JP6017823B2 - Driver integrated motor - Google Patents

Driver integrated motor Download PDF

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JP6017823B2
JP6017823B2 JP2012097743A JP2012097743A JP6017823B2 JP 6017823 B2 JP6017823 B2 JP 6017823B2 JP 2012097743 A JP2012097743 A JP 2012097743A JP 2012097743 A JP2012097743 A JP 2012097743A JP 6017823 B2 JP6017823 B2 JP 6017823B2
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driver
motor
intermediate member
circuit board
main body
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JP2013226015A (en
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靖幸 月岡
靖幸 月岡
雅哉 倉本
雅哉 倉本
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Nidec Sankyo Corp
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Priority to PCT/JP2013/060042 priority patent/WO2013161521A1/en
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K11/00Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30Structural association with control circuits or drive circuits
    • H02K11/33Drive circuits, e.g. power electronics
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K5/00Casings; Enclosures; Supports
    • H02K5/04Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/18Casings or enclosures characterised by the shape, form or construction thereof with ribs or fins for improving heat transfer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Motor Or Generator Frames (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

本発明は、モータ本体部とドライバ部とが一体化されたドライバ一体型モータに関する。   The present invention relates to a driver integrated motor in which a motor body and a driver are integrated.

従来、モータ本体部とドライバ部とが一体化されたドライバ一体型モータが知られている(たとえば、特許文献1参照)。特許文献1に記載のドライバ一体型モータでは、ドライバ部は、パワートランジスタ等の電子部品が実装される回路基板と、回路基板が収容されるケース体とを備えている。このドライバ一体型モータでは、モータ本体部とドライバ部とが支柱を介して連結されており、モータ本体部とドライバ部との間に隙間が形成されている。そのため、このドライバ一体型モータでは、モータ本体部およびドライバ部の相互間の熱伝達が抑制される。   2. Description of the Related Art Conventionally, a driver-integrated motor in which a motor body and a driver are integrated is known (see, for example, Patent Document 1). In the driver integrated motor described in Patent Document 1, the driver unit includes a circuit board on which electronic components such as a power transistor are mounted, and a case body in which the circuit board is accommodated. In this driver-integrated motor, the motor main body and the driver are connected via a support column, and a gap is formed between the motor main body and the driver. Therefore, in this driver-integrated motor, heat transfer between the motor body and the driver is suppressed.

特開2004−201415号公報JP 2004-201415 A

回路基板に実装される電子部品の温度が許容温度を超えると、電子部品が正常に作用しなくなるおそれがあるため、電子部品の温度上昇を抑制する必要がある。特許文献1のドライバ一体型モータでは、モータ本体部およびドライバ部の相互間の熱伝達が抑制されるため、モータ本体部で発生した熱に起因する電子部品の温度上昇を抑制することは可能である。しかしながら、このドライバ一体型モータでは、ドライバ部で発生した熱をモータ本体部へ効率的に逃がすことができないため、ドライバ部で発生した熱に起因する電子部品の温度上昇を抑制することは困難である。   If the temperature of the electronic component mounted on the circuit board exceeds the allowable temperature, the electronic component may not function normally, so it is necessary to suppress the temperature rise of the electronic component. In the driver-integrated motor of Patent Document 1, heat transfer between the motor main body and the driver is suppressed, so that it is possible to suppress the temperature rise of electronic components due to the heat generated in the motor main body. is there. However, in this driver-integrated motor, the heat generated in the driver section cannot be efficiently released to the motor main body section, so it is difficult to suppress the temperature rise of the electronic components due to the heat generated in the driver section. is there.

そこで、本発明の課題は、回路基板に実装される電子部品の、モータ本体部で発生した熱に起因する温度上昇とドライバ部で発生した熱に起因する温度上昇とを抑制することが可能なドライバ一体型モータを提供することにある。   Therefore, an object of the present invention is to suppress the temperature rise caused by the heat generated in the motor main body portion and the temperature rise caused by the heat generated in the driver portion of the electronic component mounted on the circuit board. The object is to provide a driver integrated motor.

上記の課題を解決するため、本発明のドライバ一体型モータは、ロータとステータとを有するモータ本体部と、ロータを駆動するための駆動回路が実装される回路基板と回路基板が収容されるケース体とを有するドライバ部と、モータ本体部とドライバ部との間に配置される中間部材とを備え、中間部材は、略四角筒状に形成され、中間部材の内周側は、モータ本体部と回路基板とを繋ぐケーブルが通過する貫通孔となっており、中間部材とケース体とは、略四角筒状に形成される中間部材の軸方向の端面とケース体とが接触した状態で互いに固定され、ドライバ部の発熱量がモータ本体部の発熱量よりも大きい場合には、ケース体の熱伝導率以上の熱伝導率を有する部材で形成された中間部材がモータ本体部とドライバ部との間に配置され、モータ本体部の発熱量がドライバ部の発熱量よりも大きい場合には、ケース体の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材がモータ本体部とドライバ部との間に配置されていることを特徴とする。 In order to solve the above-described problems, a driver-integrated motor according to the present invention includes a motor body having a rotor and a stator, a circuit board on which a drive circuit for driving the rotor is mounted, and a case in which the circuit board is accommodated. A driver portion having a body, and an intermediate member disposed between the motor main body portion and the driver portion. The intermediate member is formed in a substantially rectangular tube shape, and the inner peripheral side of the intermediate member is the motor main body portion. and it has a through hole through which the cable connecting the circuit board, the intermediate member and the case body, to each other in a state in which the axial end faces of the intermediate member and the case body is in contact is formed in a substantially square tube shape When the heat generation amount of the driver unit is fixed and larger than the heat generation amount of the motor main body, an intermediate member formed of a member having a thermal conductivity equal to or higher than the thermal conductivity of the case body includes the motor main body and the driver unit. Placed between When the heat generation amount of the motor main body is larger than the heat generation amount of the driver section, an intermediate member formed of a member having a thermal conductivity lower than the thermal conductivity of the case body is between the motor main body section and the driver section. It is characterized by being arranged in.

本発明のドライバ一体型モータでは、ドライバ部の発熱量がモータ本体部の発熱量よりも大きい場合には、ケース体の熱伝導率以上の熱伝導率を有する部材で形成された中間部材がモータ本体部とドライバ部との間に配置され、モータ本体部の発熱量がドライバ部の発熱量よりも大きい場合には、ケース体の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材がモータ本体部とドライバ部との間に配置されている。そのため、ドライバ部の発熱量が大きい場合には、ドライバ部で発生した熱をモータ本体部へ効率的に逃がすことが可能になり、その結果、回路基板に実装される電子部品の、ドライバ部で発生した熱に起因する温度上昇を抑制することが可能になる。また、モータ本体部の発熱量が大きい場合には、モータ本体部で発生した熱がドライバ部へ伝達されるのを抑制することが可能になり、その結果、回路基板に実装される電子部品の、モータ本体部で発生した熱に起因する温度上昇を抑制することが可能になる。このように、本発明では、回路基板に実装される電子部品の、モータ本体部で発生した熱に起因する温度上昇とドライバ部で発生した熱に起因する温度上昇とを抑制することが可能になる。   In the driver-integrated motor of the present invention, when the heat generation amount of the driver portion is larger than the heat generation amount of the motor main body portion, an intermediate member formed of a member having a thermal conductivity equal to or higher than that of the case body is used as the motor. It is arranged between the main body part and the driver part, and when the calorific value of the motor main body part is larger than the calorific value of the driver part, it is formed of a member having a thermal conductivity lower than that of the case body. An intermediate member is disposed between the motor body and the driver. For this reason, when the amount of heat generated in the driver section is large, it is possible to efficiently release the heat generated in the driver section to the motor body, and as a result, in the driver section of the electronic component mounted on the circuit board. It becomes possible to suppress the temperature rise caused by the generated heat. In addition, when the heat generation amount of the motor main body is large, it is possible to suppress the heat generated in the motor main body from being transmitted to the driver section. As a result, the electronic components mounted on the circuit board can be prevented. It becomes possible to suppress the temperature rise caused by the heat generated in the motor main body. As described above, according to the present invention, it is possible to suppress the temperature rise caused by the heat generated in the motor main body portion and the temperature rise caused by the heat generated in the driver portion of the electronic component mounted on the circuit board. Become.

また、本発明では、ドライバ部の発熱量およびモータ本体部の発熱量に応じて中間部材のみを入れ替えれば、回路基板に実装される電子部品の温度上昇を抑制することが可能になるため、ドライバ一体型モータの汎用性を高めることが可能になる。   In the present invention, if only the intermediate member is replaced according to the heat generation amount of the driver section and the heat generation amount of the motor main body section, it becomes possible to suppress the temperature rise of the electronic components mounted on the circuit board. The versatility of the integrated motor can be improved.

本発明において、比較されるモータ本体部の発熱量およびドライバ部の発熱量は、たとえば、ロータを定格出力で駆動したときの発熱量である。また、本発明において、たとえば、モータ本体部の、中間部材側の端面の温度と、ケース体の、中間部材側の端面の温度とに基づいて、モータ本体部の発熱量とドライバ部の発熱量とが比較される。   In the present invention, the heat generation amount of the motor main body and the heat generation amount of the driver section to be compared are, for example, the heat generation amounts when the rotor is driven at the rated output. Further, in the present invention, for example, based on the temperature of the end surface on the intermediate member side of the motor main body portion and the temperature of the end surface on the intermediate member side of the case body, the heat generation amount of the motor main body portion and the heat generation amount of the driver portion. Are compared.

本発明において、ドライバ一体型モータは、モータ本体部と中間部材との間に挟まれる平板状の弾性部材を備えていることが好ましい。このように構成すると、モータ本体部と弾性部材との密着性を高めること、および、中間部材と弾性部材との密着性を高めることが可能になる。したがって、モータ本体部と中間部材との間の防水性を高めることが可能になる。   In the present invention, the driver-integrated motor preferably includes a flat elastic member sandwiched between the motor main body and the intermediate member. If comprised in this way, it will become possible to improve the adhesiveness of a motor main-body part and an elastic member, and to improve the adhesiveness of an intermediate member and an elastic member. Therefore, it becomes possible to improve the waterproofness between the motor body and the intermediate member.

本発明において、ケース体は、略筒状に形成される筒部材と、筒部材の、中間部材側の端面と反対の端面を覆うカバー部材とを備え、カバー部材は、ドライバ部の、中間部材側の端面と反対の端面を構成するカバー部を備え、カバー部の内側には、放熱用の放熱板が配置され、回路基板は、カバー部の内側面に固定されていることが好ましい。このように構成すると、カバー部の内側面に対する回路基板の相対位置精度を高めることが可能になる。したがって、カバー部の内側に配置される放熱板と、回路基板または回路基板に実装される電子部品とを確実に接触させることが可能になる。その結果、放熱板を利用して電子部品の熱を効率的に放散することが可能になる。   In this invention, a case body is provided with the cylindrical member formed in a substantially cylindrical shape, and the cover member which covers the end surface opposite to the end surface of the intermediate member side of a cylindrical member, and a cover member is an intermediate member of a driver part. It is preferable that a cover portion constituting an end surface opposite to the end surface on the side is provided, a heat radiating plate is disposed inside the cover portion, and the circuit board is fixed to the inner surface of the cover portion. If comprised in this way, it will become possible to raise the relative positional accuracy of a circuit board with respect to the inner surface of a cover part. Therefore, it is possible to reliably contact the heat sink disposed inside the cover portion and the circuit board or the electronic component mounted on the circuit board. As a result, it is possible to efficiently dissipate heat of the electronic component using the heat sink.

本発明において、たとえば、回路基板は、支柱を介してカバー部の内側面に固定され、回路基板、または、回路基板に実装される電子部品は、放熱板に接触している。   In the present invention, for example, the circuit board is fixed to the inner side surface of the cover portion via a support column, and the circuit board or the electronic component mounted on the circuit board is in contact with the heat sink.

本発明において、カバー部の外側面には、放熱用のフィンが形成されていることが好ましい。このように構成すると、放熱用のフィンを利用して電子部品の熱を効率的に放散することが可能になる。   In this invention, it is preferable that the fin for heat radiation is formed in the outer surface of a cover part. If comprised in this way, it will become possible to dissipate the heat | fever of an electronic component efficiently using the fin for thermal radiation.

以上のように、本発明のドライバ一体型モータでは、回路基板に実装される電子部品の、モータ本体部で発生した熱に起因する温度上昇とドライバ部で発生した熱に起因する温度上昇とを抑制することが可能になる。   As described above, in the driver-integrated motor of the present invention, the temperature rise caused by the heat generated in the motor main body portion and the temperature rise caused by the heat generated in the driver portion of the electronic component mounted on the circuit board are reduced. It becomes possible to suppress.

本発明の実施の形態にかかるドライバ一体型モータの斜視図である。It is a perspective view of a driver integrated motor concerning an embodiment of the invention. 図1に示すドライバ一体型モータのドライバ部、中間部材およびその周辺部分を示す平面図である。It is a top view which shows the driver part of the driver integrated motor shown in FIG. 1, an intermediate member, and its peripheral part. 図1に示す中間部材の斜視図である。It is a perspective view of the intermediate member shown in FIG. 本発明の他の実施の形態にかかるケース体の構成を説明するための断面図である。It is sectional drawing for demonstrating the structure of the case body concerning other embodiment of this invention.

以下、図面を参照しながら、本発明の実施の形態を説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(ドライバ一体型モータの構成)
図1は、本発明の実施の形態にかかるドライバ一体型モータ1の斜視図である。図2は、図1に示すドライバ一体型モータ1のドライバ部3、中間部材4およびその周辺部分を示す平面図である。図3は、図1に示す中間部材4の斜視図である。なお、以下の説明では、ドライバ一体型モータ1の軸方向(図1等のZ方向)を「軸方向」とする。また、ドライバ一体型モータ1の出力側(図1等のZ1方向側)を「前」側とし、ドライバ一体型モータ1の反出力側(図1等のZ2方向側)を「後(後ろ)」側とする。
(Configuration of driver integrated motor)
FIG. 1 is a perspective view of a driver-integrated motor 1 according to an embodiment of the present invention. FIG. 2 is a plan view showing the driver unit 3, the intermediate member 4, and the peripheral portion of the driver integrated motor 1 shown in FIG. FIG. 3 is a perspective view of the intermediate member 4 shown in FIG. In the following description, the axial direction (Z direction in FIG. 1 and the like) of the driver integrated motor 1 is referred to as “axial direction”. Also, the output side (Z1 direction side in FIG. 1 etc.) of the driver integrated motor 1 is the “front” side, and the non-output side (Z2 direction side in FIG. 1 etc.) of the driver integrated motor 1 is “rear (rear)”. ”Side.

本形態のドライバ一体型モータ1(以下、「モータ1」とする)は、産業用のサーボモータであり、その定格出力は、50W〜750Wとなっている。このモータ1は、モータ本体部2とドライバ部3とを備えている。また、モータ1は、モータ本体部2とドライバ部3との間に配置される中間部材4と、ドライバ部3に固定される放熱用の放熱部材5とを備えている。なお、本形態では、モータ1の定格出力に応じて、モータ本体部2の内部構造や外形が変わることはあるが、ドライバ部3は、モータ1の定格出力にかかわらず、共通のものが使用される。   The driver integrated motor 1 (hereinafter referred to as “motor 1”) of this embodiment is an industrial servo motor, and its rated output is 50 W to 750 W. The motor 1 includes a motor main body 2 and a driver unit 3. Further, the motor 1 includes an intermediate member 4 disposed between the motor main body 2 and the driver unit 3 and a heat radiating member 5 for heat dissipation fixed to the driver unit 3. In this embodiment, the internal structure and outer shape of the motor body 2 may change depending on the rated output of the motor 1, but the driver unit 3 is used in common regardless of the rated output of the motor 1. Is done.

モータ本体部2は、図示を省略するロータおよびステータを備えている。ロータまたはステータの一方は駆動用磁石を備え、ロータまたはステータの他方は駆動用コイルを備えている。また、モータ本体部2は、ロータおよびステータが収容される略円筒状のケース体8と、ケース体8の後端面に固定されるホルダ9と、ケース体8の前端面に固定されるフランジ10とを備えている。   The motor body 2 includes a rotor and a stator (not shown). One of the rotor or the stator includes a driving magnet, and the other of the rotor or the stator includes a driving coil. The motor body 2 includes a substantially cylindrical case body 8 in which the rotor and the stator are accommodated, a holder 9 fixed to the rear end surface of the case body 8, and a flange 10 fixed to the front end surface of the case body 8. And.

ケース体8、ホルダ9およびフランジ10は、アルミニウム合金で形成されている。ホルダ9は、略筒状に形成されている。具体的には、ホルダ9は、モータ1の軸方向から見たときの内周面の形状が略円形状となり、外周面の形状が略正方形状となる略筒状に形成されている。ホルダ9の内周側には、ドライバ部3を構成する後述の回路基板13、14とモータ本体部2とを繋ぐケーブル(図示省略)等が引き回されている。フランジ10は、略筒状に形成されている。具体的には、フランジ10は、軸方向から見たときの内周面の形状が略円形状となり、外周面の形状が略正方形状となる略筒状に形成されている。フランジ10の内周側には、モータ本体部2の出力軸が配置されている。フランジ10は、モータ1を産業用機器に取り付けるために設けられている。   The case body 8, the holder 9, and the flange 10 are made of an aluminum alloy. The holder 9 is formed in a substantially cylindrical shape. Specifically, the holder 9 is formed in a substantially cylindrical shape having a substantially circular inner peripheral surface when viewed from the axial direction of the motor 1 and a substantially square outer peripheral surface. On the inner peripheral side of the holder 9, cables (not shown) that connect circuit boards 13 and 14, which will be described later, constituting the driver unit 3 and the motor main unit 2 are routed. The flange 10 is formed in a substantially cylindrical shape. Specifically, the flange 10 is formed in a substantially cylindrical shape in which the shape of the inner peripheral surface when viewed from the axial direction is a substantially circular shape and the shape of the outer peripheral surface is a substantially square shape. An output shaft of the motor main body 2 is disposed on the inner peripheral side of the flange 10. The flange 10 is provided to attach the motor 1 to industrial equipment.

ドライバ部3は、ロータを駆動するための駆動回路等が実装される2枚の回路基板13、14と、回路基板13、14が収容されるケース体15とを備えている。ケース体15は、略四角筒状に形成されている。また、ケース体15は、アルミニウム合金で形成されている。回路基板13には、駆動用コイルに電流を供給するための電界効果トランジスタ(FET)16等の各種の電子部品が実装されている。また、回路基板14には、集積回路(IC、図示省略)等の各種の電子部品が実装されている。   The driver unit 3 includes two circuit boards 13 and 14 on which a drive circuit and the like for driving the rotor are mounted, and a case body 15 in which the circuit boards 13 and 14 are accommodated. The case body 15 is formed in a substantially rectangular tube shape. The case body 15 is formed of an aluminum alloy. Various electronic components such as a field effect transistor (FET) 16 for supplying a current to the driving coil are mounted on the circuit board 13. Various electronic components such as an integrated circuit (IC, not shown) are mounted on the circuit board 14.

放熱部材5は、ケース体15の後端面にその前側面が固定される平板状のベース部5aと、ベース部5aの後側面に形成される複数のフィン5bとを備えている。ベース部5aの前側面には、放熱用の放熱板17が固定されている。放熱板17は、アルミニウム合金等の放熱性を有する部材で形成されている。この放熱板17は、ケース体15の内部に配置されている。回路基板13は、放熱板17に固定されている。また、回路基板14は、回路基板13と回路基板14との間に配置される支柱18を介して、放熱板17に固定されている。   The heat dissipating member 5 includes a flat base portion 5a whose front side surface is fixed to the rear end surface of the case body 15, and a plurality of fins 5b formed on the rear side surface of the base portion 5a. A heat radiating plate 17 for heat dissipation is fixed to the front side surface of the base portion 5a. The heat radiating plate 17 is formed of a heat radiating member such as an aluminum alloy. The heat radiating plate 17 is disposed inside the case body 15. The circuit board 13 is fixed to the heat sink 17. In addition, the circuit board 14 is fixed to the heat radiating plate 17 via a support 18 disposed between the circuit board 13 and the circuit board 14.

中間部材4は、図3に示すように、略四角筒状に形成されており、中間部材4の内周側は、モータ本体部2と回路基板13、14とを繋ぐケーブルが通過する貫通孔4aとなっている。中間部材4とケース体15とは、中間部材4の後端面とケース体15の前端面15aとが接触した状態で、互いに固定されている。   As shown in FIG. 3, the intermediate member 4 is formed in a substantially rectangular tube shape, and the inner peripheral side of the intermediate member 4 is a through hole through which a cable connecting the motor main body 2 and the circuit boards 13 and 14 passes. 4a. The intermediate member 4 and the case body 15 are fixed to each other with the rear end surface of the intermediate member 4 and the front end surface 15a of the case body 15 in contact with each other.

中間部材4とホルダ9との間には、平板状の弾性部材20が挟まれている。弾性部材20は、ゴム等の弾性を有する弾性材料で形成されている。弾性部材20の中心には、モータ本体部2と回路基板13、14とを繋ぐケーブルを通過させるための貫通孔20a(図2参照)が形成されている。中間部材4とホルダ9とは、中間部材4の前端面と弾性部材20とが密着し、かつ、ホルダ9の後端面9aと弾性部材20とが密着するように、弾性部材20を軸方向に圧縮した状態で、互いに固定されている。   A flat elastic member 20 is sandwiched between the intermediate member 4 and the holder 9. The elastic member 20 is formed of an elastic material having elasticity such as rubber. At the center of the elastic member 20, a through hole 20 a (see FIG. 2) for passing a cable connecting the motor main body 2 and the circuit boards 13 and 14 is formed. The intermediate member 4 and the holder 9 are arranged so that the front end surface of the intermediate member 4 and the elastic member 20 are in close contact, and the rear end surface 9a of the holder 9 and the elastic member 20 are in close contact with each other in the axial direction. In a compressed state, they are fixed to each other.

以上のように構成されたモータ1では、駆動用コイルに電流が供給されてロータが回転をすると、駆動用コイル等が発熱してモータ本体部2が発熱し、また、FET16等の電子部品が発熱してドライバ部3が発熱する。   In the motor 1 configured as described above, when current is supplied to the driving coil and the rotor rotates, the driving coil and the like generate heat, the motor main body 2 generates heat, and the electronic components such as the FET 16 The driver unit 3 generates heat and generates heat.

本形態では、ドライバ部3の発熱量がモータ本体部2の発熱量よりも大きい場合には、ケース体15の熱伝導率以上の熱伝導率を有する部材で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されている。具体的には、アルミニウム合金または銅合金等で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されている。中間部材4がアルミニウム合金で形成されている場合には、中間部材4を軽量化することが可能になる。また、中間部材4が銅合金で形成されている場合には、中間部材4の剛性を高めることが可能になる。   In this embodiment, when the amount of heat generated by the driver unit 3 is larger than the amount of heat generated by the motor body 2, the intermediate member 4 formed of a member having a thermal conductivity equal to or higher than the thermal conductivity of the case body 15 is used as the motor body. It is arranged between the part 2 and the driver part 3. Specifically, an intermediate member 4 made of an aluminum alloy or a copper alloy is disposed between the motor main body 2 and the driver unit 3. When the intermediate member 4 is formed of an aluminum alloy, the intermediate member 4 can be reduced in weight. Further, when the intermediate member 4 is formed of a copper alloy, the rigidity of the intermediate member 4 can be increased.

一方、モータ本体部2の発熱量がドライバ部3の発熱量よりも大きい場合には、ケース体15の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されている。具体的には、樹脂やゴム等で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されている。たとえば、ポリカーボネート(PC)で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されている。   On the other hand, when the heat generation amount of the motor main body 2 is larger than the heat generation amount of the driver unit 3, the intermediate member 4 formed of a member having a thermal conductivity lower than that of the case body 15 is used as the motor main body portion. 2 and the driver unit 3. Specifically, an intermediate member 4 formed of resin, rubber, or the like is disposed between the motor main body 2 and the driver unit 3. For example, an intermediate member 4 made of polycarbonate (PC) is disposed between the motor body 2 and the driver unit 3.

なお、ケース体15の熱伝導率以上の熱伝導率を有する部材で形成された中間部材4の形状と、ケース体15の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材4の形状とは同じである。また、モータ1の定格出力が比較的小さい場合には、ドライバ部3の発熱量がモータ本体部2の発熱量よりも大きくなり、モータ1の定格出力が比較的大きい場合には、モータ本体部2の発熱量がドライバ部3の発熱量よりも大きくなる。   Note that the shape of the intermediate member 4 formed of a member having a thermal conductivity equal to or higher than the thermal conductivity of the case body 15 and the intermediate member formed of a member having a thermal conductivity lower than the thermal conductivity of the case body 15 The shape of 4 is the same. Further, when the rated output of the motor 1 is relatively small, the amount of heat generated by the driver unit 3 is larger than the amount of heat generated by the motor body 2, and when the rated output of the motor 1 is relatively large, the motor body. 2 is larger than the amount of heat generated by the driver unit 3.

また、本形態では、比較されるモータ本体部2の発熱量およびドライバ部3の発熱量は、ロータを定格出力で駆動したときの発熱量である。すなわち、ロータを定格出力で駆動したときのモータ本体部2の発熱量とドライバ部3の発熱量とが比較されて、どちらの発熱量が大きいのかが判定される。また、ホルダ9の後端面9aの温度とケース体15の前端面15aの温度とに基づいて、モータ本体部2の発熱量とドライバ部3の発熱量とが比較される。すなわち、モータ本体部2の、中間部材4側の端面の温度と、ケース体15の、中間部材4側の端面の温度とに基づいて、モータ本体部2の発熱量とドライバ部3の発熱量とが比較される。具体的には、ケース体15の前端面15aの温度がホルダ9の後端面9aの温度よりも高ければ、ドライバ部3の発熱量がモータ本体部2の発熱量よりも大きくなり、後端面9aの温度が前端面15aの温度よりも高ければ、モータ本体部2の発熱量がドライバ部3の発熱量よりも大きくなる。   In the present embodiment, the heat generation amount of the motor main body 2 and the heat generation amount of the driver unit 3 to be compared are the heat generation amounts when the rotor is driven at the rated output. That is, the amount of heat generated by the motor body 2 when the rotor is driven at the rated output and the amount of heat generated by the driver unit 3 are compared to determine which amount of heat is larger. Further, based on the temperature of the rear end surface 9 a of the holder 9 and the temperature of the front end surface 15 a of the case body 15, the heat generation amount of the motor body 2 and the heat generation amount of the driver unit 3 are compared. That is, based on the temperature of the end face of the motor body 2 on the intermediate member 4 side and the temperature of the end face of the case body 15 on the side of the intermediate member 4, the amount of heat generated by the motor body 2 and the amount of heat generated by the driver section 3. Are compared. Specifically, if the temperature of the front end surface 15a of the case body 15 is higher than the temperature of the rear end surface 9a of the holder 9, the amount of heat generated by the driver unit 3 becomes larger than the amount of heat generated by the motor body 2, and the rear end surface 9a. Is higher than the temperature of the front end face 15 a, the amount of heat generated by the motor body 2 is greater than the amount of heat generated by the driver unit 3.

なお、比較されるモータ本体部2の発熱量およびドライバ部3の発熱量は、計算または実験によって、モータ1の組立前に算出されている。また、この発熱量の算出結果に基づいて、ケース体15の熱伝導率以上の熱伝導率を有する部材で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されるのか、あるいは、ケース体15の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されるのかがモータ1の組立前に決定され、決定された中間部材4がモータ1に組み付けられる。   Note that the heat generation amount of the motor main body 2 and the heat generation amount of the driver unit 3 to be compared are calculated before the assembly of the motor 1 by calculation or experiment. Further, based on the calculation result of the calorific value, the intermediate member 4 formed of a member having a thermal conductivity equal to or higher than the thermal conductivity of the case body 15 is disposed between the motor main body 2 and the driver unit 3. Or whether the intermediate member 4 formed of a member having a thermal conductivity lower than that of the case body 15 is disposed between the motor main body 2 and the driver unit 3 before the motor 1 is assembled. The determined intermediate member 4 is assembled to the motor 1.

(本形態の主な効果)
以上説明したように、本形態では、ドライバ部3の発熱量がモータ本体部2の発熱量よりも大きい場合には、ケース体15の熱伝導率以上の熱伝導率を有する部材で形成された中間部材4がモータ本体部2とドライバ部3との間に配置され、モータ本体部2の発熱量がドライバ部3の発熱量よりも大きい場合には、ケース体15の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材4がモータ本体部2とドライバ部3との間に配置されている。そのため、本形態では、ドライバ部3の発熱量が大きい場合には、ドライバ部3で発生した熱をモータ本体部2へ効率的に逃がすことが可能になり、その結果、回路基板13、14に実装される電子部品の、ドライバ部3で発生した熱に起因する温度上昇を抑制することが可能になる。また、本形態では、モータ本体部2の発熱量が大きい場合には、モータ本体部2で発生した熱がドライバ部3へ伝達されるのを抑制することが可能になり、その結果、回路基板13、14に実装される電子部品の、モータ本体部2で発生した熱に起因する温度上昇を抑制することが可能になる。
(Main effects of this form)
As described above, in this embodiment, when the heat generation amount of the driver unit 3 is larger than the heat generation amount of the motor main body unit 2, it is formed of a member having a thermal conductivity equal to or higher than the thermal conductivity of the case body 15. When the intermediate member 4 is disposed between the motor main body 2 and the driver unit 3 and the heat generation amount of the motor main body unit 2 is larger than the heat generation amount of the driver unit 3, it is lower than the thermal conductivity of the case body 15. An intermediate member 4 formed of a member having thermal conductivity is disposed between the motor main body 2 and the driver unit 3. Therefore, in this embodiment, when the amount of heat generated by the driver unit 3 is large, it is possible to efficiently release the heat generated in the driver unit 3 to the motor main body unit 2. It becomes possible to suppress the temperature rise caused by the heat generated in the driver unit 3 of the electronic component to be mounted. Further, in the present embodiment, when the heat generation amount of the motor main body 2 is large, it is possible to suppress the heat generated in the motor main body 2 from being transmitted to the driver unit 3, and as a result, the circuit board. It is possible to suppress the temperature rise caused by the heat generated in the motor main body 2 of the electronic components mounted on 13 and 14.

また、本形態では、モータ本体部2の発熱量およびドライバ部3の発熱量に応じて中間部材4のみを入れ替えれば、回路基板13、14に実装される電子部品の温度上昇を抑制することが可能になるため、モータ1の汎用性を高めることが可能になる。   Further, in this embodiment, if only the intermediate member 4 is replaced according to the heat generation amount of the motor main body 2 and the heat generation amount of the driver unit 3, the temperature rise of the electronic components mounted on the circuit boards 13 and 14 can be suppressed. Therefore, the versatility of the motor 1 can be improved.

本形態では、中間部材4とホルダ9との間に弾性部材20が挟まれており、中間部材4とホルダ9とは、中間部材4の前端面と弾性部材20とが密着し、かつ、ホルダ9の後端面9aと弾性部材20とが密着するように、弾性部材20を軸方向に圧縮した状態で、互いに固定されている。そのため、本形態では、モータ本体部2と中間部材4との間の防水性を高めることが可能になる。   In this embodiment, the elastic member 20 is sandwiched between the intermediate member 4 and the holder 9. The intermediate member 4 and the holder 9 are in close contact with the front end surface of the intermediate member 4 and the elastic member 20. 9, the elastic member 20 is fixed to each other in a state where the elastic member 20 is compressed in the axial direction so that the rear end surface 9a and the elastic member 20 are in close contact with each other. Therefore, in this embodiment, it becomes possible to improve the waterproofness between the motor main body 2 and the intermediate member 4.

本形態では、回路基板13は、放熱板17に固定されている。そのため、FET16等の電子部品が実装される回路基板13を放熱板17に確実に接触させることが可能になる。したがって、本形態では、回路基板13に実装されるFET16等の発熱量の大きな電子部品の熱を、放熱板17を利用して効率的に放散することが可能になる。   In this embodiment, the circuit board 13 is fixed to the heat radiating plate 17. Therefore, the circuit board 13 on which electronic components such as the FET 16 are mounted can be reliably brought into contact with the heat radiating plate 17. Therefore, in this embodiment, it is possible to efficiently dissipate the heat of the electronic component having a large calorific value such as the FET 16 mounted on the circuit board 13 by using the heat radiating plate 17.

(ケース体の変形例)
図4は、本発明の他の実施の形態にかかるケース体25の構成を説明するための断面図である。
(Modification of case body)
FIG. 4 is a cross-sectional view for explaining the configuration of a case body 25 according to another embodiment of the present invention.

上述した形態では、ドライバ部3は、略四角筒状に形成されるケース体15を備えている。この他にもたとえば、ドライバ部3は、ケース体15に代えて、図4に示すように、略四角筒状に形成される筒部材23と、筒部材23の後端面を覆うカバー部材24とから構成されるケース体25を備えていても良い。   In the embodiment described above, the driver unit 3 includes the case body 15 formed in a substantially rectangular tube shape. In addition to this, for example, as shown in FIG. 4, the driver unit 3, instead of the case body 15, includes a cylindrical member 23 formed in a substantially square cylindrical shape, and a cover member 24 that covers the rear end surface of the cylindrical member 23. The case body 25 comprised from may be provided.

カバー部材24は、ドライバ部3の後端面を構成するカバー部24aを備えている。カバー部24aの前側面には、放熱板17の後側面が接触している。回路基板13は、カバー部24aの前側面に固定されている。具体的には、回路基板13は、支柱28を介してカバー部24aの前側面に固定されている。また、回路基板14は、回路基板13と回路基板14との間に配置される支柱18を介して、回路基板13に固定されている。回路基板13の後側面は、放熱板17の前側面に接触している。   The cover member 24 includes a cover portion 24 a that constitutes the rear end surface of the driver portion 3. The rear side surface of the heat sink 17 is in contact with the front side surface of the cover portion 24a. The circuit board 13 is fixed to the front side surface of the cover portion 24a. Specifically, the circuit board 13 is fixed to the front side surface of the cover portion 24 a via the support column 28. Further, the circuit board 14 is fixed to the circuit board 13 via a support column 18 disposed between the circuit board 13 and the circuit board 14. The rear side surface of the circuit board 13 is in contact with the front side surface of the heat sink 17.

ケース体25では、カバー部24aの前側面に対する回路基板13の相対位置精度を高めることが可能になるため、カバー部24aの前側に配置される放熱板17と、FET16等の電子部品が実装される回路基板13とを確実に接触させることが可能になる。その結果、上述した形態と同様に、回路基板13に実装されるFET16等の発熱量の大きな電子部品の熱を、放熱板17を利用して効率的に放散することが可能になる。   In the case body 25, since it becomes possible to raise the relative positional accuracy of the circuit board 13 with respect to the front side surface of the cover part 24a, the heat sink 17 arrange | positioned in the front side of the cover part 24a, and electronic components, such as FET16, are mounted. The circuit board 13 can be reliably brought into contact with the circuit board 13. As a result, similarly to the above-described embodiment, it is possible to efficiently dissipate the heat of electronic components having a large heat generation amount such as the FET 16 mounted on the circuit board 13 using the heat radiating plate 17.

なお、図4に示す例では、カバー部24aの後側面に放熱用のフィンが形成されていないが、カバー部24aの後側面に放熱用のフィンが形成されても良い。この場合には、回路基板13に実装されるFET16等の発熱量の大きな電子部品の熱を、放熱用のフィンを利用してより効率的に放散することが可能になる。また、図4に示す例では、回路基板13の前側面にFET16等の電子部品が実装されており、回路基板13の後側面が放熱板17の前側面に接触しているが、回路基板13の後側面にFET16等の電子部品が実装されて、この電子部品が放熱板17の前側面に接触していても良い。   In the example shown in FIG. 4, the heat radiating fins are not formed on the rear side surface of the cover portion 24 a, but the heat radiating fins may be formed on the rear side surface of the cover portion 24 a. In this case, it becomes possible to more efficiently dissipate the heat of the electronic components having a large calorific value such as the FET 16 mounted on the circuit board 13 by using the fins for heat dissipation. In the example shown in FIG. 4, an electronic component such as FET 16 is mounted on the front side surface of the circuit board 13, and the rear side surface of the circuit board 13 is in contact with the front side surface of the heat sink 17. An electronic component such as FET 16 may be mounted on the rear side surface, and the electronic component may be in contact with the front side surface of the heat sink 17.

(他の実施の形態)
上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形実施が可能である。
(Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited to this, and various modifications can be made without departing from the scope of the present invention.

上述した形態では、ホルダ9の後端面9aの温度とケース体15の前端面15aの温度とに基づいて、モータ本体部2の発熱量とドライバ部3の発熱量とが比較されている。この他にもたとえば、モータ本体部2の他の箇所の温度と、ドライバ部3の他の箇所の温度とに基づいて、モータ本体部2の発熱量とドライバ部3の発熱量とが比較されても良い。たとえば、モータ本体部2の駆動用コイルの近傍部分の温度と、ドライバ部3のFET16の近傍部分の温度とに基づいて、モータ本体部2の発熱量とドライバ部3の発熱量とが比較されても良い。   In the embodiment described above, the heat generation amount of the motor main body 2 and the heat generation amount of the driver unit 3 are compared based on the temperature of the rear end surface 9 a of the holder 9 and the temperature of the front end surface 15 a of the case body 15. In addition to this, the amount of heat generated by the motor body 2 and the amount of heat generated by the driver unit 3 are compared based on, for example, the temperature of the other part of the motor body 2 and the temperature of the other part of the driver unit 3. May be. For example, the amount of heat generated by the motor body 2 and the amount of heat generated by the driver unit 3 are compared based on the temperature in the vicinity of the driving coil of the motor body 2 and the temperature in the vicinity of the FET 16 of the driver unit 3. May be.

上述した形態では、中間部材4とホルダ9との間に弾性部材20が挟まれているが、中間部材4とホルダ9との間に弾性部材20が挟まれていなくても良い。また、上述した形態では、中間部材4とケース体15との間に弾性部材20に相当する弾性部材が挟まれていないが、中間部材4とケース体15との間に弾性部材が挟まれても良い。   In the embodiment described above, the elastic member 20 is sandwiched between the intermediate member 4 and the holder 9, but the elastic member 20 may not be sandwiched between the intermediate member 4 and the holder 9. In the embodiment described above, an elastic member corresponding to the elastic member 20 is not sandwiched between the intermediate member 4 and the case body 15, but an elastic member is sandwiched between the intermediate member 4 and the case body 15. Also good.

上述した形態では、ケース体15の熱伝導率以上の熱伝導率を有する部材で形成された中間部材4の形状と、ケース体15の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材4の形状とは同じである。この他にもたとえば、ケース体15の熱伝導率以上の熱伝導率を有する部材で形成された中間部材4とケース体15および弾性部材20との接触面積が、ケース体15の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材4とケース体15および弾性部材20との接触面積よりも大きくなるように、中間部材4が形成されても良い。この場合には、ケース体15の熱伝導率以上の熱伝導率を有する部材で形成された中間部材4の外形と、ケース体15の熱伝導率よりも低い熱伝導率を有する部材で形成された中間部材4の外形とが同じであっても良いし、異なっていても良い。   In the embodiment described above, the intermediate member 4 is formed of a member having a thermal conductivity equal to or higher than that of the case body 15 and a member having a thermal conductivity lower than that of the case body 15. The shape of the intermediate member 4 is the same. In addition to this, for example, the contact area between the case member 15 and the elastic member 20 formed by a member having a thermal conductivity equal to or higher than that of the case member 15 is greater than the heat conductivity of the case member 15. The intermediate member 4 may be formed so as to be larger than the contact area between the intermediate member 4 formed of a member having a low thermal conductivity, the case body 15 and the elastic member 20. In this case, the outer shape of the intermediate member 4 formed of a member having a thermal conductivity equal to or higher than that of the case body 15 and a member having a thermal conductivity lower than that of the case body 15 are formed. Further, the outer shape of the intermediate member 4 may be the same or different.

1 モータ(ドライバ一体型モータ)
2 モータ本体部
3 ドライバ部
4 中間部材
9a 後端面(モータ本体部の中間部材側の端面)
13、14 回路基板
15、25 ケース体
15a 前端面(ケース体の中間部材側の端面)
16 FET(電子部品)
17 放熱板
20 弾性部材
23 筒部材
24 カバー部材
24a カバー部
28 支柱
1 Motor (driver integrated motor)
2 Motor body section 3 Driver section 4 Intermediate member 9a Rear end face (end face of motor body section on the intermediate member side)
13, 14 Circuit board 15, 25 Case body 15a Front end surface (end surface on the intermediate member side of the case body)
16 FET (electronic parts)
17 heat sink 20 elastic member 23 cylinder member 24 cover member 24a cover part 28 support

Claims (7)

ロータとステータとを有するモータ本体部と、前記ロータを駆動するための駆動回路が実装される回路基板と前記回路基板が収容されるケース体とを有するドライバ部と、前記モータ本体部と前記ドライバ部との間に配置される中間部材とを備え、
前記中間部材は、略四角筒状に形成され、前記中間部材の内周側は、前記モータ本体部と前記回路基板とを繋ぐケーブルが通過する貫通孔となっており、
前記中間部材と前記ケース体とは、略四角筒状に形成される前記中間部材の軸方向の端面と前記ケース体とが接触した状態で互いに固定され、
前記ドライバ部の発熱量が前記モータ本体部の発熱量よりも大きい場合には、前記ケース体の熱伝導率以上の熱伝導率を有する部材で形成された前記中間部材が前記モータ本体部と前記ドライバ部との間に配置され、
前記モータ本体部の発熱量が前記ドライバ部の発熱量よりも大きい場合には、前記ケース体の熱伝導率よりも低い熱伝導率を有する部材で形成された前記中間部材が前記モータ本体部と前記ドライバ部との間に配置されていることを特徴とするドライバ一体型モータ。
A motor main unit having a rotor and a stator; a driver unit having a circuit board on which a drive circuit for driving the rotor is mounted; and a case body accommodating the circuit board; the motor main unit and the driver An intermediate member disposed between the two parts,
The intermediate member is formed in a substantially rectangular tube shape, and the inner peripheral side of the intermediate member is a through-hole through which a cable connecting the motor main body and the circuit board passes .
The intermediate member and the case body are fixed to each other in a state where the axial end face of the intermediate member formed in a substantially rectangular tube shape and the case body are in contact with each other,
When the heat generation amount of the driver part is larger than the heat generation amount of the motor main body part, the intermediate member formed of a member having a thermal conductivity equal to or higher than the thermal conductivity of the case body is the motor main body part and the motor body part. Placed between the driver and
When the heat generation amount of the motor main body is larger than the heat generation amount of the driver unit, the intermediate member formed of a member having a thermal conductivity lower than the thermal conductivity of the case body is the motor main body portion. A driver-integrated motor, which is disposed between the driver unit and the driver unit.
比較される前記モータ本体部の発熱量および前記ドライバ部の発熱量は、前記ロータを定格出力で駆動したときの発熱量であることを特徴とする請求項1記載のドライバ一体型モータ。   2. The driver integrated motor according to claim 1, wherein the heat generation amount of the motor main body and the heat generation amount of the driver section to be compared are heat generation amounts when the rotor is driven at a rated output. 前記モータ本体部の、前記中間部材側の端面の温度と、前記ケース体の、前記中間部材側の端面の温度とに基づいて、前記モータ本体部の発熱量と前記ドライバ部の発熱量とが比較されることを特徴とする請求項1または2記載のドライバ一体型モータ。   Based on the temperature of the end surface of the motor body portion on the intermediate member side and the temperature of the end surface of the case body on the side of the intermediate member, the heat generation amount of the motor body portion and the heat generation amount of the driver portion are 3. The driver integrated motor according to claim 1, wherein the motor is integrated. 前記モータ本体部と前記中間部材との間に挟まれる平板状の弾性部材を備えることを特徴とする請求項1から3のいずれかに記載のドライバ一体型モータ。   4. The driver-integrated motor according to claim 1, further comprising a flat plate-like elastic member sandwiched between the motor main body and the intermediate member. 前記ケース体は、略筒状に形成される筒部材と、前記筒部材の、前記中間部材側の端面と反対の端面を覆うカバー部材とを備え、
前記カバー部材は、前記ドライバ部の、前記中間部材側の端面と反対の端面を構成するカバー部を備え、
前記カバー部の内側には、放熱用の放熱板が配置され、
前記回路基板は、前記カバー部の内側面に固定されていることを特徴とする請求項1から4のいずれかに記載のドライバ一体型モータ。
The case body includes a cylindrical member formed in a substantially cylindrical shape, and a cover member that covers an end surface of the cylindrical member opposite to the end surface on the intermediate member side,
The cover member includes a cover portion that constitutes an end surface of the driver portion opposite to the end surface on the intermediate member side,
Inside the cover part, a heat dissipation plate for heat dissipation is arranged,
5. The driver-integrated motor according to claim 1, wherein the circuit board is fixed to an inner surface of the cover portion.
前記回路基板は、支柱を介して前記カバー部の内側面に固定され、
前記回路基板、または、前記回路基板に実装される電子部品は、前記放熱板に接触していることを特徴とする請求項5記載のドライバ一体型モータ。
The circuit board is fixed to the inner surface of the cover part via a support,
6. The driver-integrated motor according to claim 5, wherein the circuit board or an electronic component mounted on the circuit board is in contact with the heat radiating plate.
前記カバー部の外側面には、放熱用のフィンが形成されていることを特徴とする請求項5または6記載のドライバ一体型モータ。   The driver integrated motor according to claim 5 or 6, wherein a fin for heat radiation is formed on an outer surface of the cover portion.
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