JP2009081176A - 絶縁性配線基板、これを用いた半導体パッケージ、および絶縁性配線基板の製造方法 - Google Patents
絶縁性配線基板、これを用いた半導体パッケージ、および絶縁性配線基板の製造方法 Download PDFInfo
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- JP2009081176A JP2009081176A JP2007247553A JP2007247553A JP2009081176A JP 2009081176 A JP2009081176 A JP 2009081176A JP 2007247553 A JP2007247553 A JP 2007247553A JP 2007247553 A JP2007247553 A JP 2007247553A JP 2009081176 A JP2009081176 A JP 2009081176A
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- wiring board
- semiconductor chip
- insulating wiring
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- insulating
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Abstract
【解決手段】本発明の絶縁性配線基板8は、両面がソルダーレジストに覆われ、半導体チップ搭載領域2における、両面の導体層を導通する少なくとも1つ以上のビアホール4が絶縁性配線基板8を貫通し、貫通した少なくとも1つ以上のビアホール4部分を除く部分がソルダーレジストで覆われているので、絶縁性配線基板8上に配線できない領域を減らしつつ、絶縁性配線基板8が吸湿した水分等の加熱膨張によって生じる不具合を防止する絶縁性配線基板8を実現することができる。
【選択図】図1
Description
上記課題を解決するために、本発明に係る半導体パッケージは、両面に導体層が形成され、一方の面に半導体チップが搭載される搭載領域を有し、上記搭載領域における、上記両面の導体層を導通する少なくとも1つ以上のビアホールが上記絶縁性配線基板を貫通している絶縁性配線基板と、上記絶縁性配線基板の半導体チップ搭載領域に搭載された半導体チップとを備え、上記半導体チップは、樹脂封止されていることを特徴としている。
2 半導体チップ搭載領域
3 信号配線
4 ビアホール
5 ワイヤボンド端子
6 ビアホール内貫通孔
7 金属細線
8 絶縁性配線基板
9 半田ボール
10 封止樹脂
11 水分放出用貫通孔
20 コア基板
21 銅箔
22 銅メッキ
23 貫通孔
24 ドライフィルム
25 ソルダーレジスト
26 ドライフィルム
27 ニッケル、金
Claims (5)
- 両面に導体層が形成され、一方の面に半導体チップが搭載される搭載領域を有している絶縁性配線基板において、
両面がソルダーレジストに覆われ、
上記搭載領域における、上記両面の導体層を導通する少なくとも1つ以上のビアホールが上記絶縁性配線基板を貫通し、上記貫通した少なくとも1つ以上のビアホール部分を除く部分がソルダーレジストで覆われていることを特徴とする絶縁性配線基板。 - 上記絶縁性配線基板を貫通したビアホールが少なくとも2つ以上形成されており、
上記2つ以上の貫通したビアホールの間のソルダーレジストが所定の幅で取り除かれていることを特徴とする請求項1に記載の絶縁性配線基板。 - 両面に導体層が形成され、一方の面に半導体チップが搭載される搭載領域を有し、上記搭載領域における、上記両面の導体層を導通する少なくとも1つ以上のビアホールが上記絶縁性配線基板を貫通している絶縁性配線基板と、
上記絶縁性配線基板の半導体チップ搭載領域に搭載された半導体チップとを備え、
上記半導体チップは、樹脂封止されていることを特徴とする半導体パッケージ。 - 請求項1または2に記載の絶縁性配線基板と、
上記絶縁性配線基板の半導体チップ搭載領域に搭載された半導体チップとを備え、
上記半導体チップは、樹脂封止されていることを特徴とする半導体パッケージ。 - 両面に導体層が形成され、一方の面に半導体チップが搭載される搭載領域を有している絶縁性配線基板の製造方法であって、
上記両面の導体層を導通するビアホールを形成するステップと、
上記ビアホールを形成した絶縁性配線基板の両面にソルダーレジストを塗布するステップと、
上記搭載領域における、上記ビアホールのうち、少なくとも1つ以上のビアホール部分の上記ソルダーレジストを取り除くステップと、を含むことを特徴とする絶縁性配線基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007247553A JP4659802B2 (ja) | 2007-09-25 | 2007-09-25 | 絶縁性配線基板、これを用いた半導体パッケージ、および絶縁性配線基板の製造方法 |
US12/212,089 US20090184413A1 (en) | 2007-09-25 | 2008-09-17 | Insulative wiring board, semiconductor package using the same, and method for producing the insulative wiring board |
CNA2008102152427A CN101399249A (zh) | 2007-09-25 | 2008-09-22 | 绝缘配线基板及其制造方法和使用了该基板的半导体封装 |
TW097136349A TW200935573A (en) | 2007-09-25 | 2008-09-22 | Insulative wiring board, semiconductor package using the same, and method for producing the insulative wiring board |
Applications Claiming Priority (1)
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JP2007247553A JP4659802B2 (ja) | 2007-09-25 | 2007-09-25 | 絶縁性配線基板、これを用いた半導体パッケージ、および絶縁性配線基板の製造方法 |
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JP2009081176A true JP2009081176A (ja) | 2009-04-16 |
JP4659802B2 JP4659802B2 (ja) | 2011-03-30 |
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JP2007247553A Expired - Fee Related JP4659802B2 (ja) | 2007-09-25 | 2007-09-25 | 絶縁性配線基板、これを用いた半導体パッケージ、および絶縁性配線基板の製造方法 |
Country Status (4)
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US (1) | US20090184413A1 (ja) |
JP (1) | JP4659802B2 (ja) |
CN (1) | CN101399249A (ja) |
TW (1) | TW200935573A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2022145928A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145931A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145930A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145927A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145929A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022160670A (ja) * | 2020-03-30 | 2022-10-19 | 株式会社藤商事 | 遊技機 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115621243B (zh) * | 2022-12-15 | 2023-04-07 | 北京唯捷创芯精测科技有限责任公司 | 降低翘曲应力的基板、封装结构、电子产品及制备方法 |
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- 2007-09-25 JP JP2007247553A patent/JP4659802B2/ja not_active Expired - Fee Related
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2008
- 2008-09-17 US US12/212,089 patent/US20090184413A1/en not_active Abandoned
- 2008-09-22 TW TW097136349A patent/TW200935573A/zh unknown
- 2008-09-22 CN CNA2008102152427A patent/CN101399249A/zh active Pending
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JPH03108791A (ja) * | 1989-09-22 | 1991-05-08 | Matsushita Electric Works Ltd | プリント配線板 |
JPH09205164A (ja) * | 1995-12-20 | 1997-08-05 | Samsung Electron Co Ltd | 半導体チップパッケージ及びその製造方法 |
JPH1126627A (ja) * | 1997-07-03 | 1999-01-29 | Mitsui Chem Inc | 半導体搭載用基板 |
JPH11186432A (ja) * | 1997-12-25 | 1999-07-09 | Canon Inc | 半導体パッケージ及びその製造方法 |
JP2001007246A (ja) * | 1999-06-24 | 2001-01-12 | Hitachi Cable Ltd | Bga用配線テープ及びそれを用いた半導体装置 |
JP2002171065A (ja) * | 2000-11-30 | 2002-06-14 | Sony Corp | 多層プリント配線板の製造方法 |
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JP2022145928A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145931A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145930A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145927A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022145929A (ja) * | 2020-03-30 | 2022-10-04 | 株式会社藤商事 | 遊技機 |
JP2022160670A (ja) * | 2020-03-30 | 2022-10-19 | 株式会社藤商事 | 遊技機 |
JP7438291B2 (ja) | 2020-03-30 | 2024-02-26 | 株式会社藤商事 | 遊技機 |
JP7438290B2 (ja) | 2020-03-30 | 2024-02-26 | 株式会社藤商事 | 遊技機 |
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JP4659802B2 (ja) | 2011-03-30 |
CN101399249A (zh) | 2009-04-01 |
US20090184413A1 (en) | 2009-07-23 |
TW200935573A (en) | 2009-08-16 |
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