (154) is from 10 ° to 170 °.

The device (100) according to one embodiment, wherein the first holding portion (140) and / or the second holding portion (142) is arranged so as to keep the tension of the tape (130) constant.

Device (100) according to one embodiment, wherein the first holding portion (140) and / or the second holding portion (142) is a roller, particularly a rotatable roller.

Device (100) according to one embodiment, wherein the tape (130) is configured to transfer the structure (110) from the carrier (120) to the tape frame (170 ₁ , 170 ₂ ).

Device (100) according to one embodiment, wherein the structure to be stripped (110) is flexible and comprises a polymer device or silicon having an extension perpendicular to the carrier (120) smaller than 50 μm.

A method (200) for stripping the structure (110) from the main surface region of the carrier (120).
The step (210) of attaching the tape (130) to the structure (110),
A step (220) in which the tape (130) is bridged between the first holding portion (140) and the second holding portion (142) in order to maintain the tension of the tape (130).
A step (230) of moving the second holding portion (142) to a lifting position (144) having a vertical offset (146) with respect to the main surface region of the carrier (120).
A step (240) of setting a deflection element (150) towards the first end of the structure (110) on the tape (130), the first holding portion (140) and the second holding portion. A step of providing a deflection line (152) disposed between (142) and deflecting the tape (130) in response to the movement of the second holding portion (142) to the lifting position (144).
The deflection element (150) is moved parallel to the carrier (120) from the first end of the structure (110) to the second end of the structure (110) to move the deflection line (152) to the carrier (120). A method (200) comprising a step (250) of moving in parallel with the carrier (120), wherein the structure (110) attached to the tape (130) is stripped from the carrier (120).

A method according to one embodiment (200) comprising a step of cutting the tape (130) to a size slightly larger than the size of the structure (110) prior to the step of attaching the tape (130) to the structure (110). ).

A method according to one embodiment (200) comprising attaching a tape (130) with a structure (110) to a tape frame (170 ₁ , 170 ₂ ).

After the step of attaching the tape (130) with the structure (110) to the tape frame (170 ₁ , 170 ₂ ), the tape (130) is cut to a size slightly larger than the size of the structure (110). A method according to one embodiment (200), comprising steps.

Although some embodiments have been described as features in the context of the device, it is clear that such descriptions may be considered as descriptions of the corresponding features of the method. Although some embodiments have been described as features in the context of the method, it is clear that such descriptions may be considered as descriptions of the corresponding features relating to the function of the device.

In the section of embodiments for carrying out the invention described above, it can be seen that various features are summarized in some examples for the purpose of facilitating the present disclosure. This disclosure method should not be construed as expressing the intent that the claimed example requires more features than those expressly stated in each claim. Rather, as the appended claims represent, the subject matter of the invention may not be all the features of a single disclosed example. Therefore, the appended claims are incorporated herein into the sections of embodiments for carrying out the invention, and each claim can stand on its own as a separate example. While each claim can stand on its own as a separate example, in the claims, the dependent claim may represent a particular combination with one or more other claims, but other examples. Note that may also include combinations of dependent claims with the subject matter of each other dependent claim, or features with other dependent or independent claims. Such combinations are proposed herein unless it is explicitly stated that no particular combination is intended. Furthermore, it is also intended to include the characteristics of a claim in the independent claim, even if the claim is not directly dependent on any other independent claim.

Although specific embodiments have been illustrated and described herein, various alternative and / or equivalent implementations may be used in place of the specific embodiments illustrated and described without departing from the scope of the invention. Those skilled in the art will understand that they can. The present application is intended to cover any adaptation or modification of the particular embodiments discussed herein. Accordingly, the invention is intended to be limited only by the claims and their equivalents.

100 Device 110 Structure 112 Dimensions 114 Adhesive 116 Retaining Structure 120 Carrier 122 Thickness 130 Tape 132 First Part 134 Second Part 140 First Retaining Part 142 Second Retaining Part 144 Lifting Position 146 Vertical Deviation 150 Deflection element 152 Deflection line 154 Polarization angle 160 Control device 170 ₁ First tape frame 170 ₂ Second tape frame 180 Cutting element 210, 210a, 270 Bonding step 220, 220a Crossing step 230 Moving step 240 Setting Step 250 Peeling step 260, 280 Cutting step

Claims (14)

A device (100) for stripping the structure (110) from the main surface region of the carrier (120).
A tape (130) for being attached to the structure (110) and
A first holding portion (140) and a second holding portion (142) that maintain tension and bridge the tape (130), and at least the second holding portion (142) is the carrier (the carrier (142). A first holding portion (140) and a second holding portion (142) that are movable to a lifting position (144) having a vertical displacement (146) with respect to the main surface region of 120).
A deflection line (152) arranged between the first holding portion (140) and the second holding portion (142) is provided, and the second holding portion (the second holding portion (144) to the lifting position (144) is provided. It is provided with a deflection element (150) for deflecting the tape (130) in response to the movement of 142).
The deflection element (150) moves the deflection line (152) parallel to the carrier (120) and peels the structure (110) attached to the tape (130) from the carrier (120). Therefore, it is arranged so as to be movable in parallel with the carrier (120).
Device (100). The device (100) of claim 1, wherein the deflection element (150) is a roller, particularly a rotatable roller, or a wedge, particularly a wedge with rounded corners that are corners of the deflection line (152). ). The deflection line (152) is separated from the first portion (132) of the structure (110) bonded to the carrier (120) and attached to the tape (130) and from the carrier (120). The device (100) according to claim 1 or 2, which separates the second portion (134) of the structure (110) which is transferred to the tape (130). The second holding portion (142) can also move laterally with respect to the main surface of the carrier (120), and the deflection angle (154) of the tape (130) at the deflection line (152). 1 to 3 can be adjusted based on the combination of lateral and vertical movements of the second holding portion (142) and based on the lateral position of the deflection element (150). The device (100) according to any one of the above. The device (100) according to claim 4, wherein the deflection angle (154) is 10 ° to 170 °. One of claims 1 to 5, wherein the first holding portion (140) and / or the second holding portion (142) is arranged so as to keep the tension of the tape (130) constant. The device (100) according to the above. The device (100) according to any one of claims 1 to 6, wherein the first holding portion (140) and / or the second holding portion (142) is a roller, particularly a rotatable roller. .. The invention according to any one of claims 1 to 7, wherein the tape (130) is configured to transfer the structure (110) from the carrier (120) to the tape frame (170 ₁ , 170 ₂ ). Device (100). Any one of claims 1-8, wherein the structure (110) to be stripped comprises a polymer device or silicon that is flexible and has an extension perpendicular to the carrier (120) that is less than 50 μm. The device (100) according to the above. A method (200) for stripping the structure (110) from the main surface region of the carrier (120).
In the step (210) of attaching the tape (130) to the structure (110),
A step (220) in which the tape (130) is bridged between the first holding portion (140) and the second holding portion (142) so as to maintain tension .
A step (230) of moving the second holding portion (142) to a lifting position (144) having a vertical displacement (146) with respect to the main surface region of the carrier (120).
The step (240) of setting the deflection element (150) toward the first end of the structure (110) on the tape (130), the first holding portion (140) and the first. A deflection line (152) is provided between the holding portion (142) and the tape (130) in response to the movement of the second holding portion (142) to the lifting position (144). ) And the step (240)
The deflection element (150) is moved parallel to the carrier (120) from the first end of the structure (110) to the second end of the structure (110) and the deflection line ( The step (250) of moving the 152) in parallel with the carrier (120), whereby the structure (110) attached to the tape (130) is peeled off from the carrier (120). (250) and
(200). A claim comprising a step of cutting the tape (130) to a size slightly larger than the size of the structure (110) prior to the step of attaching the tape (130) to the structure (110). 10. The method according to 10 (200). 10. The method (200) of claim 10 or 11, comprising attaching the tape (130) with the structure (110) to a tape frame (170 ₁ , 170 ₂ ). After the step of attaching the tape (130) with the structure (110) to the tape frame (170 ₁ , 170 ₂ ), the tape (130) is slightly smaller than the dimensions of the structure (110). 12. The method of claim 12, comprising the step of cutting to a larger size (200). The first holding portion (140) and the second holding portion (142) do not have a vertical deviation (146) with respect to the main surface region of the carrier (120). The device (100) according to any one of claims 1 to 9, which is arranged on both sides of the structure (110).

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