JP2004260153A - Board holder, its manufacturing method, and method of manufacturing die - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate handling of a FPC (Flexible Printed Circuit board), when the FPC is mounted on an electronic component, while holding it by adhesion. <P>SOLUTION: For mounting an electronic component, a pallet (1) holding the FPC (9) has the periphery part of a first adhesive hold region (21) which is relatively less adhesive and the center part of a second adhesive hold region (22) which is more adhesive than the primary region (21). The pallet (1) has a plurality of through-holes (31), in which projection pins for peeling the FPC (9) are stuck and a plurality of air blast nozzles (32) for assisting the peeling. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a technique for holding a circuit board, and preferably relates to a technique for holding a circuit board when electronic components are mounted on a flexible circuit board.

  2. Description of the Related Art In recent years, in small-sized electronic devices such as a mobile phone, a PDA (PersonAl DatA Assistants), and a notebook computer, a sheet-shaped flexible printed circuit board (Flexible Printed Circuit, hereinafter abbreviated as “FPC”) is used. Have been. The FPC is formed by forming various wiring patterns on a sheet-like resin, and various electronic components such as an IC, a capacitor, a resistor, a coil, and a connector are mounted on the wiring pattern. By using an FPC for an electronic device, a circuit board can be flexibly arranged in the electronic device and the size of the electronic device can be reduced.

As an example of such a technique, there is a method of providing an adhesive holding layer on a base plate (base plate) (Patent Document 1). In this method, an FPC is adhered to an adhesive holding layer provided on a base plate. In this state, the FPC is handled together with the base plate in the same manner as a normal circuit board.
JP-A-2002-232197

In the above-described example, for the purpose of adhering the FPC, an area on the base plate on which the adhesive holding layer is provided is referred to as an adhesive holding area, and the adhesive holding layer provided on the adhesive holding area is referred to as a holding adhesive holding layer for identification. Shall be. When an FPC is adhered on a base plate and an electronic component is mounted on the FPC, it is important to properly design the shape of the adhesive holding layer (adhesion holding region) and the adhesive strength of the adhesive holding layer to the FPC. When an electronic component is mounted on an FPC using a solder paste, usually, a process in a series of mounting processes including screen printing of the solder paste on the FPC, mounting of the electronic component, and reflow (heating and cooling) is performed. Is performed.
If an adhesive material with high adhesive strength is also present on the base play and in an area that is not an adhesive holding area, that is, in a non-adhesive holding area, the screen mask also sticks to the non-adhesive holding area during screen printing. Would. As described above, the non-adhesion holding area does not originally intend to adhere the FPC, and the adhesion of the FPC to the non-adhesion area greatly hinders the mounting process.
Further, when the adhesive strength of the adhesive holding layer is small, the FPC cannot be adhesively held on the base plate against the wind pressure due to the hot air circulation during reflow. On the other hand, when the adhesive strength of the adhesive holding layer is large, a large force is applied to the FPC when the FPC is peeled from the adhesive material even if the adhesive material is not present in the non-adhesive region, and the FPC is normally removed from the base plate. Can not be removed.

  The present invention has been made in view of the above problems, and has as its object to provide a technique for easily handling a circuit board when the circuit board is held by adhesion.

  The present invention is a substrate holder for holding a circuit board, comprising a main body, and a holding surface to which a circuit board is adhered on the main body, wherein the holding surface has a first degree of adhesion. It has a first adhesive holding area for holding a circuit board and a second adhesive holding area for holding the circuit board together with the first adhesive holding area at a second adhesiveness different from the first adhesiveness.

  In the present invention, the circuit board can be easily handled according to the presence or absence of the component mounted on the FPC by forming the adhesive holding region with two adhesive holding layers having different degrees of adhesion. .

(First Embodiment)
In the following, referring to FIGS. 1, 2, 3, 4, 5, 6, 6, 7, 8, 9, 10, 11, 12, and 13, the present invention will be described. The substrate holder according to the embodiment will be described. As shown in FIG. 1, the substrate holder according to the present embodiment is implemented as a pallet 1a for transporting FPCs. FIG. 2 is a cross-sectional view of the pallet 1a along II-II in FIG. As clearly shown in FIG. 2, the pallet 1a is formed of a metal such as aluminum or magnesium having a high thermal conductivity (other materials having high rigidity may be used), or a resin such as a glass epoxy resin. It has a structure in which an adhesive holding layer 12 formed of an adhesive material is adhered to a plate-shaped base plate 11 serving as a main body member. As the adhesive material, silicone rubber is preferably used when heat resistance is required, and polyurethane rubber or the like can be used when heat resistance is not required.

  The upper surface of the pallet 1a on which the adhesive holding layer 12 is formed serves as a holding surface 121 for holding an FPC, which is a flexible circuit board, with an adhesive. As shown in FIG. 1, the peripheral surface of the holding surface 121 is a first adhesive holding area 21 having a low adhesiveness, and the center has a higher adhesiveness than the first adhesive holding area 21. A second adhesive holding area 22 for holding the FPC together with the area 21 is provided. In FIG. 1, the difference in the degree of adhesion is indicated by different parallel oblique lines for convenience. Note that the degree of adhesion is a value corresponding to a load required for peeling after an object is adhered to an adhesive holding layer under predetermined conditions, and is a value indicating the degree of adhesion.

  The first adhesive holding area 21 and the second adhesive holding area 22 are provided in the same plane, and are both surfaces of the adhesive holding layer 12 and surfaces of the same adhesive material. By providing both adhesive holding regions 21 and 22 in the same plane, these adhesive holding regions 21 and 22 can be easily formed as described later. Further, it has an unprecedented effect in handling FPC.

  The difference between the adhesiveness of the first adhesive holding area 21 and the adhesiveness of the second adhesive holding area 22 is realized by making the surface roughness of the adhesive different. The relationship between the surface roughness and the degree of adhesion will be described with reference to Table 1. The same table shows that the mirror-finished aluminum material having a contact area of 1 square centimeter after the alumite treatment was pressed against the adhesive holding layer with a load of 500 g weight for about 3 seconds, and then the aluminum material was peeled off from the adhesive holding layer. The load values required at that time are shown. It can be seen from the table that the smaller the surface roughness, the higher the degree of adhesion.

  As shown in FIG. 1, a through hole 30a for positioning is formed at a corner of the pallet 1a. Further, as shown in FIGS. 1 and 2, the second adhesive holding area 22 is provided with a through hole 31 into which a push-up pin for peeling off the held FPC is inserted, and air is supplied at the time of peeling. A large number of air outlets 32 are formed as through holes. Further, through holes 30b for positioning the FPC to be held are formed near the four corners of the first adhesive holding area 21.

  FIG. 3 shows a state where the FPC 9 is held on the pallet 1a. Note that a plurality of FPC pieces 91 are collectively formed on the FPC 9. Each FPC piece 91 is mounted with an IC package (the mounting target may be various electronic components such as an IC bare chip, a capacitor, a resistor, a coil, a connector, etc., and is hereinafter collectively referred to as “electronic components”). It has a mounting area 91a. At four corners of the FPC 9, positioning holes 90 overlapping the FPC through holes 30b shown in FIG. 1 are formed. The peripheral portion of the FPC 9 overlaps the first adhesive holding region 21, and the second adhesive holding region 22 overlaps the center of the FPC 9. The through hole 31 for the push-up pin is located between the FPC pieces 91, and the air ejection port 32 is located immediately below the FPC piece 91 or between the through holes 31.

  4 and 5 show a mounting system 5 that mounts electronic components on the mounting area 91a of the FPC piece 91 while the FPC 9 is held on the pallet 1a. The mounting system 5 includes, from the upstream, a loader 51 for mounting the FPC 9 on the pallet 1a, a printing device 52 for printing solder paste on the FPC 9, a mounting device 53 for mounting electronic components on the FPC 9, and melting and solidification of the solder paste. A reflow device 54 for fixing electronic components to the FPC 9, an unloader 55 for separating the FPC 9 from the pallet 1 a, and a cleaning device 56 for cleaning the pallet 1 a are provided.

  FIG. 4 shows the loader 51, the printing device 52, the mounting device 53, and the ends of the reflow device 54. FIG. 5 shows an end of the mounting device 53, a reflow device 54, an unloader 55, and a cleaning device 56. At the approximate center of each device, a forward conveyor 61 for the pallet 1a is arranged, and at the bottom of each device, a backward conveyor 62 is arranged.

  In the loader 51, a plurality of trays 951 are stored in the storage device 95 in a state of being vertically stacked, and the FPC 9 is placed on each tray 951. The loader 51 includes an elevating mechanism 511 that moves the container 95 up and down, a protruding mechanism 512 that moves one tray 951 in and out of the container 95, a transfer mechanism 513 that extracts the FPC 9 from the protruded tray 951 by suction and suction, and a pallet. A pallet moving mechanism 514 is provided for moving 1a from the end point of the backward conveyor 62 to the start point of the forward conveyor 61.

  The holding surface 5131 of the transfer mechanism 513 that holds the FPC 9 is a flat surface having a large number of suction ports. After the transfer mechanism 513 takes out the FPC 9 from the tray 951 by suction and suction, the transfer mechanism 513 transfers the FPC 9 to the pallet 1 a on the conveyor 61. The FPC 9 is placed. At this time, while positioning is performed with reference to the through hole 30b of the pallet 1a and the hole 90 of the FPC 9, the holding surface 5131 descends and presses the entire FPC 9 toward the pallet 1a with a predetermined pressure. Thereby, the whole FPC 9 is held by the adhesive holding layer 12 of the pallet 1a by the adhesive. The pallet 1a holding the FPC 9 is conveyed to the printing device 52 by the conveyor 61.

  The printing device 52 positions and holds the pallet 1a based on the positioning through-hole 30a (see FIG. 1) (that is, by inserting a pin), and pushes up and down the pallet 1a toward the upper screen mask 522. In addition, a printing mechanism 523 that reciprocates the solder paste on the screen mask 522 with a squeegee 5231 is provided. When the printing mechanism 523 reciprocates the squeegee 5231 while the FPC 9 on the pallet 1a is in contact with the screen mask 522, the solder paste adheres to the FPC 9 from the hole formed in the screen mask 522. The FPC 9 on which the solder paste is printed descends together with the pallet 1 a and is conveyed by the conveyor 61 to the mounting device 53.

  In addition, as shown in FIG. 3, in the adhesive holding layer 12 on the pallet 1a, a region where the FPC 9 is not adhered is a first adhesive holding region 21 having a relatively low adhesiveness. Therefore, at the time of printing, the screen mask 522 is only weakly adhered to the first adhesive holding area 21, and the screen mask 522 can be easily brought into contact with and separated from the pallet 1a. Further, regardless of the layout of the FPC pieces 91, the distribution of the insulating regions on the front and back surfaces of the FPC 9 and the electrodes, and the like, the adhesive holding layer 12 is uniformly formed on the base plate 11 (more precisely, (Since the adhesive holding layer is continuously provided with a certain width or more over the entire moving range of the squeegee 5231), the deformation of the screen mask 522 due to the pressing of the squeegee 5231 can be prevented, and the print quality is reduced. Is prevented.

  The mounting device 53 includes a holding mechanism 531 for holding the pallet 1a based on the through hole 30a, and a mounting mechanism 532 for mounting an electronic component on the FPC 9 on the pallet 1a. The mounting mechanism 532 has a plurality of nozzles 5321 for sucking and sucking electronic components, and a nozzle moving mechanism 5322 for moving the nozzle 5321 in a horizontal plane and moving the nozzle 5321 up and down, and a supply mechanism (not shown on the tape or Electronic components are received from a mechanism for arranging and preparing the electronic components on the tray), and the electronic components are mounted on the solder paste on the FPC 9. The FPC 9 on which the electronic components are mounted is transported by the conveyor 61 together with the pallet 1a to the reflow device 54 shown in FIG.

  The reflow device 54 includes a heating unit 541 for preheating and main heating the FPC 9 transported by the conveyor 61 while being held on the pallet 1a, and a cooling unit 542 for cooling the FPC 9 by air. The FPC 9 is heated and cooled while being conveyed, and the solder paste is melted and solidified to fix the electronic component on the FPC 9. As shown in FIG. 3, since the entire FPC 9 is in a state of being adhered to the adhesive holding layer 12 of the pallet 1 a, even when heating by hot air or cooling by cold air is performed, a part of the FPC 9 becomes part of the adhesive holding layer. 12 is prevented from being peeled off. After the reflow, the FPC 9 is transported to the unloader 55 together with the pallet 1a.

  The unloader 55 includes a holding mechanism 551 that holds the pallet 1a, a transfer mechanism 552 that receives the FPC 9 from the pallet 1a, an elevating mechanism 553 that moves up and down a container 96 that stores the FPC 9, and a protruding mechanism that puts a tray from the container 96. (Not shown). A plurality of trays are vertically stacked in the container 96. A protruding mechanism protrudes the tray, the transfer mechanism 552 receives the FPC 9 from the pallet 1a, and places the FPC 9 on the tray. Pull it into the container 96.

  6 and 7 show how the transfer mechanism 552 receives the FPC 9 from the pallet 1a. An air flow channel 631 is formed inside the lower holding mechanism 551, and the flow channel 631 communicates with an opening 632 of the holding surface 5511 (upper surface). Further, a push-up pin 641 for separating the FPC 9 is disposed inside the holding mechanism 551, and the push-up pin 641 is pushed up from the holding surface 5511 by raising the shaft 642. The pallet 1a is held in the holding mechanism 551 by being positioned with reference to the positioning through-hole 30a (see FIG. 1), the opening 632 and the air ejection port 32 of the pallet 1a coincide, and the push-up pin 641 and the through-hole 31 (see FIGS. 1 and 2).

  A concave portion 651 for avoiding the electronic component 92 mounted on the FPC 9 is formed in the holding surface 5521 (lower surface) on the transfer mechanism 552 side, and a suction port for sucking and sucking the FPC 9 is formed in the holding surface 5521. 652 are formed, and a suction channel 653 is formed inside.

  When the transfer mechanism 552 receives the FPC 9, first, the holding surface 5521 of the transfer mechanism 552 descends and comes into contact with the FPC 9 as shown in FIG. 6, and the ejection of air from the opening 632 of the holding mechanism 551 is started. At the same time, suction is started from the suction port 652 on the transfer mechanism 552 side. Thereby, the FPC 9 is peeled to some extent from the adhesive holding layer 12 of the pallet 1a. This process is referred to as a temporary peeling process of the FPC 9.

  Next, as shown in FIG. 7, the shaft 642 of the holding mechanism 551 rises, and the push-up pin 641 pushes up the FPC 9. At this time, the holding surface 5521 of the transfer mechanism 552 rises as shown in FIG. 7 in synchronization with the movement of the push-up pin 641, and the FPC 9 is completely peeled off the pallet 1a and moves to the holding surface 5521 of the transfer mechanism 552. Adsorbed. This process is referred to as complete peeling of the FPC 9.

  By the above operation, even when the entire FPC 9 is adhered to the adhesive holding layer 12 of the pallet 1a, since most of the FPC 9 is peeled off by air, excessive force is applied to the FPC 9 by the push-up pins 641. The FPC 9 can be safely separated from the pallet 1a without acting on the pallet 1a.

  The pallet 1a from which the FPC 9 has been peeled is conveyed to the cleaning device 56 by the conveyor 61 as shown in FIG. The cleaning device 56 includes a cleaning mechanism 561 that cleans the pallet 1a, and a pallet moving mechanism 562 that moves from the end point of the forward conveyor 61 to the start point of the backward conveyor 62. The cleaning mechanism 561 draws out the cloth from the cross roll 5611 wound around the cloth to which the cleaning liquid is applied, makes the cloth abut on the adhesive holding layer 12 of the pallet 1 a with the roller 5612, and then winds the cloth around the shaft 5613. To collect. Thus, dust adhering to the adhesive holding layer 12 is removed. The cleaned pallet 1a moves down to the conveyor 62 by the pallet moving mechanism 562, is conveyed from the cleaning device 56 to the loader 51, and moves to the conveyor 61 by the pallet moving mechanism 514 of the loader 51.

  As described above, since the pallet 1a holds the entire FPC 9 with adhesive force, it is possible to prevent the FPC 9 from peeling off the pallet 1a when mounting electronic components. Also, a first adhesive holding area 21 that holds the periphery of the FPC 9 with a low adhesiveness, a second adhesive holding area 22 that holds the central part of the FPC 9 with a higher adhesiveness than the first adhesive holding area 21, Thereby, screen printing can be easily performed. Further, the mounted FPC 9 can be safely separated from the pallet 1a by using the ejection of air. As a result, by using the pallet 1a, it is possible to easily handle the FPC 9 on the entire mounting line.

  Next, a method of manufacturing the pallet 1a will be described. FIG. 8 shows a flow of the manufacturing process of the pallet 1a, and FIGS. 9 and 10 show how the pallet 1a is manufactured. As described above, in the first adhesive holding area 21 and the second adhesive holding area 22 of the adhesive holding layer 12 of the pallet 1a, a difference in the degree of adhesion is realized due to a difference in surface roughness. Therefore, as shown in FIG. 9, a mold 71 reflecting the surface roughness of these areas is prepared and attached to a press device 72. In FIG. 9, a range indicated by reference numeral 711 indicates a region corresponding to the first adhesive holding region 21, and a range indicated by reference numeral 712 indicates a region corresponding to the second adhesive holding region 22. The press device 72 is provided with a heater 73, and the die 71 is heated by the heater 73 in advance (step S11).

  Thereafter, the adhesive material 12a is placed on the base plate 11 (Step S12). In addition, the adhesive material 12a may be configured by, for example, a rubber sheet, or may be configured by applying an adhesive material. Then, as shown in FIG. 10, the adhesive material 12a is heated and pressed by the mold 71 at a predetermined temperature and force for a fixed time, and the uneven pattern on the surface of the mold 71 is transferred to the adhesive material 12a. Then, the adhesive holding layer 12 having the first adhesive holding area 21 and the second adhesive holding area 22 is formed (Step S13). Thereby, the adhesion holding layer 12 having the regions having different degrees of adhesion can be easily formed. Note that a mechanism for forming various holes of the pallet 1a simultaneously with the formation of the adhesive holding layer 12 may be incorporated in the mold 71.

  Next, a method of manufacturing the mold 71 having the concavo-convex pattern corresponding to the first adhesive holding area 21 and the second adhesive holding area 22 will be described. FIG. 11 is a view showing a flow of a process of manufacturing the mold 71 (a typical example, which is appropriately changed as described later), and FIGS. 12 and 13 are views showing a manner in which the mold 71 is manufactured. It is.

  First, a mirror surface is formed on the base member 70 of the mold 71 as the basis of the pressing surface (step S21). Next, as shown in FIG. 12, a metal mask member 709 is installed facing the pressing surface 708 (step S22). The mask member 709 has an opening only in a region corresponding to the second adhesive holding region 22. Thereafter, small particles having a predetermined particle size are projected toward the pressing surface 708 at a predetermined speed as shown by an arrow 81 using a shot blasting device (step S23).

  When the first shot blast is completed, the mask member 709 is replaced with another mask member 713 as shown in FIG. 13 (step S24). The mask member 713 has an opening only in a region corresponding to the first adhesive holding region 21. Then, small particles having a larger particle diameter than the first shot blast are projected toward the pressing surface 711708 at a predetermined speed as shown by an arrow 82 (step S25). Thus, an uneven pattern having a larger surface roughness than the area corresponding to the second adhesive holding area 22 is formed in the area on the pressing surface 708 corresponding to the first adhesive holding area 21. In step S25, a projection / recess pattern having a depth different from that in step S23 may be formed by projecting small particles having the same particle diameter as in step S23 at different projection speeds.

  By using the shot brass as described above, a plurality of regions having different surface roughness can be easily formed on the pressing surface 708.

  If the second adhesive holding area 22 having a high adhesiveness is a mirror surface, steps S22 and S23 may be omitted. Further, when the pressing surface 708 is formed in step S21, irregularities corresponding to the surface roughness of the second adhesive holding region 22 may be formed, and steps S22 and S23 may be omitted. Further, when three or more types of regions having different surface roughnesses are formed, steps S24 and S25 may be repeated.

  It is also preferable to use chemical etching as a technique for easily forming regions having different surface roughness on the pressing surface 708. In this case, first, the pressing surface 711 of the mirror surface is formed, and then, an uneven pattern having predetermined characteristics is formed on the pressing surface 708 by chemical etching. In addition, the surface roughness of the pressing surface 708 is appropriately determined by providing an uneven pattern having predetermined characteristics on the surface of the adhesive holding layer for adjusting the adhesive force.

(Second embodiment)
Hereinafter, a substrate holder according to the second embodiment of the present invention will be described with reference to FIG. 14, FIG. 15, and FIG. As shown in FIG. 14, the substrate holder according to the present embodiment is also configured as a pallet 1b similarly to the substrate holder according to the first embodiment. However, the pallet 1b according to the present embodiment individually holds a plurality of FPC pieces, and includes a first adhesive holding area 21 having a low adhesiveness and a second adhesive holding area 22 having a relatively high adhesiveness. Has multiple combinations.

  In FIG. 14, the surface of the base plate 11 is exposed in a region not provided with parallel diagonal lines, and the adhesive holding layer is formed only on the first adhesive holding region 21 and the second adhesive holding region 22 provided with parallel diagonal lines. I have. Further, as shown in FIG. 14, a plurality of through holes 31 into which protrusion pins are inserted are formed in the first adhesive holding area 21, and a plurality of air outlets 32 are formed in the second adhesive holding area 22. .

  FIG. 15 shows the appearance of the FPC pieces 91 held on the pallet 1b. The FPC piece 91 has a shape in which the lead portion 912 protrudes from the mounting portion 911. The mounting portion 911 has a mounting region 91b in which an IC package is mounted and a mounting region 91c in which a resistor, a capacitor, and the like are mounted. Is set.

  FIG. 16 shows a state in which a plurality of FPC pieces 91 are adhesively held on the pallet 1b. As shown in FIG. 16, the mounting portion 911 of the FPC piece 91 is held in a region where the two second adhesive holding regions 22 are included in the first adhesive holding region 21 (that is, a region surrounded by the first adhesive holding region 21). The tip of the portion 912 is held in the small second adhesive holding area 22.

  The manner in which electronic components are mounted on the FPC pieces 91 using the pallet 1b is the same as that of the pallet 1a shown in FIG. 1 except that a plurality of FPC pieces 91 are held on the pallet 1b. is there. By using the pallet 1b, almost the entirety of the plurality of FPC pieces 91 is held by adhesion, and it is possible to prevent the FPC pieces 91 from peeling off the pallet 1b when mounting electronic components. In particular, since the lead portion 912 is held in the second adhesive holding region 22 having a high degree of adhesion, peeling of the FPC piece 91 from the lead portion 912 is prevented. In addition, since most of the region where the FPC pieces 91 are not held do not have adhesiveness, screen printing can be easily performed.

  By the way, in the pallet 1b, a through hole 31 for a push-up pin is provided in the first adhesive holding area 21, and an air outlet 32 is provided in the second adhesive holding area 22. As a result, when the FPC pieces 91 are peeled from the pallet 1b, first, when air is blown out from the air outlet 32, peeling occurs in most of the second adhesive holding area 22 having a high adhesiveness. Thereafter, by mechanically peeling off the first adhesive holding area 21 having a low degree of adhesiveness using a push-up pin, the FPC pieces 91 can be smoothly peeled off without applying an excessive force to the FPC pieces 91. As a result, easy peeling of the FPC pieces 91 is realized while the second adhesive holding area 22 has a degree of adhesion that reliably holds the FPC pieces 91.

  Further, the mounting portion 911 of the FPC piece 91 is held by the first adhesive holding region 21 and the second adhesive holding region 22 existing in one region of the adhesive material, and the second adhesive holding region 22 is formed by the first adhesive holding region 22. Since the FPC pieces 91 are included in the holding area 21, the FPC pieces 91 can be smoothly peeled off from the peripheral portion (the same applies to the pallet 1 a in FIG. 1). Furthermore, since the first adhesive holding area 21 and the second adhesive holding area 22 exist in one area of the adhesive material without interposing a gap, the mounting portion 911 can be held stably. In addition, also in the case of the pallet 1a of FIG. 1, the entire upper surface can be regarded as one region of the adhesive material. As described above, the two adhesive holding regions having different degrees of adhesiveness are successively arranged on the same plane, so that the FPCs can be held with different adhesive forces without being deformed. Therefore, electronic components and the like can be stably mounted on the FPC portion located on the boundary between the two adhesive holding regions.

  The method for manufacturing the pallet 1b and the mold used for manufacturing the pallet 1b and the method for manufacturing the mold are shown in FIG. 1 except that the adhesive holding layer is provided on a part of the surface of the base plate 11. This is the same as the case of the pallet 1a.

(Third embodiment)
FIG. 17 illustrates a substrate holder according to a third embodiment of the present invention. As shown in FIG. 17, in the present embodiment, the substrate holder is configured as a pallet 1c. The pallet 1c has a base plate 11 and an adhesive holding layer 12, similarly to the pallet 1a shown in FIG. However, a step is provided on the holding surface 121, and the area with a high step is the first adhesive holding area 21 with a low adhesiveness, and the area with a low step is the second adhesive holding with a relatively high adhesiveness. This is an area 22. In addition, the high step area may be provided in a convex shape in the low step area, and the high step area and the low step area may be alternately provided in a strip shape.

  As in the case of the pallet 1b shown in FIG. 14, a through-hole 31 into which the push-up pin 641 is inserted is formed in the first adhesive holding area 21, and an air outlet 32 is formed in the second adhesive holding area 22. Have been. The second adhesive holding area 22 also has a through hole 31 into which the push-up pin 641 is inserted.

  The FPC 9 held by the pallet 1c has a reinforcing member 93 adhered to the back surface (the surface facing the pallet 1c) opposite to the surface on which the electronic components 92 are mounted, and the thickness of the reinforcing member 93 is maintained. It is made equal to the step of the surface 121. Thereby, the FPC 9 is held on the pallet 1c without being affected by the reinforcing member 93. Further, almost the entire FPC 9 is held by the pallet 1c by adhesion, thereby preventing the FPC 9 from peeling off the pallet 1c when mounting electronic components. Further, when the FPC 9 is peeled, air is blown out from the air outlet 32, and peeling occurs in a large part of the second adhesive holding region 22 having high adhesiveness, and thereafter, mechanical peeling is performed with a push-up pin. Thereby, the FPC 9 can be peeled off smoothly without applying excessive force.

  In addition, in order to avoid the reinforcing member 93, the adhesiveness inside the concave portion formed on the pallet 1c and the adhesiveness outside the concave portion are appropriately set according to the handling method of the FPC 9 and the strength characteristics of the FPC 9. For example, when it is necessary to completely prevent the FPC 9 from being peeled off during mounting, the adhesiveness of a region with a high step corresponding to the peripheral portion of the FPC 9 is set to be relatively high. In addition, if a dent of the push-up pin 641 remains on the FPC 9 when the reinforcing member 93 is strongly adhered, the degree of adhesion is set to be low in a region with a low step (that is, in the concave portion). Therefore, in some cases, unlike the example illustrated in FIG. 17, the area facing the reinforcing member 93 may be the first adhesive holding area 21, and the other area may be the second adhesive holding area 22.

  The method of manufacturing the pallet 1c, the mold used for the manufacturing, and the method of manufacturing the mold are the same as those of the pallet 1a shown in FIG. 1 except that the step of the holding surface 121 is considered.

(Fourth embodiment)
FIG. 18 illustrates a substrate holder according to a fourth embodiment of the present invention. As shown in FIG. 18, in the present embodiment, the substrate holder is configured as a pallet 1d. The pallet 1d has a relationship between the first adhesive holding area 21 and the second adhesive holding area 22 reversed as compared with the pallet 1a shown in FIG. The first adhesive holding area 21 having low adhesiveness is included. However, the portion of the second adhesive holding area 22 that protrudes from the FPC 9 is minimized so that the screen mask is not strongly adhered to the pallet 1d when printing the solder paste.

  In the pallet 1d, it is possible to remarkably reduce the peeling of the periphery of the FPC 9 from the adhesive holding layer 12 at the time of reflow, and it is possible to easily handle the FPC 9 at the time of reflow. As described above, whether to increase or decrease the adhesiveness of the adhesive holding area corresponding to the peripheral portion of the FPC 9 is appropriately determined according to the characteristics of the FPC 9 and the purpose of what kind of processing the FPC 9 is to be held. You.

  The method of manufacturing the pallet 1d, the mold used for the manufacture, and the method of manufacturing the mold are the same as those of the pallet 1a described above.

(Fifth embodiment)
FIG. 19 illustrates a substrate holder according to a fifth embodiment of the present invention. As shown in FIG. 19, in the present embodiment, the substrate holder is configured as a pallet 1e. As shown in FIG. 19, in the pallet 1e, the surface of the base plate 11 is flat, but a step is provided on the holding surface 121 of the adhesive holding layer 12, similarly to the pallet 1c shown in FIG. An area with a low step is a first adhesive holding area 21 with a low degree of adhesion, and an area with a high step is a second adhesion holding area 22 with a relatively high degree of adhesion. That is, the first adhesive holding area 21 and the second adhesive holding area 22 are integrally formed. When the pallet 1e is observed from above, the first adhesive holding area 21 is the bottom surface of the concave portion surrounded by the second adhesive holding area 22.

  As in the case of the pallet 1c shown in FIG. 17, the first adhesive holding area 21 and the second adhesive holding area 22 are formed with through holes 31 into which the push-up pins are inserted. Is also formed with an air ejection port 32. A reinforcing member 93 is adhered to the back surface of the FPC 9 held by the pallet 1e on the opposite side to the surface on which the electronic components 92 are mounted. The thickness of the reinforcing member 93 is made equal to the step of the holding surface 121. Thereby, the FPC 9 is held on the pallet 1e without being affected by the reinforcing member 93, and for example, the print quality of the solder is improved. In addition, the pallet 1e holds almost the entire FPC 9 with adhesive, thereby preventing the FPC 9 from peeling off the pallet 1e when mounting electronic components.

  In the pallet 1e, when the FPC 9 is peeled off, air is blown out from the air outlet 32 to cause peeling in most of the first adhesive holding area 21, and thereafter, mechanical peeling is performed with a push-up pin. Accordingly, the FPC 9 can be peeled off smoothly without applying excessive force. Further, since the second adhesive holding region 22 surrounds the first adhesive holding region 21 which is the bottom surface of the concave portion, the entire outer edge portion of the FPC 9 is held by the second adhesive holding region 22 having high adhesiveness. Peeling is prevented.

  FIG. 20 shows how the pallet 1e is manufactured by the mold 71. The mold 71 has a step between an area 711 corresponding to the first adhesive holding area 21 and an area 712 corresponding to the second adhesive holding area 22, and the area 711 corresponds to the first adhesive holding area 21. An uneven pattern is formed. In the area 712, an uneven pattern corresponding to the second adhesive holding area 22 (that is, an uneven pattern having a smaller surface roughness than the area 711) is formed.

  At the time of manufacturing the pallet 1e, an adhesive material 12a having a constant thickness is adhered on the base plate 11 and then pressed by a mold 71, so that the first adhesive holding area 21 and the second adhesive The concavo-convex pattern of the holding region 22 and the step between these regions are simultaneously formed.

(Sixth embodiment)
FIG. 21 illustrates a substrate holder according to a sixth embodiment of the present invention. As shown in FIG. 21, in the present embodiment, the substrate holder is configured as a pallet 1f. In the pallet 1f, a step is provided on the holding surface 121 of the adhesive holding layer 12, and a region having a high step is a first adhesive holding region 21 having a low degree of adhesion, and a region having a low step is relatively having a low degree of adhesion. The second adhesive holding area 22 is higher. When the pallet 1f is observed from above, the second adhesive holding area 22 surrounds the first adhesive holding area 21, and the first adhesive holding area 21 is the upper surface of a portion protruding from the second adhesive holding area 22.

  As in the case of the pallet 1e shown in FIG. 19, the first adhesive holding area 21 and the second adhesive holding area 22 are formed with through holes 31 into which protrusion pins are inserted. An air outlet 32 is also formed in the first adhesive holding area 21. A reinforcing member 93 is adhered to the FPC 9 held on the pallet 1f along substantially the entire periphery of the outer edge, and the thickness of the reinforcing member 93 is made equal to the step of the holding surface 121. Thus, the FPC 9 is held on the pallet 1f without being affected by the reinforcing member 93. In addition, the pallet 1f holds almost the entire FPC 9 with an adhesive, thereby preventing the FPC 9 from peeling off the pallet 1f when mounting electronic components.

  Also, when the FPC 9 is peeled off from the pallet 1f, air is blown out from the air outlet 32 to cause peeling in most of the first adhesive holding area 21, and thereafter, mechanical peeling is performed with a push-up pin. Accordingly, the FPC 9 can be peeled off smoothly without applying excessive force. In addition, since the second adhesive holding area 22 surrounds the first adhesive holding area 21 which is the upper surface of the projection, the entire outer edge of the FPC 9 is held by the second adhesive holding area 22 having a high adhesiveness. Is prevented from peeling off.

  The method of manufacturing the pallet 1f is the same as the method described with reference to FIG. 20 except that the step of the pressing surface of the mold is different. By pressing, the concavo-convex pattern of the first adhesive holding area 21 and the second adhesive holding area 22 and the step between these areas are simultaneously formed on the adhesive material 12a.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.

  For example, the pallets 1a to 1f are suitable for holding a flexible circuit board, but the held circuit board is a highly rigid plate-shaped circuit board (for example, a circuit board formed of glass epoxy or semiconductor). It may be.

  The holding of the circuit board by adhesion is not only applied to the pallets 1a to 1f for transportation, but also can be used as a board holder in various aspects of handling the circuit board. Of course, the above-described adhesive holding method can be used in fields other than the mounting of electronic components using a solder paste, an anisotropic conductive resin, or the like, for example, when holding a circuit board when processing the circuit board.

  In the pallets 1a to 1f in the above embodiment, an adhesive material is provided on the base plate 11. For example, the substrate holder can be manufactured by processing an adhesive member. In this case, there is no adhesive holding layer, and the member serving as the main body of the substrate holder and the member provided with the holding surface are the same member.

  The first adhesive holding area 21 and the second adhesive holding area 22 may be different adhesive material surfaces. However, in order to easily form the first adhesive holding area 21 and the second adhesive holding area 22, it is preferable that these areas are surfaces of the same adhesive material. In the above embodiment, only two adhesive holding regions are exemplified, but three or more types of adhesive holding regions may be used. Furthermore, the boundaries between these adhesive holding regions need not be clearly present, and for example, a holding surface in which the adhesiveness changes gradually may be formed so that the adhesiveness differs for each position.

  In the above embodiment, the adhesiveness is adjusted by the surface roughness, but the adjustment of the adhesiveness involves changing the shape of the unevenness of the adhesive surface (for example, a sharp convex shape or a rounded convex shape). May be changed. That is, the adhesiveness may be changed by making the characteristics of the unevenness pattern for adjusting the adhesiveness different.

  Further, the adhesive material is not limited to silicone rubber or polyurethane rubber, and other materials may be used. Other preferred materials include, for example, fluoro rubber. Since fluororubber has a high mold release property, in actual use, the surface is processed into a mirror surface to improve the adhesiveness (or adhesion). Then, for example, the degree of adhesion of the surface of the fluororubber is adjusted by forming fine grooves on the mirror surface. When silicon rubber is used, siloxane acid gas is generated by heating, which may affect the circuit board due to the deposition of insulating siloxane acid.However, the use of fluororubber generates siloxane acid. Can be prevented.

  The present invention can be applied to an automation manufacturing line that automatically mounts electronic components and the like on a sheet-shaped flexible printed circuit board.

FIG. 2 is a plan view of the pallet according to the first embodiment of the present invention. II-II sectional view of the pallet shown in FIG. FIG. 2 is a plan view showing a state in which the FPC is held on the pallet shown in FIG. Front view of a part of a mounting system for mounting components on a pallet according to an embodiment of the present invention. Front view of a part different from the part shown in FIG. 4 of the mounting system for mounting components on a pallet according to an embodiment of the present invention. Explanatory drawing of the temporary peeling process when the transfer mechanism shown in FIG. 5 receives an FPC from a pallet FIG. 4 is an explanatory view of the complete chestnut processing when the transfer mechanism shown in FIG. 4 receives the FPC from the pallet. The flowchart which shows the manufacturing process of the pallet shown in FIG. Explanatory drawing of the manufacturing method of the pallet shown in FIG. Explanatory drawing of the manufacturing method of the pallet shown in FIG. 1 like FIG. 9 is a flowchart showing a manufacturing process of the mold shown in FIGS. 9 and 10. Explanatory drawing of the manufacturing method of the metal mold shown in FIG. 9 and FIG. Explanatory drawing of the manufacturing method of the metal mold | die shown in FIG. 9 and FIG. 10 like FIG. A plan view of a pallet according to a second embodiment of the present invention. FIG. 14 is a plan view of an FPC piece held on the pallet shown in FIG. 14. FIG. 14 is a plan view showing a state where a plurality of FPC pieces shown in FIG. 15 are held on the pallet shown in FIG. Sectional view of a pallet according to a third embodiment of the present invention. A plan view of a pallet according to a fourth embodiment of the present invention. Sectional view of a pallet according to a fifth embodiment of the present invention. Explanatory drawing of the manufacturing method of the pallet shown in FIG. Sectional view of a pallet according to a sixth embodiment of the present invention.

Explanation of reference numerals

1a, 1b, 1c, 1d, 1e, 1f Pallet 9 FPC
11 Base plate 12 Adhesive holding layer 12a Adhesive material 21 First adhesive holding area 22 Second adhesive holding area 31 Through hole 32 Air outlet 71 Mold 91 FPC piece 121 Holding surface 641 Raised pin 708 Pressing surface 709 713 Mask member S12, S13, S21 to S25 Step

Claims (24)

A board holder for holding a circuit board,
The main body,
A holding surface to which a circuit board is adhered on the main body,
With
The holding surface is
A first adhesive holding area for holding the circuit board at a first degree of adhesion;
A second adhesive holding area that holds the circuit board together with the first adhesive holding area at a second adhesiveness different from the first adhesiveness;
A substrate holder comprising: The substrate holder according to claim 1, wherein
Further comprising an adhesive material provided on the main body,
A substrate holder, wherein the first adhesive holding area and the second adhesive holding area are surfaces of the adhesive material. The substrate holder according to claim 2, wherein
The substrate holder, wherein the first adhesive holding area and the second adhesive holding area are present in one area of the adhesive material provided on the main body. The substrate holder according to claim 2, wherein:
The adhesive material corresponding to the first adhesive holding region and the adhesive material corresponding to the second adhesive holding region are the same material, and the surface of the first adhesive holding region and the surface of the second adhesive holding region are the same. A substrate holder characterized by having different irregularities. The substrate holder according to claim 4, wherein
A substrate holder, wherein the first adhesive holding area and the second adhesive holding area have different surface roughness. The substrate holder according to claim 1, wherein:
A substrate holder, wherein the first adhesive holding area and the second adhesive holding area are provided in one plane. The substrate holder according to claim 1, wherein:
A substrate holder, wherein a step is provided between the first adhesive holding area and the second adhesive holding area. The substrate holder according to claim 7, wherein:
A substrate holder, wherein one of the first adhesive holding area and the second adhesive holding area surrounds the other area, and the other area protrudes from the one area. The substrate holder according to claim 7, wherein:
A substrate holder, wherein a bottom surface of a concave portion surrounded by one of the first adhesive holding area and the second adhesive holding area is the other area. The substrate holder according to claim 1, wherein:
The substrate holder, wherein the first adhesiveness is lower than the second adhesiveness, and the first adhesive holding region includes the second adhesive holding region. The substrate holder according to claim 1, wherein:
The first adhesiveness is lower than the second adhesiveness,
A substrate holder, wherein a through hole into which a pin for removing a circuit board is inserted is formed in the first adhesive holding region. The substrate holder according to claim 11, wherein
A substrate holder, wherein an air ejection port is provided in the second adhesive holding area. The substrate holder according to claim 1, wherein:
The substrate holder, wherein the first adhesiveness is lower than the second adhesiveness, and the second adhesive holding region includes the first adhesive holding region. The substrate holder according to claim 1, wherein:
The substrate holder, wherein the holding surface has a plurality of combinations of the first adhesive holding area and the second adhesive holding area. A board holder for holding a flexible circuit board,
The main body,
An adhesive material provided on the main body and to which the circuit board is adhered,
With
A substrate holder, wherein an uneven pattern for adjusting the degree of adhesion is formed on a surface of the adhesive material. The substrate holder according to claim 2, wherein:
The substrate holder, wherein the adhesive material is silicon rubber, polyurethane rubber or fluorine rubber.   The substrate holder according to any one of claims 1 to 16, wherein the substrate holder is used as a pallet for transporting a circuit board. A method of manufacturing a board holder for holding a circuit board,
A step of placing an adhesive material on the main body member,
A step of pressing the adhesive material while heating the mold on which the irregularity pattern for adjusting the adhesiveness is formed,
A method for manufacturing a substrate holder, comprising: A method for manufacturing a substrate holder according to claim 18, wherein
A method for manufacturing a substrate holder, wherein the mold has a region where a first concave-convex pattern is formed and a region where a second concave-convex pattern is formed. A method for manufacturing a substrate holder according to claim 19,
A method for manufacturing a substrate holder, wherein the mold has a step between a region where the first concave-convex pattern is formed and a region where the second concave-convex pattern is formed. A method of manufacturing a mold used when forming a concave and convex pattern for adhesiveness adjustment on an adhesive material having a substrate holder for holding a circuit board,
Forming a pressing surface of the mold;
Projecting small particles toward the pressing surface,
A method for manufacturing a mold, comprising: A method for manufacturing a mold according to claim 21,
A method for manufacturing a mold, further comprising a step of installing a mask member facing the pressing surface before the step of projecting the small particles. It is a manufacturing method of the metal mold according to claim 21 or 22,
After the step of projecting the small particles,
Installing a mask member facing the pressing surface,
Projecting other small particles toward the pressing surface through the mask member,
The method for manufacturing a mold, further comprising: A method of manufacturing a mold used when forming a concave and convex pattern for adhesiveness adjustment on an adhesive material having a substrate holder for holding a circuit board,
Forming a pressing surface of the mold;
A step of forming a concavo-convex pattern on the pressing surface by chemical etching,
A method for manufacturing a mold, comprising:

Images