JP2004193366A - Holding jig of electronic part and method for handling electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a holding jig by which an electronic part stuck and held to an adhesive layer can surely be scratched off without being left behind, and to obtain a method for handling the electronic part. <P>SOLUTION: The holding jig 10 is composed of a supporting plate 11, the adhesive layer 15 provided on the main surface of the supporting plate 11 and holding the electronic part 20 in an adhering state, and a low adhesive part (including being non-adhesive) 16 provided adjacent to the adhesive layer 15. The electronic part 20 whose one end is stuck to and held by the adhesive layer 15 is scratched off from the adhesive layer 15 by moving a scratching-off blade 25 in the direction of an arrow A along the surface of the adhesive layer 15. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a holding jig for an electronic component and a method for handling the electronic component, and more particularly to a holding jig for holding an electronic component at one end surface thereof in an electronic component such as a chip-shaped multilayer capacitor. It relates to how to handle parts.
[0002]
[Prior art and problems]
Conventionally, in the manufacture of electronic components such as chip-shaped multilayer capacitors, one end surface of many multilayer capacitors is held in a state where one end surface of the multilayer capacitor is adhered to an adhesive layer provided on the main surface of a supporting plate, and an electrode is applied to the other end surface. After drying, it is known that the transfer is performed with the other end face adhered to the adhesive layer of another support plate, and an electrode is applied to one end face and dried.
[0003]
As shown in FIG. 6, the multilayer capacitor 5 manufactured through the above steps is adhesively held on the adhesive layer 2 of the supporting flat plate 1, and the scraping blade 6 is moved along the surface of the adhesive layer 2. By moving in one direction (the direction of arrow A), the adhesive material layer 2 was scraped off.
[0004]
[Patent Document 1]
JP 2001-118755 A (FIG. 7 (5), paragraphs 0014 and 0019)
A technique similar to that shown in FIG. 6 is disclosed.
[Patent Document 2]
Japanese Patent Application 2001-263833
A technique similar to that shown in FIG. 6 is disclosed, particularly regarding the shape of the scraping blade.
[0005]
By the way, as shown in FIG. 7, the multilayer capacitor 5 adhered to the adhesive layer 2 is first moved in the same direction by the movement of the scraping blade 6 in the direction of arrow A, and is positioned downstream. And falls down in contact with the laminated capacitor 5a. Since the capacitors 5 located in the last row have no capacitors located on the downstream side, as shown in FIG. 6, the capacitors 5 once go around the step on the end surface of the adhesive material layer 2, and after the blade 6 has passed, as shown by a broken line. This causes a problem that the adhesive layer 2 is reattached to the end of the adhesive layer 2 and left.
[0006]
In recent years, miniaturization of electronic components has been progressing, and such a problem is remarkable in lightweight small electronic components having a length of 0.6 mm and a width of 0.3 mm or less. If scraping remains, the remaining electronic components are mixed into other types of electronic components to be processed next, mixed between lots, or new electronic components are held. At times, the equipment was damaged.
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to provide a holding jig and a method for handling an electronic component that can reliably scrape off an electronic component that has been adhesively held on an adhesive layer without leaving it.
[0008]
Means and Action for Solving the Problems
In order to achieve the above object, an electronic component holding jig according to a first aspect of the present invention includes a support flat plate, and an adhesive layer provided on a main surface of the support flat plate and holding the electronic component in an adhered state. And a non-adhesive portion provided on a peripheral portion of the adhesive layer or a low-adhesion portion having lower adhesive strength than the adhesive layer.
[0009]
In the electronic component holding jig according to the first invention, when the scraping blade is moved to scrape the electronic component held by the adhesive layer, the electronic component is located at the end of the adhesive layer. The electronic component comes off the adhesive layer, contacts the non-adhesive portion or the low-adhesion portion, and falls downward. That is, the problem that the electronic component is held on the end surface of the pressure-sensitive adhesive layer and the scraping remains is reliably prevented.
[0010]
In the electronic component holding jig according to the first invention, it is preferable that a height of the non-adhesive portion or the low-adhesion portion is set lower than a height of the adhesive layer. The scraping blade prevents the non-adhesive portion or the low-adhesion portion from being worn or peeled off.
[0011]
Further, the non-adhesive portion or the low-adhesive portion may be formed by coating the non-adhesive material or the low-adhesive material on the adhesive layer, or the adhesive layer may be partially heated. It may be formed by processing.
[0012]
Further, the non-adhesive portion or the low-adhesive portion may be formed by so-called two-color molding by simultaneously filling different materials together with the adhesive layer. Alternatively, the non-adhesive portion or the low-adhesion portion may be formed independently of the adhesive layer and adhered adjacent to the adhesive layer.
[0013]
Further, the surface of the non-adhesive portion or the low-adhesive portion may be subjected to a surface roughening treatment. The contact area with the electronic component is reduced, and the adhesive strength is further reduced.
[0014]
A method of handling an electronic component according to a second aspect of the present invention includes the steps of: preparing a holding unit having an adhesive layer and a non-adhesive portion or a low-adhesion portion having lower adhesive strength than the adhesive layer; Adhering one end surface of the electronic component to the material layer to hold the electronic component, and applying a scraping means along the surface of the adhesive material layer, and wherein the non-adhesive portion or the low-adhesion portion is terminated in the moving direction. And scraping the electronic component from the adhesive layer.
[0015]
A method for handling an electronic component according to a third aspect of the present invention includes a step of preparing a first holding means having at least an adhesive layer, an adhesive layer, and a non-adhesive portion or a low-adhesion portion having an adhesive force smaller than that of the adhesive layer. Preparing a second holding means having a portion, a step of adhering one end surface of the electronic component to an adhesive layer of the first holding means, and holding the electronic component; and a step of holding the first holding means. Adhering the other end surface of the electronic component held on the adhesive layer of the second holding means, transferring the electronic component to the second holding means, and holding the electronic component; Moving the non-adhesive portion or the low-adhesion portion along the surface of the adhesive layer of the holding means in the direction in which the non-adhesive portion or the low-adhesion portion comes to the end of the moving direction, and scraping the electronic component from the adhesive layer; It is characterized by having.
[0016]
In the electronic component handling method according to the third invention, it is preferable that the adhesive force of the second holding means is larger than that of the first holding means.
[0017]
In the electronic component handling method according to the second and third aspects of the present invention, like the electronic component holding jig according to the first aspect of the invention, the scraping blade does not leave any unscraped residue, so Can be scraped off.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a jig for holding an electronic component and a method for handling an electronic component according to the present invention will be described with reference to the accompanying drawings.
[0019]
(Basic structure of holding jig, see Fig. 1)
First, the basic structure of the holding jig according to the present invention will be described with reference to FIG. The holding jig (holding means) 10 includes a supporting flat plate 11, an adhesive layer 15 provided on the main surface thereof, and a non-adhesive portion / low-adhesive portion 16 provided adjacent to the adhesive layer 15. I have. The low adhesiveness means that the adhesive strength is smaller than that of the adhesive material layer 15. Hereinafter, in the description of the embodiments, the term low tackiness is used including the meaning of non-stickiness.
[0020]
The holding jig 10 holds a large number of electronic components 20 (for example, chip-shaped multilayer capacitors) arranged in a matrix at predetermined intervals by pressing an adhesive layer 15 against one end surface thereof. In this holding state, the other end surface of the electronic component 20 is immersed in a conductive paste to form an external electrode.
[0021]
The electronic component 20 having the external electrode formed thereon is scraped from the adhesive layer 15 by moving the scraping blade (scraping means) 25 in one direction (in the direction of arrow A) along the surface of the adhesive layer 15. Dropped and falls down. The electronic component 20a located in the last row in the scraping direction A is pushed by the tip of the scraping blade 25, comes off the end of the adhesive layer 15, comes into contact with the low adhesive portion 16, and drops downward. Since there is no step between the adhesive layer 15 and the low-adhesion portion 16 so that the electronic component 20 is hidden, the last row of electronic components 20a is re-attached to the end surface of the adhesive layer 15 and scraping remains. Will not occur.
[0022]
Incidentally, the external electrodes are formed on both end surfaces of the electronic component 20. Therefore, another holding jig is prepared for the holding jig 10, and first, the other end surface of the electronic component 20 is adhesively held on the adhesive material layer of the other holding jig, and one end surface of the electronic component is Is immersed in a conductive paste, an external electrode is formed and dried. Then, the adhesive layer 15 of the holding jig 10 is pressed against the other end surface of the electronic component held by the other holding jig, and the electronic component is transferred to the holding jig 10 and held. In this case, the adhesive strength of the adhesive layer 15 of the holding jig 10 is set to be larger than the adhesive strength of the adhesive layer of the other holding jig.
[0023]
The electronic component 20 held by the holding jig 10 is assumed to be a multilayer capacitor having a length of 0.6 mm, a width of 0.3 mm, and a thickness of 0.3 mm. The support plate 11 is made of, for example, stainless steel having a thickness of 0.8 mm. The adhesive layer 15 is made of, for example, a silicon-based rubber material having a thickness of 2.4 mm, and has an adhesive strength of 0.025 kgf / cm ² .
[0024]
The low adhesion portion 16 can be made of, for example, a dustproof lubricating paint for silicon rubber, a fluorine-based coating material, or the like, and has a width dimension f of 2 mm. The same material as the pressure-sensitive adhesive layer 15 may be used for the low-adhesion portion 16, and the corresponding portion may be subjected to a process for reducing the adhesiveness. Details of such processing will be described later.
[0025]
The low-adhesion portion 16 is not only the downstream end (peripheral edge) of the adhesive layer 15 in the scraping direction A, but also the upstream side 16b and / or both sides as shown by a dashed line in FIG. 16c, 16c (the entire periphery). In order to achieve the object of the present invention, the low-adhesion portion 16 only needs to be provided at least at the downstream end in the scraping direction A.
[0026]
(Scraping blade, see FIGS. 2 and 3)
As the scraping blade 25, for example, a blade having a sectional shape shown in FIG. 2 is used. The blade portion 25b extends at a predetermined angle from the base portion 25a to be attached to the driving means. It is preferable that the cross-sectional shape of the tip of the blade portion 25b is not an acute angle, but a small arc is provided at the corner or the entire arc is formed as shown in FIGS. 3 (A) and 3 (B).
[0027]
(1st Embodiment, see FIG. 4)
In the holding jig 10A according to the first embodiment, as shown in FIGS. 4A and 4B, an adhesive layer 15 is provided on the main surface of the supporting flat plate 11, and the edge thereof is reduced in height. A low-adhesion portion 16 is obtained by performing a low-adhesion treatment (including a non-adhesion treatment).
[0028]
To reduce the height means to provide a step having a dimension t in the low adhesive portion 16 with respect to the thickness of the adhesive layer 15 (2.4 mm in this example), as shown in FIG. The tip of the scraping blade 25 moves in contact with the adhesive layer 15 with a bite amount d shown in FIG. The step size t is set to be equal to or larger than the bite amount d, for example, 0.2 mm. By providing such a step, it is possible to prevent the low-adhesion portion 16 from being worn or damaged by the tip of the blade 25 when the electronic component 20 is scraped.
[0029]
Note that if the low-adhesion portion 16 slides well, the low-adhesion portion 16 does not necessarily need to be reduced in height, and may be set higher than the adhesive layer 15.
[0030]
As the low-adhesion treatment, the first method is to form a coating film using a low-adhesion material (including a non-adhesion material). As the coating material, a dustproof lubricating paint for silicon rubber, a fluorine-based coating material, or the like can be used. Note that the coating film may be formed not only on the surface but also on the side surface 16a (see FIG. 4C).
[0031]
Further, the surface of the coating layer may be subjected to a roughening treatment. When the surface is roughened, the contact area between the low-adhesion portion 16 and the electronic component 20 is reduced, and the adhesion is further reduced.
[0032]
A second method of the low-adhesion treatment is to perform a heat treatment on the adhesive layer 15 so that the heat-treated portion becomes the low-adhesion portion 16. This method can be easily implemented as long as the material of the adhesive layer 15 reduces the amount of adhesion due to curing by heating.
[0033]
The heat treatment increases the heat conduction efficiency by increasing the thickness of the mold portion that contacts the low-adhesion portion 16 with respect to the mold used when the adhesive material layer 15 is formed by hot pressing, and partially accelerates the curing of the rubber. It can be done by doing. Further, after the pressure-sensitive adhesive layer 15 is formed, the heater may be partially contacted or approached to be cured to form the low-adhesion portion 16.
[0034]
In any of the above heat treatments, the heat treatment may be performed not only on the surface of the low-adhesion portion 16 but also on the side surface 16a. If minute irregularities are formed on the contact surface of the mold or the heater by sandblasting, electric discharge machining or the like, the surface roughening treatment can be performed simultaneously with the heating treatment.
[0035]
(Second embodiment, see FIG. 5)
As shown in FIGS. 5A and 5B, the holding jig 10B according to the second embodiment forms the adhesive layer 15 and the low-adhesion portion 16 with two different colors using different materials. It is bonded to the main surface. Alternatively, the low adhesive portion 16 may be formed independently of the adhesive layer 15 and adhered adjacent to the adhesive layer 15.
[0036]
Regardless of the molding method, a silicone rubber material can be used for the adhesive layer 15, and a dust-proof lubricating paint for silicon rubber or a fluorine-based coating material can be used for the low adhesive portion 16.
[0037]
Further, similarly to the first embodiment, the surface of the low-adhesion portion 16 may be subjected to a surface roughening treatment. Further, the low adhesive portion 16 has a step size t and is provided lower than the adhesive layer 15 as in the first embodiment.
[0038]
(Other embodiments)
The electronic component holding jig and the electronic component handling method according to the present invention are not limited to the above-described embodiment, but can be variously changed within the scope of the gist.
[0039]
In particular, the numerical values shown in the above embodiment are merely examples, and the size of the support flat plate 11 is arbitrary. Further, as the electronic components to be conveyed, various electronic components such as inductors, filters, LC composite components, and the like can be used in addition to the multilayer capacitor.
[0040]
In addition, when transferring electronic components using one holding jig in addition to the holding jig 10, the other holding jig used for the first holding does not have a non-adhesive portion or a low-adhesion portion. You may. The holding jig 10 according to the present invention may be used at least at the time of the second holding after the transfer. If a non-adhesive part or a low-adhesive part is also provided on another holding jig, even if there are remaining electronic parts when transferring electronic parts, the remaining electronic parts can be scraped securely. Can be taken.
[0041]
Also, by setting the thickness of the adhesive layer to be smaller than the thickness (minimum dimension) of the electronic component without providing a non-adhesive portion or a low-adhesion portion in the holding jig, the electronic component can be positioned at the end face of the adhesive layer. Thus, it is possible to prevent sneaking into the part, and to prevent the occurrence of scraping residue.
[0042]
【The invention's effect】
As apparent from the above description, according to the present invention, since a non-adhesive portion or a low-adhesive portion is provided adjacent to the adhesive layer for adhesively holding the electronic component, a scraping blade is provided on the surface of the adhesive layer. By moving the electronic component along one direction, the electronic component held by the adhesive layer can be reliably scraped off.
[Brief description of the drawings]
FIG. 1 shows a basic structure of a holding jig according to the present invention, wherein (A) is a side view and (B) is a bottom view.
FIG. 2 is a sectional view showing a blade for scraping an electronic component from a holding jig according to the present invention.
FIGS. 3A and 3B are cross-sectional views each showing a tip portion of the scraping blade.
4A and 4B show a holding jig according to the first embodiment of the present invention, wherein FIG. 4A is a bottom view, FIG. 4B is a sectional view, and FIG. 4C is a sectional view of a main part.
5A and 5B show a holding jig according to a second embodiment of the present invention, wherein FIG. 5A is a bottom view, FIG. 5B is a cross-sectional view, and FIG.
FIG. 6 is an explanatory view when a small electronic component is scraped from a conventional holding jig using a blade.
FIG. 7 is an explanatory diagram showing details of FIG. 6;
[Explanation of symbols]
10, 10A, 10B ... holding jig 11 ... support flat plate 15 ... adhesive layer 16 ... low adhesive part (non-adhesive part)
Reference numeral 20: electronic component 25: scraping blade

Claims (10)

A support plate,
An adhesive layer provided on the main surface of the supporting flat plate and holding the electronic component in an adhered state,
A non-adhesive portion or a low-adhesion portion having a lower adhesive strength than the adhesive layer provided on the peripheral portion of the adhesive layer,
A jig for holding an electronic component, comprising: The electronic component holding jig according to claim 1, wherein a height of the non-adhesive portion or the low adhesive portion is set lower than a height of the adhesive layer. The electronic component according to claim 1, wherein the non-adhesive portion or the low-adhesion portion is formed by coating the adhesive layer with a non-adhesive material or a low-adhesive material. Holding jig. The jig for holding an electronic component according to claim 1, wherein the non-adhesive portion or the low-adhesive portion is formed by partially heating the adhesive layer. . 3. The electronic component holding jig according to claim 1, wherein the non-adhesive portion or the low-adhesion portion is formed by simultaneously filling different materials together with the adhesive layer. The non-adhesive portion or the low-adhesion portion is formed independently of the adhesive layer, and is adhered adjacent to the adhesive layer. Electronic component holding jig. 7. The electronic device according to claim 1, wherein a surface of the non-adhesive portion or the low-adhesion portion is subjected to a surface roughening treatment. 8. Parts holding jig. An adhesive material layer, a step of preparing a holding means having a non-adhesive portion or a low-adhesion portion having a smaller adhesive force than the adhesive material layer,
Holding the electronic component by adhering one end surface of the electronic component to the adhesive layer of the holding means,
Moving the scraping means along the surface of the adhesive layer, and in a direction such that the non-adhesive portion or the low-adhesion portion comes to the end of the moving direction, and scraping the electronic component from the adhesive layer;
A method for handling electronic components, comprising: Providing a first holding means comprising at least an adhesive layer;
An adhesive material layer, a step of preparing a second holding means comprising a non-adhesive portion or a low-adhesion portion having a lower adhesive strength than the adhesive material layer,
Adhering one end surface of the electronic component to the adhesive layer of the first holding means to hold the electronic component;
Attaching the other end surface of the electronic component held by the first holding means to the adhesive layer of the second holding means, transferring the electronic component to the second holding means, and holding the electronic component;
Moving the scraping means along the surface of the adhesive layer of the second holding means and in a direction such that the non-adhesive portion or the low-adhesion portion comes to the end of the moving direction, and moves the electronic component to the adhesive layer Scraping from the
A method for handling electronic components, comprising: The method according to claim 9, wherein the adhesive force of the adhesive layer of the second holding means is larger than the adhesive force of the adhesive layer of the first holding means.

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