JP2023528508A - 静電チャックを用いる導電性ボール搭載方法 - Google Patents
静電チャックを用いる導電性ボール搭載方法 Download PDFInfo
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- JP2023528508A JP2023528508A JP2022574840A JP2022574840A JP2023528508A JP 2023528508 A JP2023528508 A JP 2023528508A JP 2022574840 A JP2022574840 A JP 2022574840A JP 2022574840 A JP2022574840 A JP 2022574840A JP 2023528508 A JP2023528508 A JP 2023528508A
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- Prior art keywords
- electrostatic chuck
- mask
- mounting
- conductive
- conductive ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 230000004907 flux Effects 0.000 claims description 7
- 230000003213 activating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Engineering (AREA)
Abstract
Description
Claims (8)
- (a)平板状のマスク本体と、導電性ボールが装着されるように前記マスク本体の下面に形成される多数の取付凹部と、前記取付凹部の内側に前記マスク本体を貫通するように形成される貫通孔を有するマスクを設けて水平に配置するステップと、
(b)前記マスクの上側に静電チャックを配置するステップと、
(c)前記マスクの下側に多数の導電性ボールが収容されるボール供給モジュールを配置するステップと、
(d)前記静電チャックを作動させ、静電気力によって、前記ボール供給モジュールに収容された導電性ボールを前記マスクのそれぞれの取付凹部に装着するステップと、
(e)フラックスが塗布された基板を設け、前記マスクと基板のうちの少なくとも一つを移送して前記マスクの下側に前記基板を配置させるステップと、
(f)前記静電チャックとマスクとの間隔を増加させて、前記マスクの取付凹部に装着された前記導電性ボールを前記基板上に落として前記基板に搭載するステップと、を含む、静電チャックを用いる導電性ボール搭載方法。 - (g)前記(d)ステップを行うとき、前記ボール供給モジュールに収容された導電性ボールが前記取付凹部に装着されやすいように加振器で前記ボール供給モジュールに振動を加えるステップをさらに含む、請求項1に記載の静電チャックを用いる導電性ボール搭載方法。
- (h)前記(f)ステップを行うとき、前記静電チャックをオフ(off)にして静電気力を除去するステップをさらに含む、請求項1又は2に記載の静電チャックを用いる導電性ボール搭載方法。
- 前記(b)ステップは、前記マスクの上面に前記静電チャックの下面が接触するように前記静電チャックを配置する、請求項3に記載の静電チャックを用いる導電性ボール搭載方法。
- 前記(a)ステップは、前記貫通孔の内径が導電性ボールの外径より小さく、前記貫通孔の深さは前記導電性ボールが前記静電チャックに接触できる深さである前記マスクを用いて行う、請求項4に記載の静電チャックを用いる導電性ボール搭載方法。
- (i)前記ステップ(d)で、前記マスクの取付凹部ごとにそれぞれ1つの導電性ボールが装着される程度の静電気力が前記静電チャックに発生するように前記静電チャックの静電気力を調節するステップをさらに含む、請求項3に記載の静電チャックを用いる導電性ボール搭載方法。
- 前記(f)ステップは、前記静電チャックを固定した状態で前記マスクを下降させる方法で行う、請求項3に記載の静電チャックを用いる導電性ボール搭載方法。
- 前記(f)ステップは、前記マスクを固定した状態で前記静電チャックを上昇させる方法で行う、請求項3に記載の静電チャックを用いる導電性ボール搭載方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2020-0066851 | 2020-06-03 | ||
KR1020200066851A KR102330427B1 (ko) | 2020-06-03 | 2020-06-03 | 정전 척을 이용하는 도전성 볼 탑재 방법 |
PCT/KR2021/006836 WO2021246767A1 (ko) | 2020-06-03 | 2021-06-02 | 정전 척을 이용하는 도전성 볼 탑재 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023528508A true JP2023528508A (ja) | 2023-07-04 |
JP7498458B2 JP7498458B2 (ja) | 2024-06-12 |
Family
ID=78748049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022574840A Active JP7498458B2 (ja) | 2020-06-03 | 2021-06-02 | 静電チャックを用いる導電性ボール搭載方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230093905A1 (ja) |
JP (1) | JP7498458B2 (ja) |
KR (1) | KR102330427B1 (ja) |
CN (1) | CN115700018A (ja) |
WO (1) | WO2021246767A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283521A (ja) * | 1994-04-06 | 1995-10-27 | Fujitsu Ltd | 成形ハンダ搭載方法 |
JP2001223236A (ja) | 2000-02-10 | 2001-08-17 | Ueno Seiki Kk | 金属ボール移載装置 |
KR20070056337A (ko) * | 2005-11-29 | 2007-06-04 | 삼성전자주식회사 | 솔더 볼 자동 공급 수단을 갖는 솔더 볼 부착 장치 |
JP5211724B2 (ja) * | 2008-02-04 | 2013-06-12 | 日本電気株式会社 | ボール吸着ヘッド |
JP2010129866A (ja) * | 2008-11-28 | 2010-06-10 | Shibuya Kogyo Co Ltd | 導電性ボール搭載装置 |
KR102307528B1 (ko) * | 2014-07-21 | 2021-10-05 | 삼성전자주식회사 | 솔더 볼 흡착 장치 |
-
2020
- 2020-06-03 KR KR1020200066851A patent/KR102330427B1/ko active IP Right Grant
-
2021
- 2021-06-02 JP JP2022574840A patent/JP7498458B2/ja active Active
- 2021-06-02 CN CN202180039892.4A patent/CN115700018A/zh active Pending
- 2021-06-02 WO PCT/KR2021/006836 patent/WO2021246767A1/ko active Application Filing
-
2022
- 2022-12-01 US US18/073,493 patent/US20230093905A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230093905A1 (en) | 2023-03-30 |
WO2021246767A1 (ko) | 2021-12-09 |
KR102330427B1 (ko) | 2021-11-24 |
CN115700018A (zh) | 2023-02-03 |
JP7498458B2 (ja) | 2024-06-12 |
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