JP2009078502A5 - - Google Patents
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- JP2009078502A5 JP2009078502A5 JP2007251006A JP2007251006A JP2009078502A5 JP 2009078502 A5 JP2009078502 A5 JP 2009078502A5 JP 2007251006 A JP2007251006 A JP 2007251006A JP 2007251006 A JP2007251006 A JP 2007251006A JP 2009078502 A5 JP2009078502 A5 JP 2009078502A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- crack
- work
- nozzle
- cleaving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims description 67
- 238000005520 cutting process Methods 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 23
- 206010053759 Growth retardation Diseases 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 13
- 239000011521 glass Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000005489 elastic deformation Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000007664 blowing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 239000006063 cullet Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000001755 vocal effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007251006A JP5171186B2 (ja) | 2007-09-27 | 2007-09-27 | 脆性材料基板の割断装置および割断方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007251006A JP5171186B2 (ja) | 2007-09-27 | 2007-09-27 | 脆性材料基板の割断装置および割断方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009078502A JP2009078502A (ja) | 2009-04-16 |
| JP2009078502A5 true JP2009078502A5 (https=) | 2010-10-14 |
| JP5171186B2 JP5171186B2 (ja) | 2013-03-27 |
Family
ID=40653624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007251006A Expired - Fee Related JP5171186B2 (ja) | 2007-09-27 | 2007-09-27 | 脆性材料基板の割断装置および割断方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5171186B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5237318B2 (ja) * | 2010-03-19 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | 基板分断装置 |
| JP5194076B2 (ja) * | 2010-08-27 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | レーザ割断装置 |
| JP6381539B2 (ja) | 2012-11-29 | 2018-08-29 | コーニング インコーポレイテッド | 異なる幅のガラスリボンを製造するための方法及び装置 |
| KR101948382B1 (ko) * | 2013-01-30 | 2019-02-14 | 코닝 인코포레이티드 | 가요성 유리의 연속 레이저 절단을 위한 장치 및 방법 |
| US9260337B2 (en) * | 2014-01-09 | 2016-02-16 | Corning Incorporated | Methods and apparatus for free-shape cutting of flexible thin glass |
| EP3107868B1 (en) | 2014-02-20 | 2021-05-26 | Corning Incorporated | Methods for cutting radii in flexible thin glass |
| WO2016011114A1 (en) * | 2014-07-18 | 2016-01-21 | Corning Incorporated | Methods and apparatus for controlled laser cutting of flexible glass |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3751122B2 (ja) * | 1997-06-25 | 2006-03-01 | 長崎県 | 割断加工方法 |
| JP2003286044A (ja) * | 2002-03-27 | 2003-10-07 | Sharp Corp | 基板分断装置および基板分断方法 |
| JP2005001264A (ja) * | 2003-06-12 | 2005-01-06 | Sharp Corp | 分断装置および分断方法 |
| JP4619024B2 (ja) * | 2004-03-19 | 2011-01-26 | 芝浦メカトロニクス株式会社 | 脆性材料の割断加工システム及びその方法 |
| JP2004256391A (ja) * | 2004-05-18 | 2004-09-16 | Beldex Corp | スクライブ方法および装置 |
| WO2006129563A1 (ja) * | 2005-05-30 | 2006-12-07 | Mitsuboshi Diamond Industrial Co., Ltd. | 脆性材料基板分断装置および分断方法 |
| JP2007090860A (ja) * | 2005-09-01 | 2007-04-12 | Shibaura Mechatronics Corp | 脆性材料の割断加工システム及びその方法 |
| WO2007037118A1 (ja) * | 2005-09-28 | 2007-04-05 | Shibaura Mechatronics Corporation | 脆性材料のレーザ割断装置、レーザ割断システム及びその方法 |
-
2007
- 2007-09-27 JP JP2007251006A patent/JP5171186B2/ja not_active Expired - Fee Related
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