JP2009060069A - 高演色性のあるアレイ型発光装置 - Google Patents

高演色性のあるアレイ型発光装置 Download PDF

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Publication number
JP2009060069A
JP2009060069A JP2007291095A JP2007291095A JP2009060069A JP 2009060069 A JP2009060069 A JP 2009060069A JP 2007291095 A JP2007291095 A JP 2007291095A JP 2007291095 A JP2007291095 A JP 2007291095A JP 2009060069 A JP2009060069 A JP 2009060069A
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JP
Japan
Prior art keywords
light emitting
light
array type
chip
high color
Prior art date
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Pending
Application number
JP2007291095A
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English (en)
Japanese (ja)
Inventor
Chih-Liang Su
智良 蘇
Hsin-Chun Liu
信均 劉
Fang-Po Wang
方波 王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ledtech Electronics Corp
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Ledtech Electronics Corp
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Filing date
Publication date
Application filed by Ledtech Electronics Corp filed Critical Ledtech Electronics Corp
Publication of JP2009060069A publication Critical patent/JP2009060069A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
JP2007291095A 2007-09-03 2007-11-08 高演色性のあるアレイ型発光装置 Pending JP2009060069A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096132752A TWI331397B (en) 2007-09-03 2007-09-03 Array type light-emitting device with high color rendering index

Publications (1)

Publication Number Publication Date
JP2009060069A true JP2009060069A (ja) 2009-03-19

Family

ID=40299229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007291095A Pending JP2009060069A (ja) 2007-09-03 2007-11-08 高演色性のあるアレイ型発光装置

Country Status (3)

Country Link
JP (1) JP2009060069A (de)
DE (1) DE102007058703B4 (de)
TW (1) TWI331397B (de)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216868A (ja) * 2010-03-16 2011-10-27 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP2012227249A (ja) * 2011-04-18 2012-11-15 Citizen Electronics Co Ltd Ｌｅｄパッケージ
JP2013526016A (ja) * 2010-04-16 2013-06-20 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクスデバイス及び該オプトエレクトロニクスデバイスの製造方法
KR20140007306A (ko) * 2013-11-29 2014-01-17 서울반도체 주식회사 멀티 칩 엘이디 패키지
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
JP2015079924A (ja) * 2013-10-18 2015-04-23 シチズン電子株式会社 半導体発光装置
JP2015106660A (ja) * 2013-11-29 2015-06-08 シチズン電子株式会社 発光装置
JP2016042470A (ja) * 2009-08-14 2016-03-31 ワンス イノベーションズ, インコーポレーテッドOnce Innovations, Inc. 調光可能なａｃｌｅｄ照明のためのスペクトル変化制御
KR20160053974A (ko) * 2013-09-09 2016-05-13 지이 라이팅 솔루션스, 엘엘씨 향상된 컬러 선호 광원
CN107339617A (zh) * 2017-07-26 2017-11-10 佛山市川东照明科技有限公司 一种led光源组件以及led灯具
US10206378B2 (en) 2014-01-07 2019-02-19 Once Innovations, Inc. System and method of enhancing swine reproduction
US10237956B2 (en) 2013-08-02 2019-03-19 Once Innovations, Inc. System and method of illuminating livestock
US10485072B2 (en) 2014-02-11 2019-11-19 Signify North America Corporation Shunt regulator for spectral shift controlled light source
US10617099B2 (en) 2010-03-17 2020-04-14 Signify North America Corporation Light sources adapted to spectral sensitivity of diurnal avians and humans
US10772172B2 (en) 2016-03-29 2020-09-08 Signify North America Corporation System and method of illuminating livestock
TWI709711B (zh) * 2014-09-16 2020-11-11 美商Ｇｅ照明解決方案公司 增強的色彩偏好光源
CN112669779A (zh) * 2020-12-30 2021-04-16 佛山市国星光电股份有限公司 一种背光模组及其制作方法

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TWI447965B (zh) * 2010-01-22 2014-08-01 Tzu Kuei Wen 發光二極體晶片封裝方法
CN101958316B (zh) * 2010-07-20 2013-01-16 上海亚明灯泡厂有限公司 Led集成封装光源模块
DE202011000007U1 (de) * 2011-01-04 2012-04-05 Zumtobel Lighting Gmbh LED-Anordnung zur Erzeugung von weißem Licht
DE102011013504B4 (de) 2011-03-10 2022-03-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Licht emittierende Vorrichtung
DE102012111564A1 (de) * 2012-11-29 2014-06-18 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
DE102013226793A1 (de) * 2013-12-19 2015-06-25 Osram Gmbh LED-Modul
DE202016103386U1 (de) * 2016-06-27 2017-09-28 BÄ*RO GmbH & Co. KG Leuchte, insbesondere Downlight- und/oder Spotlight-Leuchte, mit einer Lichtquelle
US20190259923A1 (en) * 2018-02-22 2019-08-22 Epistar Corporation Light-emitting device

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JP3120556U (ja) * 2005-11-29 2006-04-13 東貝光電科技股▲ふん▼有限公司 混合光発光ダイオード構造
JP2007036232A (ja) * 2005-07-21 2007-02-08 Avago Technologies General Ip (Singapore) Private Ltd 光ルミネセンス材料を有する複数の光源を用いて出力光を放出するためのデバイス及び方法。

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US6995355B2 (en) * 2003-06-23 2006-02-07 Advanced Optical Technologies, Llc Optical integrating chamber lighting using multiple color sources
US7564180B2 (en) * 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
DE102005059362A1 (de) * 2005-02-01 2006-09-07 Helmut Dipl.-Ing. Grantz Farblich einstellbare Tageslichtquelle

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036232A (ja) * 2005-07-21 2007-02-08 Avago Technologies General Ip (Singapore) Private Ltd 光ルミネセンス材料を有する複数の光源を用いて出力光を放出するためのデバイス及び方法。
JP3120556U (ja) * 2005-11-29 2006-04-13 東貝光電科技股▲ふん▼有限公司 混合光発光ダイオード構造

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016042470A (ja) * 2009-08-14 2016-03-31 ワンス イノベーションズ, インコーポレーテッドOnce Innovations, Inc. 調光可能なａｃｌｅｄ照明のためのスペクトル変化制御
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
JP2011216868A (ja) * 2010-03-16 2011-10-27 Toshiba Lighting & Technology Corp 発光装置及び照明装置
US10617099B2 (en) 2010-03-17 2020-04-14 Signify North America Corporation Light sources adapted to spectral sensitivity of diurnal avians and humans
US8835931B2 (en) 2010-04-16 2014-09-16 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
JP2013526016A (ja) * 2010-04-16 2013-06-20 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクスデバイス及び該オプトエレクトロニクスデバイスの製造方法
JP2012227249A (ja) * 2011-04-18 2012-11-15 Citizen Electronics Co Ltd Ｌｅｄパッケージ
US10537012B2 (en) 2013-08-02 2020-01-14 Signify North America Corporation System and method of illuminating livestock
US10237956B2 (en) 2013-08-02 2019-03-19 Once Innovations, Inc. System and method of illuminating livestock
JP2016532276A (ja) * 2013-09-09 2016-10-13 ジーイー・ライティング・ソルーションズ，エルエルシー 色の嗜好性が向上した光源
KR102246211B1 (ko) * 2013-09-09 2021-05-04 커런트 라이팅 솔루션즈, 엘엘씨 향상된 컬러 선호 광원
US10196565B2 (en) 2013-09-09 2019-02-05 GE Lighting Solutions, LLC Enhanced color-preference light sources
KR20160053974A (ko) * 2013-09-09 2016-05-13 지이 라이팅 솔루션스, 엘엘씨 향상된 컬러 선호 광원
US10240087B2 (en) 2013-09-09 2019-03-26 GE Lighting Solutions, LLC Enhanced color-preference LED light sources using lag, nitride, and PFS phosphors
JP2015079924A (ja) * 2013-10-18 2015-04-23 シチズン電子株式会社 半導体発光装置
KR20140007306A (ko) * 2013-11-29 2014-01-17 서울반도체 주식회사 멀티 칩 엘이디 패키지
KR101653395B1 (ko) * 2013-11-29 2016-09-01 서울반도체 주식회사 멀티 칩 엘이디 패키지
JP2015106660A (ja) * 2013-11-29 2015-06-08 シチズン電子株式会社 発光装置
US10506801B2 (en) 2014-01-07 2019-12-17 Signify North America Corporation System and method of enhancing swine reproduction
US10206378B2 (en) 2014-01-07 2019-02-19 Once Innovations, Inc. System and method of enhancing swine reproduction
US10485072B2 (en) 2014-02-11 2019-11-19 Signify North America Corporation Shunt regulator for spectral shift controlled light source
TWI709711B (zh) * 2014-09-16 2020-11-11 美商Ｇｅ照明解決方案公司 增強的色彩偏好光源
US10772172B2 (en) 2016-03-29 2020-09-08 Signify North America Corporation System and method of illuminating livestock
CN107339617A (zh) * 2017-07-26 2017-11-10 佛山市川东照明科技有限公司 一种led光源组件以及led灯具
CN112669779A (zh) * 2020-12-30 2021-04-16 佛山市国星光电股份有限公司 一种背光模组及其制作方法

Also Published As

Publication number Publication date
DE102007058703A1 (de) 2009-03-05
TWI331397B (en) 2010-10-01
TW200913248A (en) 2009-03-16
DE102007058703B4 (de) 2011-12-08

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