JP2009016841A - 電気モジュールを備えたハウジング - Google Patents

電気モジュールを備えたハウジング Download PDF

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Publication number
JP2009016841A
JP2009016841A JP2008174456A JP2008174456A JP2009016841A JP 2009016841 A JP2009016841 A JP 2009016841A JP 2008174456 A JP2008174456 A JP 2008174456A JP 2008174456 A JP2008174456 A JP 2008174456A JP 2009016841 A JP2009016841 A JP 2009016841A
Authority
JP
Japan
Prior art keywords
contact means
module
housing
electrical
outer housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008174456A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009016841A5 (enExample
Inventor
Ingbert Gerngross
ゲルングロス イングベルト
Christian Ohl
オール クリスティアン
Frieder Haag
ハーク フリーダー
Juergen Kurle
クルレ ユルゲン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2009016841A publication Critical patent/JP2009016841A/ja
Publication of JP2009016841A5 publication Critical patent/JP2009016841A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Casings For Electric Apparatus (AREA)
JP2008174456A 2007-07-06 2008-07-03 電気モジュールを備えたハウジング Pending JP2009016841A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007031562.9A DE102007031562B4 (de) 2007-07-06 2007-07-06 Gehäuse mit einem elektrischen Modul

Publications (2)

Publication Number Publication Date
JP2009016841A true JP2009016841A (ja) 2009-01-22
JP2009016841A5 JP2009016841A5 (enExample) 2011-08-04

Family

ID=40092510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008174456A Pending JP2009016841A (ja) 2007-07-06 2008-07-03 電気モジュールを備えたハウジング

Country Status (5)

Country Link
US (1) US7791891B2 (enExample)
JP (1) JP2009016841A (enExample)
DE (1) DE102007031562B4 (enExample)
FR (1) FR2918503B1 (enExample)
IT (1) IT1390818B1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039063B4 (de) 2010-08-09 2024-01-18 Robert Bosch Gmbh Sensormodul mit einem elektromagnetisch abgeschirmten elektrischen Bauteil und Verfahren zur Herstellung eines solchen Sensormoduls
DE102011081016A1 (de) * 2011-08-16 2013-02-21 Robert Bosch Gmbh Sensormodul und Verfahren zur Herstellung eines Sensormoduls
DE102013226236A1 (de) * 2013-12-17 2015-06-18 Robert Bosch Gmbh Elektrische Baugruppe
US10804913B1 (en) 2018-09-10 2020-10-13 Inphi Corporation Clock and data recovery devices with fractional-N PLL

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278298A (ja) * 1988-09-14 1990-03-19 Hitachi Ltd 電子装置
JPH07288332A (ja) * 1994-02-25 1995-10-31 Fujitsu Ltd 光素子組立体とその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3540471B2 (ja) 1995-11-30 2004-07-07 三菱電機株式会社 半導体モジュール
US5948991A (en) 1996-12-09 1999-09-07 Denso Corporation Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip
JP3452835B2 (ja) * 1999-05-28 2003-10-06 三菱電機株式会社 圧力センサ装置
DE10052406A1 (de) * 2000-10-20 2002-05-23 Bosch Gmbh Robert Drucksensormodul
DE10054013B4 (de) * 2000-11-01 2007-06-21 Robert Bosch Gmbh Drucksensormodul
DE10065013B4 (de) * 2000-12-23 2009-12-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
JP4892781B2 (ja) 2001-01-18 2012-03-07 富士電機株式会社 半導体物理量センサ
DE10213648B4 (de) 2002-03-27 2011-12-15 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278298A (ja) * 1988-09-14 1990-03-19 Hitachi Ltd 電子装置
JPH07288332A (ja) * 1994-02-25 1995-10-31 Fujitsu Ltd 光素子組立体とその製造方法

Also Published As

Publication number Publication date
FR2918503A1 (fr) 2009-01-09
DE102007031562B4 (de) 2024-01-18
DE102007031562A1 (de) 2009-01-08
IT1390818B1 (it) 2011-10-19
FR2918503B1 (fr) 2013-04-05
ITMI20081215A1 (it) 2009-01-07
US7791891B2 (en) 2010-09-07
US20090027861A1 (en) 2009-01-29

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