JP2005315157A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005315157A5 JP2005315157A5 JP2004133534A JP2004133534A JP2005315157A5 JP 2005315157 A5 JP2005315157 A5 JP 2005315157A5 JP 2004133534 A JP2004133534 A JP 2004133534A JP 2004133534 A JP2004133534 A JP 2004133534A JP 2005315157 A5 JP2005315157 A5 JP 2005315157A5
- Authority
- JP
- Japan
- Prior art keywords
- pump
- rotating body
- attachment portions
- housing
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000003507 refrigerant Substances 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 2
- 230000005484 gravity Effects 0.000 claims 1
Claims (8)
上記ポンプ室内に設けられた回転体と、
この回転体を回転させるモータと、を具備することを特徴とするポンプ。 A heat receiving surface thermally connected to the heating element, a pump chamber, and a pump housing having three attachment portions;
A rotating body provided in the pump chamber;
Pump characterized by comprising a motor for rotating the rotating body.
上記3つの取付け部のうちの2つの取付け部は、上記一対の辺のうちの一方の辺の両端部に対応する位置に夫々設けられているとともに、上記3つの取付け部のうちの残りの1つの取付け部は、上記一対の辺のうちの他方の辺の中間部に対応する位置に設けられていることを特徴とする請求項1乃至請求項3のいずれか1項に記載のポンプ。 The heat receiving surface of the pump housing has a pair of sides facing each other,
Two of the three attachment portions are provided at positions corresponding to both ends of one of the pair of sides, and the remaining one of the three attachment portions. The pump according to any one of claims 1 to 3, wherein the one attachment portion is provided at a position corresponding to an intermediate portion of the other side of the pair of sides.
上記回転体は、上記ポンプハウジングの中心に対して上記一対の辺のうちの一方の辺の方向に偏心させた姿勢でポンプ室内に設けられており、
上記3つの取付け部のうちの2つの取付け部は、上記一対の辺のうちの一方の辺の両端部に対応する位置に夫々設けられているとともに、上記3つの取付け部のうちの残りの1つの取付け部は、上記一対の辺のうちの他方の辺の中間部に対応する位置に設けられていることを特徴とする請求項1乃至請求項3のいずれか1項に記載のポンプ。 The heat receiving surface of the pump housing has a pair of sides facing each other,
The rotating body is provided in the pump chamber in a posture that is eccentric in the direction of one of the pair of sides with respect to the center of the pump housing,
Two of the three attachment portions are provided at positions corresponding to both ends of one of the pair of sides, and the remaining one of the three attachment portions. The pump according to any one of claims 1 to 3, wherein the one attachment portion is provided at a position corresponding to an intermediate portion of the other side of the pair of sides.
上記放熱部に熱的に接続される循環経路と、A circulation path thermally connected to the heat radiating portion;
上記循環経路内に冷媒を強制循環させるとともに、発熱体に熱的に接続される受熱面を有するポンプと、を具備し、A forced circulation of the refrigerant in the circulation path, and a pump having a heat receiving surface thermally connected to the heating element,
上記ポンプは、The above pump
上記冷媒を上記循環経路に送り出す回転体が収容されるポンプ室と、A pump chamber in which a rotating body for sending out the refrigerant to the circulation path is housed;
上記回転体を回転させるモータと、A motor for rotating the rotating body;
3つの取付け部と、Three mounting parts;
を備えることを特徴とする冷却装置。A cooling device comprising:
放熱部と、この放熱部に熱的に接続される循環経路と、この循環経路内に冷媒を強制循環させるとともに、上記発熱体に熱的に接続される受熱面を有するポンプと、を備える冷却装置と、を具備し、Cooling comprising: a heat dissipating part; a circulation path thermally connected to the heat dissipating part; and a pump having a heat receiving surface thermally forcibly circulating the refrigerant in the circulation path and thermally connected to the heating element. An apparatus,
上記ポンプは、The above pump
上記受熱面を有するハウジングと、A housing having the heat receiving surface;
上記冷媒を上記循環経路に送り出す回転体と、A rotating body for sending the refrigerant to the circulation path;
上記回転体を収容するポンプ室と、A pump chamber that houses the rotating body;
上記回転体を回転させるモータと、A motor for rotating the rotating body;
上記ハウジングを上記筐体内に固定する3つの取付け部と、Three attachment portions for fixing the housing in the housing;
を具備することを特徴とする電子機器。An electronic apparatus comprising:
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004133534A JP2005315157A (en) | 2004-04-28 | 2004-04-28 | Pump, cooling system and electronic equipment |
US11/083,633 US20050217828A1 (en) | 2004-04-02 | 2005-03-18 | Pump, cooler, and electronic device |
CNA2005100662652A CN1690439A (en) | 2004-04-28 | 2005-04-25 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004133534A JP2005315157A (en) | 2004-04-28 | 2004-04-28 | Pump, cooling system and electronic equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005315157A JP2005315157A (en) | 2005-11-10 |
JP2005315157A5 true JP2005315157A5 (en) | 2007-05-10 |
Family
ID=35052998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004133534A Abandoned JP2005315157A (en) | 2004-04-02 | 2004-04-28 | Pump, cooling system and electronic equipment |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050217828A1 (en) |
JP (1) | JP2005315157A (en) |
CN (1) | CN1690439A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7729118B2 (en) * | 2006-11-03 | 2010-06-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Miniature liquid cooling device having an integral pump |
WO2008109805A2 (en) * | 2007-03-07 | 2008-09-12 | Asetek Usa Inc. | Hybrid liquid-air cooled graphics display adapter |
JP5531400B2 (en) * | 2008-12-04 | 2014-06-25 | 富士通株式会社 | COOLING UNIT, COOLING SYSTEM, AND ELECTRONIC DEVICE |
JP6331771B2 (en) * | 2014-06-28 | 2018-05-30 | 日本電産株式会社 | Heat module |
JP7247517B2 (en) * | 2018-10-24 | 2023-03-29 | 日本電産株式会社 | Cooling system |
US11172592B1 (en) * | 2021-05-17 | 2021-11-09 | Rouchon Industries Inc. | Pump-driven coolant filling device and methods |
CN116294301B (en) * | 2022-12-05 | 2024-05-03 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid heat management system |
CN116498433B (en) * | 2023-06-29 | 2023-09-29 | 江苏普瑞亚动力科技有限公司 | Exhaust water collection type hydrogen ammonia energy engine |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5268817A (en) * | 1990-04-27 | 1993-12-07 | Kabushiki Kaisha Toshiba | Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard |
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
JP3258198B2 (en) * | 1995-04-28 | 2002-02-18 | 株式会社東芝 | Cooling device for circuit module and portable electronic device having this cooling device |
US6094180A (en) * | 1996-04-05 | 2000-07-25 | Fakespace, Inc. | Gimbal-mounted virtual reality display system |
US6005767A (en) * | 1997-11-14 | 1999-12-21 | Vadem | Portable computer having articulated display |
US20020053421A1 (en) * | 1997-09-10 | 2002-05-09 | Kabushiki Kaisha Toshiba | Heat dissipating structure for electronic apparatus |
KR100286375B1 (en) * | 1997-10-02 | 2001-04-16 | 윤종용 | Radiator of electronic system and computer system having the same |
US6464195B1 (en) * | 1997-12-04 | 2002-10-15 | Raymond Hildebrandt | Ergonomic mounting for computer screen displays |
JP3366244B2 (en) * | 1998-02-04 | 2003-01-14 | 富士通株式会社 | Electronics |
US6282082B1 (en) * | 1998-07-31 | 2001-08-28 | Qubit, Llc | Case for a modular tablet computer system |
US6377452B1 (en) * | 1998-12-18 | 2002-04-23 | Furukawa Electric Co., Ltd. | Heat pipe hinge structure for electronic device |
US6483445B1 (en) * | 1998-12-21 | 2002-11-19 | Intel Corporation | Electronic device with hidden keyboard |
JP4132680B2 (en) * | 1999-02-26 | 2008-08-13 | 日本サーモスタット株式会社 | Electronic equipment cooling device |
GB2348459B (en) * | 1999-03-27 | 2003-03-19 | Ibm | Lid restraint for portable computer |
US6231371B1 (en) * | 1999-06-25 | 2001-05-15 | Hewlett-Packard Company | Docking station for multiple devices |
JP3283853B2 (en) * | 1999-09-17 | 2002-05-20 | 米沢日本電気株式会社 | Docking station |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6196850B1 (en) * | 2000-02-10 | 2001-03-06 | International Business Machines Corporation | Rotatable docking station for an electronic device |
US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6430038B1 (en) * | 2000-04-18 | 2002-08-06 | Hewlett-Packard Company | Computer with articulated mechanism |
US6437973B1 (en) * | 2000-04-18 | 2002-08-20 | Hewlett-Packard Company | Modular mechanism for movable display |
US6313990B1 (en) * | 2000-05-25 | 2001-11-06 | Kioan Cheon | Cooling apparatus for electronic devices |
US6765751B2 (en) * | 2000-06-16 | 2004-07-20 | Hdvi Technology Llc | Disk drive system with enclosed removable cartridge including voice coil/head/disk assembly |
JP3302350B2 (en) * | 2000-06-29 | 2002-07-15 | 株式会社東芝 | Electronics |
US6296048B1 (en) * | 2000-09-08 | 2001-10-02 | Powerwave Technologies, Inc. | Heat sink assembly |
JP2002099356A (en) * | 2000-09-21 | 2002-04-05 | Toshiba Corp | Cooling device for electronic equipment and electronic equipment |
US6396687B1 (en) * | 2000-10-13 | 2002-05-28 | Dell Products, L.P. | Rotating portable computer docking station |
JP3607608B2 (en) * | 2000-12-19 | 2005-01-05 | 株式会社日立製作所 | Liquid cooling system for notebook computers |
US6717798B2 (en) * | 2001-03-22 | 2004-04-06 | Intel Corporation | Docking digital picture displays |
US20020141159A1 (en) * | 2001-03-29 | 2002-10-03 | Bloemen James Andrew | Sealed and passively cooled telecommunications customer service terminal |
FR2827115B1 (en) * | 2001-07-06 | 2003-09-05 | Alstom | BOX FOR POWER CONVERTER |
TW558611B (en) * | 2001-07-18 | 2003-10-21 | Matsushita Electric Ind Co Ltd | Small pump, cooling system and portable equipment |
US6873521B2 (en) * | 2001-07-24 | 2005-03-29 | Hewlett-Packard Development Company, L.P. | Multiple environment foldable computer |
US6480373B1 (en) * | 2001-07-24 | 2002-11-12 | Compaq Information Technologies Group, L.P. | Multifunctional foldable computer |
JP4512296B2 (en) * | 2001-08-22 | 2010-07-28 | 株式会社日立製作所 | Liquid cooling system for portable information processing equipment |
JP2003078270A (en) * | 2001-09-07 | 2003-03-14 | Hitachi Ltd | Electronic apparatus |
JP3946018B2 (en) * | 2001-09-18 | 2007-07-18 | 株式会社日立製作所 | Liquid-cooled circuit device |
TW561226B (en) * | 2001-09-25 | 2003-11-11 | Matsushita Electric Ind Co Ltd | Ultra-thin pump and cooling system including the pump |
JP2003223238A (en) * | 2002-01-28 | 2003-08-08 | Internatl Business Mach Corp <Ibm> | Computer device, monitor unit and support structure of unit facing user |
US6839234B2 (en) * | 2002-05-15 | 2005-01-04 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
WO2003098686A1 (en) * | 2002-05-22 | 2003-11-27 | Siemens Aktiengesellschaft | Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support |
US6856506B2 (en) * | 2002-06-19 | 2005-02-15 | Motion Computing | Tablet computing device with three-dimensional docking support |
JP3629257B2 (en) * | 2002-08-30 | 2005-03-16 | 株式会社東芝 | Electronics |
US6788530B2 (en) * | 2002-09-24 | 2004-09-07 | International Business Machines Corporation | User friendly computer equipment, monitor unit, and monitor unit setting base |
JP2004139187A (en) * | 2002-10-15 | 2004-05-13 | Toshiba Corp | Electronic device |
US6655449B1 (en) * | 2002-11-08 | 2003-12-02 | Cho-Chang Hsien | Heat dissipation device by liquid cooling |
US7035090B2 (en) * | 2003-09-04 | 2006-04-25 | Kabushiki Kaisha Toshiba | Interlocking mechanism for a display |
JP2005107122A (en) * | 2003-09-30 | 2005-04-21 | Toshiba Corp | Electronic equipment |
JP2005190316A (en) * | 2003-12-26 | 2005-07-14 | Toshiba Corp | Electronic device |
-
2004
- 2004-04-28 JP JP2004133534A patent/JP2005315157A/en not_active Abandoned
-
2005
- 2005-03-18 US US11/083,633 patent/US20050217828A1/en not_active Abandoned
- 2005-04-25 CN CNA2005100662652A patent/CN1690439A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2005317746A5 (en) | ||
JP2005315156A5 (en) | ||
TWI277717B (en) | Multiple evaporator heat pipe assisted heat sink | |
JP2000013070A5 (en) | ||
JP2007310716A5 (en) | ||
WO2006095436A1 (en) | Heat absorption member, cooling device, and electronic apparatus | |
JP2006304543A5 (en) | ||
JP2001159931A (en) | Computer | |
JP2006229180A5 (en) | ||
JP2001263243A (en) | Motor-driven compressor | |
JP2005315157A5 (en) | ||
KR20170057018A (en) | Dehumidifying module using thermoeletric element and dehumidifyer having the same | |
JP4431263B2 (en) | Electronic component cooling system | |
KR20140055027A (en) | Cold water tank | |
JP4546345B2 (en) | Heat dissipation structure for mobile robot | |
JP2013064539A5 (en) | ||
TWI543693B (en) | Cooling fan frame | |
JP2010210202A (en) | Heat exchange body | |
JP2008130879A5 (en) | ||
JP2010190454A (en) | Outdoor unit | |
JP2003060372A (en) | Method of cooling electronic apparatus and electronic apparatus | |
TWI323403B (en) | ||
JP2006250379A (en) | Bathroom vanity | |
TWI292688B (en) | Liquid cooling apparatus | |
KR200284580Y1 (en) | Fan support means of an electronic machine heat dissipation structure |