JP2009010372A - 構造物の熱刻印 - Google Patents

構造物の熱刻印 Download PDF

Info

Publication number
JP2009010372A
JP2009010372A JP2008157179A JP2008157179A JP2009010372A JP 2009010372 A JP2009010372 A JP 2009010372A JP 2008157179 A JP2008157179 A JP 2008157179A JP 2008157179 A JP2008157179 A JP 2008157179A JP 2009010372 A JP2009010372 A JP 2009010372A
Authority
JP
Japan
Prior art keywords
particles
stamping foil
transfer layer
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008157179A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009010372A5 (enExample
Inventor
Ulrich Schindler
ウーリッヒ シンドラー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leonhard Kurz Stiftung and Co KG
Original Assignee
Leonhard Kurz Stiftung and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leonhard Kurz Stiftung and Co KG filed Critical Leonhard Kurz Stiftung and Co KG
Publication of JP2009010372A publication Critical patent/JP2009010372A/ja
Publication of JP2009010372A5 publication Critical patent/JP2009010372A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1405—Capsule or particulate matter containing [e.g., sphere, flake, microballoon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Catalysts (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008157179A 2007-06-14 2008-06-16 構造物の熱刻印 Pending JP2009010372A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007027999A DE102007027999A1 (de) 2007-06-14 2007-06-14 Heißprägen von Strukturen

Publications (2)

Publication Number Publication Date
JP2009010372A true JP2009010372A (ja) 2009-01-15
JP2009010372A5 JP2009010372A5 (enExample) 2011-07-28

Family

ID=39926495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008157179A Pending JP2009010372A (ja) 2007-06-14 2008-06-16 構造物の熱刻印

Country Status (4)

Country Link
US (1) US20080311330A1 (enExample)
EP (1) EP2015620A3 (enExample)
JP (1) JP2009010372A (enExample)
DE (1) DE102007027999A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018530452A (ja) * 2015-08-05 2018-10-18 レオンハード クルツ シュティフトゥング ウント コー． カーゲー 多層膜の製造方法および製造装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008014824B4 (de) * 2008-03-18 2014-07-10 Leonhard Kurz Stiftung & Co. Kg Dotierfolien und deren Verwendung
KR101039156B1 (ko) * 2009-04-30 2011-06-03 한양대학교 산학협력단 탄소나노튜브층을 포함하는 태양전지
WO2013187843A1 (en) * 2012-06-15 2013-12-19 Agency For Science, Technology And Research Embossing method and embossing arrangement
DE102012222416A1 (de) 2012-12-06 2014-06-12 Robert Bosch Gmbh Verfahren zum Verbinden von wenigstens zwei Komponenten unter Verwendung eines Sinterprozesses
DE102014104510B4 (de) * 2014-03-31 2019-02-07 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zum Fügen und Einrichtung zum Fügen einer Anordnung unter Verwendung des Verfahrens
CN104009124B (zh) * 2014-06-13 2018-09-18 苏州苏大维格光电科技股份有限公司 太阳能电池超精细电极转移薄膜、制备方法及其应用方法
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
CN108687442B (zh) * 2017-03-30 2021-10-01 法拉第未来公司 用于焊接的系统和方法
CN109809357A (zh) * 2017-11-21 2019-05-28 锐迪科微电子（上海）有限公司 一种mems器件的晶圆级封装方法
EP4490985A4 (en) * 2022-03-10 2025-04-30 Commonwealth Scientific and Industrial Research Organisation TRANSFERABLE ELECTRODE FOR PRINTED ELECTRONICS

Citations (9)

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Publication number Priority date Publication date Assignee Title
JPH10235986A (ja) * 1997-02-21 1998-09-08 Dainippon Printing Co Ltd 静電印刷マスター版形成用の転写シートと静電印刷マスター版の製造方法および画像形成方法
JPH10287052A (ja) * 1997-04-11 1998-10-27 Ncr Internatl Inc 熱転写媒体
JPH11144628A (ja) * 1997-11-12 1999-05-28 Jsr Corp 隔壁形成用転写フィルムおよびそれを用いたプラズマディスプレイパネルの製造方法
JP2001085822A (ja) * 1999-09-16 2001-03-30 Dainippon Printing Co Ltd 転写版の作製方法と転写版、および配線基板の製造方法と配線基板
JP2002243692A (ja) * 2001-02-19 2002-08-28 Riken Corp 窒素酸化物ガスセンサ
JP2003229252A (ja) * 2002-02-01 2003-08-15 Sharp Corp 転写フィルムを用いた有機ｌｅｄ素子の製造方法
JP2005148502A (ja) * 2003-11-18 2005-06-09 Dainippon Printing Co Ltd レーザー転写フィルム及びカラーフィルターの製造方法
JP2006313744A (ja) * 2005-04-14 2006-11-16 E I Du Pont De Nemours & Co 導電性厚膜組成物、電極、およびそれから形成される半導体デバイス
JP2008311665A (ja) * 2007-06-14 2008-12-25 Leonhard Kurz Stiftung & Co Kg 光起電力シリコンウェファ上に導体路を形成する方法

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US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
JP2794960B2 (ja) * 1991-02-19 1998-09-10 松下電器産業株式会社 焼結導体配線基板とその製造方法
US5609704A (en) * 1993-09-21 1997-03-11 Matsushita Electric Industrial Co., Ltd. Method for fabricating an electronic part by intaglio printing
WO1995026935A1 (en) * 1994-04-05 1995-10-12 The University Of Queensland Coating of substrates
KR100536868B1 (ko) * 1997-10-03 2006-02-28 다이니폰 인사츠 가부시키가이샤 전사시트
TWI231293B (en) * 1997-11-12 2005-04-21 Jsr Corp Transfer film
US6743319B2 (en) * 1998-09-30 2004-06-01 Paralec Inc. Adhesiveless transfer lamination method and materials for producing electronic circuits
US6280552B1 (en) * 1999-07-30 2001-08-28 Microtouch Systems, Inc. Method of applying and edge electrode pattern to a touch screen and a decal for a touch screen
US20030134095A1 (en) * 2002-01-16 2003-07-17 Bottari Frank J Method of applying an edge electrode pattern to a touch screen
DE19940015B9 (de) * 1999-08-24 2004-09-09 Deutsches Zentrum für Luft- und Raumfahrt e.V. Verfahren und Vorrichtung zur Herstellung einer Elektrode
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JP2003031948A (ja) * 2001-07-12 2003-01-31 Matsushita Electric Ind Co Ltd セラミック多層基板の製造方法
DE10210696A1 (de) * 2002-03-12 2003-10-02 Elringklinger Ag Verfahren zum Herstellen einer Deckschicht auf einem Substrat für eine Kathoden-Elektrolyt-Anoden-Einheit
US20080083484A1 (en) * 2006-09-28 2008-04-10 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate
KR20100016622A (ko) * 2007-05-24 2010-02-12 바스프 에스이 금속 코팅 베이스 적층판의 제조 방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10235986A (ja) * 1997-02-21 1998-09-08 Dainippon Printing Co Ltd 静電印刷マスター版形成用の転写シートと静電印刷マスター版の製造方法および画像形成方法
JPH10287052A (ja) * 1997-04-11 1998-10-27 Ncr Internatl Inc 熱転写媒体
JPH11144628A (ja) * 1997-11-12 1999-05-28 Jsr Corp 隔壁形成用転写フィルムおよびそれを用いたプラズマディスプレイパネルの製造方法
JP2001085822A (ja) * 1999-09-16 2001-03-30 Dainippon Printing Co Ltd 転写版の作製方法と転写版、および配線基板の製造方法と配線基板
JP2002243692A (ja) * 2001-02-19 2002-08-28 Riken Corp 窒素酸化物ガスセンサ
JP2003229252A (ja) * 2002-02-01 2003-08-15 Sharp Corp 転写フィルムを用いた有機ｌｅｄ素子の製造方法
JP2005148502A (ja) * 2003-11-18 2005-06-09 Dainippon Printing Co Ltd レーザー転写フィルム及びカラーフィルターの製造方法
JP2006313744A (ja) * 2005-04-14 2006-11-16 E I Du Pont De Nemours & Co 導電性厚膜組成物、電極、およびそれから形成される半導体デバイス
JP2008311665A (ja) * 2007-06-14 2008-12-25 Leonhard Kurz Stiftung & Co Kg 光起電力シリコンウェファ上に導体路を形成する方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018530452A (ja) * 2015-08-05 2018-10-18 レオンハード クルツ シュティフトゥング ウント コー． カーゲー 多層膜の製造方法および製造装置
US11124010B2 (en) 2015-08-05 2021-09-21 Leonhard Kurz Stiftung & Co. Kg Method and device for producing a multilayer film

Also Published As

Publication number Publication date
EP2015620A2 (de) 2009-01-14
EP2015620A3 (de) 2010-10-06
DE102007027999A1 (de) 2008-12-18
US20080311330A1 (en) 2008-12-18

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