CN101958316B - Led集成封装光源模块 - Google Patents

Led集成封装光源模块 Download PDF

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CN101958316B
CN101958316B CN2010102317041A CN201010231704A CN101958316B CN 101958316 B CN101958316 B CN 101958316B CN 2010102317041 A CN2010102317041 A CN 2010102317041A CN 201010231704 A CN201010231704 A CN 201010231704A CN 101958316 B CN101958316 B CN 101958316B
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led chip
power source
source module
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integrated packaging
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CN101958316A (zh
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张海兵
徐光明
严华峰
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Shanghai Yaming Lighting Co Ltd
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Abstract

本发明公开了一种LED集成封装光源模块，包括一基板，所述基板上设有数个碗状的反射杯，每个反射杯内均设有一蓝光LED芯片或红光LED芯片，所述基板上蓝光LED芯片与红光LED芯片的个数比为2∶1，所述蓝光LED芯片上涂布有黄、绿色荧光粉混合胶体。该LED集成封装光源模块在基板上设置碗状的反射杯，一方面可提高蓝光LED芯片和红光LED芯片的出光效率，另一方面可改善蓝光LED芯片的散热性，防止蓝光LED芯片产生的热量对红光LED芯片造成影响，进而提高整个集成封装光源模块的可靠性。

Description

LED集成封装光源模块
技术领域
本发明涉及一种光源模块，特别涉及一种低色温高显色性的LED集成封装光源模块。
背景技术
LED发光二极管具有寿命长、功耗低、驱动简单等优点，已经广泛应用于人们的生产生活之中。在目前使用的白光LED中，人们通常将蓝光LED芯片作为激发光源，激发YAG荧光粉得到黄光，黄光和蓝光LED芯片发出的剩余蓝光再混合得到所需要的白光。利用这种“蓝光LED+YAG荧光粉”方法获得的白光，在高色温情况下，光效和显色性较高，但是在低色温下，显色指数和光效偏低，难于满足普通照明的要求。
为了解决上述这一问题，通常会把红色荧光粉加入到黄色荧光粉中(如专利CN 1677695A、CN 101414604A和CN 101195742A)来加强白光LED中的红色成分，借以提供显色指数，但是采用这种方法其光通量损失较多，很难得到实际应用。还有一种方法是在同一个LED内封装白光LED和红光LED(如专利CN 1937222A)，利用红光LED芯片发出的红光来弥补白光缺少红光辐射的缺点。但由于目前红光LED芯片采用AlGaInP系材料，耐温性较差，如封装在蓝光LED芯片附近，则很容易受蓝光LED芯片发热的影响，进而使整个封装模块的稳定性受到影响。
发明内容
针对上述现有技术的不足，本发明要解决的技术问题是提供一种高稳定、散热佳的低色温高显色性的LED集成封装光源模块。
为解决上述技术问题，本发明采用如下技术方案：
一种LED集成封装光源模块，包括一基板，所述基板上设有数个碗状的反射杯，每个反射杯内均设有一蓝光LED芯片或红光LED芯片，所述基板上蓝光LED芯片与红光LED芯片的个数比为2∶1，所述蓝光LED芯片上涂布有黄、绿色荧光粉混合胶体。
优选的，所述基板上设有6个所述反射杯，其中4个反射杯内设有蓝光LED芯片，2个反射杯内设有红光LED芯片。
优选的，所述蓝光LED芯片的峰值波长为440～480nm，所述红光LED芯片的峰值波长为600～670nm，所述黄色荧光粉的激发波长为540～560nm，所述绿色荧光粉的激发波长为510nm～540nm。
优选的，所述蓝光LED芯片的峰值波长为450～470nm，所述红光LED芯片的峰值波长为620～650nm。
优选的，所述反射杯上封装有半球状的透明硅胶。
优选的，所述基板为铝基板、铜基板或陶瓷基板。
优选的，所述黄、绿色荧光粉混合胶体中黄色荧光粉与绿色荧光粉的重量比在5∶1～3∶1的范围之内。
优选的，所述黄、绿色荧光粉混合胶体中黄色荧光粉与绿色荧光粉的重量比为4∶1。
优选的，所述蓝光LED芯片或红光LED芯片的的功率为0.5W、1W、3W或5W。
优选的，该LED集成封装光源模块上安装有雾面玻璃或PC扩散板。
上述技术方案具有如下有益效果：该LED集成封装光源模块利用蓝光LED芯片发出的蓝光激发黄绿色荧光粉产生黄绿光，黄绿光再与蓝光LED芯片激发荧光粉后剩余的蓝光、红光LED芯片发出的红光混合即可获得低色温高显色性的白光光源。在基板上设置碗状的反射杯，一方面可提高蓝光LED芯片和红光LED芯片的出光效率，另一方面可改善蓝光LED芯片的散热性，防止蓝光LED芯片产生的热量对红光LED芯片造成影响，进而提高整个集成封装光源模块的可靠性。
附图说明
图1是本发明实施例的立体结构示意图；
图2是本发明实施例的侧视图；
图3是本发明实施例的俯视图；
图4是本发明实施例的相对光谱图。
图5是本发明另一个实施例的俯视图。
具体实施方式
下面结合附图对本发明的优选实施例进行详细介绍。
如图1、2、3所示，该LED集成封装光源模块上包括一基板1，该基板1可以为铝基板、铜基板或陶瓷基板，采用这几种形式的基板进行封装，工艺成熟、生产成本低。该基板1上设有6个碗状的反射杯4，其中在基板中部的两个反射杯内各设有一红光LED芯片3，其余4个反射杯内各设有一蓝光LED芯片2，4个放置蓝光LED芯片2的放射杯位于两个放置红光LED芯片3的反射杯的外围，这样可提高白光的光效，使其显色性更好。基板1上蓝光LED芯片2与红光LED芯片3的个数比为2∶1。蓝光LED芯片2上涂布有黄、绿色荧光粉混台胶体5，黄、绿色荧光粉混合胶体5中黄色荧光粉与绿色荧光粉的重量比在5∶1～3∶1的范围之内，最优的重量比为4∶1。上蓝光LED芯片的峰值波长为440～480nm，更可取的是450～470nm；红光LED芯片的峰值波长为600～670nm，更可取的是620～650nm，黄色荧光粉的激发波长为540～560nm，绿色荧光粉的激发波长为510nm～540nm。
反射杯4上封装有半球状的透明硅胶6，该透明硅胶具有一定成型能力，可提高蓝光LED芯片或红光LED芯片的出光效率，进而可提高整个LED集成封装光源模块的光效。上述蓝光LED芯片或红光LED芯片的的功率可以为0.5W、1W、3W或5W，为方便驱动电路的制作，上述蓝光LED芯片和红光LED芯片可采用相同的驱动电流来驱动，电路连接方面可选择6串或3串2并的方式，实现非常的方便。
该LED集成封装光源模块利用蓝光LED芯片发出的蓝光激发黄绿色荧光粉产生黄绿光，黄绿光再与蓝光LED芯片激发荧光粉后剩余的蓝光、红光LED芯片发出的红光混合即可获得低色温高显色性的白光光源。该LED集成封装光源模块的相对光谱图如图4所示，测试的光通量、显色性、色温等数据分别如下表所示：
 色温(K)   色坐标x/y   显色指数(Ra)   光通量(lm)   光效(lm/W)
 3120   0.433/0.411   87   471   85.6
由上表数据可见，该LED集成封装光源模块的光效高，显色性好，非常适合于普通照明光源。而且基板上的碗状反射杯一方面可提高蓝光LED芯片和红光LED芯片的出光效率，另一方面可改善蓝光LED芯片的散热性，防止蓝光LED芯片产生的热量对红光LED芯片造成影响，进而提高整个集成封装光源模块的可靠性。因此该LED集成封装光源模块在显色性、寿命以及环保等方面优于普通白炽灯和三基色荧光灯，所以对今后的普通照明的发展意义重大。
如图5所示，为本发明的另一个实施例，该实施例与第一个实施例的结构基本相同，其不同之处在于：4个蓝光LED芯片2放置在基板中部的四个反射杯上，而2个红光LED芯片3放置在基板两侧的反射杯上。这样也能有效提高白光的光效，使所得白光的显色性更好。
采用上述实施例制得的LED集成封装光源模块可用于制作各种不同的照明灯具，如低色温的筒灯、低色温的吸顶灯、低色温的照明灯泡和低色温的路灯等。在制作的照明灯具过程中，为了消除因不同LED芯片发不同颜色光带来的视觉差异和眩光，可以在该LED集成封装光源模块上安装雾面玻璃或PC扩散板，以使其达到均匀混光的效果，进而使照明灯具具有更好的光效性和显色性。
以上对本发明实施例所提供的LED集成封装光源模块进行了详细介绍，对于本领域的一般技术人员，依据本发明实施例的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制，凡依本发明设计思想所做的任何改变都在本发明的保护范围之内。

Claims (9)

1.一种LED集成封装光源模块，包括一基板，其特征在于：所述基板上设有数个碗状的反射杯，每个反射杯内均设有一蓝光LED芯片或红光LED芯片，所述基板上蓝光LED芯片与红光LED芯片的个数比为2∶1，所述蓝光LED芯片上涂布有黄、绿色荧光粉混合胶体，所述黄、绿色荧光粉混合胶体中黄色荧光粉与绿色荧光粉的重量比在5∶1～3∶1的范围之内，所述红光LED芯片上未涂布黄、绿色荧光粉混合胶体。
2.根据权利要求1所述的LED集成封装光源模块，其特征在于：所述基板上设有6个所述反射杯，其中4个反射杯内设有蓝光LED芯片，2个反射杯内设有红光LED芯片。
3.根据权利要求1所述的LED集成封装光源模块，其特征在于：所述蓝光LED芯片的峰值波长为440～480nm，所述红光LED芯片的峰值波长为600～670nm，所述黄色荧光粉的激发波长为540～560nm，所述绿色荧光粉的激发波长为510nm～540nm。
4.根据权利要求3所述的LED集成封装光源模块，其特征在于：所述蓝光LED芯片的峰值波长为450～470nm，所述红光LED芯片的峰值波长为620～650nm。
5.根据权利要求1所述的LED集成封装光源模块，其特征在于：所述反射杯上封装有半球状的透明硅胶。
6.根据权利要求1所述的LED集成封装光源模块，其特征在于：所述基板为铝基板、铜基板或陶瓷基板。
7.根据权利要求1所述的LED集成封装光源模块，其特征在于：所述黄、绿色荧光粉混合胶体中黄色荧光粉与绿色荧光粉的重量比为4∶1。
8.根据权利要求1所述的LED集成封装光源模块，其特征在于：所述蓝光LED芯片或红光LED芯片的的功率为0.5W、1W、3W或5W。
9.根据权利要求1所述的LED集成封装光源模块，其特征在于：该LED集成封装光源模块上安装有雾面玻璃或PC扩散板。
CN2010102317041A 2010-07-20 2010-07-20 Led集成封装光源模块 Expired - Fee Related CN101958316B (zh)

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Application Number Priority Date Filing Date Title
CN2010102317041A CN101958316B (zh) 2010-07-20 2010-07-20 Led集成封装光源模块
US13/811,250 US9010961B2 (en) 2010-07-20 2010-11-25 LED integrated packaging light source module
PCT/CN2010/079126 WO2012009919A1 (zh) 2010-07-20 2010-11-25 Led集成封装光源模块
EP10854949.4A EP2597353A4 (en) 2010-07-20 2010-11-25 LED INTEGRATED LIGHT SOURCE MODULE

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CN2010102317041A CN101958316B (zh) 2010-07-20 2010-07-20 Led集成封装光源模块

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