JP2008519695A - ばね解放ブリッジを備えたマイクロ電気機械（ｍｅｍ）装置およびその製造方法 - Google Patents

ばね解放ブリッジを備えたマイクロ電気機械（ｍｅｍ）装置およびその製造方法 Download PDF

Info

Publication number
JP2008519695A
JP2008519695A JP2007540350A JP2007540350A JP2008519695A JP 2008519695 A JP2008519695 A JP 2008519695A JP 2007540350 A JP2007540350 A JP 2007540350A JP 2007540350 A JP2007540350 A JP 2007540350A JP 2008519695 A JP2008519695 A JP 2008519695A
Authority
JP
Japan
Prior art keywords
suspension spring
release
etchant
sacrificial layer
release bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007540350A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008519695A5 (enExample
Inventor
プラサンナ ゴゴイ、ビシュヌ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2008519695A publication Critical patent/JP2008519695A/ja
Publication of JP2008519695A5 publication Critical patent/JP2008519695A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00936—Releasing the movable structure without liquid etchant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
JP2007540350A 2004-11-09 2005-10-25 ばね解放ブリッジを備えたマイクロ電気機械（ｍｅｍ）装置およびその製造方法 Pending JP2008519695A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/985,530 US7273762B2 (en) 2004-11-09 2004-11-09 Microelectromechanical (MEM) device including a spring release bridge and method of making the same
PCT/US2005/038848 WO2006052472A2 (en) 2004-11-09 2005-10-25 Microelectromechanical (mem) device including a spring release bridge and method of making the same

Publications (2)

Publication Number Publication Date
JP2008519695A true JP2008519695A (ja) 2008-06-12
JP2008519695A5 JP2008519695A5 (enExample) 2008-12-18

Family

ID=36314958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007540350A Pending JP2008519695A (ja) 2004-11-09 2005-10-25 ばね解放ブリッジを備えたマイクロ電気機械（ｍｅｍ）装置およびその製造方法

Country Status (4)

Country Link
US (1) US7273762B2 (enExample)
JP (1) JP2008519695A (enExample)
TW (1) TWI358389B (enExample)
WO (1) WO2006052472A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014176904A (ja) * 2013-03-13 2014-09-25 National Institute Of Advanced Industrial & Technology 微小構造体の作製方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833508B1 (ko) * 2006-12-07 2008-05-29 한국전자통신연구원 멤즈 패키지 및 그 방법
US8136383B2 (en) * 2007-08-28 2012-03-20 Westerngeco L.L.C. Calibrating an accelerometer
JP4636187B2 (ja) * 2008-04-22 2011-02-23 株式会社デンソー 力学量センサの製造方法および力学量センサ
TWI360516B (en) * 2008-05-09 2012-03-21 Pixart Imaging Inc In-plane sensor and method for making same
US8877648B2 (en) * 2009-03-26 2014-11-04 Semprius, Inc. Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
CN102139854B (zh) * 2010-01-28 2013-07-24 钜晶电子股份有限公司 微机电系统结构及其制造方法
US9010170B2 (en) 2010-08-16 2015-04-21 Westerngeco L.L.C. Method and apparatus to test an accelerometer
US9217805B2 (en) 2010-10-01 2015-12-22 Westerngeco L.L.C. Monitoring the quality of particle motion data during a seismic acquisition
ITTO20120691A1 (it) * 2012-08-01 2014-02-02 Milano Politecnico Sensore d'urto con meccanismo bistabile e metodo per il rilevamento di urti
FR3005045A1 (fr) * 2013-04-25 2014-10-31 Commissariat Energie Atomique Structure microelectromecanique et/ou nanoelectromecanique a facteur de qualite ajustable
US9612254B2 (en) * 2014-06-27 2017-04-04 Nxp Usa, Inc. Microelectromechanical systems devices with improved lateral sensitivity
US9764942B2 (en) 2015-05-15 2017-09-19 Murata Manufacturing Co., Ltd. Multi-level micromechanical structure
FI126508B (en) 2015-05-15 2017-01-13 Murata Manufacturing Co Method for manufacturing a multilevel micromechanical structure
DE102016209732B4 (de) 2016-06-02 2025-02-06 Robert Bosch Gmbh Mikromechanisches Bauelement
CN112141999B (zh) * 2020-09-27 2024-01-02 地球山(苏州)微电子科技有限公司 一种mems器件的制造方法及mems器件

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0923015A (ja) * 1995-07-04 1997-01-21 Nippondenso Co Ltd 半導体力学量センサ
JPH09223690A (ja) * 1996-02-16 1997-08-26 Denso Corp 半導体装置の製造方法
JPH10170275A (ja) * 1996-12-13 1998-06-26 Toyota Central Res & Dev Lab Inc 振動型角速度センサ
JPH11326365A (ja) * 1998-05-11 1999-11-26 Denso Corp 半導体力学量センサ
JP2001281264A (ja) * 2000-03-30 2001-10-10 Denso Corp 半導体力学量センサ
JP2002005955A (ja) * 2000-06-26 2002-01-09 Denso Corp 容量式力学量センサ
JP2003046091A (ja) * 2001-08-01 2003-02-14 Toyota Central Res & Dev Lab Inc 微小構造体とその製造方法
JP2004106074A (ja) * 2002-09-13 2004-04-08 Sony Corp 中空構造体の製造方法、及びｍｅｍｓ素子の製造方法
US20040121506A1 (en) * 2002-12-23 2004-06-24 Motorola Inc. Release etch method for micromachined sensors

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004208A (en) * 1992-11-04 1999-12-21 Kabushiki Kaisha Ace Denken Slot machine that can superimpose on a display screen images from different storage locations
US5258097A (en) 1992-11-12 1993-11-02 Ford Motor Company Dry-release method for sacrificial layer microstructure fabrication
US5393061A (en) * 1992-12-16 1995-02-28 Spielo Manufacturing Incorporated Video gaming machine
EP0737494A4 (en) * 1993-12-28 1997-08-27 Ace Denken Kk GAME MACHINE
US5542295A (en) 1994-12-01 1996-08-06 Analog Devices, Inc. Apparatus to minimize stiction in micromachined structures
US5725428A (en) * 1995-03-09 1998-03-10 Atronic Casino Technology Distribution Gmbh Video slot machine
DE19526903B4 (de) * 1995-07-22 2005-03-10 Bosch Gmbh Robert Drehratensensor
US5704835A (en) * 1995-12-13 1998-01-06 Infinity Group, Inc. Electronic second spin slot machine
US5788573A (en) * 1996-03-22 1998-08-04 International Game Technology Electronic game method and apparatus with hierarchy of simulated wheels
US5997401A (en) * 1996-10-25 1999-12-07 Sigma Game, Inc. Slot machine with symbol save feature
AUPO429596A0 (en) * 1996-12-18 1997-01-23 Aristocrat Leisure Industries Pty Ltd Find the prize
US6234897B1 (en) * 1997-04-23 2001-05-22 Wms Gaming Inc. Gaming device with variable bonus payout feature
US5980384A (en) * 1997-12-02 1999-11-09 Barrie; Robert P. Gaming apparatus and method having an integrated first and second game
JPH11244453A (ja) * 1998-03-04 1999-09-14 Aruze Corp 遊技機
WO1999045509A1 (en) * 1998-03-06 1999-09-10 Mikohn Gaming Corporation Gaming machines with bonusing
US6190255B1 (en) * 1998-03-24 2001-02-20 Wms Gaming Inc. Bonus game for a gaming machine
US6159098A (en) * 1998-09-02 2000-12-12 Wms Gaming Inc. Dual-award bonus game for a gaming machine
US6060336A (en) * 1998-12-11 2000-05-09 C.F. Wan Incorporated Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
US6159097A (en) * 1999-06-30 2000-12-12 Wms Gaming Inc. Gaming machine with variable probability of obtaining bonus game payouts
US6232104B1 (en) 1999-08-17 2001-05-15 Dade Behring Inc. Detection of differences in nucleic acids by inhibition of spontaneous DNA branch migration
US6632139B1 (en) * 2000-08-31 2003-10-14 Igt Gaming device having a bonus scheme with symbol generator and symbol terminating condition
US6544898B2 (en) 2001-06-25 2003-04-08 Adc Telecommunications, Inc. Method for improved die release of a semiconductor device from a wafer
US6632698B2 (en) * 2001-08-07 2003-10-14 Hewlett-Packard Development Company, L.P. Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6634945B2 (en) * 2001-09-28 2003-10-21 Igt Gaming device having independent bonus reels
US7102467B2 (en) * 2004-04-28 2006-09-05 Robert Bosch Gmbh Method for adjusting the frequency of a MEMS resonator

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0923015A (ja) * 1995-07-04 1997-01-21 Nippondenso Co Ltd 半導体力学量センサ
JPH09223690A (ja) * 1996-02-16 1997-08-26 Denso Corp 半導体装置の製造方法
JPH10170275A (ja) * 1996-12-13 1998-06-26 Toyota Central Res & Dev Lab Inc 振動型角速度センサ
JPH11326365A (ja) * 1998-05-11 1999-11-26 Denso Corp 半導体力学量センサ
JP2001281264A (ja) * 2000-03-30 2001-10-10 Denso Corp 半導体力学量センサ
JP2002005955A (ja) * 2000-06-26 2002-01-09 Denso Corp 容量式力学量センサ
JP2003046091A (ja) * 2001-08-01 2003-02-14 Toyota Central Res & Dev Lab Inc 微小構造体とその製造方法
JP2004106074A (ja) * 2002-09-13 2004-04-08 Sony Corp 中空構造体の製造方法、及びｍｅｍｓ素子の製造方法
US20040121506A1 (en) * 2002-12-23 2004-06-24 Motorola Inc. Release etch method for micromachined sensors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014176904A (ja) * 2013-03-13 2014-09-25 National Institute Of Advanced Industrial & Technology 微小構造体の作製方法

Also Published As

Publication number Publication date
US7273762B2 (en) 2007-09-25
TWI358389B (en) 2012-02-21
US20060096377A1 (en) 2006-05-11
WO2006052472A2 (en) 2006-05-18
WO2006052472A3 (en) 2007-02-08
TW200628396A (en) 2006-08-16

Similar Documents

Publication Publication Date Title
US7268463B2 (en) Stress release mechanism in MEMS device and method of making same
JP2008519695A (ja) ばね解放ブリッジを備えたマイクロ電気機械（ｍｅｍ）装置およびその製造方法
JP5637638B2 (ja) 応力分離部を有するｍｅｍｓデバイスおよび製造方法
US7232701B2 (en) Microelectromechanical (MEM) device with a protective cap that functions as a motion stop
US7785481B2 (en) Method for fabricating micromachined structures
EP2805913B1 (en) Active lateral force stiction self-recovery for microelectromechanical systems devices
US20040224523A1 (en) Method of fabricating anti-stiction micromachined structures
US7405099B2 (en) Wide and narrow trench formation in high aspect ratio MEMS
JPH08510598A (ja) 表面の微小機械的構造の製造方法
CN110058052B (zh) 惯性传感器及其制造方法
TW201241923A (en) MEMS device having variable gap width and method of manufacture
US6694504B2 (en) Method of fabricating an electrostatic vertical and torsional actuator using one single-crystalline silicon wafer
US7322240B2 (en) Micromachined comb capacitive accelerometer
JP2009200474A (ja) 単一ｓｏｉウェハ加速度計の製造方法
JP2008519695A5 (enExample)
US6365056B1 (en) Method for producing a suspended element in a micro-machined structure
JP2002190608A (ja) 半導体力学量センサ及びその製造方法
CN210222061U (zh) 惯性传感器
CN103910323B (zh) 微机电装置
JP4220582B2 (ja) センサの製造方法
CN112327003B (zh) 微机电传感器及其制造方法
KR20050055330A (ko) 마이크로 관성센서 제조방법
KR100701151B1 (ko) 미세기전집적시스템용 부양 구조물 제조 방법
WO2014008819A1 (zh) 微机电系统结构及其牺牲层湿法腐蚀方法
Mao et al. Fabrication of SOI MEMS inertial sensors with dry releasing process

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081024

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081024

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110802

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111031

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120306