JP2011224790A - Cleaning device of mask, solder printing machine and cleaning method of mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning device of a mask, solder printing machine and cleaning method of the mask, which sufficiently clean the whole undersurface of the mask including side areas of a projection part.SOLUTION: A nozzle part 31 moving relatively for the mask 4 is provided with a paper member pressing part 32 having two facing walls 32a opposite to the relative moving direction for the mask 4 of the nozzle part 31 and an intermediate member 33 provided between two walls 32a of the paper member pressing part 32. The intermediate member 33 is provided with a notch 33k which slips through the projection part 4a when passing through the projection part 4a.

Description

  The present invention relates to a mask cleaning device, a solder printer, and a mask cleaning method having protrusions fitted from above into an opening of a substrate.

  In a semiconductor element that generates a large amount of heat during operation, such as a power FET (Field Effect Transistor) used in a transmission amplifier of a mobile phone base station, a semiconductor element is provided to efficiently dissipate the heat. A heat sink called a heat sink is attached to a substrate to be mounted, and the semiconductor element and the heat sink are brought into contact with each other through a copper plate as a spacer.

  Thus, in a semiconductor element structure composed of a semiconductor element, a substrate, a copper plate, and a radiator, conventionally, after disposing a radiator on the lower surface side of the substrate, the semiconductor element is inserted into the opening provided in the substrate from above, The copper plate is interposed between the lower surface of the semiconductor element and the radiator, and then the semiconductor element, the substrate, the copper plate, and the radiator are integrally joined by a screw. If it is stopped, the central part of the package of the semiconductor element may be warped and damaged by thermal stress due to the difference in thermal expansion coefficient of each component, etc., so the semiconductor on the copper plate on the upper surface of the radiator attached to the lower surface of the board A structure in which elements are joined with solder is considered. In this case, since it is necessary to supply (print) the solder into the opening provided in the substrate, the mask is provided with a protrusion that protrudes downward and fits into the opening of the substrate from above. A type in which a solder supply path into the opening of the substrate is formed is used.

  Further, if the solder residue remains on the lower surface of the mask, the printing accuracy of the next solder printing may be deteriorated. Therefore, the lower surface of the mask needs to be periodically cleaned by a cleaning device. 2. Description of the Related Art Conventionally, a cleaning device masks a paper member by a paper member pressing portion that has two wall portions extending upward from a base portion that is provided so as to be relatively movable with respect to the mask and facing the relative movement direction of the base portion with respect to the mask. The solder adhered to the lower surface of the mask is wiped off by pressing the lower surface of the mask and moving the base portion relative to the mask in that state (for example, Patent Document 1).

JP 2004-66832 A

  However, when the conventional cleaning device is used to clean a mask having a protrusion that fits into the opening of the substrate from above, the two wall portions of the paper member pressing portion pass through the protrusion of the mask. When you do this, it rides on the projecting part, and the part other than the projecting part is lifted from the lower surface of the mask, so the solder attached to the projecting part can be cleaned sufficiently, but the side area of the projecting part (cleaning) There is a problem that the solder adhering to the side area in the direction orthogonal to the relative movement direction with respect to the mask of the apparatus cannot be sufficiently cleaned.

  Accordingly, an object of the present invention is to provide a mask cleaning device, a solder printer, and a mask cleaning method that can sufficiently clean the entire lower surface of the mask including the side region of the protrusion.

  The cleaning device according to claim 1, wherein a base portion that is relatively moved in a direction parallel to the mask with respect to the mask having a protrusion fitted into the opening of the substrate from above, and extends upward from the base portion. A paper member pressing portion provided with two wall portions opposed to each other in the relative movement direction of the base portion with respect to the mask, and perpendicular to the relative movement direction of the base portion with respect to the mask between the two wall portions of the paper member pressing portion. An intermediate member provided extending in the direction of the paper, a paper member pressed against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion, and a paper member by the two wall portions and the intermediate member of the paper member pressing portion Solder adhered to the lower surface of the mask is removed by moving the base part relative to the mask with the surface pressed against the lower surface of the mask. And a base portion moving means for wiped wood, the intermediate member is provided with a notch causes slip through the protruding portion of the mask when the paper member pressing portion moves relative to the mask.

  The solder printing machine according to claim 2, wherein the semiconductor element mounting opening provided so as to penetrate in the thickness direction and the heat dissipation for cooling the semiconductor element provided covering the lower region including the opening are provided. A solder printing machine for printing solder in the opening of a substrate provided with a container, the mask having a protrusion fitted into the opening of the substrate from above, and the protrusion of the mask on the opening of the substrate Solder supplying means for supplying solder into the solder supply path of the mask that connects the upper surface of the mask and the opening of the substrate in a state of being fitted from above, and the solder supply into the solder supply path of the mask by the solder supplying means After the supply is completed, the mask cleaning device includes a separating unit that relatively separates the substrate and the mask, and a mask cleaning device, and the mask cleaning device has a protrusion that fits into the opening of the substrate from above. Parallel to the mask A base part that is relatively moved in the direction, a paper member pressing part that extends upward from the base part, and has two wall parts facing the relative moving direction of the base part with respect to the mask, and the paper member pressing part An intermediate member provided between the two wall portions so as to extend in a direction orthogonal to the relative movement direction of the base portion with respect to the mask, and a paper member pressed against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion. And by moving the base portion relative to the mask while the paper member is pressed against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion, the solder attached to the lower surface of the mask is applied to the paper member. A base part moving means for wiping off, and the intermediate member moves relative to the mask with the paper member pressing part. With a cut-out portion to let slip through the protruding portion of the mask to come.

  According to a third aspect of the present invention, there is provided a mask cleaning method comprising: a base portion that is relatively moved in a direction parallel to the mask with respect to a mask having a protrusion that fits into the opening of the substrate from above; A paper member pressing portion having two wall portions provided extending and facing in the relative movement direction of the base portion with respect to the mask, and a relative movement direction of the base portion with respect to the mask between the two wall portions of the paper member pressing portion. An intermediate member provided extending in a direction orthogonal to the paper, a paper member pressed against the lower surface of the mask by the two wall portions of the paper member pressing portion and the intermediate member, and the intermediate member has the paper member pressing portion on the mask. A cleaning method for a mask by a cleaning device having a notch for passing through the protrusion of the mask when moving relative to the mask. In the state where the paper member is pressed against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion, and the paper member is pressed against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion. A step of wiping the solder attached to the lower surface of the mask with a paper member by moving the base portion relative to the mask, and when the intermediate member passes through the protruding portion of the mask, the protruding portion is provided on the intermediate member. By passing through the notch, the side area in the direction perpendicular to the direction of relative movement of the protrusion on the lower surface of the mask with respect to the mask of the cleaning device is cleaned by the paper member pressed against the lower surface of the mask by the intermediate member. It was made to be.

  In the present invention, a paper member pressing portion having two wall portions opposed to each other in the relative movement direction of the base portion to the mask on the base portion relatively moved with respect to the mask, and two wall portions of the paper member pressing portion are provided. The intermediate member is provided with an intermediate member, and the intermediate member is provided with a notch for passing through the protrusion when passing through the protrusion. The member does not float from the lower surface of the mask, and the solder adhering to the side area of the protrusion on the lower surface of the mask is wiped off by the paper member pressed against the intermediate member. For this reason, the solder attached to the protruding portion can be wiped off by the paper member pressed by the two wall portions, and the solder attached to the side area of the protruding portion can be wiped off by the paper member pressed by the intermediate member. The entire lower surface of the mask including the side region of the part can be sufficiently cleaned.

The figure which shows schematic structure of the solder printer in one embodiment of this invention BRIEF DESCRIPTION OF THE DRAWINGS (a) Top view (b) Side sectional view of a substrate on which solder is printed by a solder printer in an embodiment of the present invention BRIEF DESCRIPTION OF THE DRAWINGS (a) Top view (b) Side sectional view of a mask provided in a solder printer according to an embodiment of the present invention BRIEF DESCRIPTION OF THE DRAWINGS (a) Perspective view (b) Partial side sectional view of a cleaning device provided in a solder printer according to an embodiment of the present invention (A) (b) (c) (d) The figure explaining the execution procedure of the solder printing process by the solder printer in one embodiment of this invention (A) (b) (c) (d) The figure explaining the execution procedure of the semiconductor element attachment process by the electronic component mounting machine in one embodiment of this invention (A) (b) (c) (d) (e) The figure explaining the execution procedure of the cleaning process which wipes off the solder adhering to the lower surface of a board | substrate with the cleaning apparatus with which the solder printer in one embodiment of this invention is equipped.

  Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, a solder printer 1 according to the present embodiment includes a transport conveyor 3 including a pair of belt conveyors 3 a for transporting and positioning a substrate 2, and a metallic flat plate provided horizontally above the transport conveyor 3. A mask 4 for solder printing, a solder supply head 5 as a solder supply means provided above the mask 4, and a lower surface of the mask 4 are contacted from below to perform cleaning of the mask 4 after execution of solder printing by the solder printer 1. A cleaning device 6 is provided. Hereinafter, for convenience of explanation, a direction in the horizontal plane that is perpendicular to the plane of FIG. 1 is the X-axis direction, and is a direction in the horizontal plane that is orthogonal to the X-axis direction and the horizontal direction of the plane of FIG. Are the Y-axis direction and the vertical direction, and the vertical direction of the paper surface of FIG. 1 is the Z-axis direction.

  2 (a) and 2 (b), a rectangular shape in which a semiconductor element such as a power FET is attached to a central portion of the substrate 2 by a component mounting machine (not shown) installed on the downstream side of the solder printer 1 is shown. The heat sink 12 as a radiator that covers the opening 11 from below is attached to the lower surface of the substrate 2. The heat sink 12 is for cooling a semiconductor element attached to the substrate 2 by a component mounting machine, and the opening 11 of the substrate 2 is viewed from above through a copper plate 13 as a spacer provided on the upper surface of the heat sink 12. It is in contact with the lower surface of the semiconductor element mounted through. In addition, the board | substrate 2 and the heat sink 12, and the heat sink 12 and the copper plate 13 are previously joined by solder, an adhesive agent, etc., respectively.

  3 (a) and 3 (b), the mask 4 is formed of a flat plate-like member whose four sides are supported by a frame member 4w, and has a protruding portion 4a protruding downward on the lower surface of the central portion thereof. . The protrusion 4 a is formed in a size and shape that can be fitted into the opening 11 of the substrate 2 from above when the lower surface of the mask 4 is brought into contact with the upper surface of the substrate 2.

  A solder supply path 4h extending through the mask 4 including the protrusion 4a in the thickness direction (vertical direction) is provided at a position where the protrusion 4a of the mask 4 is provided. In a state where the mask 4 is in contact with the protrusion 4a and the opening 11 of the substrate 2 is fitted from above, the upper surface of the mask 4 and the inside of the opening 11 of the substrate 2 are communicated by the solder supply path 4h. In addition, it is preferable that the mask 4 and the protrusion part 4a are comprised from the same metallic material (for example, stainless steel).

  In FIG. 1, the solder supply head 5 has two guide members 5 a opposed to the Y-axis direction at the lower part thereof, and in a horizontal plane direction (XY plane direction) and a vertical direction (Z-axis direction) with respect to the mask 4. ) Is movably provided. Each guide member 5a is formed of a “spar” -like member extending in the X-axis direction, and the solder Sd supplied (pressed) downward from the solder cartridge 5b built in the solder supply head 5 is an object on the mask 4. The flow path of the solder Sd is guided so as to be concentrated and supplied to the location (here, in the solder supply path 4h).

  In FIGS. 1 and 4A and 4B, the cleaning device 6 has a rectangular cross section provided to be movable in the horizontal direction (Y-axis direction) and the vertical direction (Z-axis direction) parallel to the mask 4. A nozzle portion 31 as a base portion made of a cylindrical member, and a lower end fixed to the upper portion of the nozzle portion 31 and extending upward, and facing the relative movement direction of the nozzle portion 31 with respect to the mask 4 (here, the Y-axis direction) 2 Relative movement of the nozzle portion 31 relative to the mask 4 between the paper member pressing portion 32 having two wall portions 32a and formed in a rectangular cylindrical closed cross section and the two wall portions 32a constituting the paper member pressing portion 32 The plate-shaped intermediate member 33 extending in the direction (X-axis direction) orthogonal to the direction (Y-axis direction), the two wall portions 32 a of the two paper member pressing portions 32, and the upper end of the intermediate member 33 are masked 4 A paper member 34 is pressed against the lower surface, and a pair of roller members 35 for the winding of the paper member 34.

  In the paper member 34, the region (wiping region R) spanned between the two wall portions 32 a included in the paper member pressing portion 32 is pressed against the lower surface of the mask 4 by the two wall portions 32 a and the intermediate member 33. By moving relative to the mask 4 together with the wall portion 32a and the intermediate member 33, the solder Sd adhering to the lower surface of the mask 4 is wiped off. Further, the wiping area R can be updated by winding the paper member 34 with the pair of roller members 35.

  Here, as shown in FIGS. 4A and 4B, the intermediate member 33 has a size that allows the protruding portion 4 a of the mask 4 to pass through when the paper member pressing portion 32 moves relative to the mask 4. A notch 33k having a thickness and shape is provided so as to be cut out from the upper end side of the intermediate member 33.

  1 and 4B, the inside of the nozzle portion 31 is an air suction pipe 31a penetrating vertically, and by supplying a vacuum pressure into the air suction pipe 31a, the paper member 34 Air can be sucked into the air suction pipe line 31a through the wiping area R.

  The transport and stop operation of the substrate 2 by the transport conveyor 3 is performed by controlling the operation of the transport conveyor drive mechanism 41 (FIG. 1) including an actuator (not shown) by the control device 40 (FIG. 1) provided in the solder printer 1. Made. Moreover, the movement operation | movement and raising / lowering operation | movement in the horizontal surface of the conveyance conveyor 3 whole is made | formed when the control apparatus 40 performs operation control of the conveyance conveyor moving mechanism 42 (FIG. 1) which consists of an actuator etc. which are not shown in figure.

  The movement operation of the solder supply head 5 in the horizontal plane direction and the vertical movement operation is performed by the control device 40 controlling the operation of the solder supply head moving mechanism 43 (FIG. 1) including an actuator (not shown). The In addition, the supply (discharge) operation of the solder Sd by the solder supply head 5 is performed by the operation control of the solder discharge mechanism 44 (FIG. 1) including an actuator or the like (not shown).

  The movement operation of the cleaning device 6 in the horizontal plane and the movement operation in the vertical direction are performed by the control device 40 controlling the operation of a nozzle part moving mechanism 45 (FIG. 1) including an actuator (not shown).

  The suction operation of the solder Sd by the cleaning device 6 is performed when the control device 40 controls the operation of a suction mechanism 46 (FIG. 1) including an actuator (not shown) incorporated in the cleaning device 6. The control device 40 operates the suction mechanism 46 to supply a vacuum pressure into the air suction pipe 31 a, and the solder Sd adhering to the lower surface of the mask 4 through the wiping region R of the nozzle part 31 and the paper member 34. Aspirate.

  Further, the renewal operation of the wiping area R of the paper member 34 in the cleaning device 6 is to control the operation of the paper member take-up mechanism 47 (FIG. 1) including an actuator (not shown) that drives the pair of roller members 35 described above. Made by.

  In a solder printing process in which solder is printed on the substrate 2 by the solder printer 1, the control device 40 first controls the operation of the transport conveyor drive mechanism 41 to cause the transport conveyor 3 to perform the feeding operation of the substrate 2, and the solder printer. 1 receives the board 2 loaded from the upstream side of the board 1 and carries it into the solder printer 1 to position the board 2 at a predetermined position (board loading / positioning step). Then, the control device 40 controls the operation of the transfer conveyor moving mechanism 42 to move the entire transfer conveyor 3 in the horizontal plane direction, so that the opening 11 of the substrate 2 and the protrusion 4a of the mask 4 face each other vertically. Thus, the mask 4 and the substrate 2 are aligned (alignment process; FIG. 5A).

  When the positioning process is completed, the control device 40 controls the operation of the transport conveyor moving mechanism 42 to raise the substrate 2 (arrow A shown in FIG. 5A), and the protrusion 4a is the opening of the substrate 2. 11, the upper surface of the substrate 2 is brought into contact with the lower surface of the mask 4 so as to be fitted into the inner surface 11 (contact process, FIG. 5B). Thereby, the upper surface of the mask 4 and the opening 11 of the substrate 2 are communicated with each other through the solder supply path 4h.

  When the contact process is completed, the control device 40 controls the operation of the solder supply head moving mechanism 43 to lower the solder supply head 5 with respect to the mask 4, and the guide member 5 a of the solder supply head 5 is placed on the upper surface of the mask 4. Make contact. Then, the control device 40 controls the operation of the solder discharge mechanism 44 to discharge the solder Sd from the solder supply head 5, and supplies the solder Sd into the solder supply path 4h of the mask 4 (solder supply process, FIG. 5 ( c)). Here, since the internal volume of the solder supply path 4h when the protrusion 4a is provided on the mask 4 is much larger than when the protrusion 4a is not provided on the mask 4, a semiconductor element is attached to the heat sink 12. A sufficient amount of solder Sd for good bonding is supplied into the opening 11 of the substrate 2.

  When the solder supply process is completed, the control device 40 controls the operation of the transfer conveyor moving mechanism 42 to lower the substrate 2 (arrow B shown in FIG. 5D), and separates the substrate 2 from the mask 4 (plate). (Separation process: FIG. 5 (d)). As a result, the solder Sd is printed (transferred) in the opening 11 (on the copper plate 13) of the substrate 2, and the solder printing process by the solder printer 1 is completed.

  The substrate 2 that has undergone the solder printing process by the solder printing machine 1 is transferred to a component mounting machine (not shown) installed on the downstream side of the solder printing machine 1 and subjected to a semiconductor element mounting process. In this semiconductor element mounting process, first, after the semiconductor element 50 such as an FET is aligned above the opening 11 of the substrate 2 (FIG. 6A), the semiconductor element 50 is lowered with respect to the substrate 2. Thus (arrow C shown in FIG. 6A), the semiconductor element 50 is attached through the opening 11 of the substrate 2 from above (FIG. 6B). Then, the entire board 2 is then sent to a reflow furnace (not shown) installed on the downstream side of the component mounting machine, and the solder Sd is reflowed (FIG. 6C). Thus, the lower surface of the semiconductor element 50 is attached to the upper surface of the copper plate 13 via the solder Sd, and the semiconductor element 50 is joined to the heat sink 12 via the copper plate 13 (FIG. 6D).

  When the control device 40 of the solder printer 1 finishes the above-described solder printing process, the control device 40 executes a cleaning process in which the cleaning device 6 wipes (cleans) the lower surface of the mask 4.

  In this cleaning process, the control device 40 controls the operation of the nozzle portion moving mechanism 45, and as shown in FIG. 7A, the paper member is formed by the two wall portions 32a of the paper member pressing portion 32 provided in the cleaning device 6. The wiping area | region R of 34 is pressed on the lower surface of the mask 4 (pressing process). Then, the nozzle part 31 was reciprocated in the horizontal plane direction (Y-axis direction) (arrow D shown in FIGS. 7A to 7E), and was adhered to the lower surface of the mask 4 by the paper member 34. The remaining residue Ds (FIG. 7A) of the solder Sd is wiped off (wiping process).

  In this wiping process, the wiping area R of the paper member 34 is masked in a state where it is pressed against the lower surface of the mask 4 by the two wall portions 32 a of the paper member pressing portion 32 provided on the upper portion of the nozzle portion 31 and the intermediate member 33. 4, but the intermediate member 33 is provided with a notch 33 k, so when the intermediate member 33 passes through the protrusion 4 a (FIG. 7C), the protrusion 4 a is notched. Go through the part 33k. For this reason, the intermediate member 33 does not float from the lower surface of the mask 4, and the solder Sd adhering to the side region (side region in the X-axis direction) of the protrusion 4 a on the lower surface of the mask 4 is pressed against the intermediate member 33. The paper member 34 is wiped off.

  On the other hand, when the two wall portions 32a of the paper member pressing portion 32 pass through the protruding portion 4a (FIGS. 7B and 7D), the upper ends thereof move along the shape of the protruding portion 4a. While the lower surface of the protruding portion 4a is cleaned, the paper member pressing portion 32 is separated from the lower surface of the mask 4 during that time, and therefore adheres to the lower surface of the mask 4 on the side of the protruding portion 4a (side in the X-axis direction). The solder Sd that has been removed is not wiped off by the paper member 34. However, as described above, since the region of the lower surface of the mask 4 on the side of the protrusion 4a is cleaned by the intermediate member 33, as a result, sufficient solder Sd is applied to the entire region of the lower surface of the mask 4 including the protrusion 4a. Clean.

  Further, when performing the above wiping process, the control device 40 also controls the operation of the suction mechanism 46 so that air is vacuum-sucked from the air suction pipe 31a through the wiping region R of the paper member 34. To do. As a result, the solder Sd adhering to the lower surface of the mask 4 is sucked out to the paper member 34 side, so that the solder Sd can be more effectively wiped off. Further, since the paper member pressing portion 32 is provided as a member having a closed cross section on the upper portion of the nozzle portion 31, the solder Sd can be sucked out with the solder Sd suction target region on the lower surface of the mask 4 being sealed. . The control device 40 operates the paper member winding mechanism 47 to wind the paper member 34 when the remaining amount Ds of the solder Sd stuck to the wiping region R of the paper member 34 increases, and the paper member 34 is wound. The wiping area R of 34 is updated.

  As described above, the cleaning device 6 for the mask 4 in the present embodiment is parallel to the mask 4 with respect to the mask 4 for solder printing having the protruding portion 4 a fitted into the opening 11 of the substrate 2 from above. A nozzle portion 31 as a base portion that is relatively moved in any direction, and two wall portions 32a that extend upward from the nozzle portion 31 and face the relative movement direction (Y-axis direction) of the nozzle portion 31 with respect to the mask 4. A paper member pressing portion 32 having an intermediate member 33, an intermediate member 33 provided between two wall portions 32a of the paper member pressing portion 32 and extending in a direction orthogonal to the relative movement direction of the nozzle portion 31 with respect to the mask 4, and a paper The paper member 34 pressed against the lower surface of the mask 4 by the two wall portions 32 a of the member pressing portion 32 and the intermediate member 33, and the paper member pressing portion 32 The solder Sd adhering to the lower surface of the mask 4 is applied to the paper member 34 by moving the nozzle portion 31 relative to the mask 4 with the paper member 34 pressed against the lower surface of the mask 4 by the wall portion 32a and the intermediate member 33. A nozzle part moving mechanism 45 is provided as a nozzle part (base part) moving means for wiping off, and the intermediate member 33 passes through the protruding part 4 a of the mask 4 when the paper member pressing part 32 moves relative to the mask 4. The cutout portion 33k is provided.

  The mask cleaning method in the present embodiment is a cleaning method of the mask 4 by the cleaning device 6, and the paper member 34 is attached to the lower surface of the mask 4 by the two wall portions 32 a of the paper member pressing portion 32 and the intermediate member 33. The nozzle portion 31 is moved relative to the mask 4 in a state where the paper member 34 is pressed against the lower surface of the mask 4 by the two wall portions 32a of the paper member pressing portion 32 and the intermediate member 33. This includes a step of wiping the solder Sd adhering to the lower surface of the mask 4 with the paper member 34 (wiping step), and when the intermediate member 33 passes through the protruding portion 4a of the mask 4, the protruding portion 4a is provided on the intermediate member 33. The lower surface of the mask 4 is formed by passing through the cut-out portion 33k. The lateral region in the direction orthogonal to the relative movement direction of the protrusion 4 a with respect to the mask 4 of the cleaning device 6 is cleaned by the paper member 34 pressed against the lower surface of the mask 4 by the intermediate member 33. Yes.

  As described above, in the cleaning device 6 (cleaning method) for the mask 4 in the present embodiment, the relative movement direction (Y-axis direction) of the nozzle portion 31 with respect to the mask 4 is moved toward the nozzle portion 31 that is moved relative to the mask 4. A paper member pressing portion 32 having two wall portions 32a facing each other, and an intermediate member 33 provided between the two wall portions 32a of the paper member pressing portion 32. Since the notch 33k that passes through the protruding portion 4a when passing through the portion 4a is provided, the intermediate member 33 does not float from the lower surface of the mask 4 when the intermediate member 33 passes through the protruding portion 4a. The solder Sd adhering to the lateral region of the protruding portion 4 a on the lower surface of the sheet is wiped off by the paper member 34 pressed against the intermediate member 33. For this reason, the solder Sd adhering to the protrusion 4a is pressed by the paper member 34 pressed by the two walls 32a, and the solder Sd adhering to the side region of the protrusion 4a is pressed by the paper member 34 pressed by the intermediate member 33. Since each can be wiped off, the entire lower surface of the mask 4 including the lateral region of the protrusion 4a can be sufficiently cleaned. Moreover, since the wall portion 32a of the paper member pressing portion 32 is provided at both front and rear positions in the traveling direction of the intermediate member 33 (here, the Y-axis direction), the nozzle portion 31 does not depend on the moving direction of the nozzle portion 31 (the nozzle portion 31 is The solder Sd can be satisfactorily cleaned in both cases of moving from the front to the rear and moving from the rear to the front.

  In addition, the solder printer 1 according to the present embodiment includes an opening 11 for mounting the semiconductor element 50 provided so as to penetrate in the thickness direction and a semiconductor element provided so as to cover a lower region including the opening 11. Solder Sd is printed in the opening 11 of the substrate 2 provided with 50 cooling radiators (heat sinks 12), and has a protrusion 4a fitted into the opening 11 of the substrate 2 from above. 4 and the protrusion 4a of the mask 4 are fitted into the opening 11 of the substrate 2 from above, solder in the solder supply path 4h of the mask 4 that connects the upper surface of the mask 4 and the opening 11 of the substrate 2. After the supply of solder Sd into the solder supply path 4h of the mask 4 by the solder supply head 5 as the solder supply means for supplying Sd and the solder supply head 5 is finished, the substrate 2 and the mask 4 are relatively separated from each other. Carrying as separation means A conveyor moving mechanism 42 and a cleaning device 6 for the mask 4 are provided, and the cleaning device 6 for the mask 4 has a mask 4 with respect to the mask 4 having a protrusion 4 a that fits into the opening 11 of the substrate 2 from above. A paper having a nozzle portion 31 as a base portion that is relatively moved in a parallel direction, and two wall portions 32a that extend upward from the nozzle portion 31 and face the relative movement direction of the nozzle portion 31 with respect to the mask 4. A member pressing portion 32, an intermediate member 33 provided between the two wall portions 32a of the paper member pressing portion 32 and extending in a direction orthogonal to the relative movement direction of the nozzle portion 31 with respect to the mask 4, and a paper member pressing portion 32. The paper member 34 pressed against the lower surface of the mask 4 by the two wall portions 32 a and the intermediate member 33, and the paper member pressing portion 32. The solder Sd adhering to the lower surface of the mask 4 is applied to the paper member 34 by moving the nozzle portion 31 relative to the mask 4 with the paper member 34 pressed against the lower surface of the mask 4 by the wall portion 32a and the intermediate member 33. A nozzle part moving mechanism 45 as a base part moving means for wiping off is provided, and the intermediate member 33 is a notch part for passing through the protruding part 4a of the mask 4 when the paper member pressing part 32 moves relative to the mask 4. 33k is provided.

  In the solder printer 1 according to the present embodiment, the mask 4 is cleaned using the cleaning device 6, so the remaining residue Ds of the solder Sd adhering to the mask 4 can be efficiently removed, and the substrate 2 can be removed. The printed state of the solder Sd can be made extremely good.

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, since the substrate 2 has one opening 11 for attaching the semiconductor element 50, the mask 4 has one protrusion 4 a, but the substrate 2 has the semiconductor element 50. In the configuration having a plurality of openings 11 for attaching the mask 4, the number of protrusions 4 a included in the mask 4 is a plurality corresponding to the number.

  Provided are a mask cleaning device, a solder printer, and a mask cleaning method capable of sufficiently cleaning the entire lower surface of the mask including a side region of a protrusion.

DESCRIPTION OF SYMBOLS 1 Solder printer 2 Board | substrate 4 Mask 4a Protrusion part 4h Solder supply path 5 Solder supply head (solder supply means)
6 Cleaning device 11 Opening 12 Heat sink (heat radiator)
31 Nozzle part (base part)
32 Paper member pressing portion 32a Wall portion 33 Intermediate member 33k Notch portion 34 Paper member 42 Conveyor moving mechanism (separating means)
45 Nozzle part moving mechanism (base part moving means)
50 Semiconductor element Sd Solder

Claims (3)

A base portion that is relatively moved in a direction parallel to the mask with respect to the mask having a protrusion fitted from above into the opening of the substrate;
A paper member pressing portion that extends upward from the base portion and has two wall portions facing each other in the direction of relative movement with respect to the mask of the base portion;
An intermediate member provided extending between the two wall portions of the paper member pressing portion in a direction perpendicular to the direction of relative movement of the base portion with respect to the mask;
A paper member pressed against the lower surface of the mask by the two wall portions of the paper member pressing portion and the intermediate member;
Solder attached to the lower surface of the mask is wiped off to the paper member by moving the base portion relative to the mask with the paper member pressed against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion. And a base part moving means
The mask cleaning apparatus according to claim 1, wherein the intermediate member includes a notch for passing through the protrusion of the mask when the paper member pressing portion moves relative to the mask. Solder in the opening of the substrate provided with an opening for mounting the semiconductor element provided penetrating in the thickness direction and a radiator for cooling the semiconductor element provided to cover the lower region including the opening A solder printing machine for printing
A mask having a protrusion fitted into the opening of the substrate from above;
Solder supply means for supplying solder into the solder supply path of the mask that connects the upper surface of the mask and the opening of the substrate in a state where the protrusion of the mask is fitted to the opening of the substrate from above;
A separation means for relatively separating the substrate and the mask after the supply of the solder into the solder supply path of the mask by the solder supply means is completed;
A mask cleaning device,
Mask cleaning device
A base portion that is relatively moved in a direction parallel to the mask with respect to the mask having a protrusion fitted from above into the opening of the substrate;
A paper member pressing portion that extends upward from the base portion and has two wall portions facing each other in the direction of relative movement with respect to the mask of the base portion;
An intermediate member provided extending between the two wall portions of the paper member pressing portion in a direction perpendicular to the direction of relative movement of the base portion with respect to the mask;
A paper member pressed against the lower surface of the mask by the two wall portions of the paper member pressing portion and the intermediate member;
Solder attached to the lower surface of the mask is wiped off to the paper member by moving the base portion relative to the mask with the paper member pressed against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion. And a base part moving means
The solder printing machine according to claim 1, wherein the intermediate member includes a notch for passing through the protruding portion of the mask when the paper member pressing portion moves relative to the mask. A base part that is relatively moved in a direction parallel to the mask with respect to a mask having a protrusion that fits into the opening of the substrate from above, and a relative movement of the base part relative to the mask that extends upward from the base part. A paper member pressing portion having two wall portions opposed to each other, and an intermediate member provided between the two wall portions of the paper member pressing portion so as to extend in a direction orthogonal to the relative movement direction of the base portion with respect to the mask. And a paper member pressed against the lower surface of the mask by the two wall portions of the paper member pressing portion and the intermediate member, and the intermediate member moves the protrusion of the mask when the paper member pressing portion moves relative to the mask. A cleaning method of a mask by a cleaning device having a notch for passing through,
A step of pressing the paper member against the lower surface of the mask by the two wall portions and the intermediate member of the paper member pressing portion;
The process of wiping the solder adhered to the lower surface of the mask with the paper member by moving the base portion relative to the mask while the paper member is pressed against the lower surface of the mask with the two wall portions and the intermediate member of the paper member pressing portion. Including
When the intermediate member passes through the protruding portion of the mask, the protruding portion passes through a notch provided in the intermediate member, so that the protruding portion on the lower surface of the mask is orthogonal to the relative movement direction of the cleaning device with respect to the mask. A method for cleaning a mask, characterized in that a lateral region in a direction is cleaned by a paper member pressed against the lower surface of the mask by an intermediate member.

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