JP2006032697A - Fan-mounting structure for electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a fan-mounting structure for an electronic apparatus, in which the number of components is decreased to reduce the space inside a casing, and high-temperature components can be cooled efficiently in a concentrated manner. <P>SOLUTION: A fan mounting structure for an electronic apparatus, provided with a fan 8 for cooling a high-temperature component 5 housed in a casing 1, comprises a circuit board 2 formed by partitioning the inside of the casing 1 into a first sector chamber 3 wherein the high-temperature component 5 is housed, and a second sector chamber 4 wherein the high-temperature component 5 is not housed; a channel-forming member 7 disposed inside the second sector chamber 4 for forming a channel for exhausting air from the first sector chamber 3 over the wall of the casing 1 and the circuit board 2; and the fan 8 assembled inside this channel-forming member 7. An inlet 2a provided on the circuit board 2 and an outlet 1b provided on the wall portion of the casing 1 are communicated by the channel-forming member 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a fan mounting structure for an electronic device including a fan for forcibly cooling high temperature components housed in a housing such as a car audio.

  In general, it is well known to forcibly cool a high-temperature component (for example, a power transistor on an audio control board, a microcomputer, an LSI, or an IC on a mechanical board) housed in a housing such as a car audio with a fan. However, in recent years, the temperature of circuit boards and mechanical mounting parts has increased due to the higher performance of car audio, the space in the housing has decreased due to the concentration of functions (reduction of flow paths), and the cooling efficiency has been improved by reducing the ventilation holes to improve dust resistance. Decline is a problem. Therefore, various fan mounting structures have been proposed to solve the problem (see, for example, Patent Document 1 and Patent Document 2).

  In Patent Document 1, in order to increase the cooling efficiency of high-temperature components mounted on a circuit board, a separate board mounting frame is integrally assembled inside the housing, and the circuit board mounted on the frame is assembled. A shielding space is formed in the lower part, and a fan is directly attached to the side wall of the frame, so that outside air (air) is sucked into the shielding space from an air intake hole provided in the side wall of the housing, and the sucked air is The air is exhausted from an exhaust hole provided in a side wall of the housing opposite to the intake hole through a vent hole provided in the substrate. In such a configuration, the high-temperature component mounted on the circuit board is cooled by the flow of air sucked into the shielding space from the vent hole of the circuit board toward the exhaust hole of the housing. .

  Further, in Patent Document 2, the circuit board is fixed inside a chassis provided with a plurality of ventilation holes formed in a box shape separate from the casing, and the casing is covered with a gap in the chassis. In addition, a fan mounting frame located between the housing and the chassis is fixed to the outside of the chassis, and the fan is mounted on the fan mounting frame. Here, a plurality of air intake holes (vent holes) are provided at positions away from the fan mounting portion in the opposing wall portion of the housing and the chassis, and when the fan is in operation, the air intake holes are separated from the air intake holes of the housing. The circuit board and the heat-generating component on the circuit board are cooled by the air sucked into the chassis from the intake hole of the chassis through the gap between the housing and the chassis.

Japanese Patent Laid-Open No. 11-251775 (pages 2 and 3, FIG. 1) Japanese Patent Laid-Open No. 10-117079 (second page, FIG. 1)

  Since the fan mounting structure of the conventional electronic device is configured as described above, in both cases of Patent Document 1 and Patent Document 2, the number of parts is increased by requiring a separate frame and chassis from the housing. In addition to leaving a problem in reducing the space in the housing, in Patent Document 1, outside air is once sucked into a shielding space below the circuit board in the frame, and the sucked air is exhausted from the vent hole of the circuit board to the exhaust hole of the housing. Since the high temperature components on the circuit board are cooled by allowing the high temperature components to flow out, the cooling efficiency of the high temperature components is poor. Further, in Patent Document 2, not only the fan mounting frame and the fan must be mounted separately, but also from the plurality of air intake holes of the housing through the gap between the housing and the chassis and the plurality of air intake holes of the shaft. Since air is sucked into the interior, turbulence of the sucked air is likely to occur between the chassis and the chassis, which reduces the cooling efficiency of the circuit board inside the chassis and the high-temperature components on the circuit board. There was a problem of being easy to decrease.

  The present invention has been made in order to solve the above-described problems. The number of parts can be reduced to reduce the space in the housing, and an electronic device capable of intensively and efficiently cooling high-temperature parts. The purpose is to obtain a fan mounting structure for equipment.

  In the fan mounting structure for an electronic device according to the present invention, a circuit board is formed by partitioning a housing into a first compartment in which the high temperature component is accommodated and a second compartment in which the high temperature component is not accommodated. And a flow path forming member that is disposed in the second compartment and forms an exhaust flow path from the first compartment across the wall of the housing and the circuit board, and the flow path formation. A fan assembled inside the member, and an air inlet hole provided in the circuit board and an exhaust hole provided in the wall portion of the housing are communicated by the flow path forming member.

  According to the present invention, the inside of the housing is partitioned and formed by the circuit board into the first compartment and the second compartment, the high temperature component is accommodated in the first compartment, and the fan is provided in the second compartment. The flow path forming member that is unitized is assembled and disposed across the wall portion of the housing and the circuit board, and an air intake hole provided in the circuit board and an exhaust hole provided in the wall portion of the housing Is configured to communicate with the flow path forming member, so that a frame or chassis for mounting a substrate separate from the housing is not required as in the conventional example, and the number of components can be reduced and the housing space can be reduced. Since the flow path forming member can be reduced and the flow path forming member is directly connected to the circuit board, the fan is unitized in the flow path forming member and is housed in the first compartment. High temperature parts can be cooled intensively. Efficiency is the effect of improving.

Embodiment 1 FIG.
1 is a schematic sectional view showing an electronic apparatus having a fan mounting structure according to Embodiment 1 of the present invention, FIG. 2 is a partially enlarged perspective view showing a fan mounting structure portion of FIG. 1, and FIG. FIG.
In the figure, a circuit board 2 is accommodated in a housing 1 of an electronic device such as a car audio. The circuit board 2 is divided into a first compartment 3 below the circuit board 2 and a second compartment 4 above the circuit board 2 by dividing the interior of the housing 1 up and down. A high temperature component 5 is accommodated in the first compartment 3. Here, the high temperature component 5 means a component including a mechanical mounting component 5a mounted on a mechanical control board and a heat source component 5b such as a microcomputer, LSI, or IC. In the second compartment 4 in which the high-temperature component 5 is not stored, the fan unit 6 straddling the rear chassis 1a and the circuit board 2 is assembled on the rear chassis 1a side of the casing 1. It has been.

  The fan unit 6 is disposed at a corner between the rear chassis 1a of the housing 1 and the circuit board 2 in the second compartment 4 above the circuit board 2, and the rear chassis 1a, the circuit board 2, and the like. The duct-shaped flow path forming member 7 assembled over the two and the fan 8 assembled into the flow path forming member 7 as a unit. Here, as shown in FIGS. 2 and 3, the flow path forming member 7 is formed in a box shape including both side surface plate portions 7a and 7b, an inclined back surface plate portion 7c, and an upper surface plate portion 7d. At the front ends of the face plate portions 7a and 7b, there is a structure having a mounting piece portion 7e to the rear chassis 1a. Such a flow path forming member 7 is formed by punching an aluminum thin plate having a good heat conduction efficiency and is bent to perform the function of a heat sink. As described above, the flow path forming member 7 assembled across the rear chassis 1a of the housing 1 and the circuit board 2 includes the air holes (intake holes) 2a provided in the circuit board 2 and the rear. A vent hole (exhaust hole) 1b provided in the chassis 1a is communicated with. Each of the vent holes 2a and 1b is composed of a plurality of parallel slits.

  The heat source component 5b is disposed below (substantially directly below) the intake hole 2a in the first compartment 3, and below that, a ventilation hole (intake hole) is formed in the bottom of the first compartment 3. 3a is provided. Further, a temperature sensor (not shown) for turning the fan 8 on and off is provided in the first compartment 3. The temperature sensor is to turn on the fan 8 when the mechanical mounting component 5a (particularly the pickup) and / or the heat source component 5b is heated to a predetermined temperature or higher.

Next, the operation will be described.
When the fan 8 in the flow path forming member 7 is operated, outside air is sucked into the first compartment 3 from the suction hole 3a at the bottom thereof, and the sucked air is passed from the suction hole 2a of the circuit board 2 to the flow path forming member 7. By being intensively sucked in, the high temperature component 5 in the first compartment 3, in particular, the heat source component 5 b located below the intake hole 2 a of the circuit board 2 is efficiently cooled by the sucked air. . The air that has been sucked into the first compartment 3 in this way and has cooled the high temperature component 5 passes through the flow path forming member 7 and is discharged from the exhaust hole 1 b of the rear chassis 1 a of the housing 1. At this time, the flow path forming member 7 functions as a heat sink that removes its own heat.

  According to the first embodiment described above, since the flow path forming member 7 in which the fan 8 is assembled into a unit is installed so as to straddle the rear chassis 1a and the circuit board 2 of the housing 1, As in the example, there is no need for a frame or chassis separate from the casing, the number of parts can be reduced, the casing space can be reduced, and the exhaust design of the entire casing 1 need not be performed. Only the flow path forming member 7 can secure a ventilation flow path and exhaust air from a target area in the housing 1, and can efficiently cool high-temperature components. In particular, as shown in FIG. 1, there is no fan mounting space at the rear of the mechanical mounting component 5a in the housing 1 (first compartment 3), and a fan 8 is installed in the housing 1 near the place to be cooled. Even if it is not possible, according to the first embodiment, there is an effect that it is possible to secure a flow path that guides exhaust from a target area in the housing 1.

Embodiment 2. FIG.
4A is a perspective view of a main part showing a fan mounting structure for an electronic device according to Embodiment 2 of the present invention, FIG. 4B is an exploded perspective view of FIG. 4A, and FIGS. The same reference numerals are given to the same or corresponding parts, and the duplicate description is omitted.
In the second embodiment, a heat source component 5b such as a power transistor is mounted near one side of the flow path forming member 7 on the circuit board 2, and the heat source component 5b is screwed on one side wall surface of the flow path forming member 7. 9 was concluded.

  According to the second embodiment configured as described above, the heat source component 5b mounted on the circuit board 2 can be efficiently cooled by the flow path forming member 7, and the circuit board 2 and the flow path forming member can be cooled. 7 can be fastened together with the screw 9 through the heat source component 5b, so that the heat source component 5b can be efficiently used without requiring a special bracket for mounting the heat source component or a heat sink for improving heat dissipation. There is an effect that cooling can be realized. Furthermore, by forming the flow path forming member 7 with a heat conducting member such as aluminum, there is an effect that the power efficiency of the heat source component 5b can be further increased.

Embodiment 3 FIG.
5A is a perspective view showing a fan mounting structure for an electronic device according to Embodiment 3 of the present invention, and FIG. 5B is an exploded perspective view of FIG. 5A.
In the first embodiment, the circuit board 2 is provided with a plurality of intake holes 2a formed of parallel slits, and the fan 8 is obliquely assembled in the flow path forming member 7 to be integrated as a unit. 3, the circuit board 2 is provided with one circular intake hole 2 b, and the fan 8 is assembled in the flow path forming member 7 almost horizontally on the intake hole 2 b to be integrated into a unit. As a means for attaching the fan 8, the casing of the fan 8 and the side plate portions 7 a and 7 b of the flow path forming member 7 are placed at a predetermined horizontal position in the flow path forming member 7. What is necessary is just to set it as the structure engaged with a nail | claw by one-touch operation only by inserting the casing. According to the third embodiment having such a configuration, the same effects as those of the first and second embodiments can be obtained, and the exhaust hole 1b and the intake air can be formed by making the intake hole 2b circular. There is an effect that it is possible to avoid the decrease in ventilation efficiency and the generation of wind noise due to the shape of the hole 2a.

Embodiment 4 FIG.
6 is a sectional view showing a fan mounting structure for an electronic apparatus according to Embodiment 4 of the present invention. In the fourth embodiment, the fan 8 is assembled almost vertically into the flow path forming member 7 to be integrated into a unit, and as a means for attaching the fan 8, the casing of the fan 8 is provided in the flow path forming member 7. The stopper piece 10 is made to be integrated substantially vertically and the casing of the fan 8 brought into contact with the stopper piece 10 is fastened with screws 11 such as bolts. In the case of the fourth embodiment, the same effects as those in the first and second embodiments can be expected.

Embodiment 5. FIG.
FIG. 7 is a sectional view showing a fan mounting structure for an electronic apparatus according to Embodiment 5 of the present invention. The fifth embodiment shows a specific mounting structure of the fan 8 in the first embodiment. In the fifth embodiment, the upper surface plate portion 7d of the flow path forming member 7 is formed, and stopper pieces 12, 13 in a direction perpendicular to the oblique upper surface plate portion 7d are parallel to the flow path forming member 7. The fan 8 is inserted between the stopper pieces 12 and 13 from below into the flow path forming member 7 before the circuit board 2 is attached, and the casing of the fan 8 is brought into contact with the upper surface plate portion 7d. After the contact, the flow path forming member 7 is assembled on the circuit board 2 so that the fan 8 is sandwiched and fixed between the circuit board 2 and the flow path forming member 7. In the case of the fifth embodiment as well, the same effects as those of the first and second embodiments can be expected.

It is a schematic sectional drawing which shows the electronic device which has the fan attachment structure by Embodiment 1 of this invention. It is a partial expansion perspective view which shows the fan attachment structure part of FIG. FIG. 2 is an exploded perspective view of FIG. 1. FIG. 4A is a perspective view of a main part showing a fan mounting structure for an electronic device according to Embodiment 2 of the present invention, and FIG. 4B is an exploded perspective view of FIG. 4A. 5A is a perspective view showing a fan mounting structure for an electronic device according to Embodiment 3 of the present invention, and FIG. 5B is an exploded perspective view of FIG. 5A. It is sectional drawing which shows the fan attachment structure of the electronic device by Embodiment 4 of this invention. It is sectional drawing which shows the fan attachment structure of the electronic device by Embodiment 5 of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Case, 1a Rear chassis, 1b Vent hole (exhaust hole), 2 Circuit board, 2a, 2b Vent hole (intake hole), 3rd first compartment, 4th second compartment, 5 High temperature component, 5a Mechanical mounting parts, 5b Heat source parts, 6 Fan units, 7 Flow path forming members, 7a, 7b Both side plate parts, 7c Back plate parts, 7d Top plate parts, 7e Mounting pieces, 8 Fans, 9 Screws, 10 Stopper pieces , 11 Screw, 12, 13 Stopper piece.

Claims (3)

  In a fan mounting structure for an electronic apparatus having a fan for cooling a high temperature component housed in a housing, the first compartment in which the high temperature component is housed and the high temperature component are housed in the housing. A circuit board that is partitioned into a second compartment that is not formed, an exhaust hole that is disposed in the second compartment and is provided in a wall portion of the housing, and an intake hole that is provided in the circuit board. An electronic device fan comprising: a flow path forming member that forms an exhaust flow path from the first compartment, and a fan assembled in the flow path forming member Mounting structure.   2. The fan mounting structure for an electronic device according to claim 1, wherein the flow path forming member is a heat sink.   3. The electronic device fan mounting structure according to claim 1, wherein a heat source component mounted on a circuit board is fastened to an outer wall surface of the flow path forming member.

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