JP2009019225A5 - - Google Patents

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Publication number
JP2009019225A5
JP2009019225A5 JP2007181256A JP2007181256A JP2009019225A5 JP 2009019225 A5 JP2009019225 A5 JP 2009019225A5 JP 2007181256 A JP2007181256 A JP 2007181256A JP 2007181256 A JP2007181256 A JP 2007181256A JP 2009019225 A5 JP2009019225 A5 JP 2009019225A5
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JP
Japan
Prior art keywords
plating solution
copper plating
electroless copper
electroless
film
Prior art date
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Application number
JP2007181256A
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English (en)
Japanese (ja)
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JP5201897B2 (ja
JP2009019225A (ja
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Priority to JP2007181256A priority Critical patent/JP5201897B2/ja
Priority claimed from JP2007181256A external-priority patent/JP5201897B2/ja
Publication of JP2009019225A publication Critical patent/JP2009019225A/ja
Publication of JP2009019225A5 publication Critical patent/JP2009019225A5/ja
Application granted granted Critical
Publication of JP5201897B2 publication Critical patent/JP5201897B2/ja
Active legal-status Critical Current
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JP2007181256A 2007-07-10 2007-07-10 無電解銅めっき液及び無電解銅めっき方法 Active JP5201897B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007181256A JP5201897B2 (ja) 2007-07-10 2007-07-10 無電解銅めっき液及び無電解銅めっき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007181256A JP5201897B2 (ja) 2007-07-10 2007-07-10 無電解銅めっき液及び無電解銅めっき方法

Publications (3)

Publication Number Publication Date
JP2009019225A JP2009019225A (ja) 2009-01-29
JP2009019225A5 true JP2009019225A5 (ru) 2010-06-17
JP5201897B2 JP5201897B2 (ja) 2013-06-05

Family

ID=40359126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007181256A Active JP5201897B2 (ja) 2007-07-10 2007-07-10 無電解銅めっき液及び無電解銅めっき方法

Country Status (1)

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JP (1) JP5201897B2 (ru)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015076549A1 (ko) * 2013-11-22 2015-05-28 한국생산기술연구원 무전해 구리 도금액 조성물 및 이를 이용한 무전해 구리 도금방법
JP6270681B2 (ja) 2014-09-29 2018-01-31 学校法人 関西大学 配線構造体の製造方法、銅置換めっき液および配線構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01129977A (ja) * 1987-11-13 1989-05-23 Hitachi Ltd 銅めっき液
JP3052515B2 (ja) * 1991-11-28 2000-06-12 上村工業株式会社 無電解銅めっき浴及びめっき方法
JP3332668B2 (ja) * 1994-07-14 2002-10-07 松下電器産業株式会社 半導体装置の配線形成に用いる無電解めっき浴及び半導体装置の配線形成方法
JP2002180259A (ja) * 2000-12-12 2002-06-26 Shipley Co Llc めっき液における金属析出促進化合物および該化合物を含むめっき液
JP2002363762A (ja) * 2001-06-07 2002-12-18 Naoki Toriyama 無電解めっき液及び無電解めっき方法
JP5188683B2 (ja) * 2006-06-12 2013-04-24 パナソニック株式会社 接点部品または電池部品用材料と、それを用いた電池

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