JP2009032332A - ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの製造装置 - Google Patents
ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの製造装置 Download PDFInfo
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- JP2009032332A JP2009032332A JP2007195437A JP2007195437A JP2009032332A JP 2009032332 A JP2009032332 A JP 2009032332A JP 2007195437 A JP2007195437 A JP 2007195437A JP 2007195437 A JP2007195437 A JP 2007195437A JP 2009032332 A JP2009032332 A JP 2009032332A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49025—Making disc drive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49027—Mounting preformed head/core onto other structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49027—Mounting preformed head/core onto other structure
- Y10T29/4903—Mounting preformed head/core onto other structure with bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
【解決手段】本発明の一形態において、リフロー装置のノズル30から不活性ガスがヘッド・スライダ121とサスペンション114との相互接続部に吹き付けられる。ジンバル・タング119上にヘッド・スライダ121が固定されている。ノズル30は、不活性ガスがその中を通過する管31と、管31の噴射口に固定された多孔質部材32とを有している。多孔質部材32をヘッド・スライダ114の近い位置に配置することで、効果的に半田ボール24周囲の酸素濃度を低下させることができる。
【選択図】図5
Description
好ましくは、前記多孔質部材の噴射面と前記タングとの間の間隔は1mm以下である。これによって、非常に効果的な不活性ガス濃度を実現することができる。前記多孔質素材の空孔密度は70〜90%であることが好ましい。これによって、均一で十分な不活性ガス濃度を実現することができる。
好ましい例において、前記ノズルは、前記ヘッド・ジンバル・アセンブリの周囲の少なくとも一部を囲む壁を有する。これによって、効果的に不活性ガスの濃度を上げることができる。
32 多孔質部材、33 枠体、34 壁、60 光学装置、70 真空パッド
110 ジンバル・アセンブリ、113 トレース、114 サスペンション
115 ロードビーム、116 ジンバル、121 ヘッド・スライダ
119 ジンバル・タング、122 サスペンション接続端子、123 ヘッド素子部
126 スライダ接続端子、127 スライダ、130 マウントプレート
321 噴射面
Claims (10)
- ヘッド・ジンバル・アセンブリの製造方法であって、
サスペンション上にヘッド・スライダを配置し、
前記ヘッド・スライダの端子と前記サスペンションの端子とを相互接続するための半田ボールを、前記ヘッド・スライダの端子と前記サスペンションの端子との間に配置し、
前記半田ボールに向けて多孔質部材を有するノズルから不活性ガスを吹き付けながら、前記半田ボールをリフローして前記ヘッド・スライダの端子と前記サスペンションの端子とを相互接続し、
前記多孔質部材の噴射面から噴射する前記不活性ガスが前記ヘッド・ジンバル・アセンブリに吹き付けられるように、前記ノズルは、もし前記ヘッド・スライダに近づけられた場合には最初に前記多孔質部材の噴射面が前記ヘッド・ジンバル・アセンブリに接触する状態にある、
ヘッド・ジンバル・アセンブリの製造方法。 - 前記ヘッド・スライダは前記サスペンションのタング上に配置され、
前記ノズルは、前記タングを挟んで前記ヘッド・スライダの反対側に位置し、
前記リフローのためのレーザー光を、前記ヘッド・スライダを挟んで前記タングの反対側から照射する、
請求項1に記載のヘッド・ジンバル・アセンブリの製造方法。 - 前記ヘッド・ジンバル・アセンブリの周囲の少なくとも一部を、前記ノズルから連続する壁によって囲んだ状態において、前記半田ボールをリフローする、
請求項2に記載のヘッド・ジンバル・アセンブリの製造方法。 - 前記多孔質部材の噴射面と前記タングとの間の間隔は1mm以下である、
請求項2に記載のヘッド・ジンバル・アセンブリの製造方法。 - 前記多孔質素材の空孔密度は70〜90%である、
請求項1に記載のヘッド・ジンバル・アセンブリの製造方法。 - ヘッド・ジンバル・アセンブリの製造装置であって、
前記サスペンション上に配置されたヘッド・スライダの接続端子と前記サスペンションの接続端子との間に半田ボールを配置する装置と、
多孔質部材を有し、その多孔質部材の噴射面から噴射する不活性ガスを前記半田ボールに向けて吹き付けるノズルと、
前記ノズルからの不活性ガスの雰囲気内において、前記半田ボールにレーザー照射するレーザー装置と、を有し、
サスペンションから前記多孔質部材の噴射面までの間において、前記ヘッド・スライダから前記多孔質部材の噴射面の方向に前記サスペンションを射影して形成される空間内は空である、
ヘッド・ジンバル・アセンブリの製造装置。 - 前記ヘッド・スライダは前記サスペンションのタング上に配置され、
前記ノズルは、前記タングを挟んで前記ヘッド・スライダの反対側に位置し、
前記レーザー装置は、前記ヘッド・スライダを挟んで前記タングの反対側に位置する、
請求項6に記載のヘッド・ジンバル・アセンブリの製造装置。 - 前記ノズルは、前記ヘッド・ジンバル・アセンブリの周囲の少なくとも一部を囲む壁を有する、
請求項7に記載のヘッド・ジンバル・アセンブリの製造方法。 - 前記多孔質部材の不活性ガスの噴射面と前記タングとの間の間隔は1mm以下である、
請求項7に記載のヘッド・ジンバル・アセンブリの製造方法。 - 前記多孔質素材の空孔密度は70〜90%である、
請求項6に記載のヘッド・ジンバル・アセンブリの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007195437A JP4852005B2 (ja) | 2007-07-27 | 2007-07-27 | ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの製造装置 |
US12/220,746 US7984545B2 (en) | 2007-07-27 | 2008-07-25 | Approaches for manufacturing a head gimbal assembly |
CN2008101311055A CN101352771B (zh) | 2007-07-27 | 2008-07-28 | 用于制造磁头万向架组件的方法和设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007195437A JP4852005B2 (ja) | 2007-07-27 | 2007-07-27 | ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009032332A true JP2009032332A (ja) | 2009-02-12 |
JP4852005B2 JP4852005B2 (ja) | 2012-01-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007195437A Expired - Fee Related JP4852005B2 (ja) | 2007-07-27 | 2007-07-27 | ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの製造装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7984545B2 (ja) |
JP (1) | JP4852005B2 (ja) |
CN (1) | CN101352771B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8250737B2 (en) * | 2010-10-14 | 2012-08-28 | Tdk Corporation | Method for manufacturing head including light source unit for thermal assist |
US20130256281A1 (en) * | 2012-03-30 | 2013-10-03 | Tatsumi Tsuchiya | Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive |
JP6282525B2 (ja) | 2014-05-16 | 2018-02-21 | 日本発條株式会社 | ヘッド・サスペンション用フレキシャの端子パッド構造及び形成方法 |
JP6588328B2 (ja) * | 2015-12-21 | 2019-10-09 | 日本発條株式会社 | 配線回路基板の製造方法 |
US10600435B2 (en) | 2017-11-15 | 2020-03-24 | Seagate Technology Llc | Recording head gimbal assembly programming by selective application of interconnects |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54153317A (en) * | 1978-05-24 | 1979-12-03 | Toray Ind Inc | Air dispersing pipe |
JPH06142907A (ja) * | 1992-10-31 | 1994-05-24 | Nippon Seiki Co Ltd | フラックス塗布装置 |
JP2001054746A (ja) * | 1999-08-20 | 2001-02-27 | Mitsubishi Heavy Ind Ltd | ガスノズル |
JP2002251705A (ja) * | 2001-02-16 | 2002-09-06 | Internatl Business Mach Corp <Ibm> | はんだボール配設装置、はんだボールリフロー装置、及びはんだボール接合装置。 |
JP2003205386A (ja) * | 2002-01-15 | 2003-07-22 | Yoshimasa Matsubara | ガス噴射ノズル |
JP2006289427A (ja) * | 2005-04-11 | 2006-10-26 | Hitachi Global Storage Technologies Netherlands Bv | ヘッド・ジンバル・アセンブリの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08309519A (ja) | 1995-05-23 | 1996-11-26 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
JPH09246707A (ja) | 1996-03-12 | 1997-09-19 | Matsushita Electric Ind Co Ltd | 半田吐出装置 |
US6334330B2 (en) * | 1999-07-26 | 2002-01-01 | Praxair, Inc. | Impingement cooler |
JP2001196735A (ja) | 2000-01-11 | 2001-07-19 | Taisei Kaken:Kk | リフローノズル |
US7701673B2 (en) * | 2005-05-17 | 2010-04-20 | Sae Magnetics (Hk) Ltd. | Gimbal design with solder ball bond pads and trailing edge limiter tab for a recording head |
-
2007
- 2007-07-27 JP JP2007195437A patent/JP4852005B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-25 US US12/220,746 patent/US7984545B2/en not_active Expired - Fee Related
- 2008-07-28 CN CN2008101311055A patent/CN101352771B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54153317A (en) * | 1978-05-24 | 1979-12-03 | Toray Ind Inc | Air dispersing pipe |
JPH06142907A (ja) * | 1992-10-31 | 1994-05-24 | Nippon Seiki Co Ltd | フラックス塗布装置 |
JP2001054746A (ja) * | 1999-08-20 | 2001-02-27 | Mitsubishi Heavy Ind Ltd | ガスノズル |
JP2002251705A (ja) * | 2001-02-16 | 2002-09-06 | Internatl Business Mach Corp <Ibm> | はんだボール配設装置、はんだボールリフロー装置、及びはんだボール接合装置。 |
JP2003205386A (ja) * | 2002-01-15 | 2003-07-22 | Yoshimasa Matsubara | ガス噴射ノズル |
JP2006289427A (ja) * | 2005-04-11 | 2006-10-26 | Hitachi Global Storage Technologies Netherlands Bv | ヘッド・ジンバル・アセンブリの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090025205A1 (en) | 2009-01-29 |
US7984545B2 (en) | 2011-07-26 |
JP4852005B2 (ja) | 2012-01-11 |
CN101352771A (zh) | 2009-01-28 |
CN101352771B (zh) | 2012-02-01 |
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