JP3385482B2 - Electronics - Google Patents

Electronics

Info

Publication number
JP3385482B2
JP3385482B2 JP28485593A JP28485593A JP3385482B2 JP 3385482 B2 JP3385482 B2 JP 3385482B2 JP 28485593 A JP28485593 A JP 28485593A JP 28485593 A JP28485593 A JP 28485593A JP 3385482 B2 JP3385482 B2 JP 3385482B2
Authority
JP
Japan
Prior art keywords
heat
liquid
header
heat dissipation
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28485593A
Other languages
Japanese (ja)
Other versions
JPH07142886A (en
Inventor
繁男 大橋
敏夫 畑田
伸司 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP28485593A priority Critical patent/JP3385482B2/en
Publication of JPH07142886A publication Critical patent/JPH07142886A/en
Priority to US08/730,441 priority patent/US5764483A/en
Application granted granted Critical
Publication of JP3385482B2 publication Critical patent/JP3385482B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明が属する技術分野】本発明は電子機器に係り、特
に電子部品を冷却し所定の温度に保つようにした冷却技
術に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device , and more particularly to a cooling technique for cooling electronic parts to keep them at a predetermined temperature.
Belong to the art .

【０００２】[0002]

【従来の技術】従来の電子装置は、特開昭６３−２５０
９００号公報、特開平３−２５５６９７号公報、実開平
５−２９１５３号公報に記載のように、独立の金属板、
もしくは、筐体の一部を構成する金属板を、発熱部材と
金属筐体壁との間に介在させ、発熱部材で発生する熱を
放熱部である金属筐体壁まで熱伝導により輸送して放熱
している。また、特開昭５５−７１０９２号公報に記載
のように、金属筐体壁面にヒ−トパイプを形成し、発熱
部材を熱的に金属筐体壁と接続することによって、発熱
部材で発生する熱を金属筐体壁で放熱している。2. Description of the Related Art A conventional electronic device is disclosed in JP-A-63-250.
As described in Japanese Patent Application Laid-Open No. 900, JP-A-3-255697, and Japanese Utility Model Laid-Open No. 5-29153, an independent metal plate,
Alternatively, a metal plate that forms a part of the housing is interposed between the heat generating member and the metal housing wall, and the heat generated by the heat generating member is transported to the metal housing wall that is the heat dissipation portion by heat conduction. It radiates heat. Further, as described in Japanese Patent Laid-Open No. 55-71092, a heat pipe is formed on the wall surface of a metal housing, and the heat generating member is thermally connected to the metal housing wall to generate heat generated by the heat generating member. The metal housing wall radiates heat.

【０００３】[0003]

【発明が解決しようとする課題】上記従来例で、特開昭
６３−２５０９００号公報、特開平３−２５５６９７号
公報、実開平５−２９１５３号公報の例では、発熱部材
から金属筐体壁までの伝熱経路が、筐体壁の厚さ１ｍｍ
前後の薄い断面でしかないので効率よく熱伝導されな
い。したがって、発熱量の増大に十分対応することがで
きなかった。また、部品配列によっては、必ずしも、金
属筐体壁までが短い伝導距離にあるとは限らない。その
ため、発熱部材を筐体近辺に配置するなど、部品配列あ
るいは筐体構造が制限されていた。一方、高性能が要求
される電子機器などにおいて、発熱部材を含む部品配列
は、電子回路の高速化に起因する配線長さなどの関係
で、性能に大きな影響を及ぼす。したがって、従来例で
は、電子機器のコンパクト化、高性能化が妨げられてい
た。また、特開昭５５−７１０９２号公報の例において
も同様に、発熱部材を直接、金属筐体壁に接続しなけれ
ばならず、発熱部材を含む部品配列あるいは筐体構造が
制限されていた。そのため、最適な部品配列を得ること
を優先させた場合、発熱部材に個別に放熱フィンを設置
する等の方策が必要となり、筐体が大きくならざるを得
なかった。In the above-mentioned conventional examples, examples of Japanese Patent Laid-Open No. 63-250900, Japanese Patent Laid-Open No. 3-2555697, and Japanese Utility Model Laid-Open No. 5-29153, from the heat generating member to the metal casing wall. The heat transfer path of the case is 1mm thick on the housing wall
Since it has only a thin cross-section, it does not conduct heat efficiently. Therefore, it was not possible to sufficiently cope with the increase in the amount of heat generation. In addition, depending on the arrangement of the components, the distance to the wall of the metal housing is not always short. For this reason, the arrangement of parts or the structure of the housing is limited, such as disposing the heat generating member near the housing. On the other hand, in an electronic device or the like that requires high performance, the component arrangement including the heat generating member has a great influence on the performance due to the wiring length and the like caused by the speedup of the electronic circuit. Therefore, in the conventional example, downsizing and high performance of electronic devices have been hindered. Also in the example of Japanese Patent Laid-Open No. 55-71092, similarly, the heat-generating member has to be directly connected to the wall of the metal casing, which limits the arrangement of components including the heat-generating member or the casing structure. Therefore, when priority is given to obtaining the optimum component arrangement, it is necessary to take measures such as individually disposing the heat radiation fins on the heat generating member, which inevitably requires a large housing.

【０００４】本発明は、発熱部材である電子部品が他の
部材とともに狭い空間内に搭載された電子機器であって
も、部品配列に左右されずに、発熱部材で発生する熱を
放熱部まで効率良く輸送し、発熱部材を所定の温度に冷
却することを課題とする。The present onset Ming, also electronic components is an exothermic member is an electronic device mounted in a narrow space together with other members, irrespective of the component arrangement, the heat radiating portion of heat generated by the heat generating member Also in efficiently transport, it is an object to cool the heat generating member to a predetermined temperature.

【０００５】[0005]

【課題を解決するための手段】上記課題を解決するため
に、本発明の電子機器は、薄型の筐体内部に複数の半導
体素子が搭載された配線基板を収容し、該配線基板の上
側の筐体表面にキーボードを配してなる本体と、該本体
の一側縁に該本体に対して開閉可能に連結されてなる薄
型の表示装置とを備えた電子機器において、前記半導体
素子の内の発熱部品に熱的に接続され、液体が通流され
る流路を有する受熱部材と、前記表示装置の背面側の内
壁に放熱可能に配置され、液体が通流される流路を有す
る放熱部材と、前記受熱部材の前記流路と前記放熱部材
の前記流路とを接続してなる樹脂製のフレキシブルチュ
ーブと、前記受熱部材と前記放熱部材との間で前記フレ
キシブルチューブを介して前記液体を循環させる液駆動
装置とを有してなることを特徴とする。In order to solve the above-mentioned problems, an electronic apparatus according to the present invention has a plurality of semiconductors inside a thin housing.
The wiring board on which the body element is mounted is housed and is placed on the wiring board.
A main body having a keyboard on the surface of the side casing, and the main body
A thin plate that is openably and closably connected to one side edge of the main body.
And a semiconductor display device, comprising:
It is thermally connected to the heat-generating components inside the element, allowing liquid to flow through.
A heat receiving member having a flow path, and a rear side of the display device.
It is arranged on the wall so that it can dissipate heat, and has a flow path through which liquid flows.
Heat dissipation member, the flow path of the heat receiving member, and the heat dissipation member
Flexible tube made of resin that is connected to the above
And between the heat receiving member and the heat radiating member.
Liquid drive that circulates the liquid through a kisible tube
And a device .

【０００６】[0006]

【０００７】この場合において、前記受熱部材と前記放
熱部材は、それぞれ扁平状に形成され、前記フレキシブ
ルチューブが接続される前記受熱部材と前記放熱部材の
前記流路の接続部は、前記受熱部材と前記放熱部材の扁
平方向に延在させて設けることができる。 In this case, the heat receiving member and the discharge
Each of the heat members is formed in a flat shape, and
Of the heat receiving member and the heat dissipating member to which a tube is connected.
The connecting portion of the flow path is a flat portion of the heat receiving member and the heat radiating member.
It can be provided so as to extend in the horizontal direction.

【０００８】[0008]

【作用】すなわち、本発明が対象とする電子機器は、薄
型の筐体内部に複数の半導体素子が搭載された配線基板
を収容し、その配線基板の上側の筐体表面にキーボード
を配してなる本体と、この本体の一側縁に本体に対して
開閉可能に連結されてなる薄型の表示装置とを備えてな
るいわゆるノート型パソコンである。このような電子機
器は、非常に狭い筐体内に多数の部品が実装されるが、
発熱部品に熱的に接続して設けた受熱部材と、表示装置
の背面側の内壁に放熱可能に配置された放熱部材との間
を樹脂製のフレキシブルチューブで接続し、そのフレキ
シブルチューブを介して液駆動装置により液体を循環さ
せるようにしているから、受熱部材と放熱部材との間で
高効率で熱を輸送することができる。 特に、放熱部材を
薄型の表示装置の背面側の内壁に放熱可能に配置したこ
とから、放熱面を広くとることができ、高い放熱性能が
得られるので効率的に電子部品を冷却することができ
る。また、受熱部材と放熱部材との接続に樹脂製のフレ
キシブルチュ−ブを用いているので、非常に狭い筐体内
に多数の部品が実装された状態においても、部品配列に
左右されることなく配設することができ、かつ本体に対
して開閉可能に連結されてなる表示装置に設けられた放
熱部材にも容易に配設することができる。 In other words, the electronic equipment targeted by the present invention is thin.
Circuit board with multiple semiconductor elements mounted inside the mold case
Housing the keyboard on the surface of the housing above the wiring board.
With the main body and the one side edge of this main body to the main body
And a thin display device that can be opened and closed.
It is a so-called notebook computer. Such an electronic machine
As for the container, many parts are mounted in a very narrow housing,
A heat receiving member thermally connected to the heat generating component and a display device
Between the heat dissipation member that is arranged on the inner wall on the back side of the
With a flexible tube made of resin,
The liquid is circulated by the liquid drive device through the sibble tube.
Between the heat receiving member and the heat radiating member
It can transport heat with high efficiency. Especially, the heat dissipation member
A thin display device is placed on the inner wall on the back side to radiate heat.
As a result, the heat dissipation surface can be wide and high heat dissipation performance can be obtained.
As a result, the electronic components can be cooled efficiently.
It In addition, a resin frame is used to connect the heat receiving member to the heat radiating member.
The use of a kisible tube allows it to be used in very narrow housings.
Even when many parts are mounted on the
It can be installed without being influenced by the
The display device that is connected so that it can be opened and closed.
It can be easily arranged on the heat member.

【０００９】[0009]

【実施の形態】以下、本発明のいくつかの実施例を、図
面を参照して説明する。図１に、本発明の第１の実施例
を示す。図示のように、本実施例の電子機器は、いわゆ
るノート型パソコンであり、複数の半導体素子を搭載し
た配線基板２、キ−ボード４、ディスク装置６、表示装
置８などから構成されている。本体は、金属製の筐体１
０の中に配線基板２やディスク装置６などを収容し、配
線基板２の上側の筐体１０の表面部にキーボード４を配
置して薄型に形成されている。また、本体の一側縁に薄
型の表示装置８が本体に対して開閉可能に連結されてい
る。配線基板２に搭載された半導体素子のうち、発熱量
の特に大きい半導体素子１２は、受熱ヘッダ１４、放熱
ヘッダ１６、フレキシブルチューブ１８等で構成される
熱輸送デバイスによって冷却される。図示したように、
半導体素子１２と受熱ヘッダ１４とはサ−マルコンパウ
ンド、あるいは、高熱伝導シリコンゴムなどを挟んで接
触させ、半導体素子１２で発生する熱を効率よく受熱ヘ
ッダ１４に伝える。さらに、半導体素子１２に接続され
た受熱ヘッダ１４はフレキシブルチューブ１８によっ
て、表示装置８の背面部の筐体壁に設置された放熱ヘッ
ダ１６に接続されている。放熱ヘッダ１６は、サ−マル
コンパウンド、あるいは、高熱伝導シリコンゴムを介し
て、もしくは、直接ねじ２０止めなどの手段によって金
属製筐体壁と熱的かつ物理的に取り付けられる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. As shown, the electronic device of this embodiment, so-called
It is a notebook type personal computer, which is composed of a wiring board 2 on which a plurality of semiconductor elements are mounted, a key board 4, a disk device 6, a display device 8 and the like. The main body is a metal casing 1
The wiring board 2 and the disk device 6 are housed in
The keyboard 4 is arranged on the surface of the housing 10 above the wiring board 2.
It is placed and formed thin. Also, a thin edge on one side of the body
Type display device 8 is openably and closably connected to the main body.
It Among the semiconductor elements mounted on the wiring board 2, the semiconductor element 12 having a particularly large heat generation amount is cooled by the heat transport device including the heat receiving header 14, the heat radiation header 16, the flexible tube 18, and the like. As shown,
The semiconductor element 12 and the heat receiving header 14 are brought into contact with each other with a thermal compound or high thermal conductive silicone rubber interposed therebetween, and the heat generated in the semiconductor element 12 is efficiently transmitted to the heat receiving header 14. Further, the heat receiving header 14 connected to the semiconductor element 12 is connected by a flexible tube 18 to a heat radiating header 16 installed on the housing wall on the back surface of the display device 8. The heat dissipation header 16 is thermally and physically attached to the metal housing wall via a thermal compound or a high thermal conductive silicone rubber, or directly by means of screwing 20 or the like.

【００１０】受熱ヘッダ１４、放熱ヘッダ１６の内部に
は流路が形成され、液体が封入されている。さらに、放
熱ヘッダ１６の内部には液駆動装置が組み込まれてお
り、受熱ヘッダ１４と放熱ヘッダ１６との間で液が駆動
される。液体の駆動は、両者間での往復動、あるいは、
循環による。受熱ヘッダ１４と放熱ヘッダ１６間はフレ
キシブルチュ−ブによって接続されるので、非常に狭い
筐体内に多数の部品が実装された状態においても、実装
構造に左右されることなく、高発熱半導体素子と放熱部
である筐体壁とが容易に接続できるとともに、熱輸送が
液の駆動によって行われるので、高発熱半導体素子で発
生する熱は、効果的に放熱ヘッダに輸送される。放熱部
においては、放熱ヘッダと金属製筐体壁とが熱的に接続
されているので、金属製筐体の高い熱伝導率のために熱
が広く筐体壁に拡散され高い放熱性能が得られる。した
がって、効率的に半導体素子を冷却することができる。A flow path is formed inside the heat receiving header 14 and the heat radiating header 16 and a liquid is sealed therein. Further, a liquid driving device is incorporated inside the heat dissipation header 16, and the liquid is driven between the heat receiving header 14 and the heat dissipation header 16. The liquid is driven by reciprocating motion between the two, or
By circulation. Since the heat receiving header 14 and the heat radiating header 16 are connected by a flexible tube, even if a large number of components are mounted in a very narrow housing, the semiconductor device can be a high heat generating semiconductor element without being influenced by the mounting structure. Since it can be easily connected to the housing wall, which is a heat radiating portion, and the heat is transported by driving the liquid, the heat generated in the high heat generating semiconductor element is effectively transported to the heat radiating header. In the heat dissipation part, since the heat dissipation header and the metal housing wall are thermally connected, heat is widely spread to the housing wall due to the high thermal conductivity of the metal housing, and high heat dissipation performance is obtained. To be Therefore, the semiconductor element can be cooled efficiently.

【００１１】図２に、図１で用いている熱輸送デバイス
の詳細を示す。受熱ヘッダ１４、放熱ヘッダ１６の内部
にはフィンが設けられており、液流路を形成するととも
にヘッダ壁より内部の液体に効率よく熱を伝える。さら
に、放熱ヘッダ１６は、内部に液駆動機構を内蔵してい
る。受熱ヘッダ１４は、半導体素子１２などの発熱部材
（発熱部材１ともいう）の大きさに応じて任意の大きさ
に設定でき、発熱部材１に接触などの手段によって熱的
に接続される。また、金属板（銅、アルミなど）に金属
パイプを溶接した構造であってもよい。一方、放熱ヘッ
ダ内部の液駆動機構は、一例として、流路の一部をシリ
ンダ２２としピストン２４をモータ２６及びリンク機構
２８によって往復駆動させる機構を示した。放熱ヘッダ
１６は、金属製の筐体１０の壁に取り付けられるが、取
付け構造として筐体壁にネジ止め用のボス３０をダイカ
スト成型時に一体で形成してもよい。また、受熱ヘッダ
１４と放熱ヘッダ１６を接続するフレキシブルチューブ
１８は、樹脂製でよく内径２ｍｍ前後のものを用いる。
したがって、受熱ヘッダ１４、放熱ヘッダ１６とも薄型
化が可能で、狭い空間に実装された高発熱半導体素子で
あっても効果的に冷却できる。FIG. 2 shows details of the heat transport device used in FIG. Fins are provided inside the heat receiving header 14 and the heat radiating header 16 to form a liquid flow path and to efficiently transfer heat from the header wall to the liquid inside. Further, the heat dissipation header 16 has a liquid driving mechanism built therein. The heat receiving header 14 can be set to an arbitrary size according to the size of a heat generating member (also referred to as the heat generating member 1) such as the semiconductor element 12, and is thermally connected to the heat generating member 1 by means such as contact. Further, the structure may be such that a metal pipe is welded to a metal plate (copper, aluminum, etc.). On the other hand, as the liquid drive mechanism inside the heat dissipation header, a mechanism in which a part of the flow path is a cylinder 22 and a piston 24 is reciprocally driven by a motor 26 and a link mechanism 28 is shown as an example. The heat dissipation header 16 is attached to the wall of the housing 10 made of metal, but as a mounting structure, the boss 30 for screwing may be integrally formed on the housing wall during die casting. The flexible tube 18 for connecting the heat receiving header 14 and the heat radiating header 16 is made of resin and has an inner diameter of about 2 mm.
Therefore, both the heat receiving header 14 and the heat radiating header 16 can be made thin, and even a high heat generating semiconductor element mounted in a narrow space can be effectively cooled.

【００１２】図３に本発明の第２の実施例を示す。本実
施例においては、放熱ヘッダ１６の取付けられる金属製
筐体１０のうち表示部側の筐体の内側にフィン３２ａ，
３２ｂが一体成型で設けられている。フィン３２ａの高
さは、放熱ヘッダ１６の厚さと同程度で、表示器の取り
付けに支障をきたさないようにする。また、互いに直角
方向にフィンを設けることによって筐体に高い剛性を持
たせることができる。ただし、機器使用時において、水
平方向になるフィン３２ｂは、鉛直方向のフィン３２ａ
よりも高さを低くし、自然対流による上昇空気の流動を
妨げないようにしている。つまり、表示装置８は、使用
しない時は表示面をキーボード４側に倒して閉じ、使用
時においては表示面を起こして開いて用いられるから、
表示部側の筐体の内側に起立して設けられたフィン３２
ｂは機器使用時に水平になる。さらに、筐体に空気孔３
４を設ければ、自然対流放熱を促進することができる。 FIG. 3 shows a second embodiment of the present invention. In this embodiment, the fins 32a are provided inside the housing on the display unit side of the metal housing 10 to which the heat dissipation header 16 is attached.
32b is integrally formed. The height of the fins 32a is approximately the same as the thickness of the heat dissipation header 16 so as not to hinder the mounting of the display. Further, by providing the fins at right angles to each other, the housing can have high rigidity. However, when the device is used, the fins 32b that are in the horizontal direction are the fins 32a in the vertical direction.
The height is lower than that of the above so as not to disturb the flow of rising air due to natural convection. That is, the display device 8 is used
When not using, tilt the display surface to the keyboard 4 side and close it
Sometimes it is used by raising the display surface and opening it.
Fins 32 provided upright inside the casing on the display unit side
b becomes horizontal when the device is used. Furthermore, the housing has air holes 3
If Kere set to 4, it is possible to promote the natural convection heat dissipation.

【００１３】図４に本発明の第３の実施例を示す。本実
施例においては、熱輸送デバイスを構成する放熱ヘッダ
の流路３６が、金属製筐体１０の壁面に金属筐体成型時
にダイカストによる一体成型で直接形成されている。放
熱ヘッダの流路３６は、フレキシブルチューブ１８と接
続されたフタ３８によって密閉され、発熱半導体素子に
取り付けられる受熱ヘッダ１４と放熱ヘッダの流路３６
との間で、フレキシブルチューブ１８を介して別途設け
られる液駆動装置４０によって液体が駆動される。液体
の駆動は、小型ポンプによる液循環、もしくは、図２で
一例として示した液駆動機構が用いられる。本実施例に
よれば、放熱ヘッダと放熱面である金属製筐体壁面との
接触熱抵抗がなくなるので効果的な放熱ができるととも
に、放熱ヘッダの流路が金属筐体成型時にダイカストに
よる一体成型で形成されるため複雑な流路構造の形成も
可能である。FIG. 4 shows a third embodiment of the present invention. In this embodiment, the flow path 36 of the heat dissipation header forming the heat transport device is directly formed on the wall surface of the metal casing 10 by die casting when the metal casing is molded. The heat dissipation header flow path 36 is sealed by a lid 38 connected to the flexible tube 18, and the heat receiving header 14 and the heat dissipation header flow path 36 are attached to the heat generating semiconductor element.
The liquid is driven by a liquid driving device 40 separately provided between the liquid driving device 40 and the liquid feeding device. A liquid is circulated by a small pump or a liquid driving mechanism shown as an example in FIG. 2 is used for driving the liquid. According to this embodiment, contact heat resistance between the heat dissipation header and the wall surface of the metal housing, which is the heat dissipation surface, is eliminated, so that effective heat dissipation is possible, and the flow path of the heat dissipation header is integrally formed by die casting during metal housing molding. Since it is formed by, it is possible to form a complicated flow path structure.

【００１４】図５に本発明の第４の実施例を示す。本実
施例においては、熱輸送デバイスを構成する放熱部が金
属製のパイプ４２であって、金属製筐体１０に直接取付
けられる。金属製パイプ４２は、フレキシブルチューブ
１８にコネクタ４４ａ，４４ｂによって接続され、発熱
半導体素子に取り付けられる受熱ヘッダと金属製パイプ
４２との間で、フレキシブルチューブ１８を介して別途
設けられる液駆動装置によって液体が駆動される。な
お、金属製パイプは、フレキシブルチュ−ブと同程度の
内径（２ｍｍ前後）のものをもちいる。一方、筐体壁に
は、Ｕ字状の溝部４６が一体成型で設けられており、金
属製パイプをこのＵ字状の溝部４６に嵌め込むことによ
って、特に、溶接などの手段によらなくても効率良く熱
的に接続することが可能である。本実施例によれば、放
熱部と金属製筐体とが金属製パイプによる線状の接触で
あっても、金属製筐体の高い熱伝導率のために熱が広く
筐体壁に拡散されるとともに、簡単な構造で筐体壁全面
に液流路を構成する金属製パイプを設置することも可能
で、筐体壁の広い面積を有効に放熱面として利用でき
る。このため、高い放熱性能が得られる。FIG. 5 shows a fourth embodiment of the present invention. In this embodiment, the heat radiating portion constituting the heat transport device is the metal pipe 42 and is directly attached to the metal housing 10. The metal pipe 42 is connected to the flexible tube 18 by the connectors 44a and 44b, and a liquid drive device separately provided via the flexible tube 18 between the heat receiving header attached to the heat-generating semiconductor element and the metal pipe 42 causes the liquid pipe to flow. Is driven. The metal pipe has the same inner diameter (about 2 mm) as the flexible tube. On the other hand, a U-shaped groove portion 46 is integrally formed on the housing wall, and by fitting a metal pipe into the U-shaped groove portion 46, there is no need to use welding or other means. Can be efficiently and thermally connected. According to the present embodiment, even if the heat radiating portion and the metal casing are in linear contact with each other by the metal pipe, the heat is widely diffused to the casing wall due to the high thermal conductivity of the metal casing. In addition, it is possible to install a metal pipe that constitutes a liquid flow path on the entire surface of the housing wall with a simple structure, and a large area of the housing wall can be effectively used as a heat dissipation surface. Therefore, high heat dissipation performance can be obtained.

【００１５】図６に本発明の第５の実施例を示す。電子
機器は、複数の半導体素子を搭載した配線基板２、キ−
ボード４、ディスク装置６、表示装置８などからなり、
金属製の筐体１０の中に収容されている。配線基板２に
搭載された半導体素子のうち、発熱量の特に大きい半導
体素子１２は、受熱ヘッダ１４、放熱ヘッダ１６、フレ
キシブルチューブ１８等で構成される熱輸送デバイスに
よって冷却される。半導体素子１２と受熱ヘッダ１４と
はサ−マルコンパウンド、あるいは、高熱伝導シリコン
ゴムなどを挟んで接触させ、半導体素子１２で発生する
熱を効率よく受熱ヘッダ１４に伝える。さらに、半導体
素子１２に接続された受熱ヘッダ１４はフレキシブルチ
ューブ１８によって、配線基板等が搭載された本体側の
筐体壁に設置された放熱ヘッダ１６に接続されている。
放熱ヘッダ１６は、サ−マルコンパウンド、あるいは、
高熱伝導シリコンゴムを介して、もしくは、直接ねじ止
めなどの手段によって金属製筐体壁と熱的かつ物理的に
取り付けられる。受熱ヘッダ１４、放熱ヘッダ１６の内
部には流路が形成され、液体が封入されている。熱輸送
デバイスの詳細は、図２で示したものと同様である。た
だし、図２で示した放熱ヘッダにおいては、液駆動機構
が放熱ヘッダ全体の厚さを規定している。したがって、
極めて狭い実装空間しか得られないような装置において
は、液駆動装置を放熱ヘッダから分離して設置してもよ
い。FIG. 6 shows a fifth embodiment of the present invention. Electronic equipment includes a wiring board 2 and a key on which a plurality of semiconductor elements are mounted.
It consists of board 4, disk device 6, display device 8, etc.,
It is housed in a metal casing 10. Among the semiconductor elements mounted on the wiring board 2, the semiconductor element 12 having a particularly large heat generation amount is cooled by the heat transport device including the heat receiving header 14, the heat radiation header 16, the flexible tube 18, and the like. The semiconductor element 12 and the heat receiving header 14 are brought into contact with each other with a thermal compound or high thermal conductive silicone rubber interposed therebetween, and the heat generated in the semiconductor element 12 is efficiently transmitted to the heat receiving header 14. Further, the heat receiving header 14 connected to the semiconductor element 12 is connected by the flexible tube 18 to the heat radiating header 16 installed on the main body side housing wall on which the wiring board and the like are mounted.
The heat dissipation header 16 is a thermal compound or
It is thermally and physically attached to the metal casing wall via a high thermal conductive silicone rubber or by means such as direct screwing. A flow path is formed inside the heat receiving header 14 and the heat radiating header 16, and a liquid is sealed therein. The details of the heat transport device are the same as those shown in FIG. However, in the heat dissipation header shown in FIG. 2, the liquid drive mechanism defines the thickness of the entire heat dissipation header. Therefore,
In a device where only a very small mounting space can be obtained, the liquid drive device may be installed separately from the heat dissipation header.

【００１６】[0016]

【００１７】[0017]

【００１８】[0018]

【００１９】[0019]

【００２０】[0020]

【００２１】[0021]

【００２２】[0022]

【発明の効果】本発明によれば、発熱部材である電子部
品が他の部材とともに狭い空間内に搭載された電子機器
であっても、部品配列に左右されずに、発熱部材で発生
する熱を放熱部まで効率良く輸送し、発熱部材を所定の
温度に冷却することができる。 According to the present invention , the electronic part which is the heat generating member
An electronic device in which a product is mounted in a narrow space together with other components
Even if it happens, it is generated by the heat generating member regardless of the arrangement of parts
Efficiently transfers the generated heat to the heat dissipation part,
Can be cooled to temperature.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第１の実施例の斜視図。FIG. 1 is a perspective view of a first embodiment of the present invention.

【図２】図１の実施例の詳細斜視図。2 is a detailed perspective view of the embodiment of FIG.

【図３】本発明の第２の実施例の斜視図。FIG. 3 is a perspective view of a second embodiment of the present invention.

【図４】本発明の第３の実施例の構成説明図。FIG. 4 is a structural explanatory view of a third embodiment of the present invention.

【図５】本発明の第４の実施例の斜視図。FIG. 5 is a perspective view of a fourth embodiment of the present invention.

【図６】本発明の第５の実施例の斜視図。FIG. 6 is a perspective view of a fifth embodiment of the present invention.

【符号の説明】[Explanation of symbols]

２ 配線基板 ４ キ−ボード ６ ディスク装置 ８ 表示装置 １０ 金属製筐体 １２ 半導体素子発熱部材 １４ 受熱ヘッダ １６ 放熱ヘッダ １８ フレキシブルチューブ ２０ ねじ ２２ シリンダ ２４ ピストン ２６ モータ ２８ リンク機構 ３０ ボス ３２ａ，３２ｂ フィン ３４ 空気孔 ３６ 流路 ３８ フタ ４０ 液駆動装置 ４２ 金属製パイプ ４４ａ，４４ｂ コネクタ 2 wiring board 4 key board 6 disk device 8 display devices 10 metal housing 12 Semiconductor element heat generating member 14 Heat receiving header 16 heat dissipation header 18 Flexible tube 20 screws 22 cylinders 24 pistons 26 motor 28 Link mechanism 30 boss 32a, 32b fins 34 air holes 36 channels 38 Lid 40 liquid drive 42 Metal Pipe 44a, 44b connector

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平４−307993（ＪＰ，Ａ) 特開 平４−354010（ＪＰ，Ａ) 特開 平５−264139（ＪＰ，Ａ) 実開 平３−112351（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 7/20 H01L 23/473 F25D 9/00 G06F 1/20 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-307993 (JP, A) JP-A-4-354010 (JP, A) JP-A-5-264139 (JP, A) Actual Kaihei 3- 112351 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 7/20 H01L 23/473 F25D 9/00 G06F 1/20

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 薄型の筐体内部に複数の半導体素子が搭
載された配線基板を収容し、該配線基板の上側の筐体表
面にキーボードを配してなる本体と、該本体の一側縁に
該本体に対して開閉可能に連結されてなる薄型の表示装
置とを備えた電子機器において、 前記半導体素子の内の発熱部品に熱的に接続され、液体
が通流される流路を有する受熱部材と、前記表示装置の
背面側の内壁に放熱可能に配置され、液体が通流される
流路を有する放熱部材と、前記受熱部材の前記流路と前
記放熱部材の前記流路とを接続してなる樹脂製のフレキ
シブルチューブと、前記受熱部材と前記放熱部材との間
で前記フレキシブルチューブを介して前記液体を循環さ
せる液駆動装置とを有してなることを特徴とする電子機
器。1. A plurality of semiconductor elements are mounted inside a thin housing.
Housing a mounted wiring board, and a housing table on the upper side of the wiring board.
The main body with the keyboard on the surface and one side edge of the main body
A thin display device that is openably and closably connected to the main body
In the electronic apparatus including the location, the thermally connected to the heat generating components of the semiconductor element, a heat receiving member liquid has a passing flows channel, the heat radiation can be arranged on the rear side of the inner wall of said display device A heat dissipation member having a flow path through which a liquid flows, a flexible tube made of resin connecting the flow path of the heat reception member and the flow path of the heat dissipation member, the heat reception member and the heat dissipation member Between
An electronic device characterized by having a liquid driving device for circulating the liquid through the front Symbol flexible tube in. 【請求項２】 前記受熱部材と前記放熱部材は、それぞ
れ扁平状に形成され、 前記フレキシブルチューブが接続される前記受熱部材と
前記放熱部材の前記流路の接続部は、前記受熱部材と前
記放熱部材の扁平方向に延在させて設けられてなること
を特徴とする請求項１に記載の電子機器。2. The heat receiving member and the heat radiating member are each formed in a flat shape, and a connecting portion of the flow path of the heat receiving member and the heat radiating member to which the flexible tube is connected is provided with the heat receiving member and the heat radiating member. The electronic device according to claim 1 , wherein the electronic device is provided so as to extend in a flat direction of the member. 【請求項３】 前記放熱部材が熱的に接続される前記表
示装置の背面側の内壁が金属製であることを特徴とする
請求項１又は２に記載の電子機器。3. An electronic apparatus according to claim 1 or 2 rear side of the inner wall of the display device in which the heat radiating member is thermally connected is equal to or is made of metal. 【請求項４】 前記受熱部材は、前記液体が通流される
金属パイプを金属板に接続してなることを特徴とする請
求項1乃至３のいずれかに記載の電子機器。Wherein said heat-receiving member, an electronic device according to any of claims 1 to 3, characterized in that the liquid is formed by connecting the through flows metal pipe to the metal plate. 【請求項５】 前記放熱部材は、前記液体が通流される
金属パイプであり、該金属パイプを前記表示装置の背面
側の内壁に熱的に接続してなることを特徴とする請求項
1乃至４のいずれかに記載の電子機器。5. The heat dissipation member is a metal pipe through which the liquid flows, and the metal pipe is attached to the back surface of the display device.
The inner wall on the side is thermally connected to the inner wall.
The electronic device according to any one of 1 to 4.
JP28485593A 1993-11-15 1993-11-15 Electronics Expired - Lifetime JP3385482B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP28485593A JP3385482B2 (en) 1993-11-15 1993-11-15 Electronics
US08/730,441 US5764483A (en) 1993-11-15 1996-10-15 Cooling unit for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28485593A JP3385482B2 (en) 1993-11-15 1993-11-15 Electronics

Related Child Applications (3)

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JP2001369077A Division JP3593659B2 (en) 2001-12-03 2001-12-03 Heat transport device for electronic equipment
JP2001368920A Division JP3598416B2 (en) 2001-12-03 2001-12-03 Heat transport device for electronic equipment
JP2002198468A Division JP4012773B2 (en) 2002-07-08 2002-07-08 Electronics

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JPH07142886A JPH07142886A (en) 1995-06-02
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