JP2009004732A - 導電性ボール載置装置 - Google Patents
導電性ボール載置装置 Download PDFInfo
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- JP2009004732A JP2009004732A JP2008037732A JP2008037732A JP2009004732A JP 2009004732 A JP2009004732 A JP 2009004732A JP 2008037732 A JP2008037732 A JP 2008037732A JP 2008037732 A JP2008037732 A JP 2008037732A JP 2009004732 A JP2009004732 A JP 2009004732A
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- 238000005507 spraying Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000004020 conductor Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 230000004308 accommodation Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
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- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
【解決手段】複数の導電性ボール14を収容すると共に、複数の導電性ボール14を供給する開口部13Aを有した導電性ボール収容体13と、開口部13Aと対向するように導電性ボール収容体13の上方に配置され、複数の導電性ボール14と複数のパッド35とが対向するように基板18を保持する基板保持装置15と、複数の導電性ボール14を浮上させることにより、複数の導電性ボール14を複数のパッド15に供給する導電性ボール供給装置である振動装置12と、を設けた。
【選択図】図8
Description
図8は、本発明の第1の実施の形態に係る導電性ボール載置装置の断面図である。図8では、基板保持装置15により保持された基板18の下方から複数の導電性ボール14を浮上させた状態を図示する。また、図8において、Z,Z方向は鉛直方向を示しており、X,X方向はZ,Z方向と直交する方向を示している。
図16は、本発明の第2の実施の形態に係る導電性ボール載置装置の断面図である。図16では、基板保持装置15により保持された基板18の下方から複数の導電性ボール14を浮上させた状態を図示する。また、図16において、第1の実施の形態の導電性ボール載置装置10と同一構成部分には同一符号を付す。
図17は、本発明の第3の実施の形態に係る導電性ボール載置装置の断面図である。図17では、基板保持装置15により保持された基板18の下方から複数の導電性ボール14を浮上させた状態を図示する。また、図17において、第2の実施の形態の導電性ボール載置装置45と同一構成部分には同一符号を付す。
図18は、本発明の第4の実施の形態に係る導電性ボール載置装置の断面図である。図18では、基板保持装置15により保持された基板18の下方から複数の導電性ボール14を浮上させた状態を図示する。また、図18において、第3の実施の形態の導電性ボール載置装置50と同一構成部分には同一符号を付す。
図19は、本発明の第5の実施の形態に係る導電性ボール載置装置の断面図である。図19では、マスク46が設けられた基板18に対して、鉛直方向(Z,Z方向)と直交する方向から複数の導電性ボール14を吹き付けた状態を図示している。また、図19において、第2の実施の形態の導電性ボール載置装置45と同一構成部分には同一符号を付す。
図20は、本発明の第6の実施の形態に係る導電性ボール載置装置の断面図である。図20では、基板保持装置15により保持された基板18の下方から複数の導電性ボール14を浮上させた状態を図示する。また、図20において、第2の実施の形態の導電性ボール載置装置45と同一構成部分には同一符号を付す。
11 ステージ
12 振動装置
13,72 導電性ボール収容体
13A,76A,32A,37A 開口部
14 導電性ボール
15 基板保持装置
18,25 基板
21 基板保持部
21A,26B 下面
22 支持体
26 基板本体
26A 上面
28 貫通ビア
29 上部配線
31,35 パッド
32,37 ソルダーレジスト
34 下部配線
38 粘着材
46 マスク
46A,81A 貫通部
47 レジスト膜
51 電位差発生装置
52A,52B 絶縁部材
54 電源
54A プラス端子
54B マイナス端子
56〜58 配線
61 帯電用部材
71 支持台
73 エア供給装置
74 導電性ボール回収容器
76 前面板
77 背面板
77A エア導入口
81 板体
82 収容ステージ
82A 収容部
A 切断位置
D1,D2 距離
R1,R2 直径
Claims (9)
- 粘着材が形成された複数のパッドを有する基板の前記複数のパッドに対して、それぞれ1つの導電性ボールを載置する導電性ボール載置装置であって、
前記複数の導電性ボールを収容すると共に、前記複数の導電性ボールを通過させる開口部を有した導電性ボール収容体と、
前記開口部と対向するように前記導電性ボール収容体の上方に配置され、前記複数の導電性ボールと前記複数のパッドとが対向するように前記基板を保持する基板保持装置と、
前記複数の導電性ボールを浮上させることにより、前記開口部を介して、前記複数の導電性ボールを前記複数のパッドに供給する導電性ボール供給装置と、を設け、
前記基板保持装置と前記導電性ボール供給装置とを別体にすると共に、前記基板保持装置に保持された前記基板と前記導電性ボール収容体及び前記導電性ボール供給装置とを離間させて配置したことを特徴とする導電性ボール載置装置。 - 粘着材が形成された複数のパッドを有する基板の前記複数のパッドに対して、それぞれ1つの導電性ボールを載置する導電性ボール載置装置であって、
前記複数の導電性ボールを収容すると共に、前記複数の導電性ボールを通過させる開口部を有した導電性ボール収容体と、
鉛直方向と直交する方向において、前記開口部と前記パッドとが対向するように前記基板を保持する基板保持装置と、
前記複数の導電性ボールを吹き付けることにより、前記複数のパッドに前記導電性ボールを供給する導電性ボール供給装置と、を設けたことを特徴とする導電性ボール載置装置。 - 前記複数のパッドの形成位置に対応する複数の貫通部を有したマスクを、前記複数の貫通部から前記パッドが露出するように前記基板に設け、前記貫通部の直径を1つの前記導電性ボールのみが通過可能な大きさとしたことを特徴とする請求項1又は2項記載の導電性ボール載置装置。
- 前記導電性ボール収容体に収容された前記複数の導電性ボールと前記基板との間に、電位差を発生させる電位差発生装置を設けたことを特徴とする請求項1ないし3のうち、いずれか1項記載の導電性ボール載置装置。
- 前記導電性ボール収容体に収容された前記複数の導電性ボールの電位と略等しくなるように前記マスクを帯電させる帯電用部材を設けたことを特徴とする請求項3又は4記載の導電性ボール載置装置。
- 複数の導電性ボールを収容する導電性ボール収容体と、粘着材が形成された複数のパッドを有する基板を保持すると共に、前記複数の導電性ボールと対向するように前記導電性ボール収容体の上方に配置された基板保持装置と、前記基板に配設され、前記複数のパッドの形成位置に対応する部分に複数の貫通部を有したマスクと、前記複数の導電性ボールを浮上させることにより、前記複数の導電性ボールを前記複数のパッドに供給する導電性ボール供給装置と、を備えた導電性ボール載置装置により、前記複数の貫通部を介して、前記複数のパッドにそれぞれ1つの導電性ボールを載置する導電性ボールの載置方法であって、
前記基板保持装置と前記導電性ボール供給装置とは別体とされており、
前記複数の導電性ボールと前記複数のパッドとを対向させると共に、前記複数の導電性ボールの上方に、前記導電性ボール収容体及び前記導電性ボール供給装置から離間するように前記基板を配置する基板配置工程と、
前記基板配置工程後に、前記複数の導電性ボールを浮上させることにより、前記複数の導電性ボールを前記複数のパッドに供給する導電性ボール供給工程と、を含むことを特徴とする導電性ボールの載置方法。 - 粘着材が形成された複数のパッドを有する基板に、前記複数のパッドの形成位置に対応する複数の貫通部を有したマスクを設け、前記複数の貫通部を介して、前記複数のパッドにそれぞれ1つの導電性ボールを載置する導電性ボールの載置方法であって、
鉛直方向と直交する方向において、前記複数の導電性ボールと前記複数のパッドとが対向するように前記基板を配置する基板配置工程と、
前記基板配置工程後に、前記マスクに前記複数の導電性ボールを吹き付けることにより、前記複数の導電性ボールを前記複数のパッドに供給する導電性ボール供給工程と、を含むことを特徴とする導電性ボールの載置方法。 - 前記基板配置工程と前記導電性ボール供給工程との間に、前記導電性ボール収容体に収容された前記複数の導電性ボールと前記基板との間に電位差を発生させる電位差発生工程を設けたことを特徴とする請求項7又は8記載の導電性ボールの載置方法。
- 前記基板配置工程と前記導電性ボール供給工程との間に、前記導電性ボール収容体に収容された前記複数の導電性ボールの電位と略等しくなるように前記マスクを帯電させるマスク帯電工程をさらに設けたことを特徴とする請求項8記載の導電性ボールの載置方法。
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