1292688 九、發明說明： 【發明所屬之技術領域】 • 本發縣錄歸置侧，尤其雜—_於冷卻電子藉的液 冷散熱裝置。 【先前技術】 目前，液冷散歸置已被業者使贿電子元件如電射央處理器 • 熱。液冷散熱裝置一般包括由吸熱部、散熱部及泵浦形成之迴路， 該迴路中填充有冷卻液，該冷卻液在該吸熱部吸收電子元件的熱量， 而在散熱部放出熱#。在該栗浦驅動作用下，該冷卻液在該迴路中不 斷循環，從而源源不斷地帶走該電子元件的熱量。 該吸熱部、散熱部及果浦大多靠管件連接，且散佈於電腦系統中。 齡之，在安裝該齡散餘置時，需要單獨安裝每-部分於電腦系 統中，此使得安裝耗時費工’從而增加成本。同樣，拆卸時，亦需要 • 單騎卸每-部分，操作㈣μ此，有必要對目前冷散熱裝置 作改進。 【發明内容】 針對上躲點，以下將以實_來介紹—種絲簡便之液冷散熱 裝置。 … 該液冷散熱裝置包括一内設冷卻液通道的吸熱體、一散熱體及一 用於驅動冷卻液在吸熱體與散熱體之_環縣浦。該液冷散熱裝置 還包括一底板及一與該底板結合之風罩，該風罩將所述吸熱體、散熱 6 1292688 體及泵浦罩設於内使該液冷散熱裝置模組化。 由於採用模組化設計，該液冷散熱裝置各部分係整合在一起，因 此僅需使用少量結合元件，如扣具，螺絲等即可將該液冷散熱裝置安 裝至電子元件，安裝及拆卸大為簡化。 【實施方式】 以下以具體之實施例，對本發明揭示之各形態内容加以詳細說明。 _ 敬請參閱第一圖，為該液冷散熱裝置第一實施例的立體分解圖。 該液冷散熱裝置主要包括一底板10、一吸熱體20、一散熱體30、一設 置在散熱體30 —側之風扇40、一泵浦50、複數管路及一風罩60。 該吸熱體20、散熱體30、泵浦50及複數管路形成一冷卻液循環 迴路^ §亥吸熱體20吸收熱源的熱量，如電腦系統的中央處理器，經由 冷卻液循環將吸收的熱量傳遞至散熱體3〇，在風扇4〇的辅助作用下使 該散熱體30吸收熱源的熱量吹散 | 本實施例中，該底板10設置成矩形，但可以理解，為與其他元件 相適應，該底板1〇亦可設置成其他形狀。該底板1〇靠中部設有一開 口 12，與吸熱體2〇形狀及位置對應，用於固定吸熱體2〇。該底板1〇 靠近兩相對側邊分別設有複數安裝孔14、16，其中安裝孔14用於安裝 泵浦50，安裝孔16用於安裝散熱體3〇。該底板1〇另外兩相對侧邊分 別设有一對預設安裝孔的安裝凸緣18，用於固定該風罩60。 4同時參照第二圖，為該吸熱體2〇之立體分解圖。該吸熱體2〇 包括一上蓋板22及一與上蓋板22密封結合之下蓋板25。該上蓋板22 7 1292688 設有一入液口 24及一出液口 23。該下蓋板25正對上蓋板22的表面設 有一流道26。當上蓋板22及下蓋板25結合後，兩者之間即形成一冷 卻液通道，該冷卻液通道與該入液口 24及出液口 23連通，使得吸熱 後的冷卻液能透過該出液口 23流出吸熱體20,被冷卻的冷卻液透過該 入液口 24進入吸熱體20繼續吸收熱量，如此循環，即可源源不斷地 將熱源的熱量帶走。本實施例中流道26概呈螺旋形，其亦可為其他形 狀。流道亦可以在設在上蓋板22上，藉由上蓋板22與下蓋板25密封 結合同樣可形成冷卻液通道。 請參照第三圖，為該吸熱體20固定至該底板10之立體放大圖。 該吸熱體20鑲嵌並固接於底板1〇的預設開口丨2中，其與底板1〇之 結合不限於特定方式，只要能保證當該吸熱體20被定位後，該吸熱體 20能與熱源緊密接觸，比如可經由焊接方法將兩者焊接為一體。 續請參照第四圖，該吸熱體20之厚度大於底板10之厚度，因此 吸熱體20的下表面突出於該底板1〇下表面，該下表面作為吸埶體2〇 的吸熱面，與發熱元件的發熱面接觸。 以上對照第一圖至第四圖介紹了底板1〇及吸熱體2〇,下面將介紹 散熱體30、風扇40及栗浦50。 請同時參照第一圖及第五圖，該散熱體3〇固定於該底板1〇 一側， 該栗浦50藉由一支撐體55固定於該底板1〇 一相對側，該風扇4〇位 於該散熱體30背向泵浦50的一側。在泵浦50驅動下，在吸熱體2〇 内吸收熱量的冷卻液源源不斷流過散熱體3〇進行冷卻。 8 1292688 該支撐體55利用固定件，如螺絲％固定於底板10的安裝孔l4 所在位置’該利用固定件，如螺絲5_於該支樓體55上。 口疋後4栗庸50正對該風扇4〇的中部位置，因為風扇運轉時其♦ 部基本上沒錢流’因此-定喊上可減小賊扇歧的阻擋。該菜 浦50 ,、有出液口及入液口’該泵浦5〇的出液口與吸熱體μ的入液口 24藉由管件連通。1292688 IX. Description of the invention: [Technical field to which the invention belongs] • The county is located on the side of the county, especially the miscellaneous--cooling heat sink for cooling electrons. [Prior Art] At present, the liquid cooling has been placed in the industry to make bribe electronic components such as the electric radiation processor. The liquid cooling heat dissipating device generally includes a circuit formed by a heat absorbing portion, a heat dissipating portion, and a pump, and the circuit is filled with a cooling liquid that absorbs heat of the electronic component in the heat absorbing portion and emits heat # in the heat dissipating portion. Under the action of the pump, the coolant circulates continuously in the circuit, so that the heat of the electronic component is continuously taken away. The heat absorbing portion, the heat dissipating portion, and the fruit pu are mostly connected by a pipe member and are dispersed in a computer system. In the age of installation, when installing the age of the spare, it is necessary to separately install each part in the computer system, which makes the installation time-consuming and labor-intensive, thereby increasing the cost. Similarly, when disassembling, it is also necessary to • unload each part, and operate (4) μ, it is necessary to improve the current cooling device. [Summary of the Invention] In view of the above-mentioned hiding point, the following will be introduced as a simple liquid cooling device. The liquid cooling heat dissipating device comprises a heat absorbing body with a coolant channel, a heat dissipating body and a cyclist for driving the cooling liquid in the heat absorbing body and the heat dissipating body. The liquid cooling device further includes a bottom plate and a hood coupled to the bottom plate, the hood providing the heat absorbing body, the heat dissipating body, and the pump cover to modularize the liquid cooling device. Due to the modular design, the liquid cooling and heat dissipating devices are integrated together, so only a small number of bonding components, such as fasteners, screws, etc., can be used to mount the liquid cooling device to the electronic components, and the installation and disassembly are large. For simplification. [Embodiment] Hereinafter, each aspect of the present invention will be described in detail with reference to specific embodiments. _Please refer to the first figure, which is an exploded perspective view of the first embodiment of the liquid cooling device. The liquid cooling device mainly includes a bottom plate 10, a heat absorbing body 20, a heat radiating body 30, a fan 40 disposed on the side of the heat radiating body 30, a pump 50, a plurality of pipes, and a hood 60. The heat absorbing body 20, the heat sink 30, the pump 50 and the plurality of pipes form a coolant circulation circuit. The heat absorbing body 20 absorbs heat of the heat source, such as a central processing unit of the computer system, and transfers the absorbed heat through the coolant circulation. To the heat sink 3, the heat sink 30 absorbs the heat of the heat source under the auxiliary action of the fan 4〇. In the embodiment, the bottom plate 10 is arranged in a rectangular shape, but it can be understood that, in order to adapt to other components, The bottom plate 1 can also be provided in other shapes. The bottom plate 1 is provided with an opening 12 in the middle thereof, corresponding to the shape and position of the heat absorbing body 2, for fixing the heat absorbing body 2〇. The bottom plate 1 is provided with a plurality of mounting holes 14, 16 respectively adjacent to the opposite sides, wherein the mounting holes 14 are for mounting the pump 50, and the mounting holes 16 are for mounting the heat sink 3. The other two opposite sides of the bottom plate 1 are respectively provided with a pair of mounting flanges 18 of predetermined mounting holes for fixing the hood 60. 4 Referring to the second figure at the same time, it is an exploded view of the heat absorbing body 2〇. The heat absorbing body 2 includes an upper cover 22 and a cover plate 25 that is sealingly combined with the upper cover 22. The upper cover 22 7 1292688 is provided with a liquid inlet port 24 and a liquid outlet port 23. The lower cover 25 is provided with a top path 26 facing the surface of the upper cover 22. When the upper cover 22 and the lower cover 25 are combined, a coolant passage is formed therebetween, and the coolant passage communicates with the liquid inlet 24 and the liquid outlet 23, so that the heat-absorbing coolant can pass through the coolant. The liquid outlet 23 flows out of the heat absorbing body 20, and the cooled coolant passes through the liquid inlet 24 and enters the heat absorbing body 20 to continue to absorb heat. By circulating, the heat of the heat source can be continuously taken away. In the present embodiment, the flow path 26 is substantially spiral, and it may have other shapes. The flow passage may also be provided on the upper cover 22, and the coolant passage may be formed by sealing the upper cover 22 and the lower cover 25. Referring to the third figure, a perspective enlarged view of the heat absorbing body 20 fixed to the bottom plate 10 is shown. The heat absorbing body 20 is inlaid and fixed in the predetermined opening 丨 2 of the bottom plate 1 , and the combination thereof with the bottom plate 1 不 is not limited to a specific manner, as long as the heat absorbing body 20 can be ensured when the heat absorbing body 20 is positioned. The heat source is in intimate contact, for example, the two can be welded together by welding. Continuing to refer to the fourth figure, the thickness of the heat absorbing body 20 is greater than the thickness of the bottom plate 10, so that the lower surface of the heat absorbing body 20 protrudes from the lower surface of the bottom plate 1. The lower surface serves as a heat absorbing surface of the suction body 2, and generates heat. The heating surface of the component is in contact. The first panel to the fourth diagram are described above with reference to the bottom plate 1 and the heat absorbing body 2, and the heat sink 30, the fan 40, and the Lipu 50 will be described below. Referring to the first and fifth figures, the heat dissipating body 3 is fixed to one side of the bottom plate, and the pump 50 is fixed to the opposite side of the bottom plate 1 by a supporting body 55. The heat sink 30 faces away from the side of the pump 50. Under the driving of the pump 50, the coolant source that absorbs heat in the heat absorbing body 2 不断 continuously flows through the heat sink 3 〇 for cooling. 8 1292688 The support body 55 is fixed to the mounting hole l4 of the bottom plate 10 by a fixing member, such as a screw, for example, a screw 5_ is attached to the base body 55. After the mouth, 4 Li Yong 50 is in the middle position of the fan 4〇, because the fan is basically running out of money when the fan is running, so the screaming can reduce the blockage of the thief. The dish 50 has a liquid outlet and a liquid inlet. The liquid inlet of the pump 5 与 and the liquid inlet 24 of the heat absorbing body μ are connected by a pipe.
該散熱體3G内部設有冷躲流道（圖未示），並設有與該冷卻液 流道連通的人叫32、心端34 ,該^端32 _吸舰2()的出液 口 23藉由管件連通，該出口端34藉由管件連接至栗浦％的入液口， 從而在吸紐20、散 3G及麵5G之_彡祕冷卻麵環的迴路。 该散熱體30還設有_散熱鰭狀35，該散熱·組％包括複數平行 間隔排列之鰭片。賴趙3〇内的冷卻液在辦裒時將熱量傳遞至該散熱 鰭片組35散發。 在本實施例中，該風扇40直接利用鎖固件安裝在風罩6〇進風側 且與底板10垂直。該風扇40的高度大於該散熱體3〇的高度，因此該 風扇40部分位於該底板1〇上方，部分位於該底板1〇下方。 該風罩60概呈倒U型，其兩側壁62設有固定孔，藉由螺絲等鎖 固元件可將該風罩60之側壁62固定至該底板1〇兩侧的安裝凸緣18 上。該風罩60進風側設有與風扇框架對應的安裝片，該等安裝片預設 安裝孔，藉以鎖固風扇40。安裝之後，該風罩60將該底板1〇、吸熱 體20、散熱體30、風扇40及泵浦50涵蓋於内，該風扇40的風扇框 9 1292688 架上方與側方和風罩6〇的内壁緊密接觸，使該風扇之風量涵蓋散熱器 的散熱面積。該風罩60每一側壁62底緣向外延伸第一及第二折邊63、 64。該第一及第二折邊63、64在與底板1〇垂直的方向上具有位置差， 並各設一鎖固孔。 組裝該液冷散熱裝置時’可先將吸熱體20固設於底板1〇上，再 將散熱體30、泵浦50固設在底板10相應位置，並以管件連接構成一 迴路，然後將風扇40固定於該散熱體30側邊，最後將該風罩5〇藉由 鎖固元件固設於底板10上，從而使液冷散熱裝置所有元件皆預先組裝 在一起形成一個模組。組裝完成的液冷散熱裝置如第六圖所示。 如第七圖及第八圖，為該液冷散熱裝置使用於一電腦系統的示意 圖。該電腦系統包括一機殼80及安裝在機殼8〇内的主機板82，該機 殼80僅示出一部分。該液冷散熱裝置不僅能對主機板82上的中央處 理器84進行散熱，還可以同時對主機板82 ±的其他元件進行散熱。 安裝該液冷散織置至電齡麟，首先鎌冷散紐置放置在 主機板82上，使吸熱體20與主機板&的中央處理器84正對，然後 藉由螺絲85、86等鎖固元件穿過風罩60的第-、第二折邊63、64及 機殼8〇、主脑82均設_定孔，㈣將舰冷散熱裝置固定於電 腦系射祕液冷政熱裝置採職組找計，安裝時只須以複數支 螺絲85即可肢冷散熱裝置料，具有安裝方便的伽。除螺絲鎖固 外，該液冷散賊4射細扣具將奸合岐。 —、" 咸冷政熱裝置之底板10與主機板82間隔-段距 1292688 離從而形成風道，該風扇40的一部分位於底板ι〇下方，因此風扇4〇 上方的風量用於吹拂散熱體30，而風扇40下方的風量分流到底板1〇 與主機板82之間的風道，達到充分冷卻吸熱體20底部、中央處理器 84、底板1〇本身以及位於底板10下方的其他發熱元件之效益。 由於該風罩60的設置，經過散熱體30的氣流可集中吹拂到其他 電子元件上，以作最大限度的利用。 在上述實施例中，該底板10及吸熱體20可以採用具有高導熱性 材料，比如銅、链等金屬，以便分擔一部分直接由吸熱體2〇傳導至底 板10的熱量，並藉由底板10上下兩面的風量將此部分熱量散出，達 到降底散熱體與風扇的散熱負荷之效益。但為節省成本，亦可將上蓋 板22以一種易於成形的材料，例如塑膠藉由射出或沖壓方式成形，而 下蓋板25以高熱傳導材料製成。選擇這種易於成形的材料對於流道設 在上蓋板22的情形而言，可簡化加工及降底成本。 > 第一實施例的液冷散熱裝置中，吸熱體20是單獨製作然後固接於 底板10 ’下面將參照第九圖及第十圖介紹液冷散熱裝置的第二實施 例。與第一實施例的主要區別在於吸熱體與底板為一體成形，因此與 第一實施例相同的部分不再重複介紹。 如第九圖及第十圖，底板210大致中部位置下表面設有流道226， 上表面设有與该流道226連通的入液口 224、出液口 223。一下蓋板225 密封固接於該底板210下表面，將該流道226密封從而形成冷卻液通 道0 1292688 由於該吸熱體的部分與底板210採用一體成形之製程，可免除在 底板210上預設的開口以及將吸熱體鑲嵌並固接於該開口的加工，且 由於下蓋板225為熱傳所必須的介面，因此，除該下蓋板225採用銅、 紹等導熱性良好的材質外，該一體成形件’即設有流道226的底板210 可以同樣採用上述易於成形的材料，如塑膠等。上述藉由改變底板21〇 與吸熱體的材質及一體成形的方法，可進一步達到簡化製程及降底成 本之效益。 前述實施中，風扇40位於該風罩60之吸風側，泵浦50藉由支撐 體55支撐於風罩60之出風側並對應風扇40之中央部位以減小風阻。 該泵浦50還可以其他方式固定於其他位置，如位於靠近該風罩6〇頂 壁内側的位置。 綜上所述，本發明符合發明專利要件，爰依法提出申請，盼早日 准予專利。 【圖式簡單說明】 第一圖係液冷散熱裝置第一實施例之立體分解圖； 第二圖係液冷散熱裝置的吸熱體之立體分解圖； 第三圖係吸熱體固定至底板之立體分解圓； 第四圖係第三圖之剖面視圖； 第五圖係液冷散熱裝置之部分組合圖； 第六圖係液冷散熱裝置之完全組合圖； 第七圖係液冷散熱裝置安裝於一電腦系統之立體示意圖； 12 1292688 第八圖係第七圖之側視圖； 第九圖係液冷散熱裝置第二實施例的底板及吸熱體之立體圖； 第十圖係第九圖之剖面視圖。 【主要元件符號說明】 底板 10、210 安裝孔 14、16 吸熱體 20 出液口 23、223 下蓋板 25、225 散熱體 30 出口端 34 風扇 40 支撐體 55 風罩 60 第一折邊 63 機殼 80 中央處理器 84 開口 12 安裝凸緣 18 上蓋板 22 入液口 24、224 流道 26、226 入口端 32 散熱鰭片組 35 泵浦 50 螺絲 56、58、85、86 側壁 62 第二折邊 64 主機板 82 13The heat dissipating body 3G is provided with a cold dorming passage (not shown), and is provided with a person named 32, a heart end 34, and a liquid outlet of the end 32 _ squirt 2 () 23 is connected by a pipe member, and the outlet end 34 is connected to the inlet port of the Lipu pump by a pipe member, thereby looping the cooling surface ring of the suction 20, the 3G and the surface 5G. The heat sink 30 is further provided with a heat sink fin 35, and the heat sink group % includes a plurality of fins arranged in parallel intervals. The coolant in the Lai Zhao 3〇 transfers heat to the heat sink fin group 35 during the operation. In the present embodiment, the fan 40 is directly mounted on the wind inlet side of the hood 6 and is perpendicular to the bottom plate 10 by means of a lock. The height of the fan 40 is greater than the height of the heat sink 3〇. Therefore, the fan 40 is partially located above the bottom plate 1 and partially below the bottom plate 1〇. The hood 60 is substantially inverted U-shaped, and the two side walls 62 are provided with fixing holes. The side walls 62 of the hood 60 can be fixed to the mounting flanges 18 on both sides of the bottom plate 1 by locking elements such as screws. The air inlet side of the hood 60 is provided with mounting pieces corresponding to the fan frame, and the mounting pieces are preset with mounting holes for locking the fan 40. After installation, the hood 60 covers the bottom plate 1 , the heat absorbing body 20 , the heat sink 30 , the fan 40 , and the pump 50 . The fan frame 9 1292688 of the fan 40 is disposed above the side wall and the inner wall of the hood 6 〇 Close contact, so that the fan's air volume covers the heat sink area of the heat sink. The bottom edge of each side wall 62 of the hood 60 extends outwardly from the first and second flanges 63, 64. The first and second flanges 63, 64 have a positional difference in a direction perpendicular to the bottom plate 1A, and each has a locking hole. When the liquid cooling device is assembled, the heat absorber 20 can be fixed on the bottom plate 1 first, and then the heat sink 30 and the pump 50 are fixed at corresponding positions on the bottom plate 10, and connected by a pipe to form a circuit, and then the fan is connected. 40 is fixed to the side of the heat sink 30, and finally the hood 5 is fixed on the bottom plate 10 by the locking component, so that all components of the liquid cooling device are pre-assembled to form a module. The assembled liquid cooling device is shown in Figure 6. As shown in the seventh and eighth figures, a schematic diagram of the liquid cooling device used in a computer system is shown. The computer system includes a housing 80 and a motherboard 82 mounted within the housing 8 of the housing, the housing 80 showing only a portion. The liquid cooling device not only dissipates heat to the central processor 84 on the motherboard 82, but also dissipates heat to other components of the motherboard 82. The liquid cooling and scattering is installed to the electric aging lining. First, the chilling and dispersing body is placed on the main board 82, so that the heat absorbing body 20 is opposite to the central processing unit 84 of the main board & and then by screws 85, 86, etc. The locking element passes through the first and second flanges 63 and 64 of the hood 60, the casing 8〇, and the main brain 82 are provided with a fixed hole, and (4) the ship cooling device is fixed to the computer system to spray the secret liquid cold heat device. The mining team can find out the equipment, and only need to use a plurality of screws 85 to cool the radiator material, which has convenient installation. In addition to the screw lock, the liquid cold thief 4 shot fine buckle will be rap. —, " The bottom plate 10 of the salty cold thermal device is spaced from the main plate 82 by a distance of 1292688 to form a duct. A part of the fan 40 is located below the bottom plate, so the air volume above the fan 4 is used to blow the heat sink. 30, and the air volume under the fan 40 is diverted to the air passage between the bottom plate 1 and the main plate 82, to fully cool the bottom of the heat absorbing body 20, the central processing unit 84, the bottom plate 1 itself, and other heating elements located under the bottom plate 10. benefit. Due to the arrangement of the hood 60, the airflow passing through the heat sink 30 can be concentratedly blown onto other electronic components for maximum use. In the above embodiment, the bottom plate 10 and the heat absorbing body 20 may be made of a material having a high thermal conductivity, such as copper or a chain, so as to share a portion of the heat directly transmitted from the heat absorbing body 2 to the bottom plate 10, and the bottom plate 10 is supported by the bottom plate 10 The air volume on both sides dissipates this part of the heat to achieve the benefit of reducing the heat dissipation load of the heat sink and the fan. However, in order to save cost, the upper cover 22 can also be formed by injection or stamping of an easily formed material such as plastic, and the lower cover 25 is made of a highly heat conductive material. The selection of such an easily formable material simplifies the processing and the cost of lowering the bottom in the case where the flow path is provided in the upper cover 22. > In the liquid cooling heat dissipating device of the first embodiment, the heat absorbing body 20 is separately fabricated and then fixed to the bottom plate 10'. A second embodiment of the liquid cooling heat dissipating device will be described with reference to the ninth and tenth drawings. The main difference from the first embodiment is that the heat absorbing body and the bottom plate are integrally formed, and therefore the same portions as those of the first embodiment will not be repeatedly described. As shown in the ninth and tenth views, the lower surface of the bottom plate 210 is provided with a flow path 226 at a lower surface thereof, and the upper surface is provided with a liquid inlet port 224 and a liquid outlet port 223 which communicate with the flow path 226. The lower cover 225 is sealingly fixed to the lower surface of the bottom plate 210, and the flow passage 226 is sealed to form a coolant passage 0 1292688. Since the portion of the heat absorbing body and the bottom plate 210 are integrally formed, the preset on the bottom plate 210 is eliminated. The opening and the processing of inserting and fixing the heat absorbing body to the opening, and since the lower cover 225 is an interface necessary for heat transfer, the lower cover 225 is made of a material having good thermal conductivity such as copper or sinter. The integrally formed member', that is, the bottom plate 210 provided with the flow path 226, can also employ the above-mentioned easily formed material such as plastic or the like. By changing the material of the bottom plate 21〇 and the heat absorbing body and integrally forming the above, the benefits of simplifying the process and reducing the cost can be further achieved. In the foregoing embodiment, the fan 40 is located on the suction side of the hood 60, and the pump 50 is supported by the support body 55 on the air outlet side of the hood 60 and corresponds to the central portion of the fan 40 to reduce the wind resistance. The pump 50 can also be otherwise secured to other locations, such as located near the inside of the dome wall of the hood 6. In summary, the present invention complies with the requirements of the invention patent, and submits an application according to law, and hopes to grant the patent as soon as possible. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is an exploded perspective view of a first embodiment of a liquid cooling device; the second drawing is an exploded view of the heat absorbing body of the liquid cooling device; and the third drawing is a three-dimensional structure in which the heat absorbing body is fixed to the bottom plate. The fourth figure is a cross-sectional view of the third figure; the fifth picture is a partial combination diagram of the liquid cooling device; the sixth picture is a complete combination of the liquid cooling device; the seventh picture is a liquid cooling device installed at A schematic view of a computer system; 12 1292688 The eighth diagram is a side view of the seventh diagram; the ninth diagram is a perspective view of the bottom plate and the heat absorbing body of the second embodiment of the liquid cooling heat sink; the tenth section is a sectional view of the ninth diagram . [Main component symbol description] Base plate 10, 210 Mounting holes 14, 16 Heat absorbing body 20 Liquid outlet 23, 223 Lower cover 25, 225 Heat sink 30 Outlet end 34 Fan 40 Support body 55 Windshield 60 First flange 63 Machine Shell 80 Central processor 84 Opening 12 Mounting flange 18 Upper cover 22 Inlet 24, 224 Flow path 26, 226 Inlet end 32 Heat sink fin set 35 Pump 50 Screws 56, 58, 85, 86 Side wall 62 Second Folding 64 Motherboard 82 13