JP2009056689A - Ic tagged book and bookbinding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a book which allows easy removing of an IC tag and can hardly allow inclusion of the shreds of an IC chip or an antenna in a regenerated pulp, in a wastepaper regeneration process. <P>SOLUTION: A base film 17 making up the IC tag 6a is formed of a thermoplastic resin, and in a bookbinding process, the IC tag 6a is fitted so as to allow an adhesive layer 5 and the base film 17 to come into contact with each other. The base film 17 is softened by the heat of an adhesive with which the former comes into contact during bookbinding, then is fused together with the adhesive layer 5, and the IC chip 13 of the IC tag 6a and the antenna 15 are imbedded. An adhesive layer 19 integrating the IC chip 13 and the antenna 15, is removed in a dusting stage of the wastepaper regeneration process, so that the shreds of the IC chip 13 and the antenna 15 are not included in the regenerated pulp. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a book with an IC tag suitable for recycling used paper.

  In recent years, instead of barcodes, IC tags (RFID tags, wireless tags, non-contact ICs, non-contact IC tags, etc.) that can read and write information in a non-contact manner are generically used in this specification. It has been proposed that various information necessary in the market can be managed by attaching "IC tag" to a product. Also for books, it is considered that not only the IC tag is attached and the function of preventing shoplifting is provided, but also various information management necessary for the distribution, inventory, and sales is performed. For this reason, the IC tag is attached in the printing or bookbinding process while avoiding the trouble of attaching the IC tag in the book sales stage. (For example, refer to Patent Document 1).

  In order to make effective use of resources, recycled pulp is produced from used paper and other used paper. As a method for producing recycled pulp, there are a disaggregation process in which waste paper raw material is disaggregated with a pulper to form a fiber, a dust removing process in which foreign matter is removed from the obtained pulp suspension with a screen, and ink from a pulp suspension with a floatator. In general, a deinking process for removing components is performed, and a regenerated pulp is obtained through a bleaching treatment (see, for example, Patent Document 2).

JP 2004-249492 A (page 3) JP 2006-183210 A (page 2)

  However, since the antenna of the IC tag is made of metal such as aluminum and the IC chip of the IC tag is made of silicon, the antenna of the IC tag and the IC chip become impurities in the used paper recycling process. The antenna and IC chip are pulverized to 10 to 20 μm in the disaggregation process. However, impurities having a diameter of 50 μm or more are removed in the dust removal process, and particles having a diameter of 10 μm or less are removed in the deinking process. Therefore, in the waste paper recycling process, there has been a problem that the fragments of the antenna and the IC chip are not removed and mixed into the recycled pulp.

  The present invention has been made in view of the above-described problems, and an object thereof is a book or the like to which an IC tag is attached so that an IC tag antenna or an IC chip is less likely to be mixed into recycled pulp.

In order to achieve the above-described object, the first invention is such that a cover and a book are fixed by an adhesive layer made of an adhesive, a base film, an antenna formed on the base film, and a connection to the antenna. An IC tag having an IC chip is provided on the adhesive layer, and the base film of the IC tag is made of a thermoplastic resin.
Further, it is desirable that the base film and the adhesive layer are fused to embed the IC chip and the antenna.
The base film is preferably a polyurethane resin, an ethylene-vinyl acetate copolymer resin, a vinyl chloride resin, a vinyl acetate resin, a polyethylene resin, or a polypropylene resin, and the adhesive layer and the base film are made of the same material. May be formed.

  According to a second aspect of the present invention, an IC tag having a base film, an antenna formed on the base film, and an IC chip connected to the antenna is placed on the back of the book with the base film facing outward. A step (a) of attaching, a step (b) of forming an adhesive layer on the back portion, and a step (c) of fixing a cover on the back portion, wherein the base film and the adhesive layer are fused. Then, the book manufacturing method is characterized in that the IC chip and the antenna are embedded.

  The third invention is an IC tag comprising a step (d) of forming an adhesive layer on the back of a book, a base film, an antenna formed on the base film, and an IC chip connected to the antenna. Attaching the base film to the back part with the base film facing inward (e) and fixing the cover on the back part (f), and the base film and the adhesive layer are fused Then, the book manufacturing method is characterized in that the IC chip and the antenna are embedded.

  According to a fourth aspect of the present invention, there is provided an IC tag having a base film, an antenna formed on the base film, and an IC chip connected to the antenna, with the base film facing outward and a spine portion of a cover A step (g) of attaching to the back side of the book, a step (h) of forming an adhesive layer on the back of the book, and a step (i) of fixing the cover on the back of the book. The book manufacturing method is characterized in that an adhesive layer is fused to embed the IC chip and the antenna.

  According to the present invention, since the base film of the IC tag is a thermoplastic resin having a high affinity with the binding adhesive, the base film of the IC tag is fused with the adhesive layer in the binding process, and the adhesive layer is fused. Embeds the IC tag antenna and IC chip. Therefore, in the dust removal process of the used paper recycling process, the antenna of the IC tag and the IC chip are removed in a state of being integrated with the adhesive layer, so that it is possible to prevent the fragments of the antenna and the IC chip from entering the recycled pulp.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

The book 1 according to the first embodiment will be described.
In addition, the book in a claim is comprised by the collation book 4.
FIG. 1A is a view taken in the direction of arrow A in FIG. 2D, and is a view immediately after fixing the cover 9 to the collated book 4. The IC tag 6a adhered to the collated book 4 via the adhesive layer 14 is covered with the adhesive layer 5 applied after adhesion. The IC tag 6a includes a base film 17, an antenna 15 formed thereon, an IC chip 13 connected thereto, and an adhesive layer 14 formed so as to cover the IC chip 13 and the antenna 15. . At this stage, the adhesive layer 5 and the base film 17 are not yet fused.
1B is a B arrow view of the book 1 in FIG. 2E, and the base film 17 and the adhesive layer 5 are fused to form an adhesive layer 19. FIG. The adhesive layer 19 embeds the IC chip 13, the adhesive layer 14, and the antenna 15.

  The adhesive layer 5 is not particularly limited as long as it is a hot-melt adhesive that is difficult to shatter in the used paper recycling process and does not pass through dust removal equipment such as a screen, but is preferably polyurethane resin, ethylene-vinyl acetate. A copolymer resin, a vinyl chloride resin, a vinyl acetate resin, a polyethylene resin, a polypropylene resin, and a resin obtained by mixing these.

  The base film 17 is not particularly limited as long as it is a resin that softens at 150 ° C. to 180 ° C., which is the temperature of the adhesive at the time of binding, and is preferably a resin having high affinity with the adhesive layer 5, but preferably gelatin or polyurethane A resin, an ethylene-vinyl acetate copolymer resin, a vinyl chloride resin, a vinyl acetate resin, a polyethylene resin, a polypropylene resin, and a resin obtained by mixing these.

  The material of the base film 17 and the material of the adhesive layer 5 may be the same or different.

  The IC chip 13 includes a control unit, a memory unit for storing information, a non-contact type IC wireless communication unit, and the like.

  The pressure-sensitive adhesive layer 14 is made of a pressure-sensitive adhesive that is finely dispersed and non-tackified in water or a weak alkaline aqueous solution, and does not adversely affect the recycled pulp. As the pressure-sensitive adhesive layer 14, various materials such as polyacrylic acid ester, nitrile rubber, natural rubber, silicone pressure-sensitive adhesive, and polyvinyl chloride, and their aqueous emulsion adhesives are used.

  The antenna 15 is a planar coil-shaped or dipole antenna made of a metal film such as aluminum or copper patterned on the base film 17. The IC chip 13 is connected to the antenna 15.

  FIG. 2 is a diagram illustrating a bookbinding process of the book 1. As shown in FIG. 2A, an IC tag 6a is bonded to the back portion of the collated book 4 in which one page is aligned. The collation book 4 is bundled by a clamper (not shown) until the bookbinding process is completed. In the first embodiment, the IC tag 6a is fixed with the IC chip 13 facing the book 4 so that the base film 17 faces outward.

  Thereafter, as shown in FIG. 2B, the adhesive 8 is applied to the back portion of the collated book 4 by the roll coater 7 to form the adhesive layer 5. At this time, the adhesive layer 5 is applied on the base film 17 of the IC tag 6a. As shown in FIG. 2C, the cover 9 having the crease 11 is fixed to the collated book 4 through the adhesive layer 5. The positional relationship between the fixed cover 9 and the collated book 4 is as shown in FIG. After that, as shown in FIG. 2E, the cover 9 is folded according to the crease 11, and the book 1 is bound. At this stage, as shown in FIG. 1B, the adhesive 19 embeds the IC chip 13, the adhesive layer 14, and the antenna 15.

  In the book 1 according to the first embodiment, as shown in FIG. 1B, the IC chip 13 and the antenna 15 are surrounded by an adhesive layer 19. Therefore, the integrated state with the adhesive layer 19 is maintained in the disaggregation process of the used paper recycling process, and IC chip 13 and antenna 15 fragments are not mixed in the pulp suspension. Thereafter, in the dust removal step, the adhesive layer 19, the IC chip 13, and the antenna 15 can be removed together. Therefore, IC chip 13 and antenna 15 fragments are not mixed into the recycled pulp.

Next, the book 2 which concerns on 2nd Embodiment is demonstrated.
Fig.3 (a) is a C arrow directional view of FIG.4 (d). The IC tag 6b adhered to the collated book 4 via the adhesive layer 5 is covered with the adhesive layer 5 applied after the adhesion. The IC tag 6b includes a base film 17, an antenna 15 formed thereon, and an IC chip 13 connected thereto. In FIG. 3A, the adhesive layer 5 and the base film 17 are not fused.
FIG. 3B is a view taken in the direction of arrow D in FIG. 4E, and after FIG. 3A, the base film 17 is softened by the heat of the adhesive layer 5, and both are fused to form the adhesive layer 19. It is a figure. At this time, the adhesive layer 19 embeds the IC chip 13 and the antenna 15, and further fixes the collated book 4 and the cover 9.

  In the second embodiment, since the IC tag 6 b is fixed to the collated book 4 by the adhesive layer 5, the adhesive layer 14 may or may not be provided on the IC chip 13.

  FIG. 4 is a diagram illustrating a bookbinding process of the book 2. In the following embodiment, the same number is attached | subjected to the element which fulfill | performs the same aspect as the book 1 concerning 1st Embodiment, and the duplicate description is avoided. As shown in FIG. 4A, an adhesive 8 is applied to the back portion of the collated book 4 using a roll coater 7 to form an adhesive layer 5. Thereafter, as shown in FIG. 4B, the IC tag 6 b is attached to the back portion of the collated book 4 before the adhesive layer 5 is cured. As shown in FIG. 3A, the IC tag 6 b is fixed so that the base film 17 is inside and is in contact with the adhesive layer 5. Therefore, the IC chip 13 is on the outside. As shown in FIG. 4C, a cover 9 having a fold 11 is fixed to the back portion of the collation book 4. The positional relationship between the cover 9 and the collated book 4 is as shown in FIG. Thereafter, as shown in FIG. 4 (e), the cover 9 is folded according to the crease 11. At this stage, the adhesive layer 19 embeds the IC chip 13 and the antenna 15.

  As shown in FIG. 3B, the book 2 in the second embodiment has an IC chip 13 and an antenna 15 integrated with an adhesive layer 19, so that the IC chip is used in the disaggregation process of the used paper recycling process. Only the antenna 13 and the antenna 15 are not broken, and the integrated state with the adhesive layer 19 is maintained. Thereafter, in the dust removal step, the adhesive layer 19, the IC chip 13, and the antenna 15 are removed together. Therefore, IC chip 13 and antenna 15 fragments do not enter the recycled pulp.

Next, the book 3 according to the third embodiment will be described.
FIG. 5 is an E arrow view of FIG. As shown in FIG. 5, since the IC chip 13, the adhesive layer 14 and the antenna 15 are surrounded by the adhesive layer 19, the IC chip 13 and the antenna 15 are dispersed as fragments even in the disaggregation process of the used paper recycling process. There is nothing, and the state integrated with the adhesive layer 19 is maintained. Thereafter, in the dust removing step, the adhesive layer 19, the IC chip 13, and the antenna 15 are removed together. Further, since the adhesive layer 14 is finely dispersed in the used paper recycling process, it does not adversely affect the recycled pulp. Therefore, the book 3 does not hinder the used paper recycling process.

  FIG. 6 is a diagram illustrating a bookbinding process of the book 3. As shown in FIG. 6A, an adhesive 8 is applied to the collated book 4 by a roll coater 7 to form an adhesive layer 5. Thereafter, as shown in FIG. 6 (b), the cover 9 provided with the IC tag 6 c in advance between the folds 11 is fixed to the collated book 4. The IC tag 6c is obtained by fixing the IC tag 6a in the first embodiment to the cover 9 such that the adhesive layer 14 is adhered to the cover 9 and the base film 17 is exposed to the outside. Thereafter, the cover sheet 9 is folded at the crease 11 and the bookbinding is completed as shown in FIG. At this stage, the adhesive 19 embeds the IC chip 13, the adhesive layer 14, and the antenna 15.

  As mentioned above, although preferred embodiment of the book concerning this invention was described referring an accompanying drawing, this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

The (a) A arrow directional view of FIG.2 (d) of the book 1 which concerns on 1st Embodiment, (b) B arrow directional view of FIG.2 (e). The figure which shows the bookbinding process of the book 1 which concerns on 1st Embodiment. (A) C arrow view of FIG.4 (d) and (b) D arrow view of FIG.4 (e) of the book 2 which concerns on 2nd Embodiment. The figure which shows the bookbinding process of the book 2 which concerns on 2nd Embodiment. The E arrow directional view of FIG.6 (c) of the book 3 which concerns on 3rd Embodiment. The figure which shows the bookbinding process of the book 3 which concerns on 3rd Embodiment.

Explanation of symbols

1, 2, 3 ……… Book 4 ……… Collecting book 5 ……… Adhesive layer 6 ……… IC tag 7 ……… Roll coater 8 ……… Adhesive 9 ……… Cover 11 ……… Fold 13 ......... IC chip 14 ......... Adhesive layer 15 ......... Antenna 17 ......... Base film 19 ......... Adhesive layer fused with the base film

Claims (7)

The cover and book are bonded by an adhesive layer made of an adhesive,
An IC tag having a base film, an antenna formed on the base film, and an IC chip connected to the antenna is provided on the adhesive layer,
A book wherein the base film of the IC tag is made of a thermoplastic resin.   The book according to claim 1, wherein the base film and the adhesive layer are fused to embed the IC chip and the antenna.   The book according to claim 1 or 2, wherein the base film is a polyurethane resin, an ethylene-vinyl acetate copolymer resin, a vinyl chloride resin, a vinyl acetate resin, a polyethylene resin, or a polypropylene resin.   The book according to claim 1, wherein the adhesive layer and the base film are formed of the same material. (A) attaching an IC tag having a base film, an antenna formed on the base film, and an IC chip connected to the antenna to the back of the book with the base film facing outward; ,
Forming an adhesive layer on the back portion (b);
Fixing a cover on the back (c);
Comprising
A method for producing a book, wherein the base film and the adhesive layer are fused to embed the IC chip and the antenna. Forming an adhesive layer on the back of the book (d);
Attaching an IC tag having a base film, an antenna formed on the base film, and an IC chip connected to the antenna to the back portion with the base film facing inward (e);
Fixing a cover on the back (f);
Comprising
A method for producing a book, wherein the base film and the adhesive layer are fused to embed the IC chip and the antenna. A step of attaching an IC tag having a base film, an antenna formed on the base film, and an IC chip connected to the antenna to the back side of the back cover portion of the cover with the base film facing outward ( g) and
Forming an adhesive layer on the back of the book (h);
Fixing the cover on the back (i);
Comprising
A method for producing a book, wherein the base film and the adhesive layer are fused to embed the IC chip and the antenna.

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