JP2009012230A - Metal mask dealing with adhesive conveying jig and solder printing method of substrate by employing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal mask dealing with an adhesive conveying jig, in which the adhesion of a portion bulged out of the substrate contact face side external shape of a substrate in the metal mask to the adhesive part of the adhesive conveying jig is reduced at the creamy solder printing of the substrate, a plate separation is performed smoothly and the reduction of a cycle time can be contrived. <P>SOLUTION: This metal mask 3 dealing with the adhesive conveying jig 8 is employed by fixing the substrate by making the substrate 7 adhesive with an electronic circuit formed thereon to the adhesive part of the adhesive conveying jig and by performing the creamy solder printing of the substrate by bringing the substrate contact face side of the metal mask into contact onto the substrate, by alternately providing a large number of recessed groove parts 31 extending diagonally parallel and a large number of projected stripe parts 32 extending diagonally parallel in a region nearly equal to the adhesive part contacting region of the adhesive conveying jig at the substrate contacting face side of the metal mask dealing with the adhesive conveying jig, the contacting area of the metal mask with the adhesive part during squeegeeing becomes smaller owing to the existence of the recessed groove parts 31. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  In the present invention, a substrate on which an electronic circuit is formed is adhered to an adhesive portion of an adhesive conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. The present invention relates to a metal mask for an adhesive conveyance jig used at the time, and a solder printing method for a substrate using the same.

Conventionally, in cream solder printing of a substrate on which an electronic circuit is formed, the substrate is adhered to an adhesive portion of an adhesive conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with this substrate. We do cream solder printing.
FIG. 6 is an explanatory view showing a cream solder printing process for an electronic circuit board using a conventional metal mask. In the figure, 1 is a frame for supporting the metal mask, 2 is a collar stretched inside the frame 1, and 3a is a metal mask having a conventional structure attached to the lower surface of the central portion of the collar 2. 4 is an opening that penetrates in the vertical direction provided in the metal mask 3a having a conventional structure, 5 is a squeegee, 6 is cream solder, 7 is a substrate on which an electronic circuit is formed, and 8 is an adhesive that fixes the substrate 7 on the upper surface. An adhesive conveyance jig is formed on the entire surface of the adhesive conveyance jig to securely adhere the substrate 7. Reference numeral 9 denotes a support for mounting and supporting the adhesive conveyance jig 8, and 10 denotes solder after being printed on the substrate 7. As shown in FIG. 6 (a), a substrate 7 is fixed to a substantially central position on an adhesive conveyance jig 8 supported on a support 9 by a surface adhesive portion, and a conventional metal mask is formed on the substrate 7. The substrate contact surface side of 3a is brought into contact. Then, as shown in FIG. 6 (b), the cream solder 6 is printed on the substrate 7 through the opening 4 by moving the squeegee 5 from the upper surface of the ridge 2 in the direction of the illustrated arrow. At that time, the portion of the metal mask 3a of the conventional structure that protrudes from the substrate outer surface at the time of printing bends during squeezing and sticks to the adhesive portion of the adhesive conveyance jig 8, so that the plate is separated after printing. It becomes unstable and printing failure occurs. Further, since the metal mask 3a having the conventional structure is stuck to the adhesive portion of the adhesive conveyance jig 8 and is naturally separated, the printing lead time is delayed.

  A method of forming solder bumps using a mask on electrode portions on a substrate on which a semiconductor wafer or an electronic circuit is formed is generally well known (see, for example, Patent Document 1).

JP 2002-151539 A

  In conventional cream solder printing of a substrate with an electronic circuit formed, the substrate sticks to the adhesive part of the adhesive conveyance jig, so the part that protrudes from the substrate outer surface on the substrate contact surface side of the conventional metal mask during printing is Bending at the time of squeezing causes sticking to the adhesive part of the conveying jig, the plate separation after printing becomes unstable, and printing failure occurs. Further, since the conventional metal mask is affixed to the adhesive part of the conveying jig and waits for it to be naturally separated, there is a problem that the printing lead time is delayed. Also, if it is forcibly removed, the printing result will not be good. In addition, manufacturing a dedicated transfer jig so that it does not stick to the metal mask for each board model is not a solution because of the problems of cost increase of the transfer jig and delivery time of the jig. Is the current situation.

  The present invention has been made to solve the above-described problems, and a portion of the metal mask that protrudes from the substrate outer surface on the substrate contact surface side is attached to the adhesive portion of the adhesive conveying jig during cream solder printing of the substrate. An object of the present invention is to provide a metal mask corresponding to an adhesive conveyance jig capable of reducing sticking, smoothly separating plates, and reducing tact time, and a method for solder printing of a substrate using the same.

  In the metal mask for the adhesive conveyance jig according to the present invention, the substrate on which the electronic circuit is formed is adhered to the adhesion portion of the adhesion conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate. The metal mask for the adhesive conveyance jig used when performing cream solder printing on the substrate, which is substantially equivalent to the adhesive portion contact area of the adhesion conveyance jig on the substrate contact surface side of the metal mask for the adhesion conveyance jig By providing a concave groove in the region, the contact area with the adhesive portion during squeezing is reduced.

  Further, the concave groove portion is made of a circle, a square, a polygon, and a partial shape thereof.

  Also used to perform cream solder printing on a substrate by adhering the substrate on which an electronic circuit is formed to the adhesive portion of the adhesive conveyance jig to fix the substrate and bringing the substrate contact surface side of the metal mask into contact with the substrate. A plurality of groove portions extending obliquely in parallel to an adhesive contact jig contact area on the substrate contact surface side of the adhesive transfer jig compatible metal mask. In addition, a large number of ridges extending obliquely in parallel are alternately provided, and the presence of the groove portion reduces the contact area with the adhesive portion during squeezing.

  In addition, a large number of concave groove portions extending obliquely in parallel and a large number of protrusions extending obliquely parallel are inclined at an angle of less than 90 ° with respect to the moving direction of the squeegee.

  Further, at both ends of a large number of ridges extending obliquely in parallel, when both ends of the ridges are separated from the other parts, the ridges adjacent to each other are connected to each other so as to surround the periphery. A frame-shaped peripheral ridge is provided.

  In addition, rounded portions are formed on the entire periphery or both end edge portions of a large number of ridges extending obliquely in parallel.

  Also used to perform cream solder printing on a substrate by adhering the substrate on which an electronic circuit is formed to the adhesive portion of the adhesive conveyance jig to fix the substrate and bringing the substrate contact surface side of the metal mask into contact with the substrate. An adhesive transfer jig-compatible metal mask, which has concave and convex dots arranged in a staggered pattern in an area substantially equivalent to the adhesive contact area of the adhesive transfer jig on the substrate contact surface side of the adhesive transfer jig-compatible metal mask. , Irregularities made of mesh, honeycomb, wavy line shape, etc. are formed to reduce the contact area with the adhesive part during squeezing.

  Further, the substrate contact surface side of the metal mask corresponding to the adhesive conveying jig is coated with a fluorine resin having water repellency and slipperiness, a silicone resin or both, or a coating of a silane compound or the like.

  In the solder printing method for a substrate using the metal mask for the adhesive conveyance jig according to the present invention, the substrate on which the electronic circuit is formed is adhered to the adhesion portion of the adhesion conveyance jig, and the substrate is fixed. A method for solder printing of a substrate using a metal mask corresponding to an adhesive conveyance jig that performs cream solder printing on a substrate by contacting the substrate contact surface side of the metal mask with the adhesive of the adhesion conveyance jig supported by the support The substrate is adhered to the substrate and the substrate is fixed, and the substrate contact surface side of the metal mask for the adhesive transport jig is brought into contact with the substrate, and the adhesive transport treatment on the substrate contact surface side of the metal mask for the adhesive transport jig is performed. The process of moving the squeegee to a position where a large number of concave grooves extending diagonally in parallel and a large number of convex ridges extending diagonally parallel are opposed to each other in an area substantially equivalent to the adhesive contact area of the tool When the cream solder is printed on the substrate, even if the metal mask corresponding to the adhesive transport jig is bent and deformed by the pressing force of the squeegee, the presence of the concave groove portion causes the contact with the adhesive part of the adhesive transport jig. A cream solder printing process in which the contact area is reduced and a contact is made, and a process of facilitating separation of the metal mask from the adhesive conveyance jig of the metal mask for the adhesion conveyance jig after printing from the adhesive portion after printing.

  In addition, the substrate having the electronic circuit formed thereon is adhered to the adhesive portion of the adhesive conveyance jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. A method for solder printing of a substrate using a metal mask corresponding to a tool, the step of adhering the substrate to an adhesive portion of an adhesive conveyance jig supported by a support and fixing the substrate, and an adhesion conveyance jig on the substrate The contact surface side of the corresponding metal mask is contacted, and uneven dots arranged in a staggered pattern in the adhesive contact area of the adhesive transfer jig on the substrate contact surface side of the adhesive mask When the cream solder is printed on the substrate by moving the squeegee to a position where the concave and convex portions made of mesh, honeycomb, wavy line shape, etc. are opposed to each other, Even if the metal mask corresponding to the transfer jig is bent and deformed, the presence of uneven dots and uneven portions reduces the contact area with the adhesive part of the adhesive transfer jig and makes the contact with the cream solder printing process. And a step of facilitating release of the plate from the adhesive portion of the adhesive conveyance jig of the metal jig for the conveyance jig.

  According to this invention, at the time of cream solder printing of the substrate, it is possible to reduce the sticking of the portion protruding from the substrate outer shape on the substrate contact surface side of the metal mask to the adhesive portion of the adhesive conveying jig, and to release the plate after printing Is carried out stably and smoothly, so that the printability can be improved. In addition, it took 30 seconds or longer to wait for the metal mask to stick to the adhesive part of the adhesive conveyance jig and leave it naturally, but it is improved to 5 seconds or less, and the tact time is reduced. In addition, even if it comes into contact with the adhesive part of the adhesive conveyance jig, the contact area is small and sticking during printing is reduced, so there is no need to produce a dedicated conveyance jig for each board model, reducing production costs. There is an effect that it can be planned.

Embodiment 1 FIG.
FIG. 1 is an overall perspective view for explaining cream solder printing on a substrate using a metal mask for an adhesive conveyance jig according to Embodiment 1 of the present invention, and FIG. 2 is an adhesive conveyance jig according to Embodiment 1 of the present invention. FIG. 3 is a perspective view showing the structure of the corresponding metal mask, and FIG. 3 is an explanatory view showing the cream solder printing process for the substrate using the metal mask for the adhesive conveying jig in the first embodiment of the present invention.

In the figure, 1 is a frame for supporting a metal mask, 2 is a collar stretched on the inside of the frame 1, and 3 is a metal mask for an adhesive conveyance jig of the present invention attached to the lower surface of the central portion of the collar 2. 4 is an opening provided in the metal mask 3 for the adhesive conveyance jig according to the present invention, which penetrates in the vertical direction, 5 is a squeegee, 6 is cream solder, 7 is a substrate on which an electronic circuit is formed, 8 is a substrate 7 on the top surface An adhesive conveyance jig for adhering and fixing, and an adhesive portion for securely adhering the substrate 7 is formed on the entire surface. Reference numeral 9 denotes a support for mounting and supporting the adhesive conveyance jig 8, and 10 denotes solder after being printed on the substrate 7.
The metal mask 3 for an adhesive conveyance jig of the present invention is configured as follows. That is, 45 is formed on the substrate contact surface side of the metal mask 3 corresponding to the adhesive conveyance jig in order to reduce the contact area with the adhesive portion in an area substantially equal to the adhesive portion contact area of the adhesive conveyance jig 8. A large number of concave groove portions 31 extending obliquely parallel at an angle of ° and a large number of ridges 32 extending obliquely parallel at an angle of 45 ° are alternately provided. Further, due to the presence of the plurality of concave groove portions 31, a contact area with the adhesive portion of the adhesive conveyance jig 8 is reduced. The width | variety of the said protruding item | line part 32 can be suitably selected from the range of 0.02-5 mm. The groove 31 has a width of 1.0 mm and is processed at a pitch of 1.5 mm. The groove 31 may be inclined at an angle of less than 90 ° with respect to the moving direction of the squeegee 5. Is preferred, and it is best to incline at an angle of 45 °. Thereby, the movement of the squeegee 5 is performed smoothly. Moreover, the ratio of the width | variety of the protruding item | line part 32 and the width of the recessed groove part 31 is good about 1: 1 or 1: 2, and it is desirable that a protruding item | line part area | region becomes 50% or less of an adhesion area | region. Further, since the peripheral portion other than the adhesive portion contact area of the adhesive transport jig 8 on the substrate contact surface side of the metal mask 3 corresponding to the adhesive transport jig remains unprocessed, it is substantially equal to the height of the ridge portion 32. The plane is configured. In addition, the entire surface of the metal mask 3 corresponding to the adhesive conveyance jig 3 on the substrate contact surface side is coated with a fluorine resin having water repellency and slipperiness, a silicone resin or both, or a coating of a silane compound or the like. And has improved peeling.

Next, the process of cream solder printing on the substrate using the metal mask for the adhesive conveying jig of the present invention will be described with reference to FIG.
As shown in FIG. 3 (a), the substrate 7 is fixed by an adhesive portion at a substantially central position on the adhesive conveyance jig 8 supported on the support 9, and the adhesive conveyance jig of the present invention is formed on the substrate 7. The central portion of the corresponding metal mask 3 on the substrate contact surface side is brought into contact. At this time, the contact area with the adhesive portion of the adhesive transport jig 8 composed of the concave groove portion 31 and the convex strip portion 32 of the metal mask 3 corresponding to the adhesive transport jig is reduced in the adhesive portion contact area of the adhesive transport jig 8. The part which is opposite is located. Then, as shown in FIG. 3B, the cream solder 6 is printed on the substrate 7 through the opening 4 by moving the squeegee 5 from the upper surface of the ridge 2 in the direction of the illustrated arrow. At that time, the contact area with the adhesive portion of the adhesive conveyance jig 8 composed of the concave groove portion 31 and the convex strip portion 32, that is, the portion protruding from the substrate outer shape on the substrate contact surface side of the metal mask 3 for the adhesion conveyance jig at the time of printing. Since the reduced portion faces the adhesive portion of the adhesive conveyance jig 8, even if the metal mask 3 for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee 5 during squeezing, the adhesive portion Since the contact area is small, sticking at the time of printing is reduced, and plate separation after printing is performed stably and smoothly, so that the printability can be improved. In addition, it took 30 seconds or longer to wait for the metal mask to stick to the adhesive part of the adhesive conveyance jig and leave it naturally, but it is improved to 5 seconds or less, and the tact time is reduced. In addition, even if it comes into contact with the adhesive part of the adhesive conveyance jig, the contact area is small and sticking during printing is reduced, so there is no need to produce a dedicated conveyance jig for each board model, reducing production costs. Can be planned.

Embodiment 2. FIG.
In the first embodiment, formed on the substrate contact surface side of the adhesive transport jig-compatible metal mask 3 in order to reduce the contact area with the adhesive section in an area substantially equivalent to the adhesive section contact area of the adhesive transport jig 8. The plurality of groove portions 31 that extend obliquely parallel at an angle of 45 ° and the plurality of ridge portions 32 that extend obliquely parallel at an angle of 45 ° are alternately provided. The contact area with the adhesive portion of the adhesive transport jig 8 during squeezing is reduced, but not limited to this, on the substrate contact surface side of the metal mask 3 for the adhesive transport jig, For example, by forming concave and convex dots arranged in a staggered manner, a concave and convex portion made of a shape such as a mesh, a honeycomb, a wavy line, etc., or forming a concave groove portion made of a circle, a square, a polygon, and a partial shape of the shape, Above during squeezing The contact area with the adhesive part of the adhesive conveyance jig 8 may be reduced.

Embodiment 3 FIG.
FIG. 4 is a perspective view showing the structure of the metal mask for the adhesive conveying jig according to Embodiment 3 of the present invention. In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
In FIG. 4, reference numeral 33 denotes an end portion of a large number of protrusions 32 extending obliquely parallel at an angle of 45 °, and between the adjacent protrusions 32 when both ends of the protrusions are separated from other parts. Are frame-shaped peripheral ridges formed so as to surround the periphery.
As in the first embodiment, when both ends of a large number of ridges 32 are erected independently from the outer peripheral edge, the cleaning roll paper is ridged during cleaning of the adhesive transfer jig-compatible metal mask 3. There is a problem that the both ends of the portion 32 are caught. However, as in the third embodiment, at both ends of the ridge portion 32, the adjacent ridge portions 32 are connected to each other, and the frame-shaped peripheral ridge portion 33 surrounding the periphery is formed. The cleaning roll paper is prevented from being caught on both edge portions of the ridge portion 32 when cleaning the metal mask 3 for the adhesive conveyance jig.

Embodiment 4 FIG.
FIG. 5 is an enlarged perspective view showing a main part of the metal mask for the adhesive conveying jig according to Embodiment 4 of the present invention. In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
In Embodiment 3 described above, in both end portions of the ridge portion 32, when both ends of the ridge portion are separated from the other portions, the adjacent ridge portions 32 are connected to each other, and the frame-like peripheral ridges surrounding the periphery are connected. By forming the portion 33, the problem that the cleaning roll paper is caught on both edge portions of the ridge portion 32 at the time of cleaning the metal mask 3 for the adhesive conveyance jig is solved. As shown in FIG. 5, a rounded portion 34 without an edge is formed by buffing or belt polishing on both end edge portions of a large number of ridge portions 32 extending obliquely parallel at an angle of 45 °, The cleaning roll paper is prevented from being caught on both edge portions of the ridge portion 32 when cleaning the metal mask 3 for the adhesive conveyance jig.

It is a whole perspective view for demonstrating the cream solder printing of the board | substrate using the metal mask for adhesion conveyance jigs in Embodiment 1 of this invention. It is a perspective view which shows the structure of the metal mask corresponding to the adhesion conveyance jig | tool in Embodiment 1 of this invention. It is explanatory drawing which shows the process of the cream solder printing of the board | substrate using the metal mask for adhesion conveyance jigs in Embodiment 1 of this invention. It is a perspective view which shows the structure of the metal mask corresponding to the adhesion conveyance jig | tool in Embodiment 3 of this invention. It is an expansion perspective view which shows the principal part of the metal mask for adhesion conveyance jig | tools in Embodiment 4 of this invention. It is explanatory drawing which shows the process of the cream solder printing of the electronic circuit board using the conventional metal mask.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Frame 2 紗 3 Metal mask 3a corresponding to adhesion conveyance jig 3a Metal mask 31 having a conventional structure Concave groove portion 32 Convex portion 33 Frame-shaped peripheral convex portion 34 Round portion 4 Opening portion 5 Squeegee 6 Cream solder 7 Substrate 8 Adhesive conveyance treatment Tool 9 Support 10 Solder after printing

Claims (10)

Used when the substrate on which the electronic circuit is formed is adhered to the adhesive portion of the adhesive conveying jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. A metal mask for adhesive transport jigs,
The contact area with the adhesive part at the time of squeezing is provided by providing a concave groove part in a region substantially equivalent to the adhesive part contact area of the adhesive transport jig on the substrate contact surface side of the metal mask for the adhesive transport jig. Metal mask for adhesive conveyance jigs, which is characterized by a reduction.   2. The metal mask for an adhesive conveyance jig according to claim 1, wherein the concave groove portion is formed of a circle, a square, a polygon, and a partial shape thereof. Used when the substrate on which the electronic circuit is formed is adhered to the adhesive portion of the adhesive conveying jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. A metal mask for adhesive transport jigs,
A large number of grooves extending obliquely in parallel and a large number of ridges extending obliquely parallel to the adhesive contact area of the adhesive conveyance jig on the substrate contact surface side of the metal mask corresponding to the adhesion conveyance jig A metal mask corresponding to an adhesive conveyance jig, wherein portions are provided alternately, and the contact area with the adhesive portion during squeezing is reduced due to the presence of the concave groove portion.   The adhesive conveyance treatment according to claim 3, wherein the plurality of concave groove portions extending obliquely in parallel and the plurality of ridge portions extending obliquely parallel are inclined at an angle of less than 90 ° with respect to the moving direction of the squeegee. Metal mask for ingredients.   At both ends of a large number of ridges extending obliquely in parallel, when both ends of the ridges are separated from the other parts, the frames formed so as to connect the adjacent ridges to each other and surround the periphery 5. A metal mask for an adhesive conveyance jig according to claim 3 or 4, wherein a convex peripheral ridge portion is provided.   6. A metal mask for an adhesive conveyance jig according to claim 3, wherein rounded portions are formed on the entire periphery or both end edge portions of a plurality of ridges extending obliquely in parallel. . Used when the substrate on which the electronic circuit is formed is adhered to the adhesive portion of the adhesive conveying jig to fix the substrate, and the substrate contact surface side of the metal mask is brought into contact with the substrate to perform cream solder printing on the substrate. A metal mask for adhesive transport jigs,
Consists of concavo-convex dots, meshes, honeycombs, wavy lines, etc. arranged in a staggered pattern in an area substantially equivalent to the adhesive part contact area of the adhesive transport jig on the substrate contact surface side of the metal mask for the adhesive transport jig A metal mask for an adhesive conveyance jig, wherein unevenness is formed, and a contact area with the adhesive portion during squeezing is reduced.   The substrate contact surface side of the metal mask for the adhesive conveyance jig is coated with a fluorine resin having a water repellency and a slipperiness, a silicone resin or both, or a coating of a silane compound or the like. The metal mask corresponding to the adhesion conveyance jig in any one of Claims 1-7. Adhesive conveyance jig for adhering a substrate on which an electronic circuit is formed to an adhesion portion of an adhesion conveyance jig, fixing the substrate, and contacting the substrate contact surface side of the metal mask on the substrate, and performing cream solder printing on the substrate A solder printing method for a substrate using a corresponding metal mask,
A step of adhering the substrate to an adhesive portion of the adhesive conveyance jig supported by a support and fixing the substrate;
The substrate contact surface side of the metal mask corresponding to the adhesive conveyance jig is brought into contact with the substrate, and an area substantially equivalent to the adhesive portion contact area of the adhesive conveyance jig on the substrate contact surface side of the metal mask corresponding to the adhesion conveyance jig In addition, the step of opposing the portions where a plurality of recessed groove portions extending obliquely parallel and a plurality of protrusions extending obliquely parallel are alternately provided,
When the cream solder is printed on the substrate by moving the squeegee, even if the metal mask for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee, the adhesive conveyance treatment is performed due to the presence of the concave groove portion. A cream solder printing process in which the contact area with the adhesive part of the tool is reduced and brought into contact;
A step of facilitating release from the adhesive portion of the adhesive transport jig of the adhesive transport jig-compatible metal mask after printing;
A method for solder printing on a substrate using a metal mask for an adhesive conveyance jig characterized by comprising: Adhesive conveyance jig for adhering a substrate on which an electronic circuit is formed to an adhesion portion of an adhesion conveyance jig, fixing the substrate, and contacting the substrate contact surface side of the metal mask on the substrate, and performing cream solder printing on the substrate A solder printing method for a substrate using a corresponding metal mask,
A step of adhering the substrate to an adhesive portion of the adhesive conveyance jig supported by a support and fixing the substrate;
The substrate contact surface side of the metal mask corresponding to the adhesive conveyance jig is brought into contact with the substrate, and an area substantially equivalent to the adhesive portion contact area of the adhesive conveyance jig on the substrate contact surface side of the metal mask corresponding to the adhesion conveyance jig In addition, a step of opposing positions of the concave and convex dots arranged in a staggered manner, a portion where the concave and convex portions made of mesh, honeycomb, wavy line shape, etc. are formed, and
When the cream solder is printed on the substrate by moving the squeegee, even if the metal mask for the adhesive conveyance jig is bent and deformed by the pressing force of the squeegee, the presence of the uneven dots and the uneven portions causes the A cream solder printing process in which the contact area with the adhesive part of the adhesive conveyance jig is reduced and contacted,
A step of facilitating release from the adhesive portion of the adhesive transport jig of the adhesive transport jig-compatible metal mask after printing;
A method for solder printing on a substrate using a metal mask for an adhesive conveyance jig characterized by comprising:

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