JP2009071186A5 - - Google Patents

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Publication number
JP2009071186A5
JP2009071186A5 JP2007240000A JP2007240000A JP2009071186A5 JP 2009071186 A5 JP2009071186 A5 JP 2009071186A5 JP 2007240000 A JP2007240000 A JP 2007240000A JP 2007240000 A JP2007240000 A JP 2007240000A JP 2009071186 A5 JP2009071186 A5 JP 2009071186A5
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JP
Japan
Prior art keywords
frame
led package
led
lens
unit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007240000A
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Japanese (ja)
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JP2009071186A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007240000A priority Critical patent/JP2009071186A/en
Priority claimed from JP2007240000A external-priority patent/JP2009071186A/en
Publication of JP2009071186A publication Critical patent/JP2009071186A/en
Publication of JP2009071186A5 publication Critical patent/JP2009071186A5/ja
Pending legal-status Critical Current

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Claims (11)

金属配線を有する基板と、
前記金属配線と電気的に接続され、前記基板に実装されるＬＥＤパッケージと、
前記ＬＥＤパッケージに対し位置決め固定される枠体と、
前記枠体に対し位置決め固定され、前記ＬＥＤパッケージの光軸と所定の位置関係となるよう配置されたレンズと、
前記基板と熱的に接触し、前記レンズと固定される放熱部材とを備えるＬＥＤユニット。 A substrate having metal wiring;
An LED package electrically connected to the metal wiring and mounted on the substrate;
A frame body positioned and fixed to the LED package;
A lens that is positioned and fixed with respect to the frame and is arranged to have a predetermined positional relationship with the optical axis of the LED package;
An LED unit comprising a heat dissipation member that is in thermal contact with the substrate and is fixed to the lens. 前記ＬＥＤパッケージと前記枠体との位置決め固定が、前記ＬＥＤパッケージを前記枠体に形成された該ＬＥＤパッケージと略同形状の収容部との嵌合により行われるものである請求項１記載のＬＥＤユニット。 Positioning and fixing of the frame member and the LED package, LED of claim 1, wherein those performed by fitting between the housing portion of the LED package the LED package substantially the same shape formed on the frame unit. 前記ＬＥＤパッケージと前記枠体との位置決め固定が、前記ＬＥＤパッケージ又は前記枠体の一方に形成されたピンと、前記ＬＥＤパッケージ又は前記枠体の他方に形成された穴との嵌合により行われるものである請求項１記載のＬＥＤユニット。 The LED package and the frame body are positioned and fixed by fitting a pin formed on one of the LED package or the frame body and a hole formed on the other side of the LED package or the frame body. The LED unit according to claim 1 . 前記ＬＥＤパッケージと前記枠体との位置決め固定が、前記ＬＥＤパッケージと前記枠体の形成された収容部の内壁との間に設けられた接触部を介した嵌合により行われるものである請求項１記載のＬＥＤユニット。 The positioning and fixing of the LED package and the frame body are performed by fitting via a contact portion provided between the LED package and an inner wall of a housing portion where the frame body is formed. The LED unit according to 1 . 前記ＬＥＤパッケージと前記枠体との位置決め固定が、前記ＬＥＤパッケージと前記枠体の収容部の内壁との間に設けられたバネ部材の付勢力による嵌合により行われるものである請求項１記載のＬＥＤユニット。 Claim positioning and fixing of the LED package and the frame is intended to be carried out by by that fit the biasing force of the spring member provided between the LED package and the inner wall of the housing portion of the frame The LED unit according to 1 . 前記枠体と前記レンズとの位置決め固定が、前記枠体を前記レンズに形成された該枠体と略同形状の収容部との嵌合により行われるものである請求項１〜５の何れか１記載のＬＥＤユニット。 The positioning and fixing of the frame and the lens are performed by fitting the frame with a housing portion having substantially the same shape as the frame formed on the lens . The LED unit according to 1 . 前記枠体と前記レンズとの位置決め固定が、前記枠体又は前記レンズの一方に形成されたピンと、前記枠体又は前記レンズの他方に形成された穴との嵌合により行われるものである請求項１〜５の何れか１記載のＬＥＤユニット。 The positioning and fixing of the frame and the lens is performed by fitting a pin formed on one of the frame or the lens and a hole formed on the other of the frame or the lens. Item 6. The LED unit according to any one of Items 1 to 5 . 前記枠体と前記レンズとの位置決め固定が、前記枠体の外周と前記レンズの収容部の内壁との間に設けられた接触部を介した嵌合により行われるものである請求項１〜５の何れか１記載のＬＥＤユニット。 Positioning and fixing of the frame and the lens, according to claim 1 to 5 are intended to be performed by fitting through a contact portion provided between the inner wall of the housing portion of the outer periphery and the lens of the frame The LED unit according to any one of the above. 前記枠体と前記レンズとの位置決め固定が、前記枠体の外周と前記レンズの収容部の内壁との間に設けられたバネ部材の付勢力による嵌合により行われるものである請求項１〜５の何れか１記載のＬＥＤユニット。 Claim positioning and fixing of the frame and the lens is what is performed by by that fit the biasing force of the spring member provided between the inner wall of the housing portion of the outer periphery and the lens of the frame The LED unit according to any one of 1 to 5 . 前記基板が前記枠体と前記放熱部材とで挟まれる構造を有し、該構造により前記ＬＥＤパッケージが前記放熱部材に対し所定の位置関係となるよう配置されることを特徴とする請求項１〜９の何れか１記載のＬＥＤユニット。 The said board | substrate has a structure pinched | interposed by the said frame and the said heat radiating member, The said LED package is arrange | positioned by this structure so that it may become a predetermined positional relationship with respect to the said heat radiating member. The LED unit according to any one of 9 . 前記基板が前記ＬＥＤパッケージの実装領域に開口部を有し、前記ＬＥＤパッケージと前記放熱部材が前記開口部を介し熱的に接触するよう構成される請求項１〜１０の何れか１記載のＬＥＤユニット。 Wherein the substrate has an opening in the mounting region of the LED package, LED of any one described consists claim 1-10 such that the heat radiating member and the LED package is in thermal contact through the opening unit.
JP2007240000A 2007-09-14 2007-09-14 Led unit Pending JP2009071186A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007240000A JP2009071186A (en) 2007-09-14 2007-09-14 Led unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007240000A JP2009071186A (en) 2007-09-14 2007-09-14 Led unit

Publications (2)

Publication Number Publication Date
JP2009071186A JP2009071186A (en) 2009-04-02
JP2009071186A5 true JP2009071186A5 (en) 2010-10-07

Family

ID=40607102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007240000A Pending JP2009071186A (en) 2007-09-14 2007-09-14 Led unit

Country Status (1)

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JP (1) JP2009071186A (en)

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US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
JP5479232B2 (en) * 2010-06-03 2014-04-23 シャープ株式会社 Display device and manufacturing method of display device
KR101786089B1 (en) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 The light emitting device package having UV light emitting diode and the light emitting module
KR101894041B1 (en) * 2011-10-17 2018-09-04 서울반도체 주식회사 Light emitting device and light emitting module comprising the same
JP5964132B2 (en) 2012-05-23 2016-08-03 船井電機株式会社 Display device
KR102075522B1 (en) * 2013-01-07 2020-02-10 엘지이노텍 주식회사 Light-emitting device
KR102024297B1 (en) * 2013-10-07 2019-09-23 엘지이노텍 주식회사 Lens module and light emitting device package including the same
CN105814362B (en) 2013-10-07 2020-03-10 Lg伊诺特有限公司 Lens module and light emitting device package including the same
CN103697440A (en) * 2013-11-30 2014-04-02 南通环球光学仪器有限公司 LED (Light Emitting Diode) lamp bead radiating fin
KR101544488B1 (en) * 2013-12-18 2015-08-17 한국원자력연구원 Mount board for surface mount and method of mounting the same of semiconductor sensor
KR102220505B1 (en) * 2015-01-29 2021-02-25 엘지이노텍 주식회사 A light emitting module
US10008648B2 (en) 2015-10-08 2018-06-26 Semicon Light Co., Ltd. Semiconductor light emitting device
US11038086B2 (en) 2016-03-07 2021-06-15 Semicon Light Co., Ltd. Semiconductor light-emitting element and manufacturing method therefor
KR101855189B1 (en) * 2016-03-07 2018-05-09 주식회사 세미콘라이트 Semiconductor light emitting device

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JPH0420004U (en) * 1990-06-11 1992-02-19
JPH07228002A (en) * 1994-02-18 1995-08-29 Rohm Co Ltd Optical recording head
JP3481387B2 (en) * 1996-04-08 2003-12-22 アルパイン株式会社 Optical element holding structure
JPH11163420A (en) * 1997-11-28 1999-06-18 Optonix Kk Led lamp
JP4119329B2 (en) * 2002-07-16 2008-07-16 シーシーエス株式会社 Light irradiation device
JP4398781B2 (en) * 2004-05-06 2010-01-13 ローム株式会社 Light emitting device
JP4529795B2 (en) * 2005-05-25 2010-08-25 パナソニック電工株式会社 Light emitting device and lighting apparatus using the same
JP2007005378A (en) * 2005-06-21 2007-01-11 Sharp Corp Light-emitting device, method of manufacturing the same, and electronic apparatus

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