JP2009060335A - 圧電デバイス - Google Patents

圧電デバイス Download PDF

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Publication number
JP2009060335A
JP2009060335A JP2007225282A JP2007225282A JP2009060335A JP 2009060335 A JP2009060335 A JP 2009060335A JP 2007225282 A JP2007225282 A JP 2007225282A JP 2007225282 A JP2007225282 A JP 2007225282A JP 2009060335 A JP2009060335 A JP 2009060335A
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JP
Japan
Prior art keywords
terminals
circuit board
piezoelectric
piezoelectric device
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007225282A
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English (en)
Japanese (ja)
Other versions
JP2009060335A5 (enExample
Inventor
Juichiro Matsuzawa
寿一郎 松澤
Toshiya Usuda
俊也 臼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2007225282A priority Critical patent/JP2009060335A/ja
Publication of JP2009060335A publication Critical patent/JP2009060335A/ja
Publication of JP2009060335A5 publication Critical patent/JP2009060335A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
JP2007225282A 2007-08-31 2007-08-31 圧電デバイス Withdrawn JP2009060335A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007225282A JP2009060335A (ja) 2007-08-31 2007-08-31 圧電デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007225282A JP2009060335A (ja) 2007-08-31 2007-08-31 圧電デバイス

Publications (2)

Publication Number Publication Date
JP2009060335A true JP2009060335A (ja) 2009-03-19
JP2009060335A5 JP2009060335A5 (enExample) 2010-09-16

Family

ID=40555672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007225282A Withdrawn JP2009060335A (ja) 2007-08-31 2007-08-31 圧電デバイス

Country Status (1)

Country Link
JP (1) JP2009060335A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228977A (ja) * 2010-04-21 2011-11-10 Seiko Epson Corp 圧電振動片及び圧電デバイス
JP2012010128A (ja) * 2010-06-25 2012-01-12 Seiko Epson Corp 圧電振動片及び圧電デバイス
US8749123B2 (en) 2010-03-29 2014-06-10 Kyocera Kinseki Corporation Piezoelectric device
US11764502B2 (en) 2020-07-28 2023-09-19 Japan Aviation Electronics Industry, Limited Solderable component and board assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8749123B2 (en) 2010-03-29 2014-06-10 Kyocera Kinseki Corporation Piezoelectric device
JP2011228977A (ja) * 2010-04-21 2011-11-10 Seiko Epson Corp 圧電振動片及び圧電デバイス
JP2012010128A (ja) * 2010-06-25 2012-01-12 Seiko Epson Corp 圧電振動片及び圧電デバイス
US11764502B2 (en) 2020-07-28 2023-09-19 Japan Aviation Electronics Industry, Limited Solderable component and board assembly

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