JP2009012231A - Metal mask dealing with adhesive conveying jig and solder printing method of substrate by employing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal mask dealing with an adhesive conveying jig, in which the adhesion of a portion bulged out of the substrate contact face side external shape of a substrate in the metal mask to the adhesive part of the adhesive conveying jig is reduced at the creamy solder printing of the substrate, a plate separation is performed smoothly and the reduction of a cycle time can be contrived. <P>SOLUTION: This metal mask 3 dealing with the adhesive conveying jig 8 is employed by fixing the substrate by making the substrate 7 adhesive with an electronic circuit formed thereon to the adhesive part of the adhesive conveying jig and by performing the creamy solder printing of the substrate by bringing the substrate contact face side of the metal mask into contact onto the substrate. Frame-like recessed parts 31 for avoiding the contact with the adhesive pat of the adhesive conveying jig during squeegeeing are formed in a portion, which lies within the adhesive part contacting region of the adhesive conveying jig at the substrate contacting face side of the metal mask dealing with the adhesive conveying jig. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  In the present invention, a substrate on which an electronic circuit is formed is adhered to an adhesive portion of an adhesive conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. The present invention relates to a metal mask for an adhesive conveyance jig used at the time, and a solder printing method for a substrate using the same.

Conventionally, in cream solder printing of a substrate on which an electronic circuit is formed, the substrate is adhered to an adhesive portion of an adhesive conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with this substrate. We do cream solder printing.
FIG. 8 is an explanatory view showing a cream solder printing process for an electronic circuit board using a conventional metal mask. In the figure, 1 is a frame for supporting the metal mask, 2 is a collar stretched inside the frame 1, and 3a is a metal mask having a conventional structure attached to the lower surface of the central portion of the collar 2. 4 is an opening that penetrates in the vertical direction provided in the metal mask 3a having a conventional structure, 5 is a squeegee, 6 is cream solder, 7 is a substrate on which an electronic circuit is formed, and 8 is an adhesive that fixes the substrate 7 on the upper surface. An adhesive conveyance jig is formed on the entire surface of the adhesive conveyance jig to securely adhere the substrate 7. Reference numeral 9 denotes a support for mounting and supporting the adhesive conveyance jig 8, and 10 denotes solder after being printed on the substrate 7. As shown in FIG. 8 (a), a substrate 7 is fixed to a substantially central position on an adhesive conveyance jig 8 supported on a support 9 by an adhesive portion on the surface, and a conventional metal mask is formed on the substrate 7. The substrate contact surface side of 3a is brought into contact. Then, as shown in FIG. 8 (b), the cream solder 6 is printed on the substrate 7 through the opening 4 by moving the squeegee 5 from the upper surface of the ridge 2 in the direction of the illustrated arrow. At that time, the portion of the metal mask 3a of the conventional structure that protrudes from the substrate outer surface at the time of printing bends during squeezing and sticks to the adhesive portion of the adhesive conveyance jig 8, so that the plate is separated after printing. It becomes unstable and printing failure occurs. Further, since the metal mask 3a having the conventional structure is stuck to the adhesive portion of the adhesive conveyance jig 8 and is naturally separated, the printing lead time is delayed.

  A method of forming solder bumps using a mask on electrode portions on a substrate on which a semiconductor wafer or an electronic circuit is formed is generally well known (see, for example, Patent Document 1).

JP 2002-151539 A

  In conventional cream solder printing of a substrate with an electronic circuit formed, the substrate sticks to the adhesive part of the adhesive conveyance jig, so the part that protrudes from the substrate outer surface on the substrate contact surface side of the conventional metal mask during printing is Bending at the time of squeezing causes sticking to the adhesive part of the conveying jig, the plate separation after printing becomes unstable, and printing failure occurs. Further, since the conventional metal mask is affixed to the adhesive part of the conveying jig and waits for it to be naturally separated, there is a problem that the printing lead time is delayed. Also, if it is forcibly removed, the printing result will not be good. In addition, manufacturing a dedicated transfer jig so that it does not stick to the metal mask for each board model is not a solution because of the problems of cost increase of the transfer jig and delivery time of the jig. Is the current situation.

  The present invention has been made to solve the above-described problems, and a portion of the metal mask that protrudes from the substrate outer surface on the substrate contact surface side is attached to the adhesive portion of the adhesive conveying jig during cream solder printing of the substrate. An object of the present invention is to provide a metal mask corresponding to an adhesive conveyance jig capable of reducing sticking, smoothly separating plates, and reducing tact time, and a method for solder printing of a substrate using the same.

  In the metal mask for the adhesive conveyance jig according to the present invention, the substrate on which the electronic circuit is formed is adhered to the adhesion portion of the adhesion conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate. A metal mask for an adhesive transport jig used for cream solder printing on a substrate, and in the adhesive portion contact area of the adhesive transport jig on the substrate contact surface side of the metal mask for the adhesive transport jig A frame-like recess for avoiding contact with the adhesive portion of the adhesive conveyance jig during squeezing is formed in a portion other than the contact portion.

  Further, a plurality of convex portions having a height lower than the depth of the frame-shaped concave portion are formed in the frame-shaped concave portion.

  Further, the depth of the frame-shaped recess is about 5 to 95% of the mask plate thickness, and the height of the projection is 5 to 95% of the recess depth.

  In addition to the frame-shaped recess, the portion of the substrate contact portion on the substrate contact surface side of the metal mask corresponding to the adhesive conveyance jig corresponding to the through portion of the substrate is connected to the adhesive portion of the adhesion conveyance jig during squeezing. A recess for a through-substrate portion for avoiding contact is formed.

  Also, the entire surface of the substrate contact surface side of the metal mask for the adhesive conveyance jig is coated with a fluorine resin having water repellency and slipperiness, a silicone resin or both, or a coating of a silane compound or the like. .

  Further, in the method of solder printing a substrate using the metal mask for the adhesive conveyance jig according to the present invention, the substrate on which the electronic circuit is formed is adhered to the adhesion portion of the adhesion conveyance jig, and the substrate is fixed. A method for solder printing of a substrate using a metal mask corresponding to an adhesive conveyance jig that performs cream solder printing on a substrate by contacting the substrate contact surface side of the metal mask with the adhesive of the adhesion conveyance jig supported by the support The process of adhering the substrate to the substrate and fixing the substrate, contacting the substrate contact surface side of the metal mask for the adhesive transport jig on the substrate, and adhesive transport treatment on the substrate contact surface side of the metal mask for the adhesive transport jig A frame-shaped recess formed to avoid contact with the adhesive part of the adhesive transport jig is formed in the adhesive part contact area of the tool and other than the substrate contact part. Opposite to the adhesive part of the tool When the cream solder is printed on the substrate by moving the squeegee and the squeegee is moved, even if the metal mask for the adhesive transport jig is bent and deformed by the pressing force of the squeegee, the adhesive transport control is performed by the frame-shaped recess. A cream solder printing process for reducing contact with the adhesive part of the tool, and a process for facilitating separation from the adhesive part of the adhesive transport jig of the metal mask for the adhesive transport jig after printing. .

  In addition, the substrate having the electronic circuit formed thereon is adhered to the adhesive portion of the adhesive conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. A method of solder printing of a substrate using a metal mask corresponding to a tool, the step of adhering the substrate to an adhesive portion of an adhesive conveyance jig supported by a support and fixing the substrate, and an adhesion conveyance jig on the substrate The substrate contact surface side of the corresponding metal mask is brought into contact, and the adhesive transfer jig is placed in the adhesive contact area of the adhesive transfer jig on the substrate contact surface side of the metal mask. A frame-shaped recess for avoiding contact with the adhesive part and a plurality of convex parts provided in the frame-shaped concave part are formed, and the frame-shaped concave part and the plurality of convex parts are opposed to the adhesive part of the adhesive conveyance jig. Positioning and moving the squeegee Even when the cream solder is printed on the substrate, even if the metal mask for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee, the plurality of convex parts provided in the frame-shaped concave part come into contact first. And a solder paste printing process for reducing the contact area with the adhesive part of the adhesive conveyance jig, and a process for easily separating the plate from the adhesive part of the adhesive conveyance jig of the metal mask for the adhesion conveyance jig after printing. It is equipped with.

  Also, the substrate on which the electronic circuit and the penetrating portion are formed is adhered to the adhesive portion of the adhesive conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. A method for solder printing of a substrate using a metal mask for an adhesive conveyance jig, the step of adhering a substrate including a penetrating portion to an adhesion portion of an adhesion conveyance jig supported by a support, and fixing the substrate; The central portion of the metal mask corresponding to the adhesive transport jig corresponding to the substrate contact surface is brought into contact with the substrate, and the substrate contact portion within the adhesive portion contact area of the adhesive transport jig on the substrate contact surface side of the metal mask corresponding to the adhesive transport jig. A frame-shaped recess for avoiding contact with the adhesive portion of the adhesive transport jig is formed in a portion other than the portion, and the frame-shaped recess is positioned opposite to the adhesive portion of the adhesive transport jig, and the through-hole portion of the substrate In the corresponding part of the adhesive conveyance jig Forming a recess for the substrate through portion to avoid contact with the landing portion, printing the cream solder on the substrate by moving the recess for the substrate through portion to face the through portion of the substrate, and moving the squeegee In this case, even if the metal mask for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee, the cream solder that reduces the contact area between the frame-shaped concave portion and the concave portion for the substrate through portion with the adhesive portion of the adhesive conveyance jig The printing step and the step of facilitating the separation of the plate from the adhesive portion of the adhesive conveyance jig of the metal mask for the adhesion conveyance jig after printing are provided.

  According to this invention, at the time of cream solder printing of the substrate, it is possible to reduce the sticking of the portion protruding from the substrate outer shape on the substrate contact surface side of the metal mask to the adhesive portion of the adhesive conveying jig, and to release the plate after printing Is carried out stably and smoothly, so that the printability can be improved. In addition, it took 30 seconds or longer to wait for the metal mask to stick to the adhesive part of the adhesive conveyance jig and leave it naturally, but it is improved to 5 seconds or less, and the tact time is reduced. In addition, even if it comes into contact with the adhesive part of the adhesive conveyance jig, the contact area is small and sticking during printing is reduced, so there is no need to produce a dedicated conveyance jig for each board model, reducing production costs. There is an effect that it can be planned.

Embodiment 1 FIG.
FIG. 1 is an overall perspective view for explaining cream solder printing on a substrate using a metal mask for an adhesive conveyance jig according to Embodiment 1 of the present invention, and FIG. 2 is an adhesive conveyance jig according to Embodiment 1 of the present invention. FIG. 3 is a perspective view showing the structure of the corresponding metal mask, and FIG. 3 is an explanatory view showing the cream solder printing process for the substrate using the metal mask for the adhesive conveying jig in the first embodiment of the present invention.

In the figure, 1 is a frame for supporting a metal mask, 2 is a collar stretched on the inside of the frame 1, and 3 is a metal mask for an adhesive conveyance jig of the present invention attached to the lower surface of the central portion of the collar 2. 4 is an opening provided in the metal mask 3 for the adhesive conveyance jig according to the present invention, which penetrates in the vertical direction, 5 is a squeegee, 6 is cream solder, 7 is a substrate on which an electronic circuit is formed, 8 is a substrate 7 on the top surface An adhesive conveyance jig for adhering and fixing, and an adhesive portion for securely adhering the substrate 7 is formed on the entire surface. Reference numeral 9 denotes a support for mounting and supporting the adhesive conveyance jig 8, and 10 denotes solder after being printed on the substrate 7.
The metal mask 3 for an adhesive conveyance jig of the present invention is configured as follows. That is, on the substrate contact surface side of the metal mask 3 corresponding to the adhesive conveyance jig, in order to avoid contact with the adhesive portion in the adhesive portion contact area of the adhesive conveyance jig 8 and other than the central substrate contact portion. A frame-shaped recess 31 is formed. The presence of the frame-shaped recess 31 avoids contact with the adhesive portion of the adhesive transport jig 8 as much as possible. The depth of the frame-shaped recess 31 is about 5 to 95% of the mask plate thickness, and is sufficiently effective. Among them, 20 to 80% is preferable, and 30 to 60% is most preferable. Further, the peripheral portion other than the adhesive portion contact area of the adhesive transport jig 8 on the substrate contact surface side of the metal mask 3 corresponding to the adhesive transport jig and the substrate contact portion in the adhesive portion contact area and in the center are not processed. Thus, a flat surface higher than the frame-shaped recess 31 is formed. In addition, the entire surface of the metal mask 3 corresponding to the adhesive conveyance jig 3 on the substrate contact surface side is coated with a fluorine resin having water repellency and slipperiness, a silicone resin or both, or a coating of a silane compound or the like. And has improved peeling.

Next, the process of cream solder printing on the substrate using the metal mask for the adhesive conveying jig of the present invention will be described with reference to FIG.
As shown in FIG. 3 (a), the substrate 7 is fixed by an adhesive portion at a substantially central position on the adhesive conveyance jig 8 supported on the support 9, and the adhesive conveyance jig of the present invention is formed on the substrate 7. The central contact portion on the substrate contact surface side of the corresponding metal mask 3 is brought into contact. At this time, the frame-shaped concave portion 31 formed in the metal mask 3 for the adhesive conveyance jig is opposed to a portion other than the central substrate contact portion in the adhesion portion contact area of the adhesion conveyance jig 8. Then, as shown in FIG. 3B, the cream solder 6 is printed on the substrate 7 through the opening 4 by moving the squeegee 5 from the upper surface of the ridge 2 in the direction of the illustrated arrow. At that time, a portion protruding from the substrate outer shape on the substrate contact surface side of the metal mask 3 corresponding to the adhesive conveyance jig at the time of printing, that is, a portion for avoiding contact with the adhesive portion of the adhesive conveyance jig 8 composed of the frame-shaped concave portion 31. However, even if the metal mask 3 for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee 5 during squeezing, the depth of the frame-shaped concave portion 31 is reduced. Since there is an allowance for the contact by the length (about 5 to 95% of the mask plate thickness), contact with the adhesive portion of the adhesive transport jig 8 can be avoided. Further, even if contact is made, since the contact area is small, sticking at the time of printing is reduced, and plate separation after printing is performed stably and smoothly, so that the printability can be improved. In addition, it took 30 seconds or longer to wait for the metal mask to stick to the adhesive part of the adhesive conveyance jig and leave it naturally, but it is improved to 5 seconds or less, and the tact time is reduced. In addition, even if it comes into contact with the adhesive part of the adhesive conveyance jig, the contact area is small and sticking during printing is reduced, so there is no need to produce a dedicated conveyance jig for each board model, reducing production costs. Can be planned.

Embodiment 2. FIG.
4 is a perspective view showing the structure of a metal mask for an adhesive conveyance jig according to Embodiment 2 of the present invention. FIG. 5 is a cream solder for a substrate using the metal mask for an adhesion conveyance jig according to Embodiment 2 of the present invention. It is explanatory drawing which shows the process of printing. In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
In the first embodiment, the substrate contact surface side of the metal mask 3 corresponding to the adhesive transport jig is brought into contact with the adhesive portion in the adhesive portion contact area of the adhesive transport jig 8 and in a portion other than the central substrate contact portion. In order to avoid this, the frame-shaped concave portion 31 is formed. In the second embodiment, a plurality of convex portions 32 having a height of 5 to 95% of the depth of the concave portion are formed in the frame-shaped concave portion 31. It is a thing. Since the plurality of convex portions 32 are effective as long as they protrude even a little, they may protrude about 5% of the depth of the concave portion.

Next, the process of cream solder printing on the substrate using the metal mask for the adhesive conveyance jig of the second embodiment will be described with reference to FIG.
As shown in FIG. 5 (a), the substrate 7 is fixed to the substantially central position on the adhesive conveyance jig 8 supported on the support 9 by the adhesive portion, and the adhesive conveyance jig of the present invention is placed on the substrate 7. The central contact portion on the substrate contact surface side of the corresponding metal mask 3 is brought into contact. At this time, a frame-shaped recess 31 formed in the metal mask 3 corresponding to the adhesive transport jig and the portion provided in the adhesive transport jig-compatible metal mask 3 are provided in the adhesive contact area of the adhesive transport jig 8 and other than the central substrate contact portion. The plurality of convex portions 32 are opposed to each other. Then, as shown in FIG. 5 (b), the cream solder 6 is printed on the substrate 7 through the opening 4 by moving the squeegee 5 from the upper surface of the ridge 2 in the direction of the illustrated arrow. At this time, there is a portion for avoiding contact with the adhesive portion of the adhesive conveyance jig 8 composed of the frame-shaped concave portion 31 that protrudes from the substrate outer shape on the substrate contact surface side of the metal mask 3 for the adhesion conveyance jig during printing. Since the metal mask 3 corresponding to the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee 5 at the time of squeezing, it is provided in the frame-shaped recess 31 because it is located opposite to the adhesive part of the adhesion conveyance jig 8. Since the plurality of convex portions 32 contacted first, the contact area with the adhesive portion of the adhesive conveying jig 8 can be reduced, sticking during printing is reduced, and plate separation after printing is stable. Therefore, the printability can be improved. In addition, it took 30 seconds or longer to wait for the metal mask to stick to the adhesive part of the adhesive conveyance jig and leave it naturally, but it is improved to 5 seconds or less, and the tact time is reduced. In addition, even if it comes into contact with the adhesive part of the adhesive conveyance jig, the contact area is small and sticking during printing is reduced, so there is no need to produce a dedicated conveyance jig for each board model, reducing production costs. Can be planned.

Embodiment 3 FIG.
FIG. 6 is a perspective view showing the structure of the metal mask for the adhesive conveyance jig according to Embodiment 3 of the present invention, and FIG. 7 is the cream solder of the substrate using the metal mask for the adhesion conveyance jig according to Embodiment 3 of the present invention. It is explanatory drawing which shows the process of printing. In the figure, the same or corresponding parts as those in the first and second embodiments are denoted by the same reference numerals and the description thereof is omitted.
In the first embodiment, the substrate contact surface side of the metal mask 3 corresponding to the adhesive transport jig is brought into contact with the adhesive portion in the adhesive portion contact area of the adhesive transport jig 8 and in a portion other than the central substrate contact portion. In order to avoid this, the frame-shaped recess 31 is formed. However, in the third embodiment, when the substrate 7 on which the electronic circuit is formed has a relatively large through-hole 71, the adhesive is passed through the through-hole 71. There is a possibility that the substrate contact surface side of the metal mask 3 is bent and contacts the adhesive portion of the transport jig 8. Therefore, in order to avoid contact with the adhesive portion of the adhesive conveyance jig 8 in the penetration portion 71 of the substrate 7, in addition to the frame-shaped recess 31, the central substrate on the substrate contact surface side of the metal mask 3 for the adhesive conveyance jig In a portion corresponding to the penetrating portion 71 of the substrate 7 of the contact portion, a rectangular substrate penetrating portion recess (for example, about 5 to 95% of the mask plate thickness) 33 for avoiding contact with the adhesive portion was formed. Is.

Next, the process of cream solder printing of the board | substrate using the metal mask for adhesion conveyance jig | tools of Embodiment 3 is demonstrated with FIG.
As shown in FIG. 7 (a), the substrate 7 is fixed by an adhesive portion at a substantially central position on the adhesive conveyance jig 8 supported on the support 9, and the adhesive conveyance jig of the present invention is formed on the substrate 7. The central contact portion on the substrate contact surface side of the corresponding metal mask 3 is brought into contact. At this time, the frame-shaped concave portion 31 formed in the metal mask 3 for the adhesive conveyance jig is opposed to the adhesive conveyance jig 8 in the adhesion portion contact area and other than the central substrate contact portion. Further, a rectangular substrate penetration portion recess 33 formed in the metal mask 3 corresponding to the adhesive conveyance jig is opposed to a portion corresponding to the penetration portion 71 of the substrate 7. Then, as shown in FIG. 7B, the cream solder 6 is printed on the substrate 7 through the opening 4 by moving the squeegee 5 from the upper surface of the ridge 2 in the direction of the illustrated arrow. At this time, there is a portion for avoiding contact with the adhesive portion of the adhesive conveyance jig 8 composed of the frame-shaped concave portion 31 that protrudes from the substrate outer shape on the substrate contact surface side of the metal mask 3 for the adhesion conveyance jig during printing. In addition, a rectangular substrate penetrating portion recess 33 formed in the adhesive transporting jig corresponding metal mask 3 is located in a portion corresponding to the penetrating portion 71 of the substrate 7 while facing the adhesive portion of the adhesive transporting jig 8. Even if the metal mask 3 for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee 5 during squeezing, the depth of the recesses 31 and 33 (about 5 to 95% of the mask plate thickness) Since there is a margin for contact, contact with the adhesive portion of the adhesive conveyance jig 8 can be avoided. Further, even if contact is made, since the contact area is small, sticking at the time of printing is reduced, and plate separation after printing is performed stably and smoothly, so that the printability can be improved. In addition, it took 30 seconds or longer to wait for the metal mask to stick to the adhesive part of the adhesive conveyance jig and leave it naturally, but it is improved to 5 seconds or less, and the tact time is reduced. In addition, even if it comes into contact with the adhesive part of the adhesive conveyance jig, the contact area is small and sticking during printing is reduced, so there is no need to produce a dedicated conveyance jig for each board model, reducing production costs. Can be planned.

It is a whole perspective view for demonstrating the cream solder printing of the board | substrate using the metal mask for adhesion conveyance jigs in Embodiment 1 of this invention. It is a perspective view which shows the structure of the metal mask corresponding to the adhesion conveyance jig | tool in Embodiment 1 of this invention. It is explanatory drawing which shows the process of the cream solder printing of the board | substrate using the metal mask for adhesion conveyance jigs in Embodiment 1 of this invention. It is a perspective view which shows the structure of the metal mask corresponding to the adhesion conveyance jig | tool in Embodiment 2 of this invention. It is explanatory drawing which shows the process of the cream solder printing of the board | substrate using the metal mask for adhesion conveyance jig | tools in Embodiment 2 of this invention. It is a perspective view which shows the structure of the metal mask corresponding to the adhesion conveyance jig | tool in Embodiment 3 of this invention. It is explanatory drawing which shows the process of the cream solder printing of the board | substrate using the metal mask for adhesion conveyance jig | tools in Embodiment 3 of this invention. It is explanatory drawing which shows the process of the cream solder printing of the electronic circuit board using the conventional metal mask.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Frame 2 紗 3 Metal mask 3a for adhesive conveyance jig 31 Metal mask 31 having a conventional structure Frame-shaped concave portion 32 Plural convex portions 33 Rectangular concave portion for substrate through portion 4 Opening portion 5 Squeegee 6 Cream solder 7 Substrate 71 Through portion 8 Adhesive conveyance jig 9 Support 10 Solder after printing

Claims (8)

Used when the substrate on which the electronic circuit is formed is adhered to the adhesive portion of the adhesive conveying jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. A metal mask for adhesive transport jigs,
Contact with the adhesive part of the adhesive transport jig during squeezing within the adhesive part contact area of the adhesive transport jig on the substrate contact surface side of the metal mask corresponding to the adhesive transport jig and at a portion other than the substrate contact part A metal mask for an adhesive conveyance jig, characterized in that a frame-shaped concave portion for avoiding the above is formed.   The metal mask for an adhesive conveyance jig according to claim 1, wherein a plurality of convex portions having a height lower than the depth of the frame-shaped concave portion are formed in the frame-shaped concave portion.   The adhesive conveyance jig according to claim 2, wherein the depth of the frame-shaped recess is about 5 to 95% of the thickness of the mask plate, and the height of the projection is 5 to 95% of the depth of the recess. Compatible metal mask.   In addition to the frame-shaped recess, contact the adhesive contact part of the adhesive transfer jig during squeezing to the part of the substrate contact part on the substrate contact surface side of the metal mask corresponding to the adhesive transfer jig. 2. The metal mask for an adhesive conveyance jig according to claim 1, wherein a concave portion for a substrate penetrating portion to avoid is formed.   The substrate contact surface side of the metal mask for the adhesive conveyance jig is coated with a fluorine resin having a water repellency and a slipperiness, a silicone resin or both, or a coating of a silane compound or the like. The metal mask corresponding to the adhesion conveyance jig in any one of Claims 1-4. Adhesive conveyance jig for adhering a substrate on which an electronic circuit is formed to an adhesion portion of an adhesion conveyance jig, fixing the substrate, and contacting the substrate contact surface side of the metal mask on the substrate, and performing cream solder printing on the substrate A solder printing method for a substrate using a corresponding metal mask,
A step of adhering the substrate to an adhesive portion of the adhesive conveyance jig supported by a support and fixing the substrate;
Contact the substrate contact surface side of the metal mask corresponding to the adhesive transport jig on the substrate, and contact the substrate within the adhesive portion contact area of the adhesive transport jig on the substrate contact surface side of the metal mask corresponding to the adhesive transport jig Forming a frame-shaped recess formed in order to avoid contact with the adhesive part of the adhesive conveyance jig in a part other than the part, and placing the frame-shaped concave part opposite to the adhesive part of the adhesive conveyance jig;
When the cream solder is printed on the substrate by moving the squeegee, even if the metal mask for the adhesive transport jig is bent and deformed by the pressing force of the squeegee, the adhesive transport treatment is performed by the frame-shaped recess. Cream solder printing process to reduce contact with the adhesive part of the tool,
A step of facilitating release from the adhesive portion of the adhesive transport jig of the adhesive transport jig-compatible metal mask after printing;
A method for solder printing on a substrate using a metal mask for an adhesive conveyance jig characterized by comprising: Adhesive conveyance jig for adhering a substrate on which an electronic circuit is formed to an adhesion portion of an adhesion conveyance jig, fixing the substrate, and contacting the substrate contact surface side of the metal mask on the substrate, and performing cream solder printing on the substrate A solder printing method for a substrate using a corresponding metal mask,
A step of adhering the substrate to an adhesive portion of the adhesive conveyance jig supported by a support and fixing the substrate;
Contact the substrate contact surface side of the metal mask corresponding to the adhesive transport jig on the substrate, and contact the substrate within the adhesive portion contact area of the adhesive transport jig on the substrate contact surface side of the metal mask corresponding to the adhesive transport jig Forming a plurality of convex portions provided in the frame-shaped concave portion and the frame-shaped concave portion for avoiding contact with the adhesive portion of the adhesive conveyance jig, A step of opposing the convex portion of the adhesive conveying jig to the adhesive portion of the adhesive conveying jig,
When the cream solder is printed on the substrate by moving the squeegee, even if the metal mask for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee, a plurality of pieces provided in the frame-shaped recesses are provided. A solder paste printing step in which the convex portion of the adhesive contacts first and reduces the contact area with the adhesive portion of the adhesive conveying jig;
A step of facilitating release from the adhesive portion of the adhesive transport jig of the adhesive transport jig-compatible metal mask after printing;
A method for solder printing on a substrate using a metal mask for an adhesive conveyance jig characterized by comprising: Adhesive that performs solder paste printing on the substrate by adhering the substrate on which the electronic circuit and the penetrating portion are formed to the adhesive portion of the adhesive conveying jig, fixing the substrate, and contacting the substrate contact surface side of the metal mask on the substrate A solder printing method for a substrate using a metal mask for a transfer jig,
Fixing the substrate by adhering the substrate including the penetrating portion to the adhesive portion of the adhesive conveyance jig supported by the support; and
Contact the substrate contact surface side of the metal mask corresponding to the adhesive transport jig on the substrate, and contact the substrate within the adhesive portion contact area of the adhesive transport jig on the substrate contact surface side of the metal mask corresponding to the adhesive transport jig Forming a frame-like recess for avoiding contact with the adhesive part of the adhesive transport jig in a portion other than the part, and making the frame-shaped recess facing the adhesive part of the adhesive transport jig, and A substrate penetration recess is formed in a portion corresponding to the substrate penetration to avoid contact with the adhesion portion of the adhesive conveyance jig, and the substrate penetration recess is opposed to the substrate penetration. Process,
When printing the cream solder on the substrate by moving the squeegee, even if the metal mask for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee, the frame-shaped recess and the substrate penetration recess A cream solder printing process that reduces the contact area with the adhesive part of the adhesive conveying jig,
A step of facilitating release from the adhesive portion of the adhesive transport jig of the adhesive transport jig-compatible metal mask after printing;
A method for solder printing on a substrate using a metal mask for an adhesive conveyance jig characterized by comprising:

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