JP2008526025A - 基板最適化のためのプラズマ処理ステップ交互実行方法及び装置 - Google Patents
基板最適化のためのプラズマ処理ステップ交互実行方法及び装置 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/006—Other surface treatment of glass not in the form of fibres or filaments by irradiation by plasma or corona discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Abstract
【解決手段】この方法は、第1可変処理要素を含んだ第1プラズマ処理処方を選択させるステップを含み、第1可変処理要素を第1量だけ変更させることにより第1基板エッチング特性を最適化させ、第2基板エッチング特性を低下させる。この方法はさらに第2可変処理要素を含んだ第2プラズマ処理処方を選択させるステップを含み、第2可変処理要素を第2量だけ変更させることにより第1基板エッチング特性を低下させ、第2基板エッチング特性を最適化させる。方法はさらに基板をプラズマ処理チャンバ内のチャック上に配置するステップと、プラズマ処理チャンバ内でプラズマを照射するステップとを含む。方法はさらに第1プラズマ処理処方と第2プラズマ処理処方とを交互実行するステップを含み、交互実行の終了時には第1基板エッチング特性と第2基板エッチング特性とは実質的に最適化されている。
【選択図】図2
Description
Claims (24)
- プラズマ処理システムで利用する基板のエッチングを最適化する方法であって、
第1可変処理要素を含んだ第1プラズマ処理処方を選択させるステップであって、該第1可変処理要素を第1量だけ変更させることにより第1基板エッチング特性を最適化させ、第2基板エッチング特性を低下させるステップと、
第2可変処理要素を含んだ第2プラズマ処理処方を選択させるステップであって、該第2可変処理要素を第2量だけ変更させることにより前記第1基板エッチング特性を低下させ、前記第2基板エッチング特性を最適化させるステップと、
基板をプラズマ処理チャンバ内のチャック上に配置するステップと、
前記プラズマ処理チャンバ内でプラズマを照射するステップと、
前記第1プラズマ処理処方と前記第2プラズマ処理処方とを交互実行するステップであって、該交互実行の終了時には前記第1基板エッチング特性と前記第2基板エッチング特性とは実質的に最適化されているステップと、
を含んでいることを特徴とする方法。 - 第1基板エッチング特性はエッチ速度、均等度、選択度及びエッチプロファイルの中から選択されることを特徴とする請求項1記載の方法。
- 第2基板エッチング特性はエッチ速度、均等度、選択度及びエッチプロファイルの中から選択されることを特徴とする請求項1記載の方法。
- 第1可変処理要素は処理時間、RF電力、チャンバ内圧、ガス組成、ガス流、基板バイアス及びRF周波数の中から選択されることを特徴とする請求項1記載の方法。
- 第2可変処理要素は処理時間、RF電力、チャンバ内圧、ガス組成、ガス流、基板バイアス及びRF周波数の中から選択されることを特徴とする請求項1記載の方法。
- 基板は半導体ウェハーであることを特徴とする請求項1記載の方法。
- 基板はガラスパネルであることを特徴とする請求項1記載の方法。
- 交互実行は数秒ごとに反復されることを特徴とする請求項1記載の方法。
- プラズマ処理システムで利用する基板のエッチングを最適化する方法であって、
第1可変処理要素を含んだ第1セットのプラズマ処理処方を選択させるステップであって、該第1可変処理要素を第1量だけ変更させることにより第1基板エッチング特性を最適化させ、第2基板エッチング特性を低下させるステップと、
第2可変処理要素を含んだ第2セットのプラズマ処理処方を選択させるステップであって、該第2可変処理要素を第2量だけ変更させることにより前記第1基板エッチング特性を低下させ、前記第2基板エッチング特性を最適化させるステップと、
基板をプラズマ処理チャンバ内のチャック上に配置するステップと、
前記プラズマ処理チャンバ内でプラズマを照射するステップと、
前記第1セットのプラズマ処理処方のプラズマ処理処方と前記第2セットのプラズマ処理処方のプラズマ処理処方とを交互実行するステップであって、該交互実行の終了時には前記第1基板エッチング特性と前記第2基板エッチング特性とは実質的に最適化されているステップと、
を含んでいることを特徴とする方法。 - 第1基板エッチング特性はエッチ速度、均等度、選択度及びエッチプロファイルの中から選択されることを特徴とする請求項9記載の方法。
- 第2基板エッチング特性はエッチ速度、均等度、選択度及びエッチプロファイルの中から選択されることを特徴とする請求項9記載の方法。
- 第1可変処理要素は処理時間、RF電力、チャンバ内圧、ガス組成、ガス流、基板バイアス及びRF周波数の中から選択されることを特徴とする請求項9記載の方法。
- 第2可変処理要素は処理時間、RF電力、チャンバ内圧、ガス組成、ガス流、基板バイアス及びRF周波数の中から選択されることを特徴とする請求項9記載の方法。
- 基板は半導体ウェハーであることを特徴とする請求項9記載の方法。
- 基板はガラスパネルであることを特徴とする請求項9記載の方法。
- 交互実行は数秒ごとに反復されることを特徴とする請求項9記載の方法。
- プラズマ処理システムで利用する基板のエッチングを最適化する装置であって、
第1可変処理要素を含んだ第1セットのプラズマ処理処方を選択させる手段であって、該第1可変処理要素を第1量だけ変更させることにより第1基板エッチング特性を最適化させ、第2基板エッチング特性を低下させる手段と、
第2可変処理要素を含んだ第2セットのプラズマ処理処方を選択させる手段であって、該第2可変処理要素を第2量だけ変更させることにより前記第1基板エッチング特性を低下させ、前記第2基板エッチング特性を最適化させる手段と、
基板をプラズマ処理チャンバ内のチャック上に配置させる手段と、
前記プラズマ処理チャンバ内でプラズマを照射させる手段と、
前記第1セットのプラズマ処理処方のプラズマ処理処方と前記第2セットのプラズマ処理処方のプラズマ処理処方とを交互実行させる手段であって、該交互実行の終了時には前記第1基板エッチング特性と前記第2基板エッチング特性とは実質的に最適化されている手段と、
を含んでいることを特徴とする装置。 - 第1基板エッチング特性はエッチ速度、均等度、選択度及びエッチプロファイルの中から選択されることを特徴とする請求項17記載の装置。
- 第2基板エッチング特性はエッチ速度、均等度、選択度及びエッチプロファイルの中から選択されることを特徴とする請求項17記載の装置。
- 第1可変処理要素は処理時間、RF電力、チャンバ内圧、ガス組成、ガス流、基板バイアス及びRF周波数の中から選択されることを特徴とする請求項17記載の装置。
- 第2可変処理要素は処理時間、RF電力、チャンバ内圧、ガス組成、ガス流、基板バイアス及びRF周波数の中から選択されることを特徴とする請求項17記載の装置。
- 基板は半導体ウェハーであることを特徴とする請求項17記載の装置。
- 基板はガラスパネルであることを特徴とする請求項17記載の装置。
- 交互実行は数秒ごとに反復されることを特徴とする請求項17記載の装置。
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Also Published As
Publication number | Publication date |
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WO2006068971A3 (en) | 2007-09-20 |
KR101144021B1 (ko) | 2012-05-09 |
TWI386994B (zh) | 2013-02-21 |
CN101287860B (zh) | 2011-10-05 |
JP5038151B2 (ja) | 2012-10-03 |
US20060131271A1 (en) | 2006-06-22 |
WO2006068971B1 (en) | 2007-12-21 |
WO2006068971A2 (en) | 2006-06-29 |
TW200633051A (en) | 2006-09-16 |
EP1831429A4 (en) | 2008-10-22 |
EP1831429A2 (en) | 2007-09-12 |
KR20070091673A (ko) | 2007-09-11 |
US7459100B2 (en) | 2008-12-02 |
CN101287860A (zh) | 2008-10-15 |
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