JP2009063550A - 半導体センサ装置 - Google Patents

半導体センサ装置 Download PDF

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Publication number
JP2009063550A
JP2009063550A JP2007234084A JP2007234084A JP2009063550A JP 2009063550 A JP2009063550 A JP 2009063550A JP 2007234084 A JP2007234084 A JP 2007234084A JP 2007234084 A JP2007234084 A JP 2007234084A JP 2009063550 A JP2009063550 A JP 2009063550A
Authority
JP
Japan
Prior art keywords
sensor element
semiconductor
sensor
sensor device
support frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007234084A
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English (en)
Japanese (ja)
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JP2009063550A5 (https=
Inventor
Taro Nishioka
太郎 西岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007234084A priority Critical patent/JP2009063550A/ja
Publication of JP2009063550A publication Critical patent/JP2009063550A/ja
Publication of JP2009063550A5 publication Critical patent/JP2009063550A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Pressure Sensors (AREA)
JP2007234084A 2007-09-10 2007-09-10 半導体センサ装置 Pending JP2009063550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007234084A JP2009063550A (ja) 2007-09-10 2007-09-10 半導体センサ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007234084A JP2009063550A (ja) 2007-09-10 2007-09-10 半導体センサ装置

Publications (2)

Publication Number Publication Date
JP2009063550A true JP2009063550A (ja) 2009-03-26
JP2009063550A5 JP2009063550A5 (https=) 2010-10-07

Family

ID=40558237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007234084A Pending JP2009063550A (ja) 2007-09-10 2007-09-10 半導体センサ装置

Country Status (1)

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JP (1) JP2009063550A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014042055A1 (ja) * 2012-09-13 2014-03-20 アルプス電気株式会社 半導体装置
WO2014178163A1 (ja) * 2013-05-01 2014-11-06 ソニー株式会社 センサデバイス及び電子機器

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0989925A (ja) * 1995-09-21 1997-04-04 Fuji Electric Co Ltd 半導体加速度センサ
JPH10253654A (ja) * 1997-03-11 1998-09-25 Fujitsu Ten Ltd 加速度センサの実装構造
JP2001183389A (ja) * 1999-12-22 2001-07-06 Matsushita Electric Works Ltd マイクロセンサモジュールの実装構造および実装方法
JP2001227902A (ja) * 2000-02-16 2001-08-24 Mitsubishi Electric Corp 半導体装置
JP2001235485A (ja) * 2000-02-25 2001-08-31 Mitsubishi Electric Corp 加速度センサ
JP2004209585A (ja) * 2002-12-27 2004-07-29 Shinko Electric Ind Co Ltd 電子デバイス及びその製造方法
JP2004525357A (ja) * 2001-01-10 2004-08-19 シルバーブルック リサーチ ピーティワイ リミテッド ウエハスケールで設けられるキャップによって保護される加速度計
JP2005140720A (ja) * 2003-11-10 2005-06-02 Oki Electric Ind Co Ltd 加速度センサ
JP2005277387A (ja) * 2004-02-24 2005-10-06 Nippon Mektron Ltd 多層フレキシブル回路基板およびその製造方法
JP2006179607A (ja) * 2004-12-21 2006-07-06 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007017199A (ja) * 2005-07-05 2007-01-25 Sharp Corp チップスケールパッケージおよびその製造方法
JP2007048994A (ja) * 2005-08-11 2007-02-22 Akita Denshi Systems:Kk 半導体装置及びその製造方法
JP2007059787A (ja) * 2005-08-26 2007-03-08 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0989925A (ja) * 1995-09-21 1997-04-04 Fuji Electric Co Ltd 半導体加速度センサ
JPH10253654A (ja) * 1997-03-11 1998-09-25 Fujitsu Ten Ltd 加速度センサの実装構造
JP2001183389A (ja) * 1999-12-22 2001-07-06 Matsushita Electric Works Ltd マイクロセンサモジュールの実装構造および実装方法
JP2001227902A (ja) * 2000-02-16 2001-08-24 Mitsubishi Electric Corp 半導体装置
JP2001235485A (ja) * 2000-02-25 2001-08-31 Mitsubishi Electric Corp 加速度センサ
JP2004525357A (ja) * 2001-01-10 2004-08-19 シルバーブルック リサーチ ピーティワイ リミテッド ウエハスケールで設けられるキャップによって保護される加速度計
JP2004209585A (ja) * 2002-12-27 2004-07-29 Shinko Electric Ind Co Ltd 電子デバイス及びその製造方法
JP2005140720A (ja) * 2003-11-10 2005-06-02 Oki Electric Ind Co Ltd 加速度センサ
JP2005277387A (ja) * 2004-02-24 2005-10-06 Nippon Mektron Ltd 多層フレキシブル回路基板およびその製造方法
JP2006179607A (ja) * 2004-12-21 2006-07-06 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007017199A (ja) * 2005-07-05 2007-01-25 Sharp Corp チップスケールパッケージおよびその製造方法
JP2007048994A (ja) * 2005-08-11 2007-02-22 Akita Denshi Systems:Kk 半導体装置及びその製造方法
JP2007059787A (ja) * 2005-08-26 2007-03-08 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014042055A1 (ja) * 2012-09-13 2014-03-20 アルプス電気株式会社 半導体装置
JPWO2014042055A1 (ja) * 2012-09-13 2016-08-18 アルプス電気株式会社 半導体装置
WO2014178163A1 (ja) * 2013-05-01 2014-11-06 ソニー株式会社 センサデバイス及び電子機器
US9666787B2 (en) 2013-05-01 2017-05-30 Sony Corporation Sensor device and electronic apparatus

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