JP2008546550A5 - - Google Patents

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Publication number
JP2008546550A5
JP2008546550A5 JP2008518178A JP2008518178A JP2008546550A5 JP 2008546550 A5 JP2008546550 A5 JP 2008546550A5 JP 2008518178 A JP2008518178 A JP 2008518178A JP 2008518178 A JP2008518178 A JP 2008518178A JP 2008546550 A5 JP2008546550 A5 JP 2008546550A5
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JP
Japan
Prior art keywords
density
less
pores
porous material
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008518178A
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English (en)
Japanese (ja)
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JP2008546550A (ja
Filing date
Publication date
Priority claimed from US11/158,694 external-priority patent/US7267607B2/en
Application filed filed Critical
Publication of JP2008546550A publication Critical patent/JP2008546550A/ja
Publication of JP2008546550A5 publication Critical patent/JP2008546550A5/ja
Pending legal-status Critical Current

Links

JP2008518178A 2005-06-22 2006-05-24 Ｃｍｐのための透過性微細多孔質材料 Pending JP2008546550A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/158,694 US7267607B2 (en) 2002-10-28 2005-06-22 Transparent microporous materials for CMP
PCT/US2006/020193 WO2007001699A1 (en) 2005-06-22 2006-05-24 Tranparent microporous materials for cmp

Publications (2)

Publication Number Publication Date
JP2008546550A JP2008546550A (ja) 2008-12-25
JP2008546550A5 true JP2008546550A5 (https=) 2009-07-09

Family

ID=37101929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008518178A Pending JP2008546550A (ja) 2005-06-22 2006-05-24 Ｃｍｐのための透過性微細多孔質材料

Country Status (8)

Country Link
US (1) US7267607B2 (https=)
EP (1) EP1915233B1 (https=)
JP (1) JP2008546550A (https=)
KR (1) KR101265370B1 (https=)
CN (1) CN101208180A (https=)
IL (1) IL187705A (https=)
TW (1) TWI295946B (https=)
WO (1) WO2007001699A1 (https=)

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US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
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CN106146875A (zh) * 2016-07-11 2016-11-23 浙江新恒泰新材料有限公司 一种高倍率热塑性聚氨酯微孔发泡板材及其生产方法
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102794221B1 (ko) * 2020-11-19 2025-04-15 주식회사 케이씨텍 기판 연마 장치
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP7587455B2 (ja) * 2021-03-30 2024-11-20 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN114536212B (zh) * 2022-01-29 2024-02-09 浙江环龙新材料科技有限公司 一种微孔热塑性聚氨酯抛光垫及其半连续制备方法

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